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MC14029B Binary/Decade Up/Down Counter
The MC14029B Binary/Decade up/down counter is constructed with MOS P-channel and N-channel enhancement mode devices in a single monolithic structure. The counter consists of type D flip-flop stages with a gating structure to provide toggle flip-flop capability. The counter can be used in either Binary or BCD operation. This complementary MOS counter finds primary use in up/down and difference counting and frequency synthesizer applications where low power dissipation and/or high noise immunity is desired. It is also useful in A/D and D/A conversion and for magnitude and sign generation.
Features http://onsemi.com MARKING DIAGRAMS
PDIP-16 P SUFFIX CASE 648 16 MC14029BCP AWLYYWWG 1 16 SOIC-16 D SUFFIX CASE 751B 1 16 SOEIAJ-16 F SUFFIX CASE 966 1 A WL, L YY, Y WW, W G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Indicator MC14029B ALYWG 14029BG AWLYWW
* * * * * * * *
Diode Protection on All Inputs Supply Voltage Range = 3.0 Vdc to 18 Vdc Internally Synchronous for High Speed Logic Edge-Clocked Design - Count Occurs on Positive Going Edge of Clock Asynchronous Preset Enable Operation Capable of Driving Two Low-Power TTL Loads or One Low-Power Schottky TTL Load Over the Rated Temperature Range Pin for Pin Replacement for CD4029B Pb-Free Packages are Available*
MAXIMUM RATINGS (Voltages Referenced to VSS)
Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 1) Ambient Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Value -0.5 to +18.0 -0.5 to VDD + 0.5 10 500 -55 to +125 -65 to +150 260 Unit V V
PIN ASSIGNMENT
mA mW C C C PE Q3 P3 P0 Cin Q0 Cout VSS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD CLK Q2 P2 P1 Q1 U/D B/D
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS v (Vin or Vout) v VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open.
(c) Semiconductor Components Industries, LLC, 2005
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Publication Order Number: MC14029B/D
1
August, 2005 - Rev. 6
MC14029B
TRUTH TABLE
Carry In 1 0 0 X X = Don't Care Up/Down X 1 0 X Preset Enable 0 0 0 1 Action No Count Count Up Count Down Preset
ORDERING INFORMATION
Device MC14029BCP MC14029BCPG MC14029BDR2 MC14029BDR2G MC14029BFEL Package PDIP-16 PDIP-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOEIAJ-16 Shipping 500 Units / Rail 500 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 2000 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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Characteristic Symbol VDD Vdc - 55_C 25_C 125_C Min -- -- -- Max Min -- -- -- Typ (Note 2) 0 0 0 Max Min -- -- -- Max Unit Vdc Output Voltage Vin = VDD or 0 "0" Level VOLIII 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 0.05 0.05 0.05 -- -- -- 0.05 0.05 0.05 -- -- -- 0.05 0.05 0.05 -- -- -- "1" Level VOH Vin = 0 or VDD 4.95 9.95 14.95 -- -- -- 4.95 9.95 14.95 -- -- -- 5.0 10 15 4.95 9.95 14.95 -- -- -- Vdc Input Voltage (VO = 4.5 or 0.5 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) (VO = 0.5 or 4.5 Vdc) (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) "0" Level VIL Vdc 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- 2.25 4.50 6.75 2.75 5.50 8.25 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- "1" Level VIH Vdc 3.5 7.0 11 3.5 7.0 11 3.5 7.0 11 Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) Source IOHIII 5.0 - 3.0 5.0 - 0.64 10 - 1.6 15 - 4.2 IOL 5.0 10 15 15 -- 0.64 1.6 4.2 -- -- -- -- -- mAdc - 2.4 - 0.51 - 1.3 - 3.4 0.51 1.3 3.4 -- -- -- -- -- - 4.2 - 0.88 - 2.25 - 8.8 0.88 2.25 8.8 5.0 - 1.7 - 0.36 - 0.9 - 2.4 0.36 0.9 2.4 -- -- -- -- -- Sink mAdc Input Current Iin 0.1 5.0 10 20 0.00001 0.005 0.010 0.015 0.1 7.5 5.0 10 20 1.0 150 300 600 mAdc pF mAdc Input Capacitance, (Vin = 0) Quiescent Current (Per Package) Cin IDD 5.0 10 15 5.0 10 15 Total Supply Current (Notes 3 & 4) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) IT IT = (0.58 mA/kHz) f + IDD IT = (1.20 mA/kHz) f + IDD IT = (1.70 mA/kHz) f + IDD mAdc 2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 3. The formulas given are for the typical characteristics only at 25_C. 4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL - 50) Vfk where: IT is in mA (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.001.
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
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1. The formulas given are for the typical characteristics only at 25_C. 2. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance.
SWITCHING CHARACTERISTICS (1.) (CL = 50 pF, TA = 25_C)
Preset Enable Pulse Width
Binary/Decade Setup Time
Up/Down Setup Time
Carry In Setup Time
Clock Rise and Fall Time
Preset Removal Time The Preset Signal must be low prior to a positive-going transition of the clock.
Clock Pulse Frequency
Clock Pulse Width
Propagation Delay Time Clk to Q tPLH, tPHL = (1.7 ns/pF) CL + 230 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
PE to Cout tPLH, tPHL = (1. 7 ns/pF) CL + 465 ns tPLH, tPHL = (0.66 ns/pF) CL + 192 ns tPLH, tPHL = (0.5 ns/pF) CL + 125 ns
PE to Q tPLH, tPHL = (1.7 ns/pF) CL + 230 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
Cin to Cout tPLH, tPHL = (1.7 ns/pF) CL + 95 ns tPLH, tPHL = (0.66 ns/pF) CL + 47 ns tPLH, tPHL = (0.5 ns/pF) CL + 35 ns
Clk to Cout tPLH, tPHL = (1.7 ns/pF) CL + 230 ns tPLH, tPHL = (0.66 ns/pF) CL + 97 ns tPLH, tPHL = (0.5 ns/pF) CL + 75 ns
Characteristic
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Symbol
MC14029B
tW(cl)
tPLH, tPHL
tPLH, tPHL
tPLH, tPHL
tPLH, tPHL
tPLH, tPHL
tTLH, tTHL
tr(cl) tf(cl)
trem
tsu
tW
fcl
3 VDD 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 Min 130 70 50 320 140 100 340 140 100 150 60 40 160 80 60 180 80 60 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- All Types Typ (2.) 160 70 50 170 70 50 320 145 105 235 100 80 175 50 50 250 130 85 200 100 90 100 50 40 4.0 8.0 10 75 30 20 80 40 30 90 40 30 -- -- -- 65 35 25 Max 640 290 210 470 200 160 360 120 100 500 260 190 400 200 180 200 100 80 2.0 4.0 5.0 15 5 4 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- MHz Unit ns ns ns ns ns ns ns ns ns ns ns ns ms
MC14029B
VDD 500 pF PE Cin B/D U/D CLK P0 P1 P2 P3 ID Q0 Q1 Q2 Q3 Cout CL CL CL CL 0.01 mF CERAMIC
PULSE GENERATOR
CL
20 ns CLK 50% 90% VARIABLE WIDTH
20 ns 10%
VDD VSS
Figure 1. Power Dissipation Test Circuit and Waveform
VDD PE Cin B/D U/D CLK P0 P1 P2 P3 Q0 Q1 Q2 Q3 Cout VSS CL CL CL CL
PROGRAMMABLE PULSE GENERATOR
CL
CARRY IN OR UP/DOWN OR BINARY/DECADE CLOCK PRESET ENABLE
tsu 50% 50%
tW
trem
1/fcl
VDD VSS VDD
tW 20 ns 10% tPLH tTHL tPHL tPLH tTLH
VSS VDD VSS VOH VOL
Q0 OR CARRY OUT
90% 10%
Cout ONLY
90%
Figure 2. Switching Time Test Circuit and Waveforms
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MC14029B
TIMING DIAGRAM
CLOCK CARRY IN UP/DOWN BINARY/DECADE PE P0 P1 P2 P3 Q0 Q1 Q2 Q3 CARRY OUT COUNT 0 1 2 3 4 5 6 7 8 9 8 7 6 5 4 3 2 1 0 0 9 6 7 0
Q3 Q2 Q1 Q0 Cout Cin MC14029B U/D MSD B/D PE P3 P2 P1 P0 CLK 1" VDD
Q3 Q2 Q1 Q0 Cout Cin U/D MC14029B B/D PE P3 P2 P1 P0 CLK 2" VDD
Q3 Q2 Q1 Q0 Cout Cin MC14029B U/D LSD B/D PE P3 P2 P1 P0 CLK 3" VDD VDD
OUTPUT
INPUT CLOCK
CLOCK
Cout 1 (LSD) Cout 2 Cout 3 (MSD)
PE 123 122 121 120 101 100 123 COUNT 122 119 99 10 11 9 1 0
*tW ^ 900 ns @ VDD = 5 V
Figure 3. Divide by N BCD Down Counter and Timing Diagram (Shown for N = 123)
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BINARY/DECADE
9 4 P0 12 P1 13 P2 3 P3
PRESET ENABLE
1
5 TE Q0 CLK Q0 CLK Q1 TE Q1 TE Q2 CLK Q2
PE P0
PE P1
PE P2
PE P3 TE Q3 CLK Q3 7 CARRY OUT
MC14029B
LOGIC DIAGRAM
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6 Q0 1 Q1 14 Q2
6
CARRY IN
UP/DOWN
10
CLOCK
15
2
Q3
MC14029B
PACKAGE DIMENSIONS
PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE T
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.
B
1 8
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
DIM A B C D F G H J K L M S
INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040
MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
SOIC-16 D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J
-A-
16 9
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
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MC14029B
PACKAGE DIMENSIONS
SOEIAJ-16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966-01 ISSUE O
16
9
LE Q1 E HE M_ L DETAIL P
1
8
Z D e A VIEW P
c
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031
b 0.13 (0.005)
M
A1 0.10 (0.004)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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MC14029B/D

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