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| MF194 860 nm - 70 MHz High Performance LED Data Sheet September 2004 Ordering Information MF194 MF194 MF194 MF194 MF194 ST SC SMA FC TO-46 Package ST Housing SC Housing SMA Housing FC Housing -40 C to +85C Note: Rated Fiber coupled power apply only on the TO-46 package, for housing options fiber coupled power is typically 10% less. Features * * * 860 nm Surface-Emitting LED 70 MHz Bandwidth Designed for 50/125 m fiber Description This device is designed for Ethernet and general applications and offers an excellent price/performance ratio for cost-effective solutions. Its double-lens optical system results in optimum coupling of power into the fiber. Applications * * * LANs Test Equipment General Purpose CASE CATHODE ANODE CATHODE ANODE Bottom View The diode chip is isolated from the case. Figure 1 - Pin Diagram Figure 2 - Functional Schematic 1 Zarlink Semiconductor Inc. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved. MF194 Optical and Electrical Characteristics - Case Temperature 25C Parameter Fiber-Coupled Power (Figures 3, 4, and 5) (Table 1) Rise and Fall Time (10-90%) Bandwidth (3dBel) Peak Wavelength Spectral Width (FWHM) Forward Voltage (Figure 7) Reverse Current Capacitance Note 1: Data Sheet Symbol Pfiber tr,tf fc p VF IR C Min 25 Typ 45 5 70 Max Unit W Test Condition IF=60 mA (Note 1) IF=60 mA (no bias) IF=60 mA IF=60mA IF=60 mA IF=60 mA VR=1 V VR-0 V, f=1 MHz Fiber: 50/125 m Graded Index NA=0.20 7 ns MHz 840 860 50 1.7 250 880 1.9 20 nm nm V A pF Measured at the exit of 100 meters of fiber. Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature (derating: Figure 6) Electrical Power Dissipation (derating: Figure 6) Continuous Forward Current (f<10 kHz) Peak Forward Current (duty cycle<50%,f>1 MHz Reverse Voltage Soldering Temperature (2 mm from the case for 10 sec.) Symbol Tstg Top Ptot IF IFRM VR Tsld Limit -55 to +125C -40 to +85C 160 mW 80 mA 130 mA 1.5 V 260C 2 Zarlink Semiconductor Inc. MF194 Thermal Characteristics Parameter Thermal Resistance - Infinite Heat Sink Thermal Resistance - No Heat Sink Temperature Coefficient - Optical Power Temperature Coefficient - Wavelength Symbol Rthjc Rthja dP/dTj d/dTj -0.5 0.3 Min. Typ. Max. 200 500 Data Sheet Unit C/W C/W %/C nm/C Typical Fiber-Coupled Power Core Diameter/Cladding Diameter Numerical Aperture 50/12 5m 0.20 45 W 62.5/125 m 0.275 95 W 100/140 m 0.29 210 W 200/230 m 0.37 440 W 3 Zarlink Semiconductor Inc. MF194 100 Data Sheet r 80 Relative Fiber-coupled Power (%) r - optimal OC = 50 m z 60 40 20 0 0.5 1 1.5 2 2.5 3 z - Axial Displacem ent of Fiber (m) ) (m m Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber 100 r Relative Fiber-coupled Power (%) 80 z - optimal OC = 50 m z 60 40 20 0 0 20 40 60 80 100 r - Radial Displacem ent of Fiber (m) (m ) Figure 4 - Relative Fiber-coupled Power vs. r - Radial Displacement of Fiber 4 Zarlink Semiconductor Inc. MF194 Data Sheet 100 Relative Fiber-coupled Power (%) 80 60 50% Duty Cycle 40 DC 20 Heat Sinked 0 0 20 40 60 80 100 120 140 160 180 200 Forw ard Current (m A) Figure 5 - Relative Fiber-coupled Power vs. Forward Current 300 Max. Electrical Power Dissipation (mW) 250 Infinite Heat Sink 200 150 No Heat Sink 100 50 0 0 25 50 75 100 o 125 150 Operating Tem perature ( C) Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature 5 Zarlink Semiconductor Inc. MF194 Data Sheet 200 150 Forward Current (mA) 100 50 0 0 0.5 1 1.5 2 2.5 3 Forw ard Voltage (V) Figure 7 - Forward Current vs. Forward Voltage 6 Zarlink Semiconductor Inc. BOTTOM VIEW ( 10 : 1 ) 3,8 2,54 0,6 n1,17 + 0,05 (3x) n0,45 + 0,03 (3x) - SIDE VIEW 13,460,76 0 0,04 45 R2,7 R0,2 max (4x) 3, 6 1, 0 2 0, 3 Lens n1.50.05 R0,4 max NOTES:1. All dimensions in mm. 2. General tol. ISO-2768-mK. 3. Coating: Case: Ni 1,5-2,5 m. Header: Ni 2-3 m / Au min 1,32 m. n4,7 0,3 max glass overmould (2x) (c) Zarlink Semiconductor 2002. All rights reserved. Package code Previous package codes Drawing type ISSUE ACN DATE 1 JS004 076R1 A TB Package drawing, TO-46 with lens Title 22-MAR-03 APPRD. TD/BE JS004076 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request. Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE |
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