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| PD - 94409 IRGC10B60KB Die in Wafer Form Features * * * * * * * * * GEN5 Non Punch Through (NPT) Technology Low VCE(on) 10s Short Circuit Capability Square RBSOA Positive VCE(on) Temperature Coefficient Benchmark Efficiency for Motor Control Applications Rugged Transient Performance Excellent Current Sharing in Parallel Operation Qualified for Industrial Market C Benefits G E 600V IC(nom)= 10A VCE(on) typ.=1.8V @ IC(nom) @ 25C Motor Control IGBT Short Circuit Rated 150mm Wafer Reference Standard IR Package Part: IRGS10B60KD Electrical Characteristics (Wafer Form) Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Collector Current Gate-to-Emitter Leakage Current Guaranteed (min, max) 0.95V min, 1.3V max 600V min 3.5V min, 5.5V max 10A max 1.1A max Test Conditions IC = 2A, TJ = 25C, VGE = 15V TJ = 25C, I CES = 1mA, VGE = 0V VGE = VCE , TJ =25C, IC = 250A TJ = 25C, VCE = 600V TJ = 25C, VGE = +/-20V Mechanical Data Nominal Backmetal Composition, (Thickness) Nominal Front Metal Composition, (Thickness) Dimensions Wafer Diameter Wafer Thickness, Tolerance Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location Recommended Storage Environment Recommended Die Attach Conditions Al - Ti - Ni/V - Ag, (1kA - 1kA - 4kA - 6kA) 99% Al/1% Si, (4m) 0.130" x 0.130" 150mm, with std. < 100 > flat 85m, +/- 7m 01-5514 100m 0.25mm diameter minimum Consistent throughout same wafer lot Store in original container, in dessicated nitrogen, with no contamination For optimum electrical results, die attach temperature should not exceed 300C Die Outline 3.30 [.130] 2.34 [.092] NOTES : 1. ALL DIMENSIONS ARE S HOWN IN MILLIMET ERS [INCHES]. 2. CONTROLLING DIMENS ION: [INCH]. 3. LET TER DES IGNATION: S = SOURCE G = GATE SK = SOURCE KELVIN IS = CURRENT SENS E < 0.635 TOLERANCE = + /- 0.013 < [.0250] T OLERANCE = + /- [.0005] > 0.635 TOLERANCE = + /- 0.025 > [.0250] T OLERANCE = + /- [.0010] < 1.270 TOLERANCE = + /- 0.102 < [.050] TOLERANCE = + /- [.004] > 1.270 TOLERANCE = + /- 0.203 > [.050] TOLERANCE = + /- [.008] E = EMITTER 4. DIMENSIONAL T OLERANCES: EMITT ER BONDING PADS: 2.27 3.30 [.089] [.130] WIDTH & LENGTH 0.64 [.025] GATE OVERALL DIE: WIDTH 0.66 [.026] & LENGTH www.irf.com 04/19/02 |
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