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| TC1306 Dual 150mA CMOS LDO With Select ModeTM Operation, Shutdown and RESET Output Features * Extremely Low Supply Current for Longer Battery Life * Select ModeTM Operation: Selectable Output Voltages for High Design Flexibility * Very Low Dropout Voltage * 10sec (Typ.) Wake-Up Time from SHDN * Maximum 150mA Output Current per Output * High Output Voltage Accuracy * Power-Saving Shutdown Mode * RESET Output Can Be Used as a Low Battery Detector or Processor Reset Generator * Over Current Protection and Over Temperature Shutdown * Space Saving 8-Pin MSOP Package General Description The TC1306 combines two CMOS Low Dropout Regulators and a Microprocessor Monitor in a space saving 8-Pin MSOP package. Designed specifically for battery operated systems, total supply current is typically 120A at full load, 20 to 60 times lower than in bipolar regulators. The TC1306 features selectable output voltages for higher design flexibility. The dual-state SELECT input pin allows the user to select V OUT2 from 2 different values (2.8V and 3.0V). V OUT1 supplies a fixed 1.8V voltage. An active low RESET is asserted when the output voltage VOUT2 falls below the 2.63V reset voltage threshold. The RESET output remains low for 300msec (typical) after V OUT2 rises above reset threshold. When the shutdown control (SHDN1) is low, the regulator output voltage V OUT1 falls to zero and RESET output remains valid. When the shutdown control (SHDN2) is low, the regulator output voltage V OUT2 falls to zero and RESET output is low. Other key features for the device include ultra low noise operation, fast response to step changes in load and very low dropout voltage (typically 125mV at full load). The device also incorporates both over temperature and over current protection. Each regulator is stable with an output capacitor of only 1F and has a maximum output current of 150mA. Applications * * * * * * * Load Partitioning Battery Operated Systems Portable Computers Medical Instruments Instrumentation Pagers and Cellular/GSM/PHS Phones Linear Post-Regulator for SMPS Device Selection Table Part Number TC1306R-BDVUA Package 8-Pin MSOP Junction Temperature Range -40C to +125C Typical Application VIN GND 3 SELECT SHDN1 4 1 2 8 7 RESET VOUT2 3.3F 6 3.3F 5 SHDN2 VOUT1 NOTE: "R" denotes the suffix for the 2.63V RESET threshold. "B" indicates VOUT1 = 1.8V (fixed). "D" indicates VOUT2 = 2.8V, 3.0V (selectable). Other output voltages are available. Please contact Microchip Technology Inc. for details. TC1306 Package Type 8-Pin MSOP VIN 1 GND 2 SELECT 3 SHDN1 4 8 RESET 7 VOUT2 TC1306 6 VOUT1 5 SHDN2 2002 Microchip Technology Inc. DS21527B-page 1 (c) TC1306 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS* Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V Operating Temperature Range.... -40C < TJ < +125C Storage Temperature Range .............. -65C to +150C TC1306 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VR + 1V, IL = 100A, CL = 3.3F, SHDN1 > VIH, SHDN2 > VIH, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40C to +125C. Applies to both VOUT1 and VOUT2. Symbol VIN IOUTMAX VOUT TCV OUT VOUT/VIN Parameter Input Operating Voltage Maximum Output Current Output Voltage (VOUT1 and VOUT2) VOUT Temperature Coefficient Line Regulation Min 2.7 150 VR - 2.5% -- -- -- -- -- Typ -- -- 20 40 0.05 0.3 2 45 85 125 120 0.05 55 450 0.04 10 Max 6.0 -- -- -- 0.35 2 -- 120 240 360 200 0.5 -- -- -- -- Units V mA V Note 1 Per Channel Note 2 Test Conditions VR 0.5% VR + 2.5% ppm/C Note 3 % % mV (VR + 1V) < VIN < 6V IL = 0.1mA to IOUTMAX (Note 4) IL = 100A IL = 50mA IL = 100mA IL = 150mA, (Note 5) SHDN1, SHDN2 = VIH, IL = 0 SHDN1, SHDN2 = 0V FRE 120Hz VOUT = 0V Notes 6, 7 VIN = 5V CIN = 1F, COUT = 4.7F IL = 30mA, (See Figure 4-1) VIN = 5V CIN = 1F, COUT = 4.7F IL = 30mA, (See Figure 4-1) V OUT/VOUT Load Regulation VIN - VOUT Dropout Voltage IIN IINSD PSRR IOUTSC V OUTPD tWK Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Wake Up Time (from Shutdown Mode) -- -- -- -- -- -- A A dB mA V/W sec ts Settling Time (from Shutdown Mode) -- 40 -- sec Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN has to meet two conditions: VIN 2.7 and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.8V, 3.0V. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details. (c) DS21527B-page 2 2002 Microchip Technology Inc. TC1306 TC1306 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = VR + 1V, IL = 100A, C L = 3.3F, SHDN1 > VIH , SHDN2 > VIH, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40C to +125C. Applies to both VOUT1 and VOUT2. Symbol TSD TSD eN SHDN Input VIH VIL VSELH VSELL VINMIN VTH SHDN Input High Threshold SHDN Input Low Threshold SELECT Input HIgh Threshold SELECT Input Low Threshold Minimum VIN Operating Voltage Reset Threshold Reset Threshold Tempco V OUT2 to Reset Delay Reset Active Time-out Period VOL RESET Output Voltage Low 65 -- 65 -- 1.0 1.2 2.59 2.55 -- -- 140 -- -- -- 0.8 VOUT2 VOUT2 - 1.5 Note 1: 2: 3: 4: Parameter Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis Output Noise Min -- -- -- Typ 160 15 200 -- -- -- -- -- -- 2.63 -- 30 100 300 -- -- -- -- -- Max -- -- -- -- 15 -- 15 6.0 6.0 2.66 2.70 -- -- 560 0.3 0.4 0.3 -- -- Units C C nVHz %VIN %VIN %VIN %VIN V V ppm/C sec msec V Test Conditions F = 10kHz VIN = 2.7V to 6.0V VIN = 2.7V to 6.0V VIN = 2.7V to 6.0V VIN = 2.7V to 6.0V TA = 0C to +70C TA = -40C to +125C TA = +25C TA = -40C to +125C VOUT2 = VTH to (V TH - 100mV) VOUT2 = VTHMIN, ISINK = 1.2mA V OUT2 = VTHMIN, ISINK = 3.2mA V OUT2 > 1.0V, ISINK = 50A VOUT2 > VTHMAX , ISOURCE = 500A VOUT2 > VTHMAX , ISOURCE = 800A SELECT Input RESET Output VOH RESET Output Voltage High V The minimum VIN has to meet two conditions: VIN 2.7 and VIN = VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.8V, 3.0V. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details. 5: 6: 7: 2002 Microchip Technology Inc. DS21527B-page 3 (c) TC1306 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (8-Pin MSOP) 1 2 3 4 PIN FUNCTION TABLE Symbol VIN GND SELECT SHDN1 Power supply input. Ground terminal. SELECT control for setting V OUT2. SELECT = Low for VOUT2 = 2.8V, SELECT = High for VOUT2 = 3.0V. Shutdown control input for VOUT1. Regulator 1 is fully enabled when a logic high is applied to this input. Regulator 1 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output remains valid. Shutdown control input for VOUT2. Regulator 2 is fully enabled when a logic high is applied to this input. Regulator 2 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output is low. Regulated voltage output 1. Regulated voltage output 2. RESET Output. RESET = Low when VOUT2 is below the Reset Threshold Voltage. RESET = High when VOUT2 is above the Reset Threshold Voltage. Description 5 SHDN2 6 7 8 VOUT1 VOUT2 RESET 3.0 DETAILED DESCRIPTION The TC1306 is a precision fixed output voltage regulator that contains two fully independent 150mA outputs. The device also features separate shutdown modes for low-power operation. The Select ModeTM operation allows the user to select VOUT2 from two different values (2.8V, 3.0V), therefore providing high design flexibility. VOUT1 supplies a fixed 1.8V output voltage. The CMOS construction of the TC1306 results in a very low supply current, which does not increase with load changes. In addition, VOUT remains stable and within regulation at no load currents. The TC1306 also features an integrated microprocessor supervisor that monitors the V OUT2 output. The active low RESET signal is asserted when the voltage of VOUT2 falls below the reset voltage threshold (2.63V). The RESET output remains low for 300msec (typical) after VOUT2 rises above the reset threshold. The RESET output of the TC1306 is optimized to reject fast transient glitches on the monitored output line. (c) DS21527B-page 4 2002 Microchip Technology Inc. TC1306 4.0 4.1 TYPICAL APPLICATIONS Input and Output Capacitor 4.3 Select ModeTM Operation The TC1306 is stable with a wide range of capacitor values and types. A capacitor with a minimum value of 1F from V OUT to Ground is required. The output capacitor should have an effective series resistance (ESR) of 0.1 to 10 for a 1F capacitor and 0.01 to 10 for a 10F capacitor. A 1F capacitor should be connected from the VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -20C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. The Select ModeTM operation is a dual-state input that allows the user to select VOUT2 from two different values. By applying a logic low to the SELECT pin, VOUT2 is set to supply a 2.8V output voltage. A logic high signal at the SELECT pin sets VOUT2 to 3.0V. This output voltage functionality provides high design flexibility and minimizes cost associated with inventory, time-to-market and new device qualifications. 4.4 Turn On Response The turn on response is defined as two separate response categories, Wake Up Time (tWK) and Settling Time (tS). The TC1306 has a fast Wake Up Time (10sec typical) when released from shutdown. See Figure 4-1 for the Wake Up Time designated as tWK. The Wake Up Time is defined as the time it takes for the output to rise to 2% of the VOUT value after being released from shutdown. The total turn on response is defined as the Settling Time (tS), see Figure 4-1. Settling Time (inclusive with tWK) is defined as the condition when the output is within 2% of its fully enabled value (40sec typical) when released from shutdown. The settling time of the output voltage is dependent on load conditions, output voltage and VOUT (RC response). 4.2 Shutdown Mode Applying a logic high to each of the shutdown pins turns on the corresponding output. Each regulator enters shutdown mode when a logic low is applied to the corresponding input. During shutdown mode, output voltage falls to zero, and regulator supply current is reduced to 0.5A (max). If shutdown mode is not necessary, the pins should be connected to VIN. FIGURE 4-1: WAKE-UP RESPONSE TIME VIH VIL 98% tS SHDN VOUT 2% tWK 2002 Microchip Technology Inc. DS21527B-page 5 (c) TC1306 5.0 5.1 THERMAL CONSIDERATIONS Thermal Shutdown Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.8V 5% VOUT1MIN = 1.8V 2.5% VOUT2MIN = 3.0V 2.5% ILOAD1MAX = 60mA ILOAD2MAX = 120mA TJMAX TAMAX JA = 125C = 55C = 200C/W Integrated thermal protection circuitry shuts the regulator off when die exceeds approximately 160C. The regulator remains off until the die temperature drops to approximately 145C. Thermal shutdown is intended to protect the device under transient accidental (fault) overload conditions. Thermal Shutdown may not protect the LDO while operating above junction temperatures of 125C continuously. Sufficient thermal evaluation of the design needs to be conducted to ensure that the junction temperature does not exceed 125C. 5.2 Power Dissipation Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD [(VINMAX - VOUT1MIN)] x ILOAD1MAX + [(VINMAX - VOUT2MIN)] x ILOAD2MAX [(3.8 x 1.05) - (1.8 x .975)] x 60 x 10-3 + [(3.8 x 1.05) - (3.0 x .975)] x 120 x 10-3 = 256mW Maximum allowable power dissipation: PD = (TJMAX - TAMAX) JA = (125 - 55) 200 = 350mW In this example, the TC1306 dissipates a maximum of 262mW; below the allowable limit of 350mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 350mW into Equation 5-1, from which V INMAX = 4.5V. The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation. EQUATION 5-1: PD (VINMAX - VOUT1MIN)ILOAD1MAX + (VINMAX - VOUT2MIN)ILOAD2MAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUT1MIN = Minimum regulator output voltage1 ILOAD1MAX = Maximum output (load) current1 VOUT2MIN = Minimum regulator output voltage2 ILOAD2MAX = Maximum output (load) current2 The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125C), and the thermal resistance from junction-to-air (JA). The MSOP-8 package has a JA of approximately 200C/W when mounted on a four layer FR4 dielectric copper clad PC board. 5.3 Layout Considerations EQUATION 5-2: PDMAX = (T JMAX - TAMAX) JA Where all terms are previously defined. The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit. (c) DS21527B-page 6 2002 Microchip Technology Inc. TC1306 6.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. VOUT1 at Various VDD and Load vs. Temperature 1.81 VDD = 6.0V, IL = 100A Load VOUT2 at Various VDD / Load Current vs. Temperature (Select = GND) 2.505 2.500 2.495 VDD = 6.0V, IL = 100A VOUT2 at Various VDD / Load Current vs. Temperature (Select = VDD) 3.000 2.995 2.990 2.985 VOUT2 (V) 2.980 2.975 2.970 2.965 2.960 2.955 2.950 -40 VDD = 3.8V, IL = 50mA VDD = 3.8V, IL = 100mA VDD = 4.0V, IL = 150mA -20 5 30 55 80 105 125 VDD = 4.0V, IL = 100A VDD = 6.0V, IL = 100A 1.80 1.79 1.78 VDD = 2.8V, IL = 150mA Load 1.77 1.76 1.75 1.74 -40 -20 5 30 55 80 105 125 VDD = 6.0V, IL = 100mA Load VOUT2 (V) 2.490 2.485 2.480 2.475 2.470 2.465 2.460 -40 VDD = 3.8V, IL = 150mA VDD = 3.8V, IL = 100mA VDD = 3.8V, IL = 50mA VDD = 3.8V, IL = 100A -20 5 30 55 80 105 125 VOUT (V) TEMPERATURE (C) TEMPERATURE (C) TEMPERATURE (C) IDD vs. VDD (Select = GND) 160 140 120 IDD (A) 100 125C Load Regulation 1 vs. Temperature 0.50 0.50 0.45 0.40 LOAD REG (%) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.45 0.40 LOAD REG (%) 0.35 0.30 0.25 0.20 0.15 0.10 0.05 % Load Reg #1, IL = 0.1 to 150mA 0.00 -40 -20 5 30 55 80 105 125 TEMPERATURE (C) Load Regulation 2 vs. Temperature (Select = GND) 25C -40C 80 60 40 20 0 3 3.5 4 4.5 5 VDD (V) 5.5 6 IL = 0.1 to 150mA 0.00 -40 -20 5 30 55 80 105 125 TEMPERATURE (C) Load Regulation 2 vs. Temperature (Select = VDD) 0.50 DROPOUT VOLTAGE (V) LOAD REGULATION (%) 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 -40 -20 5 30 55 80 105 125 TEMPERATURE (C) IL = 0.1 to 150mA Dropout Voltage vs. Load Current (Select = GND) 0.20 DROPOUT VOLTAGE (V) 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 25 50 75 100 125 150 LOAD CURRENT (mA) 125C Dropout Voltage vs. Load Current (Select = VDD) 0.20 0.18 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 25 50 75 100 125 150 LOAD CURRENT (mA) 125C 25C 25C -40C -40C 2002 Microchip Technology Inc. DS21527B-page 7 (c) TC1306 6.0 TYPICAL CHARACTERISTICS (CONTINUED) Power Supply Rejection Ratio vs. Frequency 0 VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V IOUT = 150mA COUT = 10F Ceramic Power Supply Rejection Ratio vs. Frequency 0 VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V IOUT = 100A COUT = 10F Tantalum -20 -20 PSRR (dB) PSRR (dB) 10 100 1k f (Hz) 10k 100 1M -40 -40 -60 -60 -80 -80 -100 -100 10 100 1k f (Hz) 10k 100 1M Power Supply Rejection Ratio vs. Frequency 0 VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V IOUT = 150mA COUT = 10F Tantalum Output Noise 10 -20 1 Noise (mV/ HZ) VOUT1 VOUT2 0.1 PSRR (dB) -40 -60 0.01 -80 COUT1 = COUT2 = 4.7F, ILOAD = 100mA, VIN = 4.0V VOUT1 = VOUT2 = 3.0V 10 100 1k f (Hz) 10k 100 1M -100 0.001 0.01 0.1 1 f (Hz) 10 100 1000 (c) DS21527B-page 8 2002 Microchip Technology Inc. TC1306 6.0 TYPICAL CHARACTERISTICS (CONTINUED) Shutdown Response Thermal Shutdown Response Output Voltage (1V / div) VOUT SHDN (5V / div) VIN = 4.0V VOUT = 3.0V COUT = 10F ILOAD = 100A VIN = 6.0V VOUT = 1.8V CIN = 1F COUT = 1F Time (200ms / div) Time (500ms / div) Thermal Shutdown Response Thermal Shutdown Response VOUT VOUT VIN = 6.0V VOUT = 2.8V CIN = 1F COUT = 1F VIN = 6.0V VOUT = 3.0V CIN = 1F COUT = 1F Time (500ms / div) Time (500ms / div) Output Voltage Output Voltage (50mV / div) (50mV / div) Line Transient Response VOUT2 Output Voltage Output Voltage (50mV / div) (50mV / div) Line Transient Response VOUT2 VOUT1 VOUT1 Input Voltage (2V / div) VIN 3.6V 4.6V Input Voltage (2V / div) VIN 3.6V COUT1 = COUT2 = 10F Ceramic RLOAD = 30k 4.6V COUT1 = COUT2 = 1F Tantalum RLOAD = 30k Time (500ms / div) Time (500ms / div) 2002 Microchip Technology Inc. DS21527B-page 9 (c) TC1306 6.0 TYPICAL CHARACTERISTICS (CONTINUED) Load Transient Response VOUT2 Output Voltage Output Voltage (20mV / div) (20mV / div) Output Voltage Output Voltage (20mV / div) (20mV / div) Thermal Shutdown Response VOUT2 VOUT1 VOUT1 Output Current COUT1 = COUT2 = 10F Ceramic VIN = 5.5V RLOAD = 30k RL = 30 Output Current COUT1 = COUT2 = 1F Tantalum VIN = 5.5V RLOAD = 30k RL = 30 100mA 100mA 100A 100A Time (500ms / div) Time (500ms / div) Output Voltage 1 Output Voltage 2 (20mV / div) (50mV / div) Output Voltage 1 Output Voltage 2 (20mV / div) (50mV / div) Load Transient Response VOUT2 Thermal Shutdown Response VOUT2 VOUT1 VOUT1 Output Current Output Current COUT1 = COUT2 = 10F Ceramic VIN = 5.5V RLOAD = 30k RL = 30 COUT1 = COUT2 = 1F Tantalum VIN = 5.5V RLOAD = 30k RL = 30 100mA 100mA 100A 100A Time (500ms / div) Time (500ms / div) Wake-Up Response Output Voltage 2 (1V / div) 3.0V VOUT2 VOUT1 Output Voltage 1 (1V / div) 1.8V /Shdn1 = /Shdn2 COUT1 = COUT2 = 1F Tantalum VIN = 5.5V RLOAD = 30k Time (20ms / div) (c) DS21527B-page 10 2002 Microchip Technology Inc. TC1306 7.0 7.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 7.2 Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in 7.3 Package Dimensions 8-Pin MSOP PIN 1 .122 (3.10) .114 (2.90) .197 (5.00) .189 (4.80) .026 (0.65) TYP. .122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05) 6 MAX. .028 (0.70) .016 (0.40) .008 (0.20) .005 (0.13) Dimensions: inches (mm) 2002 Microchip Technology Inc. DS21527B-page 11 (c) TC1306 NOTES: (c) DS21527B-page 12 2002 Microchip Technology Inc. TC1306 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21527B-page13 TC1306 NOTES: DS21527B-page14 2002 Microchip Technology Inc. TC1306 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21527B-page 15 (c) WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599 Taiwan Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 EUROPE Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 Germany Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 Hong Kong Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/01/02 (c) DS21527B-page 16 2002 Microchip Technology Inc. *B72512SD* |
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