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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
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LED Driver
The MC10SX1130 is high speed LED Driver/current switch specifically targeted for use in FDDI PMD and ANSI X3T9.3 FibreChannel 266 Mbits/s optical transmitters. The integrated circuit contains several unique functional blocks which makes it easily configurable for use with a variety of high performance LED devices. The part is fabricated using Motorola's proven MOSAIC IIITM advanced bipolar process. The logic is designed so that a data HIGH input results in the modulation current flowing through the IOUT pin to turn on the LED.
MC10SX1130
* * * * * * * * * *
LED DRIVER
Differential Data Inputs 300MHz Operation 100mA Peak Drive Current Extremely Low Jitter Duty Cycle Distortion Compensation Adjustable Output Current Tracking With Temperature Thermally Enhanced 16-Lead SOIC Package 75k Data Input Pulldown Resistors +5V or -5.2V Operation VBB Reference Available
D SUFFIX SOIC PACKAGE CASE 751B-05
16 1
The device incorporates open collector outputs with a capability of driving peak currents of 100mA. Since the output current switching circuitry simply switches current between the complementary outputs, the dynamic switching demands on the system power supply are greatly reduced. In addition, because the design is pure bipolar, the device current drain is insensitive to the data pattern and frequency of operation. The LED drive current is adjustable through the selection of an external set resistor, RSET. In addition, to allow for open loop compensation for the LED's negative optical output power tracking over temperature, a circuit is included to provide an adjustable positive temperature tracking coefficient to the LED drive current. This is controlled through the selection of an external resistor, RTCO. The MC10SX1130 incorporates novel pulse stretching circuitry which is intended to compensate for the turn-on delay and rise and fall time asymmetry inherent in LED devices. The stretch circuitry can be used to pre-distort the input signal pulse width to minimize the duty cycle distortion of the transmitted optical eye pattern. The stretch circuitry supports three different selections of pre-distortion. This choice is accomplished through a unique `tri-state' input which can be left open, tied to VCC, or tied to VEE to determine the pre-distortion amount. The device provides a VBB output for either single-ended use or as a DC bias for AC coupling the signal into the device. The VBB pin should only be used as a bias for the MC10SX1130 as its current sink/source capability is limited. Whenever used, the VBB pin should be bypassed to ground via a 0.01F capacitor. Pinout: 16-Lead Plastic Package (Top View)
VEE Stretch VEE 16 15 14 IOUT RSET IOUT VCC 13 12 11 10 VEE 9 ECL BUFFER DIN DIN PULSE WIDTH ADJUST CIRCUIT
BLOCK DIAGRAM
Stretch IOUT IOUT
VBB 1 VEE 2 VCC 3 VBB 4 DIN 5 6 7 8 DIN RTCO1 RTCO2 VEE
BIAS CONTROL
RTCO1
RTCO2
RSET
MOSAIC III is a trademark of Motorola.
3/94
(c) Motorola, Inc. 1994
REV 1
PIN FUNCTION TABLE
Pin DIN IOUT STRETCH Differential data inputs. Differential open collector outputs. Control input to select the amount of duty cycle pre-distortion. When the pin is left open, no pre-distortion is introduced. If the pin is connected to VCC, the output LOW state current pulse width is increased by 155ps. When it is connected to VEE, the current pulse width is increased by 310ps. Resistor to set LED drive current. This resistor sets the tail current of the output current switch and should be connected to the VEE plane. Since the RSET voltage compensation circuit is referenced to VEE, the RSET voltage will track 1:1 with VEE changes, thus the voltage across the RSET resistor will remain constant. Terminals for positive temperature tracking resistor. This resistor controls the temperature tracking rate of the voltage at the RSET pin, which in turn sets the LED drive current tracking. If the two pins are shorted together, the nominal tracking rate is 1.4mV/C and when a 2k resistor is connected across the pins, the nominal tracking rate is 4.9mV/C. Most positive power supply input. +5V for PECL operation or ground for standard ECL operation. Most negative power supply input. Ground for PECL operation or -5.2V for standard ECL operation. Reference voltage for use in single ended applications or when the input signal is AC coupled into the device. Function
RSET
RTCO1, RTCO2
VCC VEE VBB
+5.0V SUPPLY DECOUPLING CAPACITORS
10
10
16 VEE
15 Stretch
14 VEE
13 IOUT
12 RSET
11 IOUT
10 VCC
9 VEE
VEE 1
VCC 2
VBB 3
DIN 4
DIN 5
RTCO1 6
RTCO2 7
VEE 8
PECL BIAS
50 IN IN
50
1k PECL BIAS
Figure 1. Typical +5V Applications Circuit
MOTOROLA 2
High Performance Frequency Control Products -- BR1334
ABSOLUTE MAXIMUM RATINGS*
Symbol VEE VI Iout TA * Power Supply (VCC = 0V) Input Voltage (VCC = 0V) Output Current Continuous Surge Parameter Value -7.0 to 0 0 to -6.0 100 110 -40 to +85 -5.5 to -4.5 Unit VDC VDC mA C VDC
Operating Temperature Range
VEE Operating Range (VCC = 0) Absolute maximum rating, beyond which, device life may be impaired.
DC CHARACTERISTICS1 (RTCO = 1k 5%, RSET = R at IOUT = R at IOUT = 10 1%, Unless Otherwise Noted)
-40C Symbol IIH IIL ICC VIH Characteristic Input HIGH Current (DIN, DIN Pins) Input LOW Current (DIN, DIN Pins) Quiescent Supply Current (No Load on RSET Pin) Input HIGH Voltage2 VCC = 5.0V, VEE = GND VCC = GND, VEE = -4.5 to -5.5V Input LOW Voltage2 VCC = 5.0V, VEE = GND VCC = GND, VEE = -4.5 to -5.5V Output Reference Voltage2 VCC = 5.0V, VEE = GND VCC = GND, VEE = -4.5 to -5.5V Output Voltage at RSET Pin VCC = 5.0V, RTCO = Short VEE = GND RTCO = 1k RTCO = 2k VCC = GND3 VEE = -5.2V IOon IOoff VTR Output `ON' Current (IOUT, IOUT Pins) Output `OFF' Current (IOUT, IOUT Pins) VSET Tracking4 Short Between RTCO1 and RTCO2 1k Between RTCO1 and RTCO2 2k Between RTCO1 and RTCO2 RTCO = Short RTCO = 1k RTCO = 2k 30 0.5 Min Typ Max 200 Min 0C Typ Max 200 Min 25C Typ Max 200 Min 85C Typ Max 200 Unit A A mA
0.5
0.5
0.5
12
17
24
12
17
24
12
18
24
12
19
24
mV 3770 -1230 4110 -890 3830 -1170 4160 -840 3870 -1130 4190 -810 3940 -1060 4280 -720 mV 3050 -1950 3500 -1500 3050 -1950 3520 -1480 3050 -1950 3520 -1480 3050 -1950 3555 -1445 mV 3570 -1430 3700 -1300 3620 -1380 3730 -1270 3650 -1350 3750 -1250 3690 -1310 3810 -1190 mV 600 430 230 -4400 -4570 -4770 75 30 635 515 355 -4365 -4485 -4645 75 610 570 470 -4390 -4430 -4530 30 690 650 550 -4310 -4350 -4450 770 730 630 -4230 -4270 -4370 75 30 775 855 845 -4225 -4145 -4155 100 mA A mV/ C
VIL
VBB
VSET
50
50
50
50
1.4 3.4 4.9
1.4 3.4 4.9
1.4 3.4 4.9
1.4 3.4 4.9
1. 10SX circuits are designed to meet the DC specifications shown in the table after thermal equilibrium has been established. The circuit is mounted in a test socket or mounted on a printed circuit board and transverse air greater than 500lfm is maintained. 2. Note that in PECL applications, VIH, VIL, VBB will vary 1:1 with the VCC supply. 3. VSET tracks 1:1 with the VEE supply to maintain the same voltage across the RSET resistor. 4. VTR tracking measures the rate of change of the VSET voltage over temperature.
High Performance Frequency Control Products -- BR1334
MOTOROLA 3
AC CHARACTERISTICS1 (RTCO = 1k 5%, RSET = R at IOUT = R at IOUT = 10 1%, Unless Otherwise Noted)
-40C Symbol tPLH, tPHL tStretch Characteristic Propagation Delay to Output Propagation Delay (Differential) (Single-Ended) Stretch = OPEN Stretch = VCC Stretch = VEE Min Typ 1300 1300 0 145 300 600 375 490 260 Square Wave Input Pseudo Random Input 300 (Differential) 150 -0.400 See 7 9 10 400 30 150 -0.400 See 7 300 Max Min 1000 950 120 250 510 330 360 220 0 to 85C Typ 1400 1400 0 155 310 880 550 600 500 6 15 400 30 Max 1800 1850 200 380 1260 860 850 750 ps ps ps MHz ps mV V Note 5 Note 6 Note 7 10% to 90% 90% to 10% 20% to 80% 80% to 20% Note 3 Note 4 Unit ns ps Note 2 Condition
tr 10-90 tf 90-10 tr 20-80 tf 80-20 Jitter BW tSKEW VPP VCMR
Rise Time Fall Time Rise Time Fall Time Jitter Bandwidth Duty Cycle Skew Minimum Input Swing Common Mode Range
1. 10SX circuits are designed to meet the AC specifications shown in the table after thermal equilibrium has been established. The circuit is mounted in a test socket or mounted on a printed circuit board and transverse air greater than 500lfm is maintained. 2. When the Stretch function is used, the output low pulse width is increased by the specified amount. 3. Test condition uses a 133 MHz 50% duty cycle signal. 4. Test condition uses a 266 Mbit/s input psuedo-random data stream (n=23). 5. Duty cycle skew is the difference between tPLH and tPHL propagation delay through a device, Stretch input is left open. 6. Minimum input swing for which AC parameters are guaranteed. 7. The CMR range is referenced to the most positive side of the differential input signal. Normal operation is obtained if the HIGH level falls within the specified range and the peak-to-peak voltage lies between VPP Min and 1.0V. The lower end of the CMR range is dependent on VEE and is equal to VEE + 3.5V.
MOTOROLA 4
High Performance Frequency Control Products -- BR1334
APPLICATIONS INFORMATION
Introduction The MC10SX1130 is intended to be integrated into high performance fiber optic modules or used stand-alone to drive a packaged optical LED device. The wide frequency response of the device allows it to be used to support a variety of digital communication applications ranging from: The data input circuitry has been realized as a traditional differential ECL line receiver. It can accept either differential 100K or 10KH style ECL or PECL depending on the supply voltage used. In addition, a VBB reference is provided for use in single ended applications. This reference is useful if the input signal must be AC coupled into the device. The pulse stretcher provides two choices of duty cycle pre-distortion. It is controlled by the input STRETCH signal. When the pin is left open, no pre-distortion is applied to the input waveform. If the pin is strapped to the upper or lower rail, then the output waveform low pulse width will be increased. In a +5V application, when the STRETCH pin is tied to +5V, the nominal pulse width increase is 155 ps and when it is connected to 0V, the nominal pulse width is increased by 310 ps. The bias control circuitry regulates the voltage supplied at the RSET pin of the output current switch. In addition, it implements a positive tracking circuit which provides open loop temperature compensation for the LED's negative tracking coefficient. An external resistor connected between the RTCO1 and RTCO2 is used to select the rate of voltage change at the RSET pin. The output current switch is the final stage in modulating the LED. The emitter of the current source is pinned out so that an external resistor can be used to set the modulation current. This circuit is implemented using a fully differential gate where both collectors are brought out. As the LED is modulated on and off, the current switches from one collector to another. This architecture minimizes the switching noise inherent in some LED driver design topologies where the modulation current is actually turned on and off. Design Considerations Once the user has selected an LED, the driver circuitry should be optimized to match the characteristics of the LED. The three circuit blocks previously described allow the user to control the pulse width adjustment, LED drive current and temperature tracking rate. A very simple example may best illustrate the design process steps. An LED has been selected which has the desired optical output power when modulated with a waveform of 65mA. In addition, the LED has an output power tracking coefficient of -0.5%/C. Thus for every 1C rise in the case temperature of the LED, the output power will decrease by 0.5% of the nominal value. In addition, the LED forward voltage is 1.5V. First, the RSET resistor must be chosen to set the desired nominal modulation current based on the following equation: RSET = VSET/IMOD (Equation 1) The voltage at VSET is a function of the RTCO tracking resistor, so the desired tracking rate (VTR) must also be chosen. To determine this, the equation must be normalized to correspond to how the LED has been specified. Temp Co = VTR/VSET (Equation 2) The data sheet has three temperature tracking rates for different values of the RTCO resistor. By using the VSET values at 25C and substituting those numbers into Equation 2, normalized tracking rates can be calculated.
* * * *
OC1/3 SONET/SDH Links 100 MBit/s FDDI 155 MBit/s ATM 133/266 MBit/s FibreChannel
To support such wide ranging application areas, the LED Driver incorporates a variety of unique features. These offer designers added flexibility that could not previously be realized in less integrated designs. LED Characteristics LED devices emit light when forward biased. The optical power emitted by an LED is determined by the amount of current flowing through the device. This relationship is a relatively linear function of the current, until the device saturates. In some ways, an LED device behaves much like a traditional small signal silicon diode, although the forward "ON" voltage of an LED is much larger and ranges from 1.0V to 2.0V. In addition, for a fixed amount of current, the optical power from the LED will decrease if the device junction temperature increases. Another behavior of most LED devices is that they have unequal turn-on and turn-off times. In developing an LED transmitter, the designer must wrestle with all these behaviors to develop a product that meets the design targets. LED Driver The MC10SX1130 LED Driver accepts a digital binary data stream which is processed by the driver circuitry to create a current waveform to modulate the LED device. The LED Driver contains circuitry to program the modulation current, pre-distort the input waveform to partially compensate for the LED turn-on/turn-off delay, and compensate for the negative optical output power tracking co-efficient. The LED Driver operates from a +5V supply for PECL applications or a -5.2V supply for traditional ECL systems. For further information on PECL, please consult "Designing with PECL Application Note", AN1406/D available from a Motorola representative. Circuit Blocks Some of the key sub-circuits in the LED Driver are listed below:
* * * *
Input Line Receiver Pulse Stretcher Bias Control Circuitry Output Current Switch
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MOTOROLA 5
Normalized Tracking at 25C RTCO Short 1 K 2 K Tracking %/C +0.20 +0.52 +0.89
A specially designed thermally enhanced leadframe has been used to house the LED Driver. Below is a graph of the average JA plotted against air flow.
110
100 JA ( C/W)
To match the LED chosen, a 1K resistor can be used. Now that this is known, the value of the voltage at the VSET can be substituted into Equation 1 to determine the value of RSET resistor which, for this example is 10. The Stretch circuit can be used to compensate for the turn-on/turn-off delay of the LED. The circuit has been designed for ease of use so the pin is designed to be strapped to one of the two power plane levels to select the pre-distortion value. If no pre-distortion is desired, the pin can be left open. In this +5V example, the maximum amount of pre-distortion is desired, so the STRETCH pin is connected to ground. In addition a resistor must be placed between IOUT and VCC. In selecting this resistor, just as in the case of the RSET, the resistor type should be chosen to dissipate the worst case power and derated for the worst case temperature. As a rule of thumb, the voltage drop across the resistor should match the forward voltage across the diode. The voltage can be larger to minimize the power dissipated on chip when the LED is not 'ON'. Although, the voltage drop across this resistor should not be greater than 2V. For this example: R @ IOUT = VF/IMOD IMOD(max)
90
80
70 0 100 200 300 400 500 AIRFLOW (LFPM)
Figure 2. Typical JA versus Airflow The power dissipation of the device has two components; the quiescent power drain related to the pre-drive circuitry, and the power dissipated in the current switch when driving the LED. Pd = Pstatic + Pswitching (Equation 4)
The power dissipated in the current switch is a function of the IMOD current, the LED forward voltage, and the value of RSET. For example in a +5V application, the following equations can be used: Pstatic = VCC * ICC Pswitching = (VCC-VF-VSET)* IMOD (Equation 5) (Equation 6)
+ VSET@85C + 855mV + 86mA 10W RSET
R @ IOUT = 1.5V/86mA = 17 Because of the positive tracking circuitry in the LED driver, the modulation current will increase over temperature. It is important to now go back and re-calculate the numbers under the worst case environmental conditions to ensure that operating conditions have not been exceeded. Thermal Management LED devices tend to require large amounts of current for most efficent operation. This requirement is then translated into the design of the LED Driver. When large modulation currents are required, power dissipation becomes a critical issue and the user must be concerned about the junction temperature of the device. The following equation can be used to estimate the junction temperature of a device in a given environment: TJ = TA + PD * JA TJ TA PD JA Junction Temperature Ambient Temperature Power Dissipation Average Thermal Resistance (Junction-Ambient) (Equation 3)
Now to calculate the dissipated power on the chip for a nominal application. VCC = 5V VF = 1.5V VSET = 0.7V IMOD = 60mA ICC = 18mA so: Pd = 5 * 18 + (5 - 1.5 - 0.7) * 60 Pd = 258mW This number can be entered into Equation 3 along with the environmental information to calculate the nominal operating junction temperature. Because of the open loop feedback control in the bias control circuitry, the revised IMOD value must be determined given the tracking rate chosen so that the power dissipation can be re-calculated. For assessing product reliability, worst case values should be entered to calculate the maximum junction temperature. Reliability of Plastic Packages Although today's plastic packages are as reliable as ceramic packages under most environmental conditions, as the junction temperature increases a failure mode unique to plastic packages becomes a significant factor in the long term reliability of the device.
MOTOROLA 6
High Performance Frequency Control Products -- BR1334
Modern plastic package assembly utilizes gold wire bonded to aluminum bonding pads throughout the electronics industry. As the temperature of the silicon (junction temperature) increases, an intermetallic compound forms between the gold and aluminum interface. This intermetallic formation results in a significant increase in the impedance of the wire bond and can lead to performance failure of the affected pin. With this relationship between intermetallic formation and junction temperature established, it is incumbent on the designer to ensure that the junction temperature for which a device will operate is consistent with the long term reliability goals of the system. Reliability studies were performed at elevated ambient temperatures (125C) from which an arrhenius equation, relating junction temperature to bond failure, was established. The application of this equation yields the table of Figure 3. This table relates the junction temperature of a device in a plastic package to the continuous operating time before 0.1% bond failure (1 failure per 1000 bonds) The MC10SX1130 device is designed with chip power
levels that permit acceptable reliability levels, in most systems, under the conventional 500 lfpm (2.5m/s) airflow. T = 6.376 x 10 -9 e Where:
T = Time to 0.1% bond failure Junction Temp. (C) 80 90 100 110 120 130 140 Time (Hrs.) 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time (yrs.) 117.8 47.9 20.4 9.1 4.2 2.0 1.0
11554.267 273.15 + TJ
Figure 3. Tj vs Time to 0.1% Bond Failure
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MOTOROLA 7
OUTLINE DIMENSIONS
D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 -A-
16
9
-B1 8
P 8 PL 0.25 (0.010)
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
G F
DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019
K C -TSEATING PLANE
R X 45
M D 16 PL 0.25 (0.010)
M
J
TB
S
A
S
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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MOTOROLA 8
3PHX32168-1 PRINTED IN USA
3/94 IMPERIAL LITHO XXXXX
*MC10SX1130/D*
7,500 LOGIC YDAAAA
MC10SX1130/D High Performance Frequency Control Products -- BR1334

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