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19-0587; Rev 1; 10/06 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications General Description The MAX8660/MAX8661 power management ICs (PMICs) power Intel XScale(R) applications processors in smart cellular phones, PDAs, Internet appliances, and other portable devices. Four step-down DC-DC outputs, three linear regulators, and an 8th always-on LDO are integrated with powermanagement functions. Two dynamically controlled DCDC outputs power the processor core and internal memory. Two other DC-DC converters power I/O, memory, and other peripherals. Additional functions include on/off control for outputs, low-battery detection, reset output, and a 2-wire I2C serial interface. The MAX8661 functions the same as the MAX8660, except it lacks the REG1 step-down regulator and the REG7 linear regulator. All step-down DC-to-DC outputs use fast 2MHz PWM switching and tiny external components. They automatically switch from PWM to high-efficiency, light-load operation to reduce operating current and extend battery life. In addition, a forced-PWM option allows lownoise operation at all loads. Overvoltage lockout protects the device against inputs up to 7.5V. Features o Optimized for Intel XScale Processors o Protected to 7.5V--Shutdown Above 6.3V o Four Synchronous Step-Down Converters REG1, REG2, REG3, REG4 o Four LDO Regulators REG5, REG6, REG7, REG8 o 2MHz Switching Allows Small Components o Low, 20A Deep-Sleep Current o Low-Battery Monitor and Reset Output MAX8660/MAX8660A/MAX8661 Ordering Information PART MAX8660ETL+ MAX8660AETL+ MAX8661ETL+ PINPACKAGE PKG CODE OPTIONS V1: 3.3V, 3.0V, 2.85V 40 Thin QFN T4055-1 5mm x 5mm V2: 3.3V, 2.5V, 1.8V 40 Thin QFN T4055-1 5mm x 5mm V1: 2.5V, 2.0V, 1.8V V2: 2.5V, 2.0V, 1.8V Applications PDAs, Palmtops, and Wireless Handhelds Smart Cell Phones Personal Media Players Portable GPS Navigation Digital Cameras No REG1 and REG7 40 Thin QFN T4055-1 V2: 3.3V, 2.5V, 1.8V 5mm x 5mm Note: All devices are specified over the -40C to 85C operating temperature range. +Denotes lead-free package. Pin Configuration RAMP RSO PV3 PG3 EN5 LBR LX3 MR V3 Simplified Functional Diagram MAIN BATTERY TOP VIEW 30 29 28 27 26 25 24 23 22 21 EN34 31 EN2 32 SRAD 33 PG1 (GND) 34 LX1 (N.C.) 35 PV1 (PV) 36 EN1 (GND) 37 V1 (GND) 38 SET1 (GND) 39 V4 40 1 IN5 2 V5 3 PV4 4 LX4 5 PG4 6 SET2 7 V6 8 IN67 (IN6) 9 V7 (N.C.) 10 V2 EXPOSED PAD (EP) 20 V8 19 AGND 18 IN 17 IN8 LBF IN MAX8660 LBR LBF V1 VCC_IO: (PIN PROG) 3.3V/3.0V/2.85V AT 1.2A VCC_MEM: (PIN PROG) 1.8V/2.5V/3.3V AT 0.9A VCC_APPS: (I2C PROG) 0.725 TO 1.8V, DVM AT 1.6A VCC_SRAM: (I2C PROG) 0.725 TO 1.8V, DVM AT 0.4A VCC_MVT: (I2C PROG) 1.7V TO 2.0V AT 200mA VCC_CARD1: (I2C PROG) 1.8V TO 3.3V AT 500mA VCC_CARD2: (I2C PROG) 1.8V TO 3.3V AT 500mA VCC_BBATT: 3.3V ALWAYS ON AT 30mA V2 V3 V4 MAX8660ETL+ MAX8660AETL+ MAX8661ETL+ 16 PG2 15 LX2 14 PV2 13 LBO 12 SDA 11 SCL nBATT_FAULT nRESET LBO RSO MR V5 V6 V7 V8 I INTERFACE 2C SCL SDA EN1,2,5 EN34 SYS_EN PWR_EN THIN QFN 5mm x 5mm x 0.8mm ( ) ARE FOR THE MAX8661 Intel XScale is a registered trademark of Intel Corp. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Table of Contents General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Simplified Functional Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Typical Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Maxim vs. Intel Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Step-Down DC-DC Converters (REG1-REG4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 REG1 (VCC_IO) Step-Down DC-DC Converter (MAX8660 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 REG2 (VCC_IO, VCC_MEM) Step-Down DC-DC Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26 REG3 (VCC_APPS) Step-Down DC-DC Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 REG4 (VCC_SRAM) Step-Down DC-DC Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 REG1-REG4 Step-Down DC-DC Converter Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 REG1-REG4 Synchronous Rectification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 REG1/REG2 100% Duty-Cycle Operation (Dropout) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27 Linear Regulators (REG5-REG8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 REG5 (VCC_MVT, VCC_BG, VCC_OSC13M, VCC_PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 REG6/REG7 (VCC_CARD1, VCC_CARD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 REG8 (VCC_BBATT) Always-On Regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Ramp Rate Control (RAMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Enable Signals (EN_, PWR_EN, SYS_EN, I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 REG3/REG4 Enable (EN34, EN3, EN4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Power-Up and Power-Down Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Intel XScale Power Configuration Register (PCFR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Voltage Monitors, Reset, and Undervoltage-Lockout Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Undervoltage and Overvoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Reset Output (RSO) and MR Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Low-Battery Detector, (LBO, LBF, LBR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Internal Off-Discharge Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Thermal-Overload Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Data Transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 START and STOP Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Acknowledge Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Slave Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 I2C Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 2 _______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Table of Contents (continued) Design Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Setting the Output Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Inductor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Input Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Output Capacitor Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Applications Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 PC Board Layout and Routing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Chip Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Tables Table 1. Maxim and Intel Power Domain Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 2. Maxim and Intel Digital Signal Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 3. SET1 Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 4. SET2 Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 5. Enable Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 6. Truth Table for V3/V4 Enable Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 7. Power Modes and Corresponding Quiescent Operating Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 8. Internal Off-Discharge Resistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Table 9. I2C Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Table 10. DVM Voltage Change Register (VCC1, 0x20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 11. Serial Codes for V3 (VCC_APPS) and V4 (VCC_SRAM) Output Voltages. . . . . . . . . . . . . . . . . . . . . . 36 Table 12. Serial Codes for V5 Output Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 13. Serial Codes for V6 and V7 Output Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Figures Figure 1. Example MAX8660 Connection to Intel XScale Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 2. Functional Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 3. Typical Applications Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 4. Soft-Start and Voltage-Change Ramp Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 5. V3/V4 Enable Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 6. Power-Up Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 7. Low-Battery Detector Functional Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Figure 8. START and STOP Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Figure 9. Acknowledge Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Figure 10. Slave Address Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37 Figure 11. Writing to the MAX8660/MAX8661 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38 _______________________________________________________________________________________ 3 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 ABSOLUTE MAXIMUM RATINGS IN, IN5, IN6, IN67, EN2, EN34, EN5, LBO, RSO, MR, SET1, SET2, V1, V2, V3, V4, SCL, SDA, SRAD to AGND..................................................-0.3V to +7.5V LBF, LBR, EN1, RAMP to AGND .................-0.3V to (VIN + 0.3V) V8 to AGND................................................-0.3V to (VIN8 + 0.3V) V5 to AGND................................................-0.3V to (VIN5 + 0.3V) V6, V7 to AGND........................................-0.3V to (VIN67 + 0.3V) PV1 to PG1 ............................................................-0.3V to +7.5V PV2 to PG2 ............................................................-0.3V to +7.5V PV3 to PG3 ............................................................-0.3V to +7.5V PV4 to PG4 ............................................................-0.3V to +7.5V PV, PV1, PV2, PV3, PV4, IN8 to IN ........................-0.3V to +0.3V LX1 Continuous RMS Current (Note 1) .................................2.3A LX2 Continuous RMS Current (Note 1) .................................2.0A LX3 Continuous RMS Current (Note 1) .................................2.6A LX4 Continuous RMS Current (Note 1) .................................1.0A PG1, PG2, PG3, PG4, EP to AGND.......................-0.6V to +0.6V GND to AGND ......................................................-0.3V to +0.3V All REGx Output Short-Circuit Duration......................Continuous Continuous Power Dissipation (TA = +70C) 40-Pin Thin QFN (derate 35.7mW/C above +70C).....2857mW Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Note 1: LX_ has internal clamp diodes to PG_ and PV_. Applications that forward bias these diodes must take care not to exceed the IC's package power-dissipation limits. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 2) PARAMETER PV1, PV2, PV3, PV4, IN, IN8 Supply Voltage Range IN Undervoltage-Lockout Threshold IN Overvoltage-Lockout Threshold SYMBOL VIN VUVLO VOVLO CONDITIONS PV1, PV2, PV3, PV4, IN, and IN8 must be connected together externally VIN rising VIN falling VIN rising VIN falling Only V8 on (deep-sleep power mode) V1, V2, and V8 on; V1 and V2 in normal (skip) operating mode V1, V2, V5, and V8 on (sleep power mode); V1 and V2 in normal (skip) operating mode V1, V2, V3, V4, V5, and V8 on (run power mode); V1, V2, V3, and V4 in normal (skip) operating mode V1, V2, V3, V4, V5, V6, V7, and V8 (all on); V1, V2, V3, and V4 in normal (skip) operating mode Undervoltage lockout, VIN = 2.2V Overvoltage lockout, VIN = 6.5V MIN 2.6 2.250 2.200 6.20 6.00 2.400 2.350 6.35 6.15 20 TYP MAX 6.0 2.550 2.525 6.50 6.30 UNITS V V V 50 90 Input Current IIN+ No load; IPV1+IPV2+ SDA = SCL = V8 IPV3+IPV4+ IIN5+ IIN67+ IIN8 A 140 250 1.5 25 4 _______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications ELECTRICAL CHARACTERISTICS (continued) (VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 2) PARAMETER PWM Switching Frequency SYMBOL fSW CONDITIONS MIN 1.9 3.250 2.955 2.807 2.463 1.970 1.773 TYP 2.0 3.300 3.000 2.850 2.500 2.000 1.800 -1.5 0.15 0.01 150 200 0.12 0.15 1.5 1.8 25 Forced-PWM mode only IOUT1 2.6V VPV1 6V (Note 5) VPV1 = 6V, LX1 = PG1 or PV1, VEN1 = 0V TA = +25C TA = +85C 5 3 1.2 5 -2 0.03 0.2 7 5 350 650 Forced-PWM mode only, min duty cycle in skip mode is 0% 16.7 100 9 7 +2 A -975 2.2 MAX 2.1 3.350 3.045 2.893 2.538 2.030 1.827 V UNITS MHz MAX8660/MAX8660A/MAX8661 REG1--SYNCHRONOUS STEP-DOWN DC-DC CONVERTER (MAX8660, MAX8660A only) SET1 = IN, VPV1 = 4.2V, load = 600mA V1 Voltage SET1 not connected = VPV1 = 3.6V, V1 Accuracy--MAX8860 load = 600mA SET1 = AGND, VPV1 = 3.6V, load = 600mA SET1 = IN, VPV1 = 4.2V, load = 600mA V1 Voltage V1 SET1 not connected, VPV1 = 3.6V, 600mA Accuracy--MAX8660A SET1 = AGND, 3.6V, load = 600mA V1 Load Regulation Load = 0 to 1200mA V1 Line Regulation SET1 Input Leakage Current V1 Dropout Voltage p-Channel On-Resistance n-Channel On-Resistance p-Channel Current-Limit Threshold n-Channel Zero-Crossing Threshold n-Channel Negative Current Limit REG1 Maximum Output Current V1 Bias Current LX1 Leakage Current Load = 800mA (Notes 3, 4) Load = 1200mA (Notes 3, 4) V %/A %/V A mV A mA mA A A Soft-Start Ramp Rate--MAX8660 Soft-Start Ramp Rate-- MAX8660A V5 to V1 Enable Time Internal Off-Discharge Resistance Minimum Duty Cycle Maximum Duty Cycle tVMHVSH1 To V1 = 3.3V (total ramp time is 450s for all V1 output voltages) To V1 = 2.5V (total ramp time is 450s for all V1 output voltages) Figure 6 mV/s mV/s s % % _______________________________________________________________________________________ 5 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 ELECTRICAL CHARACTERISTICS (continued) (VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN 3.250 2.463 1.773 2.463 1.970 1.773 TYP 3.300 2.500 1.800 2.500 2.000 1.800 -1.7 0.15 0.01 Load = 900mA (Notes 3, 4) 225 0.18 0.15 1.10 Forced-PWM mode only IOUT2 2.6V VPV2 6V (Note 5) VPV2 = 6V, LX2 = PG2 or PV2, VEN2 = 0V TA = +25C TA = +85C 2 0.9 5 -2 0.03 0.2 4 350 650 Forced-PWM mode only; min duty cycle in skip mode is 0% 16.7 100 6 mV/s s % % +2 A 1.30 25 -800 1.50 MAX 3.350 2.538 1.827 2.538 2.030 1.827 %/A %/V A mV A mA mA A A V V UNITS REG2--SYNCHRONOUS STEP-DOWN DC-DC CONVERTER SET2 = IN, VPV2 = 4.2V, load = 600mA V2 Voltage Accuracy--MAX8660 V2 SET2 not connected, VPV2 = 3.6V, load = 600mA SET2 = AGND, VPV2 = 3.6V, load = 600mA SET2 = IN, VPV2 = 4.2V, load = 600mA V2 Voltage Accuracy--MAX8660A V2 SET2 not connected, VPV2 = 3.6V, load = 600mA SET2 = AGND, VPV2 = 3.6V, load = 600mA V2 Load Regulation V2 Line Regulation SET2 Input Leakage Current V2 Dropout Voltage p-Channel On-Resistance n-Channel On-Resistance p-Channel Current-Limit Threshold n-Channel Zero Crossing Threshold n-Channel Negative Current Limit REG2 Maximum Output Current V2 Bias Current LX2 Leakage Current Load = 0 to 900mA Soft-Start Ramp Rate V5 to V2 Enable Time Internal Off-Discharge Resistance Minimum Duty Cycle Maximum Duty Cycle To V2 = 1.8V (total ramp time is 450s for all V2 output voltages) tVMHVSH2 Figure 6 REG3--SYNCHRONOUS STEP-DOWN DC-DC CONVERTER REG3 default output voltage, VPV3 = 3.6V, load = 600mA V3 Output Voltage Accuracy V3 REG3 serial programmed from 0.9V to 1.8V, load = 600mA (Note 6) V3 Load Regulation V3 Line Regulation p-Channel On-Resistance n-Channel On-Resistance Load = 0 to 1600mA (Note 7) 1.379 -1.5 1.400 1.421 +1.5 V % mV/A %/V -17 0.05 0.12 0.08 6 _______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications ELECTRICAL CHARACTERISTICS (continued) (VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 2) PARAMETER p-Channel Current-Limit Threshold n-Channel Zero-Crossing Threshold n-Channel Negative Current Limit REG3 Maximum Output Current V3 Bias Current LX3 Leakage Current Soft-Start Ramp Rate V3 Dynamic-Change Ramp Rate EN34 to V3 Enable Time Internal Off-Discharge Resistance Minimum Duty Cycle Maximum Duty Cycle REG4--SYNCHRONOUS STEP-DOWN DC-DC CONVERTER REG4 default output voltage, VPV3 = 3.6V, load = 200mA REG4 serial programmed from 0.9V to 1.8V, load = 200mA (Note 6) Load = 0 to 400mA (Note 7) 1.379 -1.5 -40 0.1 0.37 0.3 0.05 Forced-PWM mode only IOUT4 2.6V VPV3 6V (Note 5) VPV4 = 6V, TA = +25C LX4 = PG4 or PV4, TA = +85C VEN34 = 0V RRAMP = 56k to 1.4V RRAMP = 56k tPHLVTH4 Powering up to 1.4V, Figure 6, RRAMP = 56k Forced-PWM mode only, min duty cycle in skip mode is 0% 0.4 0.01 -2 0.02 0.12 8 10 400 550 16.7 100 mV/s mV/s s % % +2 A 0.78 25 -975 0.90 1.400 1.421 +1.5 V % mV/A %/V A mA mA A A Forced-PWM mode only, min duty cycle in skip mode is 0% tPHLVTH3 VPV3 = 6V, LX3 = PG3 or PV3, VEN34 = 0V RRAMP = 56k to 1.4V RRAMP = 56k Powering up to 1.4V, Figure 6, RRAMP = 56k TA = +25C TA = +85C -2 IOUT3 Forced-PWM mode only 2.6V VPV3_ 6V (Note 5) 1.6 0.01 +0.03 0.24 8 10 400 550 16.7 100 mV/s mV/s s % % +2 A SYMBOL CONDITIONS MIN 1.85 TYP 2.15 25 -0.8 MAX 2.45 UNITS A mA A A A MAX8660/MAX8660A/MAX8661 V4 Output Voltage Accuracy V4 V4 Load Regulation V4 Line Regulation p-Channel On-Resistance n-Channel On-Resistance p-Channel Current-Limit Threshold n-Channel Zero-Crossing Threshold n-Channel Negative Current Limit REG4 Maximum Output Current V4 Bias Current LX4 Leakage Current Soft-Start Ramp Rate V4 Dynamic-Change Ramp Rate EN34 to V4 Enable Time Internal Off-Discharge Resistance Minimum Duty Cycle Maximum Duty Cycle _______________________________________________________________________________________ 7 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 ELECTRICAL CHARACTERISTICS (continued) (VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 2) PARAMETER REG5 LDO IN5 Input Voltage Range SYMBOL VIN5 REG5 default output voltage, 2.35V VIN5 6V, load = 0 to 200mA V5 Output Voltage V5 REG5 serial programmed from 1.7V to 2.0, 2.35V VIN5 6V, load = 0 to 200mA V5 Output Current Limit V5 Output-Voltage Noise V5 Power-Supply Rejection V5 Soft-Start Ramp Rate EN5 to V5 Enable Time V5 Dynamic-Change Ramp Rate Internal Off-Discharge Resistance REG6, REG7 LDOs IN67 Input Voltage Range REG6 and REG7 Output Voltage (POR Default to 0V, Set by Serial Input) V6, V7 Dropout Voltage V6, V7 Output Current Limit V6, V7 Soft-Start Ramp Rate Internal Off-Discharge Resistance REG8 ALWAYS-ON LDO V8 Output Voltage V8 Dropout Voltage V8 Output Current Limit Internal Off-Discharge Resistance LOW-BATTERY DETECTOR (LBF, LBR, LBO) Low-Battery Falling Threshold Low-Battery Rising Threshold LBO, RSO Output-High Leakage Current LBO Output Low Level Minimum VIN for LBO Assertion VLBFTH VLBRTH VIN = 6V, TA = +25C 2.6V VIN 6V, sinking 3mA VIN = 1V, sinking 100A LBO is forced low when the device is in UVLO 1 1.182 1.231 1.200 1.250 1.218 1.268 0.2 0.2 0.4 V V A V V IOUT8 V8 Load = 0 to 15mA Load = 30mA Load = 15mA (Note 3) V8 = 2.5V 30 3.168 2.800 3.300 3.2 180 70 1.5 135 3.432 3.432 V mV mA k IOUT6 IOUT7 VIN67 V6 V7 Setting from 1.8V to 3.3V in 0.1V steps, load = 0 to 300mA 3V mode, load = 300mA (Note 3) VIN67 = 3.6V Powering up to 3.3V, (total ramp time is 450s for all V6/V7 output voltages) 5 2.35 -3 55 750 7 350 9 VIN +3 100 V % mV mA mV/s tSEHVMH IOUT5 10Hz to 100kHz, IOUT5 = 10mA VIN5 = (V5 + 1V), IOUT5 = 10mA, f = 10kHz Powering up to 1.8V (total ramp time is 225s for all V5 output voltages) Figure 6 RRAMP = 56k 5 -2 225 350 160 40 7 290 10 2 9 +2 500 % mA VRMS dB mV/s s mV/s k CONDITIONS MIN 2.35 1.764 1.800 TYP MAX VIN 1.836 UNITS V V 8 _______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications ELECTRICAL CHARACTERISTICS (continued) (VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 2) PARAMETER LBO Deassert Delay LBF and LBR Input Bias Current RESET (MR, RSO) RSO Threshold RSO Deassert Delay RSO Output-High Leakage Current RSO Output Low Level Minimum VIN for RSO Assertion MR Input High Level MR Input Low Level MR Input Leakage Current MR Minimum Pulse Width THERMAL-OVERLOAD PROTECTION Thermal-Shutdown Temperature Thermal-Shutdown Hysteresis ENABLE INPUTS (EN1, EN2, EN34, EN5) EN_ Input High Level EN_ Input Low Level EN_ Input Leakage Current I2C LOGIC (SDA, SCL, SRAD) SCL, SDA Input High Voltage SCL, SDA Input Low Voltage SCL, SDA Input Hysteresis SCL, SDA Input Current SDA Output Low Voltage SRAD Input High Level SRAD Input Low Level SRAD Input Leakage Current TA = +25C, IN = AGND, VIN = 6V 2.6V VIN 6V, sinking 3mA 2.6V VIN 6V 2.6V VIN 6V VIN = 6V, TA = +25oC -0.2 1.4 0.4 +0.2 -10 0.1 +10 0.2 1.4 0.4 V V V A V V V A 2.6V VIN 6V 2.6V VIN 6V VIN = 6V, TA = +25C -0.2 1.4 0.4 +0.2 V V A TJ rising +160 15 C C tMR VRSOTH tVBHRSTH Voltage on V8, falling, hysteresis is 5% (typ) Figure 6 VIN = 6V, TA = +25C 2.6V VIN 6V, sinking 3mA VIN = 1V, sinking 100A RSO is forced low when the device is in UVLO 2.6V VIN 6V 2.6V VIN 6V VIN = 6V, TA = +25C -0.2 1 1 1.4 0.4 +0.2 2.1 20 2.2 24 2.3 28 0.2 0.2 0.4 V ms A V V V V A s SYMBOL tVBHBFH Figure 6 TA = +25C TA = +85C CONDITIONS MIN 0 -50 TYP 3 0 0.5 +50 MAX UNITS s nA MAX8660/MAX8660A/MAX8661 _______________________________________________________________________________________ 9 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 ELECTRICAL CHARACTERISTICS (continued) (VIN = VIN5 = VIN67 = VIN8 = 3.6V, Figure 3, TA = -40C to +85C, unless otherwise noted. Typical values are at TA = +25C.) (Note 2) PARAMETER I2C TIMING Clock Frequency Hold Time (Repeated) START Condition CLK Low Period CLK High Period Set-Up Time for a Repeated START Condition DATA Hold Time DATA Set-Up Time Set-Up Time for STOP Condition Bus-Free Time Between STOP and START Maximum Pulse Width of Spikes that Must Be Suppressed by the Input Filter of Both DATA and CLK Signals SYMBOL fSCL tHD;STA tLOW tHIGH tSU;STA tHD;DAT tSU;DAT tSU;STO tBUF Figure 8 Figure 9 Figure 9 Figure 8 Figure 8 0.6 1.3 0.6 0.6 0 100 0.6 1.3 CONDITIONS MIN TYP MAX 400 UNITS kHz s s s s s ns s s 50 ns Note 2: Limits are 100% production tested at TA = +25C. Limits over the operating temperature range are guaranteed through correlation using statistical quality control (SQC) methods. Note 3: The dropout voltage is defined as VIN - VOUT when VOUT is 100mV below the nominal value of VOUT. Note 4: Dropout voltage (VDO) is a function of the p-channel switch resistance (RPCH) and the inductor resistance (RL). The given values assume RL = 50m for the REG1 inductor and 67m for the REG2 inductor: VDO = ILOAD (RP + RL) Note 5: The maximum output current (IOUT(MAX)) is: V (1 - D) I LIM - OUT 2 x f xL I OUT(MAX) = (1 - D) 1 + (RN + RL ) 2 x f xL where: RN = n-channel synchronous rectifier RDS (on) RP = p-channel power switch RDS (on) RL = external inductor ESR IOUT(MAX) = maximum output current provided by the PMIC IOUT(TARGET) = maximum desired output current f = operating frequency minimum L = external inductor value Note 6: Tested at 1.4V, default output voltage. Note 7: All output voltages are possible in normal mode. In forced-PWM mode, the minimum output voltage is limited by 0.167 x VIN. For example, with VIN = 5.688V, the minimum output is 0.95V. 10 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Typical Operating Characteristics (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) QUIESCENT CURRENT vs. INPUT VOLTAGE MAX8660/61 toc01 MAX8660/MAX8660A/MAX8661 SWITCHING FREQUENCY vs. INPUT VOLTAGE 2.4 SWITCHING FREQUENCY (MHz) 2.3 2.2 2.1 2.0 1.9 1.8 1.7 1.6 1.5 MAX8660 toc02 100 90 80 INPUT CURRENT (A) 70 60 50 40 30 20 10 0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 SDA = SDL = V8 REG1-REG7 DISABLED REG8 IS ALWAYS ON 2.5 6.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 6.0 SWITCHING FREQUENCY vs. TEMPERATURE MAX8660 toc03 EN1/EN2/EN5 ENABLE RESPONSE MAX8660 toc04 2.3 2.2 2.1 EN1/EN2/EN5 5V/div SWITCHING FREQUENCY (MHz) 1V/div V2 1V/div V5 2.0 1.9 1.8 1.7 -40 -15 10 35 TEMPERATURE (C) 60 85 100s/div 1V/div V1 EN34 ENABLE RESPONSE MAX8660 toc05 EN34 2V/div 500mV/div V3 500mV/div V4 RRAMP = 56k 100s/div ______________________________________________________________________________________ 11 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Typical Operating Characteristics (continued) (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) REG1 EFFICIENCY vs. LOAD CURRENT 95 90 EFFICIENCY (%) 85 80 75 70 65 60 55 50 0.01 0.1 1 10 100 1000 10,000 LOAD CURRENT (mA) VIN = 4.2V VIN = 3.6V V1 = 3.3V L1 = 1.2H (TOKO DE2812C) FORCED-PWM NORMAL MAX8660 toc06 REG1 OUTPUT VOLTAGE vs. INPUT VOLTAGE DROPOUT ILOAD = 10mA MAX8660 toc07 REG1 LINE TRANSIENT MAX8660 toc08 100 3.6 3.4 OUTPUT VOLTAGE (V) 3.2 3.0 2.8 2.6 2.4 5.0V VIN 3.6V 1V/div ILOAD = 1000mA V1 600mA LOAD, V1 = 3.3V 6.0 40s/div 100mV/div 3.3V OUTPUT 2.2 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 REG1 LOAD REGULATION MAX8660 toc09 REG1 OUTPUT VOLTAGE vs. TEMPERATURE MAX8660 toc10 REG1 DROPOUT VOLTAGE vs. LOAD CURRENT MAX8660 toc11 3.40 3.38 3.36 OUTPUT VOLTAGE (V) 3.34 3.32 3.30 3.28 3.26 3.24 3.22 3.20 0 3.40 3.38 3.36 OUTPUT VOLTAGE (V) 3.34 3.32 3.30 3.28 3.26 3.24 VIN = 3.8V 300 250 DROPOUT VOLTAGE (mV) 200 150 100 50 THE NOMINAL ESR OF TOKO'S 1.2 H DE2812C INDUCTOR IS 44m. THE NOMINAL p-CHANNEL RESISTANCE OF THE REG1 IS 120m. THE SLOPE OF THIS LINE SHOWS THAT THE TOTAL REG1 DROPOUT RESISTANCE OF AN AVERAGE PART, BOARD, INDUCTOR COMBINATION IS 172m. -1.5%/A FORCED-PWM NORMAL 200 400 600 800 LOAD CURRENT (mA) 1000 1200 3.22 3.20 -40 -15 600mA LOAD 0 10 35 TEMPERATURE (C) 60 85 0 200 400 600 800 LOAD CURRENT (mA) 1000 1200 REG1 LOAD TRANSIENT MAX8660 toc12 REG 1 HEAVY-LOAD SWITCHING WAVEFORMS MAX8660 toc13 REG1 LIGHT-LOAD SWITCHING WAVEFORMS MAX8660 toc14 V1 V1 = 3.3V 3.8V INPUT 100mV/div VLX1 2V/div VLX1 2V/div V1 800mA IV1 10mA 500mV/div IL1 4.2V INPUT 1A LOAD 40s/div 400ns/div 2mV/div V1 20mV/div 1A/div 0A IL1 200mA/div 0A 3.8V INPUT, 20mA LOAD 2s/div 12 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Typical Operating Characteristics (continued) (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) REG2 EFFICIENCY vs. LOAD CURRENT 90 85 EFFICIENCY (%) 80 75 70 65 60 55 50 0.01 0.1 1 10 100 LOAD CURRENT (mA) 1000 L2 = 2.0H (TOKO DE2812C) V2 = 1.8V 1.65 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 6.0 VIN = 4.2V VIN = 3.6V FORCED-PWM NORMAL MAX8660 toc15 MAX8660/MAX8660A/MAX8661 REG2 OUTPUT VOLTAGE vs. INPUT VOLTAGE MAX8660 toc16 REG2 LINE TRANSIENT MAX8660 toc17 95 1.95 1.90 10mA LOAD OUTPUT VOLTAGE (V) 1.85 1.80 1.75 1.70 800mA LOAD 5.0V VIN 3.6V 1V/div V2 450mA LOAD, V2 = 1.8V 40s/div 100mV/div REG2 LOAD REGULATION MAX8660 toc18 REG2 OUTPUT VOLTAGE vs. TEMPERATURE MAX8660 toc19 REG2 DROPOUT VOLTAGE vs. LOAD CURRENT THE NOMINAL ESR OF TOKO'S 2.0 H DE2812C INDUCTOR IS 67m. THE NOMINAL p-CHANNEL RESISTANCE OF THE REG2 IS 180m. THE SLOPE OF THIS LINE SHOWS THAT THE TOTAL REG2 DROPOUT RESISTANCE OF AN AVERAGE PART, BOARD, INDUCTOR COMBINATION IS 255m. MAX8660 toc20 1.85 VIN = 3.6V 1.83 OUTPUT VOLTAGE (V) -1.7%/A 1.81 1.90 1.88 1.86 OUTPUT VOLTAGE (V) 1.84 1.82 1.80 1.78 1.76 1.74 800mA LOAD 300 250 DROPOUT VOLTAGE (mV) 200 150 100 50 0 1.79 1.77 FORCED-PWM NORMAL 1.75 0 200 400 600 LOAD CURRENT (mA) 800 1.72 1.70 -40 -15 10 35 TEMPERATURE (C) 60 85 0 200 400 600 800 LOAD CURRENT (mA) 1000 REG2 LOAD TRANSIENT MAX8660 toc21 REG2 HEAVY-LOAD SWITCHING WAVEFORMS MAX8660 toc22 REG2 LIGHT-LOAD SWITCHING WAVEFORMS MAX8660 toc23 VLX2 V2 100mV/div 2V/div VLX2 2V/div 600mA V2 2mV/div V2 20mV/div IV2 10mA V2 = 1.8V 20s/div 200mA/div IL2 800mA LOAD 400ns/div 1A/div 0A IL2 30mA LOAD 2s/div 200mA/div 0A ______________________________________________________________________________________ 13 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Typical Operating Characteristics (continued) (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) REG3 EFFICIENCY vs. LOAD CURRENT 85 80 EFFICIENCY (%) 75 70 65 60 55 50 0.01 0.1 1 10 100 LOAD CURRENT (mA) 1000 10,000 VIN = 3.6V V3 = 1.4V L3 = 1.2H (TOKO DE2812C) VIN = 4.2V FORCED-PWM NORMAL MAX8660 toc24 REG3 OUTPUT VOLTAGE vs. INPUT VOLTAGE MAX8660 toc25 REG3 LINE TRANSIENT MAX8660 toc26 90 1.45 1.44 1.43 OUTPUT VOLTAGE (V) 1.42 1.41 1.40 1.39 1.38 1.37 1.36 1.35 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 ILOAD = 1000mA 5.0V VIN 3.6V 1V/div V3 800mA LOAD, V3 = 1.4V 6.0 40s/div 50mV/div REG3 LOAD REGULATION MAX8660 toc27 REG3 OUTPUT VOLTAGE vs. TEMPERATURE MAX8660 toc28 REG3 VOLTAGE CHANGE RESPONSE MAX8660 toc29 1.44 1.43 OUTPUT VOLTAGE (V) 1.42 VIN = 3.6V FORCED-PWM NORMAL 1.50 1.48 1.46 OUTPUT VOLTAGE (V) 1.44 1.42 1.40 1.38 1.36 1.34 RRAMP = 56k V3 RISING 0.725V 1.8V 500mV/div RRAMP = 248k 1.41 1.40 1.39 1.38 1.37 1.36 0 200 400 600 800 1000 1200 1400 1600 LOAD CURRENT (mA) 1.8V V3 FALLING RRAMP = 56k ILOAD = 1000mA -40 -15 10 35 TEMPERATURE (C) 60 85 ACTIVE RAMP-DOWN ENABLED 100s/div RRAMP = 248k 500mV/div 0.725V 1.32 1.30 REG3 LOAD TRANSIENT MAX8660 toc30 REG3 HEAVY-LOAD SWITCHING WAVEFORMS MAX8660 toc31 REG3 LIGHT-LOAD SWITCHING WAVEFORMS MAX8660 toc32 V3 50mV/div VLX3 2V/div VLX3 2V/div 900mA V3 IL3 2mV/div V3 20mV/div IV3 10mA 500mV/div 1500mA LOAD 20s/div 400ns/div 1A/div 0A IL3 200mA/div 0A 30mA LOAD 2s/div 14 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Typical Operating Characteristics (continued) (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) REG4 EFFICIENCY vs. LOAD CURRENT MAX8660 toc33 REG4 OUTPUT VOLTAGE vs. INPUT VOLTAGE ILOAD = 300mA 1.41 OUTPUT VOLTAGE (V) 1.40 1.39 1.38 1.37 1.36 V4 MAX8660 toc34 REG4 LINE TRANSIENT MAX8660 toc35 95 90 85 EFFICIENCY (%) 80 75 70 65 60 55 50 0.01 0.1 1 10 100 LOAD CURRENT (mA) L4 = 4.7H (TOKO DE2812C) V4 = 1.4V VIN = 4.2V VIN = 3.6V FORCED-PWM NORMAL 1.42 5.0V VIN 3.6V 1V/div 10mV/div 200mA LOAD, V5 = 1.4V 1.35 1000 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 6.0 40s/div REG4 LOAD REGULATION MAX8660 toc36 REG4 OUTPUT VOLTAGE vs. TEMPERATURE MAX8660 toc37 REG4 VOLTAGE CHANGE RESPONSE MAX8660 toc38 1.44 1.43 OUTPUT VOLTAGE (V) 1.42 VIN = 3.6V FORCED-PWM NORMAL 1.50 400mA LOAD 1.45 OUTPUT VOLTAGE (V) 1.40 1.35 1.30 1.25 1.20 RRAMP = 56k V4 RISING 0.725V 1.8V 500mV/div RRAMP = 248k 1.41 1.40 1.39 1.38 1.37 1.36 0 100 200 300 LOAD CURRENT (mA) 400 1.8V V4 FALLING RRAMP = 56k ACTIVE RAMP-DOWN ENABLED -40 -15 10 35 TEMPERATURE (C) 60 85 100s/div RRAMP = 248k 500mV/div 0.725V REG4 LOAD TRANSIENT RESPONSE MAX8660 toc39 REG4 HEAVY-LOAD SWITCHING WAVEFORMS MAX8660 toc40 REG4 LIGHT-LOAD SWITCHING WAVEFORMS MAX8660 toc41 VLX4 V4 50mV/div 2V/div VLX4 2V/div V4 350mA IL4 IV4 10mA 200mV/div 20s/div 400ns/div 2mV/div V4 20mV/div 200mA/div I L4 200mA LOAD 0A 2s/div 18mA LOAD 200mA/div 0A ______________________________________________________________________________________ 15 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Typical Operating Characteristics (continued) (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) REG5 OUTPUT VOLTAGE vs. INPUT VOLTAGE MAX8660 toc42 REG5 OUTPUT VOLTAGE vs. LOAD CURRENT MAX8660 toc43 REG5 OUTPUT VOLTAGE vs. TEMPERATURE 100mA LOAD 1.82 OUTPUT VOLTAGE (V) 1.81 1.80 1.79 1.78 1.77 MAX8660 toc44 1.83 100mA LOAD 1.82 OUTPUT VOLTAGE (V) 1.81 1.80 1.79 1.78 1.77 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 1.83 1.82 OUTPUT VOLTAGE (V) 1.81 1.80 1.79 1.78 1.77 1.83 6.0 0 50 100 150 LOAD CURRENT (mA) 200 -40 -15 10 35 TEMPERATURE (C) 60 85 REG5 LINE TRANSIENT MAX8660 toc45 REG5 LOAD TRANSIENT RESPONSE MAX8660 toc46 REG5 VOLTAGE CHANGE RESPONSE MAX8660 toc47 100mA LOAD VIN 3.6V 5.0V V5 1V/div 50mV/div RRAMP = 56k 2.0V 100mV/div V5 20mV/div 1.725V IV5 180mA 10mA 100mA LOAD, V5 = 1.8V 20s/div V5 100mA LOAD, V5 = 1.8V 40s/div 100mA/div 40s/div REG5 OUTPUT NOISE SPECTRAL DENSITY vs. FREQUENCY MAX8660 toc48 REG5 OUTPUT NOISE (0.1Hz TO 10Hz) MAX8660 toc49 REG5 PSRR vs. FREQUENCY RLOAD = 180 70 60 MAX8660 toc50 10,000 80 NOISE DENSITY (nV/(Hz)) 1000 PSRR (dB) 10V/div 100 50 40 30 20 10 10 0.01 0.1 1 10 FREQUENCY (kHz) 100 1s/div 0 0.01 0.1 1 10 FREQUENCY (kHz) 100 16 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Typical Operating Characteristics (continued) (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) REG6/REG7 OUTPUT VOLTAGE vs. INPUT VOLTAGE MAX8660 toc51 MAX8660/MAX8660A/MAX8661 REG6/REG7 OUTPUT VOLTAGE vs. LOAD CURRENT MAX8660 toc52 REG6/REG7 OUTPUT VOLTAGE vs. TEMPERATURE 1.88 1.86 OUTPUT VOLTAGE (V) 1.84 1.82 1.80 1.78 1.76 1.74 300mA LOAD MAX8660 toc53 1.83 1.82 OUTPUT VOLTAGE (V) 1.81 1.80 1.79 1.78 1.77 100mA LOAD 3.5 1.90 3.0 OUTPUT VOLTAGE (V) 4.2V INPUT 3.3V OUTPUT 2.5 2.0 1.5 2.4V INPUT 1.8V OUTPUT 1.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 6.0 0 100 200 300 400 500 600 700 800 900 LOAD CURRENT (mA) 1.72 1.70 -40 -15 10 35 TEMPERATURE (C) 60 85 REG6/REG7 LINE TRANSIENT MAX8660 toc54 REG6/REG7 LOAD TRANSIENT MAX8660 toc55 5.0V VIN 3.6V 1V/div V6/V7 50mV/div 300mA V6/V7 20mV/div IV6/IV7 10mA 100mA/div 300mA LOAD, V6/V7 = 1.8V 40s/div V6/V7 = 1.8V 10s/div REG6/REG7 ENABLE WAVEFORM MAX8660 toc56 REG6/REG7 DROPOUT OUTPUT VOLTAGE vs. LOAD CURRENT 2V/div DROPOUT VOLTAGE (mV) THE SLOPE OF THESE LINES SHOWS THAT THE REG6/REG7 DROPOUT RESISTANCE OF AN AVERAGE PART MOUNTED ON THE MAXIM EVALUATION KIT IS 205m. 3.0V OUTPUT MAX8660 toc57 140 120 100 80 60 40 20 0 I2C ENABLE SIGNAL VSDA 60s 500mV/div V6/V7 3.3V OUTPUT 100s/div 0 100 200 300 400 LOAD CURRENT (mA) 500 ______________________________________________________________________________________ 17 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Typical Operating Characteristics (continued) (Circuit of Figure 3, VIN = 3.6V, TA = +25C, unless otherwise noted.) REG8 OUTPUT VOLTAGE vs. INPUT VOLTAGE 3.4 3.2 OUTPUT VOLTAGE (V) 3.0 2.8 2.6 2.4 2.2 2.0 2.5 3.0 3.5 4.0 4.5 5.0 INPUT VOLTAGE (V) 5.5 6.0 V8 (V) 5mA LOAD MAX8660 toc58 REG8 LOAD REGULATION 3.8 3.6 3.4 3.2 3.0 2.8 2.6 2.4 2.2 2.0 0 10 20 30 40 50 60 LOAD CURRENT (mA) 70 80 VIN = 3.6V MAX8660 toc59 MAX8660 toc61 4.0 REG8 OUTPUT VOLTAGE vs. TEMPERATURE MAX8660 toc60 REG8 LINE TRANSIENT 5.0V VIN 3.6V 1V/div 3.40 3.38 3.36 OUTPUT VOLTAGE (V) 3.34 3.32 3.30 3.28 3.26 3.24 3.22 3.20 -40 -15 10 35 TEMPERATURE (C) 60 5mA LOAD 50mV/div V8 10mA LOAD 85 40s/div REG8 LOAD TRANSIENT MAX8660 toc62 REG8 DROPOUT VOLTAGE vs. LOAD CURRENT 350 DROPOUT VOLTAGE (mV) 50mV/div 300 250 200 150 100 50 0 0 5 10 15 20 LOAD CURRENT (mA) 25 30 THE SLOPE OF THIS LINE SHOWS THAT THE REG8 DROPOUT RESISTANCE OF AN AVERAGE PART MOUNTED ON THE MAXIM EVALUATION KIT IS 12.4. MAX8660 toc63 400 V8 15mA IV8 5mA 10mA/div 10s/div 18 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Pin Description PIN NAME MAX8660 MAX8661 1 IN5 IN5 REG5 Power Input. Connect IN5 to IN to ensure V5 rises first to meet Intel sequencing requirements. If adherence to Intel specifications is not required, IN5 can be connected to V1, V2, or another supply between 2.35V and VIN. See the Linear Regulators (REG5-REG8) section for more information. REG5 Linear-Regulator Output. V5 defaults to 1.8V and is adjustable from 1.7V to 2.0V through the serial interface. The input to the V5 regulator is IN5. Use V5 to power VCC_MVT, VCC_BG, VCC_OSC13M, and VCC_PLL on Intel XScale processors. V5 is internally pulled to AGND through 2k when REG5 is shut down. REG4 Power Input. Connect a 4.7F ceramic capacitor from PV4 to PG4. All PV pins and IN must be connected together externally. REG4 Switching Node. Connect LX4 to the REG4 inductor. LX4 is high impedance when REG4 is shut down. REG4 Power Ground. Connect PG1, PG2, PG3, PG4, and AGND together. Refer to the MAX8660 EV kit data sheet for more information. REG2 Voltage Select Input. SET2 is a tri-level logic input. Connect SET2 to select the V2 output voltage as detailed in Table 4. The REG2 output voltage selected by SET2 is latched at the end of the REG2 soft-start period. Changes to SET2 after the startup period have no effect. REG6 Linear-Regulator Output. REG6 is activated and programmed through the serial interface to output from 1.8V to 3.3V in 0.1V steps. REG6 is off by default. V6 is internally pulled to AGND through 350 when REG6 is shut down. V6 optionally powers VCC_CARD1 on Intel XScale processors. REG6 and REG7 Power Input. IN67 is typically connected to IN. IN67 can also be connected to any supply between 2.35V to VIN. REG6 Power Input. IN6 is typically connected to IN. IN6 can also be connected to any supply between 2.35V to VIN. REG7 Linear-Regulator Output. REG7 is activated and programmed through the serial interface to output from 1.8V to 3.3V in 0.1V steps. REG7 is off by default. V7 is internally pulled to AGND through 350 when REG7 is shut down. V7 optionally powers VCC_CARD2 on Intel XScale processors. No Internal Connection REG2 Voltage Sense Input. Connect V2 directly to the REG2 output voltage. The output voltage of REG2 is selected by SET2. V2 is internally pulled to AGND through 650 when REG2 is shut down. V2 powers VCC_MEM on Intel XScale processors. Serial-Clock Input. See the I 2C Interface section. Serial-Data Input. See the I 2C Interface section. Low-Battery Output. LBO is an open-drain output that pulls low when LBF is below its threshold. LBO typically connects to the nBATT_FAULT input of the Intel XScale processor to indicate that the battery has been removed or discharged. REG2 Power Input. Connect a 4.7F ceramic capacitor from PV2 to PG2. All PV pins and IN must be connected together externally. REG2 Switching Node. Connect LX2 to the REG2 inductor. LX2 is high impedance when REG2 is shut down. REG2 Power Ground. Connect PG1, PG2, PG3, PG4, and AGND together. Refer to the MAX8660 EV kit data sheet for more information. REG8 Input Power Connection. IN8 must be connected to IN. Main Battery Input. This input provides power to the IC. Connect a 0.47F ceramic capacitor from IN to AGND. FUNCTION 2 V5 V5 3 4 5 PV4 LX4 PG4 PV4 LX4 PG4 6 SET2 SET2 7 V6 V6 IN67 8 -- -- IN6 9 V7 -- -- N.C. V2 SCL SDA LBO 10 11 12 13 V2 SCL SDA LBO 14 15 16 17 18 PV2 LX2 PG2 IN8 IN PV2 LX2 PG2 IN8 IN ______________________________________________________________________________________ 19 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Pin Description (continued) PIN 19 NAME MAX8660 MAX8661 AGND AGND Analog Ground. Connect PG1, PG2, PG3, PG4, and AGND together. Refer to the MAX8660 EV kit data sheet for more information. REG8 Always-On 3.3V LDO Output. REG8 is the first regulator that powers up in the MAX8660/MAX8661. REG8 is supplied from IN and supplies up to 30mA. V8 is internally pulled to AGND through 1.5k during IN undervoltage or overvoltage lockout. Connect V8 to VCC_BBATT on Intel XScale processors. Low-Battery Detect Falling Input. The LBF threshold is 1.20V. Connect LBF to LBR for 50mV hysteresis. Use a three-resistor voltage-divider for larger hysteresis. LBF sets the falling voltage at which LBO goes low. See the Low-Battery Detector (LBO, LBF, LBR) section for more information. Low-Battery Detect Rising Input. The LBR threshold is 1.25V. Connect LBF to LBR for 50mV hysteresis. Use a three-resistor voltage-divider for larger hysteresis. LBR sets the rising voltage at which LBO goes high. See the Low-Battery Detector (LBO, LBF, LBR) section for more information. Manual Reset Input. A low MR input causes RSO to go low and resets all serial programmed registers to their default values. See the Reset Output (RSO) and MR Input section for more information. Ramp-Rate Input. Connect a resistor from RAMP to AGND to set the regulator ramp rates. See the Ramp-Rate Control (RAMP) section for more information. REG5 Enable Input. Drive EN5 high to turn on REG5. EN5 has hysteresis so an RC can be used to implement manual sequencing with respect to other inputs. EN5 is typically driven by the SYS_EN output of an Intel XScale processor. REG3 Power Ground. Connect PG1, PG2, PG3, PG4, and AGND together. Refer to the MAX8660 EV kit data sheet for more information. REG3 Switching Node. Connect LX3 to the REG3 inductor. LX3 is high impedance when REG3 is shut down. REG3 Power Input. Connect a 4.7F ceramic capacitor from PV3 to PG3. All PV pins and IN must be connected together externally. Open-Drain Reset Output. RSO typically connects to the nRESET input on an Intel XScale processor. An output low from the MAX8660/MAX8661 RSO resets all serial programmed registers to their default values and causes the processor to enter its reset state. See the Reset Output (RSO) and MR Input section for more information. REG3 Voltage Sense Input. Connect V3 directly to the REG3 output voltage. The output voltage defaults to 1.4V and is adjustable from 0.725V to 1.8V through the serial interface. V3 is internally pulled to AGND through 550 when REG3 is shut down. V3 connects to VCC_APPS on Intel XScale processors. REG3 and REG4 Active-High Hardware Enable Input. Drive EN34 high to enable both REG3 and REG4. Drive EN34 low to allow the serial interface to enable REG3 and REG4 independently. EN34 has hysteresis so an RC can be used to implement manual sequencing with respect to other inputs. EN34 is typically driven by the PWR_EN output of an Intel XScale processor. See the REG3/REG4 Enable (EN34, EN3, EN4) section for more information. REG2 Enable Input. Drive EN2 high to turn on REG2. EN2 has hysteresis so that an RC can be used to implement manual sequencing with respect to other inputs. EN2 is typically driven by the SYS_EN output of an Intel XScale processor. Serial-Address Input. Connect SRAD to AGND for a 7-bit slave address of 0110 100 (0x68). Connect SRAD to IN to change the address to 0110 101 (0x6A). The eighth slave address bit is always zero since the MAX8660/MAX8661 are write-only. See the Slave Address section for more information. REG1 Power Ground. Connect PG1, PG2, PG3, PG4, and AGND together. Refer to the MAX8660 EV kit data sheet for more information. Ground. Connect all GND pins to EP. FUNCTION 20 V8 V8 21 LBF LBF 22 LBR MR RAMP LBR MR RAMP 23 24 25 EN5 EN5 26 27 28 PG3 LX3 PV3 PG3 LX3 PV3 29 RSO RSO 30 V3 V3 31 EN34 EN34 32 EN2 EN2 33 SRAD SRAD 34 PG1 -- -- GND 20 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Pin Description (continued) PIN NAME MAX8660 MAX8661 LX1 -- 36 PV1 -- EN1 -- V1 -- SET1 -- -- N.C. -- PV -- GND -- GND -- GND FUNCTION REG1 Switching Node. Connect LX1 to the REG1 inductor. LX1 is high impedance when REG1 is shutdown. No Internal Connection REG1 Power Input. Connect a 4.7F ceramic capacitor from PV1 to PG1. All PV pins and IN must be connected together externally. Power Input. All PV pins and IN must be connected together externally. REG1 Enable Input. Drive EN1 high to turn on REG1. EN1 has hysteresis so that an RC can be used to implement manual sequencing with respect to other inputs. EN1 is typically driven by the SYS_EN output of an Intel XScale processor. Ground. Connect all GND pins to EP. REG1 Voltage Sense Input. Connect V1 directly to the REG1 output voltage. The output voltage of REG1 is selected by SET1. Connect V1 to VCC_IOx for Intel XScale processors. V1 is internally pulled to AGND through 650 when REG1 is shut down. Ground. Connect all GND pins to EP. REG1 Voltage Select Input. SET1 is a tri-level logic input. Connect SET1 to select the V1 output voltage as detailed in Table 3. The REG1 output voltage selected by SET1 is latched at the end of the REG1 soft-start period. Changes to SET1 after the startup period have no effect. Ground. Connect all GND pins to EP. REG4 Feedback Sense Input. Connect V4 directly to the REG4 output voltage. The REG4 output voltage defaults to 1.4V and is adjustable from 0.725V to 1.8V with the serial interface. V4 is internally pulled to AGND through 550 when REG4 is shut down. V4 powers VCC_SRAM on Intel XScale processors. Exposed Pad. Connect the exposed pad to ground. Connecting the exposed pad to ground does not remove the requirement for proper ground connections to PG1, PG2, PG3, PG4, and AGND. The exposed pad is attached with epoxy to the substrate of the die, making it an excellent path to remove heat from the IC. MAX8660/MAX8660A/MAX8661 35 37 38 39 40 V4 V4 EP EP EP Detailed Description The MAX8660/MAX8661 PMICs are optimized for devices using the next-generation Intel XScale processors, including smart cellular phones, PDAs, Internet appliances, and other portable devices requiring substantial computing and multimedia capability and low power consumption. The MAX8660/MAX8661 comply with Intel XScale processor specifications. As shown in Figure 2, the MAX8660 integrates eight high-performance, low-operating-current power supplies. REG1-REG4 are step-down DC-DC converters, and REG5-REG8 are linear regulators. Other functions include low-battery detection (LBO), a reset output (RSO), a manual reset input (MR), and a 2-wire I2C serial interface. The MAX8661 functions the same as the MAX8660, but does not have the REG1 step-down regulator and the REG7 linear regulator. The operating input voltage range is from 2.6V to 6.0V, allowing use with a 1-cell Li+ battery, 3-cell NiMH, or a 5V input. Input protection is provided with undervoltage and overvoltage lockouts. Overvoltage lockout protects the device against inputs up to 7.5V. Maxim vs. Intel Terminology The MAX8660/MAX8661 are compatible with Intel's next-generation XScale processor. Figure 1 shows one of many possible connections between the Intel XScale processor and the MAX8660/MAX8661. To facilitate system development with Intel processors, this document uses both Maxim and Intel terminology. Intel terminology appears in parentheses and italics. For example, this document refers to "V8 (VCC_BBATT)" because the MAX8660 V8 output powers the Intel VCC_BBATT power domain. Tables 1 and 2 outline Maxim and Intel terminology. ______________________________________________________________________________________ 21 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 V1 3.3V AT 1200mA 15mA 5mA 1045mA AUXILIARY POWER PERIPHERALS 10mA VCC_I01 VCC_I03 VCC_I04 VCC_I06 VCC_LCD VCC_MSL VCC_DF VCC_CI VCC_MEM VCC_USB VCC_TSI INTEL XScale PROCESSOR MAX8660 135mA 25mA 50mA 50mA 55mA 20mA 160mA 50mA 35mA V2 1.8V AT 900mA 540mA V3 0.725V TO 1.8V (DEF 1.4V) AT 1600mA V4 0.725V TO 1.8V (DEF 1.4V) AT 400mA 40mA 200mA AUXILARY POWER PERIPHERALS MEMORY 1600mA 360mA AUXILIARY POWER IN VCC_APPS VCC_SRAM VCC_MVT VCC_BG V5 1.7V TO 2.0V (DEF 1.8V) AT 200mA VCC_OSC13M VCC_PLL V6 1.8V TO 3.3V (DEF 0V) AT 500mA 485mA V7 1.8V TO 3.3V (DEF 0V) AT 500mA 485mA V8 3.3V AT 30mA 25mA I2C EN1 EN2 EN5 EN34 V8 (VCC_BBATT) 15mA SD/CF MEMORY CARD 1 15mA SD/CF MEMORY CARD 2 5mA AUXILIARY POWER STANDARD I2C POWER I2C SDA {GPIO33} SCL {GPIO32} PWR_SDA PWR_SCL SYS_EN PWR_EN VCC_BBATT VCC_CARD2 VCC_CARD1 RSO LBO nRESET nBATT_FAULT Figure 1. Example MAX8660 Connection to Intel XScale Processor. This is one example only. Other connections are also supported. 22 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 BATT IN REF 1.25V PV1 BATTERY LBF (1.20V) UVLO OVLO AND BATT MON TO ALL BLOCKS OPEN-DRAIN LOW BATT OUT TO nBATT_FAULT LBO LX1 STEP-DOWN PWM REG1 ON PWM TO BATT LBR (1.25V) PG1 V1 SET1 V1, VCC_I0x, VCC_LCD, VCC_MSL, VDD_USB, VCC_DF, VDD_CI, VCC_TSI MAX8660; 3.3V, 3.0V, 2.85V MAX8660A; 2.5V, 2.0V, 1.8V 1200mA (MAX8660/MAX8660A ONLY) AGND MAX8660 MAX8661 LATCH PV2 EN1 FROM CPU SYS_EN TO IN V8, VCC_BBATT (3.3V 30mA, ALWAYS ON) EN2 IN8 V8 ON LX2 STEP-DOWN PWM REG2 LDO REG 8 HARDWARE RESET INPUT TO CPU nRESET MR RSO TO BATT PG2 V2 SET2 PV3 V2, VCC_MEM MAX8660/MAX8661; 3.3V, 2.5V, 1.8V MAX8660A; 2.5V, 2.0V, 1.8V 900mA PWM LATCH RESET V8 < 2.4V 20ms STEP-DOWN PWM REG3 RAMP TO BATT LX3 RAMP SET RATE RAMP ADJ 0.725V TO 1.8V PWM LDO REG 6 ON PG3 V3 V3, VCC_APPS 0.725V TO 1.8V (DEFAULT 1.4V) 1.6A V6, VCC_CARD1 0V/1.8-3.3V (DEFAULT 0V) 500mA V6 LOGICAL OR (FIGURE 5) IN67 (IN6) STEP-DOWN PWM REG4 RAMP LDO REG 7 ADJ 0.725V TO 1.8V PWM EN34 PV4 FROM CPU PWR_EN TO BATT TO V1, V2, OR IN V7, VCC_CARD2 0V/1.8-3.3V (DEFAULT 0V) 500mA (MAX8660/MAX8660A ONLY) V7 LX4 PG4 V4 V4, VCC_SRAM 0.725V TO 1.8V (DEFAULT 1.4V) 400mA VCC_IOx IN5 ADJ 1.7V TO 2.0V RAMP LDO REG 5 EN5 SRAD EP ( ) ARE FOR THE MAX8661 AGND PGND FROM CPU SYS_EN V5 TO IN, V1 OR V2 V5, VCC_MVT, VCC_BG, 1.7V TO 2.0V (DEFAULT 1.8V) 200mA SCL SDA I2C SERIAL INTERFACE Figure 2. Functional Diagram ______________________________________________________________________________________ 23 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 2.6V TO 6.0V INPUT IN R10 20 C22 0.47F 21 LBF R2 80.6k 22 LBR V8 R3 1M 19 AGND PV2 13 37 EN1 EN2 EN34 EN5 SET1 SET2 32 31 25 39 6 33 C21 0.1F V8 V8 R6 300k MR S1 V8 R7 300k 29 RSO 24 R4 56k 12 11 RSO RAMP SDA SCL V7 9 C16 4.7F 2 7 8 IN C20 1F C17 4.7F V7 C13 2.2F V6 23 MR C10 0.1F EN1 EN2 V2 EN34 EN5 SET1 LX3 SET2 SRAD PG3 V3 PV4 27 26 30 3 IN C18 4.7F 4 5 40 IN IN5 1 C19 1F V5 V5 V6 IN67 C8 10F C9 10F L4 4.7H V4 C3 10F C4 10F C5 10F PV3 28 10 IN C12 4.7F L3 1.2H V3 LX2 PG2 LBO 15 16 C7 10F C6 10F U1 18 IN IN PV1 36 C11 4.7F 35 34 38 14 IN C15 4.7F L2 2.0H V2 C1 10F C2 10F L1 1.2H V1 R1 1.82M MAX8660 MAX8660A LX1 PG1 V1 R5 300k LBO IN 17 20 IN8 V8 LX4 PG4 V4 SDA SCL EP AGND PGND NOTE: REFERENCE DESIGNATORS MATCH MAX8660EVKIT Figure 3. Typical Applications Circuit 24 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Table 1. Maxim and Intel Power Domain Terminology INTEL POWER DOMAIN VCC_IO1 VCC_IO3 VCC_IO4 VCC_IO6 VCC_LCD VCC_MSL VCC_CI VCC_DF VCC_MEM VCC_APPS VCC_SRAM VCC_MVT VCC_BG VCC_OSC13M VCC_PLL INTEL POWER DOMAIN ACCEPTABLE VOLTAGE 1.8V 10% or 3.0V 10% or 3.3V 10% 1.8V 10% or 3.0V 10% 1.8V 100mV 0.95V to 1.41V 5% 1.08V to 1.41V 100mV 1.8V 100mV 1.8V 10% or 3.0V 10% or 3.3V 10% 1.8V 10% or 3.0V 10% or 3.3V 10% 3.0V 1V 3.3V 300mV 3.3V 300mV COMPATIBLE MAXIM POWER DOMAIN DESCRIPTION V1 or V2 * Peripheral I/O supply for UARTs, standard I2C, power I2C, audio interface, SSPs, PWMs, etc. (VCC_IO1,VCC_IO3, VCC_IO4, VCC_IO6) * * * * LCD interface logic (VCC_LCD) Fast serial interface (VCC_MSL) Camera flash interface (VCC_CI) Data flash interface (VCC_DF) V1 or V2 V2 V3 V4 * I/O supply for high-speed memory * Main processor core * Internal SRAM memory * * * * Internal logic and I/O blocks (VCC_MVT) Bandgap reference (VCC_BG) 13MHz oscillator (VCC_OSC13M) Phase-locked loop (PLL) and oscillator (VCC_PLL) V5 VCC_CARD1 V6 * Removable storage and USIM card supply VCC_CARD2 V7 * Removable storage and USIM card supply VCC_BBATT VCC_USB VCC_TSI V8 V1 or V2 (if programmed to 3.3V) V1 or V2 (if programmed to 3.3V) * Regulated battery voltage * Universal serial bus (VCC_USB) * Touch-screen interface (VCC_TSI) Step-Down DC-DC Converters (REG1-REG4) REG1 (VCC_IO) Step-Down DC-DC Converter (MAX8660 Only) REG1 is a high-efficiency (REG1 + REG8 IQ = 40A) 2MHz current-mode step-down converter that outputs up to 1200mA with efficiency up to 96% (see the Typical Operating Characteristics). The output voltage (V1) is selected with the SET1 input as shown in Table 3. The REG1 output voltage selection is latched at the end of the REG1 soft-start period. Changes in SET1 after the startup period have no effect. EN1 is a dedicated enable input for REG1. Drive EN1 high to enable REG1 or drive EN1 low to disable REG1. ______________________________________________________________________________________ 25 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Table 2. Maxim and Intel Digital Signal Terminology MAXIM EN34 INTEL PWR_EN DESCRIPTION Active-High Enable Signal for Processor Core Power. The Intel XScale processor drives this PWR_EN signal high to exit sleep mode. The processor's PWR_EN logic is powered by the MAX8660/MAX8661 "always on" V8 (VCC_BBATT) regulator during sleep mode. Active-High Enable Signal for Peripheral Power Supplies. The Intel XScale processor drives this SYS_EN signal high to enter run mode. Active-Low Reset. The MAX8660/MAX8661 drive this signal low to reset the processor. When RSO goes low, the MAX8660/MAX8661 I2C registers are reset to their default values. Active-Low Battery Fault. The MAX8660/MAX8661 drive this signal low to signal the processor that the battery has been removed or discharged. I2C Serial-Data Input/Output. The MAX8660/MAX8861 SDA generally connects to both the XScale processor's standard I2C data line (GPIO33) and its dedicated power I2C data line. This connection operates as an I2C multimaster system with the MAX8660/MAX8661 accepting commands from both the standard I2C and the power I2C. I2C Serial Clock. The MAX8660/MAX8661 SCL generally connects to both the XScale processor's standard I2C clock line (GPIO32) and its dedicated power I2C clock line. This connection operates as an I2C multimaster system with the MAX8660/MAX8661 accepting commands from both the standard I2C and the power I2C. EN1, EN2, EN5 RSO LBO SYS_EN nRESET nBATT_FAULT SDA GPIO33 PWR_SDA SCL GPIO32 PWR_SCL Table 3. SET1 Logic SET1* IN UNCONNECTED GROUND MAX8660: V1 (V) 3.3 3.0 2.85 MAX8660A: V1 (V) 2.5 2.0 1.8 The REG1 regulator allows 100% duty-cycle operation. See the REG1/REG2 100% Duty-Cycle Operation (Dropout) section for more information. *SET1 is latched after REG1 startup. Table 4. SET2 Logic SET2* IN UNCONNECTED GROUND MAX8660, MAX8661: V2 (V) 3.3 2.5 1.8 MAX8660A: V2 (V) 2.5 2.0 1.8 *SET2 is latched after REG2 startup. EN1 has hysteresis so that an RC may be used to implement manual sequencing with respect to other inputs. In systems based on Intel XScale processors, EN1, EN2, and EN5 are typically connected to SYS_EN (Table 2). The REG1 step-down regulator operates in either normal or forced-PWM mode. See the REG1-REG4 StepDown DC-DC Converter Operating Modes section for more information. REG1 has an on-chip synchronous rectifier. See the REG1-REG4 Synchronous Rectification section for more information. 26 REG2 (VCC_IO, VCC_MEM) Step-Down DC-DC Converters REG2 is a high-efficiency (REG2 + REG8 IQ = 40A) 2MHz current-mode step-down DC-DC converter that outputs up to 900mA with efficiency up to 96%. The output voltage is selected with the SET2 input as shown in Table 4. The REG2 output voltage selection is latched at the end of the REG2 soft-start period. Changes in SET2 after the startup period have no effect. EN2 is a dedicated enable input for REG2. Drive EN2 high to enable REG2 or drive EN2 low to disable REG2. EN2 has hysteresis so that an RC may be used to implement manual sequencing with respect to other inputs. In systems based on Intel processors, EN1, EN2, and EN5 are typically connected to SYS_EN (Table 2). The REG2 step-down regulator operates in either normal or forced-PWM mode. See the REG1-REG4 StepDown DC-DC Converter Operating Modes section for more information. The REG2 regulator has an on-chip synchronous rectifier. See the REG1-REG4 Synchronous Rectification section for more information. ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications The REG2 regulator allows 100% duty-cycle operation. See the REG1/REG2 100% Duty-Cycle Operation (Dropout) section for more information. In forced-PWM mode, a converter operates with a constant 2MHz switching frequency regardless of output load. The MAX8660/MAX8661 regulate the output voltage by modulating the switching duty cycle. ForcedPWM mode is ideal for low-noise systems because output voltage ripple is small (< 10mVPP) and switching harmonics occur at multiples of the constant-switching frequency and are easily filtered. However, light-load power consumption in forced-PWM mode is higher than that of normal mode (Table 7). Normal operation offers improved efficiency at light loads by switching only as necessary to supply the load. With moderate to heavy loading, the regulator switches at a fixed 2MHz switching frequency as it does in forced-PWM mode. This transition to fixed-frequency switching occurs at the load current specified in the following equation: V - VOUT VOUT IOUT IN x 2xL VIN x fSW MAX8660/MAX8660A/MAX8661 REG3 (VCC_APPS) Step-Down DC-DC Converters REG3 is a high-efficiency (REG3 + REG8 IQ = 45A) 2MHz current-mode step-down converter that has an I2C-adjustable output voltage from 0.725V to 1.800V in 25mV increments with efficiency up to 92%. The default REG3 output voltage is 1.4V (contact factory for other default voltages). REG3 delivers up to 1.6A. See the I2C Interface section for details on how to adjust the output voltage. REG3 has an I2C enable bit (EN3) and a shared hardware enable pin (EN34). See the REG3/REG4 Enable (EN34, EN3, EN4) section for more information. The REG3 step-down regulator operates in either normal or forced-PWM mode. See the REG1-REG4 StepDown DC-DC Converter Operating Modes section for more information. The REG3 regulator has an on-chip synchronous rectifier. See the REG1-REG4 Synchronous Rectification section for more information. REG4 (VCC_SRAM) Step-Down DC-DC Converters REG4 is a high-efficiency (REG4 + REG8 IQ = 45A) 2MHz current-mode step-down converter that has an I2C-adjustable output voltage from 0.725V to 1.800V in 25mV increments with efficiency up to 92%. The default REG4 output voltage is 1.4V (contact factory for other default voltages). REG4 delivers up to 400mA. See the I2C Interface section for details on how to adjust the output voltage. REG4 has an I2C enable bit (EN4) and a shared hardware enable pin (EN34). See the REG3/REG4 Enable (EN34, EN3, EN4) section for more information. The REG4 step-down regulator operates in either normal or forced-PWM mode. See the REG1-REG4 StepDown DC-DC Converter Operating Modes section for more information. The REG4 regulator has an on-chip synchronous rectifier. See the REG1-REG4 Synchronous Rectification section for more information. REG1-REG4 Synchronous Rectification Internal n-channel synchronous rectifiers eliminate the need for external Schottky diodes and improve efficiency. The synchronous rectifier turns on during the second half of each switching cycle (off-time). During this time, the voltage across the inductor is reversed, and the inductor current ramps down. In PWM mode, the synchronous rectifier turns off at the end of the switching cycle. In normal mode, the synchronous rectifier turns off when the inductor current falls below 25mA or at the end of the switching cycle, whichever occurs first. REG1/REG2 100% Duty-Cycle Operation (Dropout) The REG1 and REG2 step-down DC-DC converters operate with 100% duty cycle when the supply voltage approaches the output voltage. This allows these converters to maintain regulation until the input voltage falls below the desired output voltage plus the dropout voltage specification of the converter. During 100% dutycycle operation, the high-side p-channel MOSFET turns on constantly, connecting the input to the output through the inductor. The dropout voltage (VDO) is calculated as follows: VDO = ILOAD (RP + RL) where: RP = p-channel power switch RDS(on) RL = external inductor ESR The REG1 dropout voltage is 200mV with a 1200mA load (with inductor resistance = 50m). The REG2 dropout voltage is 225mV with a 900mA load (with inductor resistance = 67m). 27 REG1-REG4 Step-Down DC-DC Converter Operating Modes REG1-REG4 independently operate in one of two modes: normal or forced PWM. At power-up or after a reset, REG1-REG4 default to normal operation. Activate forced-PWM mode by setting bits in the FPWM register (Table 9) with the I2C interface. The FPWM bits can be changed at any time. ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Linear Regulators (REG5-REG8) REG5 (VCC_MVT, VCC_BG, VCC_OSC13M, VCC_PLL) REG5 is a linear regulator with an I2C-adjustable output voltage from 1.700V to 2.000V in 25mV increments (REG5 + REG8 IQ = 55A). The default REG5 voltage is 1.8V. REG5 delivers up to 200mA. See the I2C Interface section for details on how to adjust the output voltage. The power input for the REG5 linear regulator is IN5. The IN5 input voltage range extends down to 2.35V. Note that in the Intel XScale specification, VCC_MVT is enabled by SYS_EN (along with V1 and V2), but must not rise after V1 (VCC_I/O) or V2 (VCC_MEM). This requirement dictates that IN5 be connected to IN and not V1 or V2. EN5 is a dedicated enable input for REG5. Drive EN5 high to enable REG5. Drive EN5 low to disable REG5. EN5 has hysteresis so that an RC may be used to implement manual sequencing with respect to other inputs. In systems with Intel XScale processors, EN1, EN2, and EN5 are typically connected to SYS_EN (Table 2). REG6/REG7 (VCC_CARD1, VCC_CARD2) The REG6/REG7 linear regulators supply up to 500mA each (REG6 or REG 7 + REG8 IQ = 85A). The output voltages, V6 and V7, are programmable through the serial interface from 1.8V to 3.3V in 0.1V steps (Table 13). See the I2C Interface section for details on changing the V6 or V7 voltage. On the MAX8660, the combined power input for the REG6 and REG7 linear regulators is IN67. On the MAX8661, IN6 is the power input for REG6 (REG7 is not available on the MAX8661). REG6 and REG7 are disabled by default and must be enabled using the I2C serial interface. REG6 and REG7 have independent enable bits in the OVER2 register: EN6 and EN7 (Table 9). To enable the regulators, set the corresponding enable bit. REG8 (VCC_BBATT) Always-On Regulator The output of REG8 (V8) is always active when the input voltage (VIN) is above the undervoltage-lockout threshold of 2.55V (max) and below the overvoltagelockout threshold of 6.0V (min). The REG8 linear regulator is supplied from IN and its output regulates to 3.3V and supplies up to 30mA. The internal REG8 pass element is 12 in dropout, providing a 180mV dropout voltage with a 15mA output current. Connect V8 to VCC_BBATT for applications that use Intel XScale processors. The RSO output goes low if V8 is less than 2.2V (falling typ). RAMP RATES vs. RAMP-RATE RESISTOR 12 10 RAMP RATE (mV/s) 8 6 REG3/4/5 DCRR 4 2 0 10 100 RRAMP (k) 1000 REG3/4 SSRR TO: 1V 1.4V 1.8V 1.4 x VOUT [V] mV SSRR = s 0.0014848 x (2.2 x (RAMP [k] + 13.5) + 9) REG / REG4 / REG5 DYNAMIC - CHANGE RAMP RATE (DCRR) : mV 12500 DCRR = s 8 x (2.2 x (RRAMP [k] + 13.5) + 9) REG3 / REG4 SOFT - START RAMP RATE (SSRR) : Figure 4. Soft-Start and Voltage-Change Ramp Rates Ramp-Rate Control (RAMP) REG1 and REG2 have a fixed soft-start ramp that eliminates input current spikes when they are enabled; 200s after being enabled, REG1 and REG2 linearly ramp from 0V to the set output voltage in 450s. When these regulators are disabled, the output voltage decays at a rate determined by the output capacitance, internal 650 discharge resistance, and the external load. The REG3 and REG4 output voltage have a variable linear ramp rate that is set by a resistor connected from RAMP to AGND (RRAMP). This resistor controls the output-voltage ramp rate during soft-start and a positive voltage change (i.e., 1.0V to 1.4V). The negative voltage change (i.e., 1.4V to 1.0V) is controlled in forcedPWM mode, and when the ARD bit is set in normal mode (Table 9). Figure 4 shows the relationship between RRAMP and the output-voltage ramp rates. A 56k RRAMP satisfies the typical requirements of Intel XScale processors; 200s after being enabled, REG3 and REG4 linearly ramp from 0V to the set output voltage at the rate set by RRAMP. When REG3 and REG4 are disabled, the output voltage decays at a rate determined by the output capacitance, internal 550 discharge resistance, and the external load. 28 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 PV3 BATT er than that specified by RRAMP, large loads (> COUT x RAMPRATE) result in an output-voltage decay that is no faster than that specified by RRAMP. 80s after being enabled, REG5 linearly ramps from 0V to the set output voltage in 225s. The ramp rate during a positive voltage change (i.e., 1.8V to 1.9V) is set with RRAMP. During a negative voltage change (i.e., 1.9V to 1.8V), the REG5 output voltage decays at a rate determined by the output capacitance and the external load; however, ramp-down is no faster than the rate specified by RRAMP. When REG5 is disabled, the output voltage decays at a rate determined by the output capacitance, internal 2k discharge resistance, and the external load. 60s after being enabled by I2C, REG6 and REG7 linearly ramp from 0V to the set output voltage in 450s. REG6 and REG7 do not have positive voltage-change (i.e., 1.8V to 2.5V) ramp-rate control. During a positive voltage change, the output-voltage dV/dt is as fast as possible. To avoid this fast output dV/dt, disable REG6 or REG7 before changing the output. With this method, the soft-start ramp rate limits the output dV/dt, and therefore, the input current is controlled. During a negative voltage change (i.e., 2.5V to 1.8V), the REG6 or REG7 output voltage decays at a rate determined by the output capacitance and the external load. When REG6 or REG7 is disabled, the output voltage decays at a rate determined by the output capacitance, internal 350 discharge resistance, and the external load. LX3 REG3 EN34 PG3 V3 (VCC_APPS) ON SDA SCL EN3 I2C EN4 ON LX4 REG4 PG4 V4 (VCC_SRAM) PV4 BATT Figure 5. V3/V4 Enable Logic Active ramp-down functionality is inherent in forcedPWM operation. In normal-mode operation, active ramp down is enabled by setting ARD3 and ARD4 (Table 9). With "active ramp-down" enabled, the regulator output voltage ramps down at the rate set by RRAMP. With small loads, the regulator must sink current from the output capacitor to actively ramp down the output voltage. In normal mode, with "active ramp-down" disabled, the regulator output voltage ramps down at the rate determined by the output capacitance and the external load; small loads result in an output-voltage decay that is slow- Power Sequencing Enable Signals (EN_, PWR_EN, SYS_EN, I 2C) As shown in Table 5, the MAX8660/MAX8661 feature numerous enable signals for flexibility in many applications. In a typical application with the Intel XScale processor, many of these enable signals are connected together. EN1, EN2, and EN5 typically connect to Intel's SYS_EN output. With this connection, REG5 is the first POWER DOMAIN V1 (VCC_IO) (MAX8660/MAX8660A only) V2 (VCC_MEM) V5 (VCC_MVT) V3 (VCC_APPS) V4 (VCC_SRAM) V6 (VCC_CARD1) V7 (VCC_CARD2) (MAX8660/MAX8660A only) V8 (VCC_BBATT) MAXIM ENABLE SIGNAL HARDWARE EN1 EN2 EN5 EN34 -- -- SOFTWARE -- -- -- EN3 (OVER1) EN4 (OVER1) EN6 (OVER2) EN7 (OVER2) Always on INTEL ENABLE SIGNAL SYS_EN PWR_EN & PWR_I2C Standard I2C -- ______________________________________________________________________________________ 29 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 supply to rise (if IN5 is connected to IN). EN34 typically connects to Intel's PWR_EN output. Alternatively, REG3 and REG4 can be activated by the I2C interface (see the REG3/REG4 Enable (EN34, EN3, EN4) section for more information). REG6 and REG7 are activated by the serial interface. REG8 has no enable input and always remains on as long the MAX8660/MAX8661 are powered between the UVLO and OVLO range. All regulators are forced off during UVLO and OVLO. See the Undervoltage and Overvoltage Lockout section for more information. Note: The logic that controls the Intel XScale processor SYS_EN and PWR_EN signals is powered from the VCC_BBATT power domain. Table 6. Truth Table for V3/V4 Enable Logic HARDWARE INPUT EN34 0 0 0 X 1 X = Don't care. EN3 0 (default) 0 1 1 X I2C BITS EN4 0 (default) 1 0 1 X V3 OFF OFF ON ON ON V4 OFF ON OFF ON ON REG3/REG4 Enable (EN34, EN3, EN4) REG3 and REG4 have independent I 2C enable bits (EN3, EN4) and a shared hardware-enable input (EN34). As shown in Figure 5, the EN34 hardwareenable input is logically ORed with the I2C enable bits. Table 6 is the truth table for the V3/V4 enable logic. Note that to achieve a pure I2C enable/disable, connect EN34 to ground. Similarly, to achieve a pure hardware enable/disable, leave the I2C enable bits at their default value (EN3 = EN4 = 0 = off); V3 and V4 cannot be independently enabled/disabled using only hardware. Note: A low MR drives RSO low and returns the I2C registers to their default values: EN3 = 0 and EN4 = 0. Power Modes The MAX8660/MAX8661 provide numerous enable signals (Table 5) and support any combination for enabling and disabling their supplies with these signals. Table 7 shows several power modes defined for Intel XScale processors along with their corresponding MAX8660/ MAX8661 quiescent operating currents. Table 7. Power Modes and Corresponding Quiescent Operating Currents POWER DOMAIN STATE DIGITAL CONTROL STATE MAX8660 QUIESCENT OPERATING CURRENT (FIGURE 3) NORMAL OPERATING MODE 250A FORCED-PWM MODE 23mA POWER MODE ALL ON RUN, IDLE, and STANDBY V1, V2, V3, V4, V5, V6, V7, and V8 are on V1, V2, V3, V4, V5, and V8 are on V6 and V7 are off V1, V2, V5, and V8 are on EN1/EN2/EN5 (SYS_EN) and EN34 (PWR_EN) are asserted. V6, V7 are enabled by I2C EN1/EN2/EN5 (SYS_EN) and EN34 (PWR_EN) are asserted V6 and V7 are disabled by I2C (default) EN1/EN2/EN5 (SYS_EN) are asserted EN34 (PWR_EN) is deasserted; V6 and V7 are disabled by I2C (default) EN1/EN2/EN5 (SYS_EN) and EN34 (PWR_EN) are deasserted; V6, V7 are disabled by I2C 140A 22.9mA SLEEP V3, V4, V6, and V7 are off All supplies off except V8 90A 10mA DEEP SLEEP 20A Note: Forced-PWM currents are measured on the MAX8660 EV kit. Currents vary with step-down inductor and output capacitor tolerance. 30 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Power-Up and Power-Down Timing Figure 6 shows the power-up sequence for the Intel XScale family of processors. In general, the supplies should power up in the following order: 1) POWER-UP: V8 V5 V1 and V2 V3 and V4 2) REG6 and REG7 typically power external card slots and can be powered up and down based on application requirements. Note that the Intel XScale processor controls EN1/EN2/EN5 with the same SYS_EN signal, yet Intel's timing diagrams show that V5 is supposed to power up before V1 and V2. Because of the Intel XScale family's timing parameters, most systems connect EN1/EN2/ EN5 together and drive them with SYS_EN. When powering up, this connection ensures that V5 powers up before V1 and V2 (only when V5 is powered from IN). MAX8660/MAX8660A/MAX8661 Intel XScale Power Configuration Register (PCFR) The MAX8660/MAX8661 comply with the Intel XScale power I2C register specifications. This allows the PMIC to be used along with the Intel XScale processor with little-to-no software development. As shown in Table 9, there are many I2C registers, but since the Intel XScale processor automatically updates the PMIC through its power I2C interface, only the REG6 and REG7 enable bits need be programmed to fully utilize the PMIC. V8 (VCC_BBATT) tVBHRSTH = 20ms, MIN (TIMED BY PMIC) RSO (nRESET) tVBHBFH = 0s, MIN (TIMED BY PMIC) LBO (nBATT_FAULT) EN1/EN2/EN5 (SYS_EN) tSEHVMH = SYS_DEL TIME, MAX (TIMED BY PMIC) V5 (VCC_MVT) tVMHVSH1 = SYS_DEL TIME, tSEHVMH, MAX (TIMED BY PMIC) V1 (VCC_IO) tVMHVSH2 = SYS_DEL TIME - t, tSEHVMH, MAX (TIMED BY PMIC) V2 (VCC_MEM) tSEHPH = SYS_DEL TIME + 152s, MIN tSEHPH = SYS_DEL TIME + 153s, MAX (TIMED BY XScale) tBFHSEH = 93.75s, MAX (TIMED BY XScale) tBSTHSEH = 2.05s, MAX (TIMED BY XScale) EN34 (PWR_EN) SCL FROM XScale (PWR_SCL) SCA FROM XScale (PWR_SDA) nRESET_OUT* FROM XScale V3 (VCC_APPS) V4 (VCC_SRAM) tSHROH = SYS_DEL TIME +213s, MIN tSHROH = SYS_DEL TIME +214s, MAX (TIMED BY XScale) tPHLVTH3 = PWR_DEL TIME (TIMED BY PMIC) tPHLVTH4 = PWR_DEL TIME (TIMED BY PMIC) *THE MAX8660/MAX8661 DO NOT DIRECTLY USE THE INTEL XScale PROCESSOR'S nRESET_OUT LOGIC OUTPUT. Figure 6. Power-Up Timing ______________________________________________________________________________________ 31 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 The Intel XScale processor contains a power management unit general configuration register (PCFR). The default values of this register are compliant with the MAX8660/MAX8661. However, wake-up performance can be optimized using this register: * The PCFR register contains timers for the SYS_DEL and PWR_DEL timing parameters as shown in Figure 6. Each timer defaults to 125ms. When using the MAX8660/MAX8661, these timers may be shortened to 2ms to speed up the overall system wake-up delay. * Enabling the "shorten wake-up delay" function (SWDD bit) bypasses the SYS_DEL and PWR_DEL timers and uses voltage detectors on the Intel XScale processor to optimize the overall system wake-up delay. RSO is high impedance when all of the following conditions are satisfied: * MR is high. * V8 is above VRSOTH (2.35V rising typ). * VUVLO < VIN < VOVLO. * The RSO deassert delay (tVBHRSTH = 24ms typ) has expired. When RSO goes low, the MAX8660/MAX8661 I2C registers are reset to their default values. If the MR feature is not required, connect MR high. If the RSO feature is not required, connect RSO low. Voltage Monitors, Reset, and Undervoltage-Lockout Functions Undervoltage and Overvoltage Lockout When the V IN is below V UVLO (typically 2.35V), the MAX8660/MAX8661 enter its undervoltage-lockout mode (UVLO). UVLO forces the device to a dormant state. In UVLO, the input current is very low (1.5A) and all regulators are off. RSO and LBO are forced low when the input voltage is between 1V (typ) and VUVLO. The I2C does not function in UVLO, and the I2C register contents are reset in UVLO. When the input voltage is above V OVLO (typically 6.35V) the MAX8660/MAX8661 enter overvoltage-lockout mode (OVLO). OVLO mode protects the MAX8660/ MAX8661 from high-voltage stress. In OVLO, the input current is 25A and all regulators are off. RSO is held low, the I2C does not function, and register contents are reset in OVLO. LBO continues to function in OVLO; however, since LBO is typically pulled up to V8 (VCC_BBATT), LBO appears to go low in OVLO because V8 is disabled. Alternatively, LBO may be pulled up to IN. Reset Output (RSO) and MR Input RSO is an open-drain reset output. As shown in Figure 1, RSO typically connects to the nRESET input of the Intel XScale processor and is pulled up to V8 (VCC_BBATT). A low on nRESET causes the processor to enter its reset state. RSO is forced low when one or more of the following conditions occur: * MR is low. * V8 is below VRSOTH (2.2V falling typ). * VIN is below VUVLO (2.35V typ). * VIN is above VOVLO (6.35V typ). 32 Low-Battery Detector (LBO, LBF, LBR) LBO is an open-drain output that typically connects to the nBATT_FAULT input of the Intel XScale processor to indicate that the battery has been removed or discharged (Figure 1). LBO is typically pulled up to V8 (VCC_BBATT). LBR and LBF monitor the input voltage (usually a battery) and trigger the LBO output (Figure 7). The truth table in Figure 7 shows that LBO is high impedance when the voltage from LBR to AGND (VLBR) exceeds the low-battery rising threshold (VLBRTH = 1.25V (typ). LBO is low when the voltage from LBF to AGND (VLBF) falls below the low-battery falling threshold (VLBFTH = 1.20V typ). On power-up, the LBR threshold must be exceeded before LBO deasserts. V8 (VCC_BBATT) + R1 LBF S Q AGND R2 VLBFTH 1.200V LBR R R3 VLBRTH 1.250V IN MAX8660 MAX8661 LBO TRUTH TABLE LBF VLBF < VLBFTH VLBF < VLBFTH VLBF > VLBFTH VLBF > VLBFTH LBR VLBR < VLBRTH VLBR > VLBRTH VLBR < VLBRTH VLBR > VLBRTH LBO 0 0 HOLD 1 Figure 7. Low-Battery Detector Functional Diagram ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Connecting LBF to LBR and to a two-resistor voltagedivider sets a 50mV hysteresis referred to LBF (hysteresis at the battery voltage is scaled up by the resistor value), connecting LBF and LBR separately to a threeresistor voltage-divider (Figure 7) allows the falling threshold and rising threshold to be set separately (achieving larger hysteresis). The Figure 7 resistor values are selected as a function of the desired falling (VLBOF) and rising (VLBOR) thresholds as follows: First, select R3 in the 100k to 1M range: R1 = R 3 x VLBOR V x 1 - LBFTH VLBRTH VLBOF V x VLBOR R2 = R 3 x LBFTH - 1 VLBRTH x VLBOF Thermal-Overload Protection Thermal-overload protection limits total power dissipation in the MAX8660/MAX8661. When internal thermal sensors detect a die temperature in excess of +160C, the corresponding regulator(s) are shut down, allowing the IC to cool. The regulators turn on again after the junction cools by 15C, resulting in a pulsed output during continuous thermal-overload conditions. A thermal overload on any of REG1 through REG5 only shuts down the overloaded regulator. An overload on REG6 or REG7 shuts down both regulators together. During thermal overload, REG8 is not turned off, and the I2C interface and voltage monitors remain active. MAX8660/MAX8660A/MAX8661 I2C Interface An I2C-compatible, 2-wire serial interface controls a variety of MAX8660/MAX8661 functions: * The output voltages of V3-V7 are set by the serial interface. * Each of the four step-down DC-DC converters (REG1/REG4) can be put into forced-PWM operation. * REG3 and REG4 can be enabled by the serial interface or by a hardware-enable pin (EN34). See the REG3/REG4 Enable (EN34, EN3, EN4) section for more information. * REG6 and REG7 are activated only by the serial interface. The serial interface operates whenever VIN is between VUVLO (typically 2.40V) and VOVLO (typically 6.35V). When VIN is outside the I2C operation range, the I2C registers are reset to their default values. The serial interface consists of a bidirectional serial-data line (SDA) and a serial-clock input (SCL). The MAX8660/ MAX8661 are slave-only devices, relying upon a master to generate a clock signal. The master (typically the Intel XScale processor) initiates data transfer on the bus and generates SCL to permit data transfer. I2C is an open-drain bus. SDA and SCL require pullup resistors (500 or greater). Optional resistors (24) in series with SDA and SCL protect the device inputs from high-voltage spikes on the bus lines. Series resistors also minimize cross-talk and undershoot on bus signals. The Intel XScale specification contains an extensive list of registers for various functions, not all of which are provided on the MAX8660/MAX8661. The list in Table 9 is a subset of the Intel list as it relates to functions included in the PMIC. Even though the MAX8660/MAX8661 use a subset of the Intel XScale-specified registers, they acknowledge writes to the entire register space (0x00 to 0xFF). In Intel XScale applications, the pullups are typically to VCC_IOx. 33 where VLBOR is the rising voltage at the top of R1 (typically VIN) when LBO goes high, and VLBOF is the falling voltage at the top of R1 when LBO goes low. For example, to set VLBOR to 3.6V and VLBOF to 3.2V, choose R3 to be 1M. Then, R1 = 1.8M and R2 = 80k. If the low-battery-detector feature is not required, connect LBO to ground and connect LBF and LBR to IN. Internal Off-Discharge Resistors Each regulator on the MAX8660/MAX8661 has an internal resistor that discharges the output capacitor when the regulator is off (Table 8). The internal discharge resistors pull their respective output to ground when the regulator is off, ensuring that load circuitry always powers down completely. The internal off-discharge resistors are active when a regulator is disabled, when the device is in OVLO, and when the device is in UVLO with VIN greater than 1.0V. With VIN less than 1.0V, the internal off-discharge resistors may not activate. Table 8. Internal Off-Discharge Resistor REGULATOR REG1 REG2 REG3 REG4 REG5 REG6 REG7 REG8 INTERNAL OFF-DISCHARGE RESISTOR VALUE 650 30% 650 30% 550 30% 550 30% 2k 30% 350 30% 350 30% 1.5k 30% ______________________________________________________________________________________ MAX8660/MAX8660A/MAX8661 DATA BIT FUNCTION 7 R Default R EN7** 0 R AVS 0 0 AGO 0 0 0 EN6 Default MVS Default R Default R Default R Default R Default R Default R Default 0 0 0 R R 0 0 0 0 0 R R 0 0 0 1 1 R R 0 0 0 1 1 R R 0 0 0 1 1 0 R R 0 0 0 1 1 0 1 R R 0 0 0 0 0 MGO SVS SGO R 0 0 0 0 0 -- -- -- -- -- 0 0 0 0 0 0 0 0 R R R R EN4 (S_EN) R EN3 (A_EN) 6 5 4 3 2 1 0 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications 34 Output-Voltage Enable Register 1. Enables/disables V3 and V4. See the REG3/REG4 Enable (EN34, EN3, EN4) section for more information. Output-Voltage Enable Register 2. Enables/disables V6 and V7. See the REG6/REG7 (VCC_CARD1, VCC_CARD2) section for more information. Voltage-Change Control Register. Independently specifies that the V3, V4, and V5 output voltage must follow either target register 1 or 2. See Table 10. V3 (VCC_APPS) Target 1--See Table 11 1 VCC_APPS (V3) DVM Target Voltage 1 Register. Sets target 1 voltage for V3. V3 (VCC_APPS) Target 2--See Table 11 1 1 VCC_APPS (V3) DVM Target Voltage 2 Register. Sets target 2 voltage for V3. V4 (VCC_SRAM) Target 1--See Table 11 0 1 1 VCC_SRAM (V4) DVM Target Voltage 1 Register. Sets target 1 voltage for V4. V4 (VCC_SRAM) Target 2--See Table 11 0 1 V5 (VCC_MVT) Target 1--See Table 12 0 1 0 V5 (VCC_MVT) Target 2--See Table 12 0 1 0 V6 Voltage--See Table 13 0 0 0 0 0 0 0 0 1 VCC_SRAM (V4) DVM Target Voltage 2 Register. Sets target 2 voltage for V4. VCC_MVT (V5) Target Voltage 1 Register. Sets target 1 voltage for V5. VCC_MVT (V5) DVM Target Voltage 2 Register. Sets target 2 voltage for V5. V7 Voltage--See Table 13 Default 0 0 LDO1 and LDO2 Voltage-Control Register (V6 and V7 on MAX8660). Specifies the V6 and V7 output voltage. V6 and V7 are enabled/disabled with OVER2. ARD4 ARD3 -- -- FPWM4 FPWM3 FPWM2 FPWM1** Forced-PWM Register. The FPWM_ bits allow V1, V2, V3, and V4 to independently operate in either skip mode or forcedPWM mode. See the REG1-REG4 Step-Down DC-DC Converter Operating Modes section for more information. The ARD_ bits allow the output voltage to be actively ramped down during negative voltage transitions See the Ramp-Rate Control (RAMP) section for more information. Note that this is a Maxim custom register that is not required by the Intel XScale processor. Default 0 0 0 0 0 0 0 0 Table 9. I2C Registers REGISTER ADDRESS REGISTER NAME R/W 0x10 OVER1* W 0x12 OVER2 W 0x20 VCC1* W 0x23 ADTV1* W 0x24 ADTV2* W 0x29 SDTV1* W 0x2A SDTV2* W 0x32 MDTV1 W 0x33 MDTV2 W 0x39 L12VCR W 0x80 FPWM W R means these data locations are designated reserved in the Intel specification. ______________________________________________________________________________________ Note: The MAX8660/MAX8661 acknowledge attempts to write to the entire address space from 0x00 to 0xFF, even though only a subset of those addresses actually exist in the IC. * These registers are accessed by the power I2C bus of the Intel XScale processor. ** Maintain these bits at their default 0 value for the MAX8661. High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Table 10. DVM Voltage-Change Register (VCC1, 0x20) REGISTER ADDRESS REGISTER NAME BIT NAME FUNCTION V5 (VCC_MVT) voltage select: 0--Ramp V5 to voltage selected by MDTV1 (default) 1--Ramp V5 to voltage selected by MDTV2 Start V5 (VCC_MVT) voltage change: 0--Hold V5 at current level (default) 1--Ramp V5 as selected by MVS V4 (VCC_SRAM) voltage select: 0--Ramp V4 to voltage selected by SDTV1 (default) 1--Ramp V4 to voltage selected by SDTV2 Start V4 (VCC_SRAM) voltage change: 0--Hold V4 at current level (default) 1--Ramp V4 as selected by SVS Reserved Reserved V3 (VCC_APPS) voltage select: 0--Ramp V3 to voltage selected by ADTV1 (default) 1--Ramp V3 to voltage selected by ADTV2 Start V3 (VCC_APPS) voltage change: 0--Hold V3 at current level (default) 1--Ramp V3 as selected by AVS MAX8660/MAX8660A/MAX8661 7 MVS 6 MGO 5 SVS 0x20 VCC1 4 3 2 1 SGO R R AVS 0 AGO Data Transfer One data bit is transferred during each SCL clock cycle. The data on SDA must remain stable during the high period of the SCL clock pulse. Changes in SDA while SCL is high are control signals (see the START and STOP Conditions section for more information). Each transmit sequence is framed by a START (S) condition and a STOP (P) condition. Each data packet is 9 bits long; 8 bits of data followed by the acknowledge bit. The MAX8660/MAX8661 suport data transfer rates with SCL frequencies up to 400kHz. START and STOP Conditions When the serial interface is inactive, SDA and SCL idle high. A master device initiates communication by issuing a START condition. A START condition is a high-to-low transition on SDA with SCL high. A STOP condition is a low-to-high transition on SDA, while SCL is high (Figure 7). A START condition from the master signals the beginning of a transmission to the MAX8660/MAX8661. The master terminates transmission by issuing a notacknowledge followed by a STOP condition (see the S SDA Sr P tSU;STA SCL tHD;STA tHD;STA tSU;STO Figure 8. START and STOP Conditions Acknowledge Bit section for more information). The STOP condition frees the bus. To issue a series of commands to the slave, the master may issue repeated start (Sr) commands instead of a stop command in order to maintain control of the bus. In general, a repeated start command is functionally equivalent to a regular start command. When a STOP condition or incorrect address is detected, the MAX8660/MAX8661 internally disconnect SCL from the serial interface until the next START condition, minimizing digital noise and feedthrough. 35 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Table 11. Serial Codes for V3 (VCC_APPS) and V4 (VCC_SRAM) Output Voltages REGISTER ADDRESS REGISTER NAME DATA BYTE 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x1D 0x1E 0x1F 0x20 0x21 0x22 0x23 0x24 0x25 0x26 0x27 0x28 0x29 0x2A 0x2B OUTPUT VOLTAGE (V) 0.725 0.750 0.775 0.800 0.825 0.850 0.875 0.900 0.925 0.950 0.975 1.000 1.025 1.050 1.075 1.100 1.125 1.150 1.175 1.200 1.225 1.250 1.275 1.300 1.325 1.350 1.375 1.400 (default)* 1.425 1.450 1.475 1.500 1.525 1.550 1.575 1.600 1.625 1.650 1.675 1.700 1.725 1.750 1.775 1.800 Table 12. Serial Codes for V5 Output Voltage REGISTER ADDRESS REGISTER NAME DATA BYTE 0x00 0x01 0x02 0x03 0x04 0x32 0x33 MDTV1 MDTV2 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B 0x0C OUTPUT VOLTAGE (V) 1.700 1.725 1.750 1.775 1.800 (default) 1.825 1.850 1.875 1.900 1.925 1.950 1.975 2.000 Table 13. Serial Codes for V6 and V7 Output Voltages REGISTER ADDRESS REGISTER NAME DATA NIBBLE 0x0 0x1 0x2 0x3 0x4 0x5 0x6 0x7 0x8 0x9 0xA 0xB 0xC 0xD 0xE 0xF OUTPUT VOLTAGE (V) 1.8 (default) 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 0x23 0x24 0x29 0x2A ADTV1 ADTV2 SDTV1 SDTV2 0x39 L12VCR *Contact factory for other default voltages. 36 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 S SDA tSU:DAT SCL 1 2 8 9 tHD:DAT NOT ACKNOWLEDGE ACKNOWLEDGE Figure 9. Acknowledge Bits SLAVE ADDRESS (WRITE) BINARY 0 (GND) 1 (IN) S SDA 0 1 1 0 1 0 0b 0110 1000 0b 0110 1010 HEXADECIMAL 0x68 0x6A R/W=0 (WRITE ONLY) SRAD 0 ACKNOWLEDGE SRAD A SCL 1 2 3 4 5 6 7 8 9 Figure 10. Slave Address Byte Acknowledge Bit Both the master and the MAX8660/MAX8661 (slave) generate acknowledge bits when receiving data. The acknowledge bit is the last bit of each 9-bit data packet. To generate an acknowledge (A), the receiving device must pull SDA low before the rising edge of the acknowledge-related clock pulse (ninth pulse) and keep it low during the high period of the clock pulse (Figure 9). To generate a not acknowledge (A), the receiving device allows SDA to be pulled high before the rising edge of the acknowledge-related clock pulse and leaves it high during the high period of the clock pulse. Monitoring the acknowledge bits allows for detection of unsuccessful data transfers. An unsuccessful data transfer occurs if a receiving device is busy or if a system fault has occurred. In the event of an unsuccessful data transfer, the bus master should reattempt communication at a later time. Slave Address A bus master initiates communication with a slave device (MAX8660/MAX8661) by issuing a START condition followed by the slave address. As shown in Figure 10, the slave address byte consists of 7 address bits and a read/write bit (R/W). After receiving the proper address, the MAX8660/MAX8661 issue an acknowledge by pulling SDA low during the ninth clock cycle. Note that the R/W bit is always zero since the MAX8660/ MAX8661 are write only. The Intel XScale processor supports 0x68 (SRAD = GND) as the I2C slave address. I 2C Write Operation The MAX8660/MAX8661 are write-only devices and recognize the "write byte" protocol as defined in the SMBus specification and shown in section A of Figure 11. The "write byte" protocol allows the I 2C master device to send 1 byte of data to the slave device. The "write byte" protocol requires a register pointer address for the subsequent write. The MAX8660/MAX8661 acknowledge any register pointer even though only a subset of those registers actually exists in the device. The "write byte" protocol is as follows: 1) The master sends a start command. 2) The master sends the 7-bit slave address followed by a write bit. 3) The addressed slave asserts an acknowledge by pulling SDA low. 4) The master sends an 8-bit register pointer. 5) The slave acknowledges the register pointer. 6) The master sends a data byte. 7) The slave updates with the new data. 37 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 8) The slave acknowledges the data byte. 9) The master sends a STOP condition. In addition to the write-byte protocol, the MAX8660/ MAX8661 recognize the multiple byte register-data pair protocol as shown in section B of Figure 11. This protocol allows the I2C master device to address the slave only once and then send data to multiple registers in a random order. Registers may be written continuously until the master issues a STOP condition. The multiple-byte register-data pair protocol is as follows: 1) The master sends a start command. 2) The master sends the 7-bit slave address followed by a write bit. 3) The addressed slave asserts an acknowledge by pulling SDA low. 4) The master sends an 8-bit register pointer. 5) The slave acknowledges the register pointer. 6) The master sends a data byte. 7) The slave updates with the new data. LEGEND MASTER TO SLAVE SLAVE TO MASTER 8) The slave acknowledges the data byte. 9) Steps 5 to 7 are repeated as many times as the master requires. Registers may be accessed in random order. 10)The master sends a STOP condition. Design Procedure Setting the Output Voltages The REG1 and REG2 regulators each have three preset voltages that are programmed with the SET1 and SET2 inputs. See the REG1 (VCC_IO) Step-Down DC-DC Converter and REG2 (VCC_IO, VCC_MEM) Step-Down DC-DC Converters sections for more information. V8 is fixed at 3.3V and cannot be changed. V3-V7 are set by the I 2 C interface. See the I 2 C Interface section for more information. Note that while operating in forced-PWM mode with an input voltage greater than 4.3V, the minimum output voltage of REG3 and REG4 is limited by the minimum duty cycle. In forced-PWM mode, the minimum output voltage for REG3 or REG4 is: A. WRITING TO A SINGLE REGISTER WITH THE "WRITE BYTE" PROTOCOL 1 S 7 SLAVE ADDRESS R/W B. WRITING TO MULTIPLE REGISTERS WITH THE "MULTIPLE-BYTE REGISTER-DATA PAIR" PROTOCOL 1 S 7 SLAVE ADDRESS R/W 8 REGISTER POINTER n 1 A 8 DATA n 1 A NUMBER OF BITS 1 0 1 A 8 REGISTER POINTER X 1 A 8 DATA X 1 A NUMBER OF BITS 1 0 1 A 8 REGISTER POINTER 1 A 8 DATA 1 1 NUMBER OF BITS AP 8 REGISTER POINTER Z 1 A 8 DATA Z 1 1 NUMBER OF BITS AP Figure 11. Writing to the MAX8660/MAX8661 38 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications V3MIN = 0.167 x VPV3 V4 MIN = 0.167 x VPV4 Note that the above minimum voltage limitation does not apply to normal-mode operation. Output Capacitor Selection The step-down DC-DC converter output capacitor keeps output ripple small and ensures control-loop stability. The output capacitor must also have low impedance at the switching frequency. Ceramic, polymer, and tantalum capacitors are suitable, with ceramic exhibiting the lowest ESR and lowest high-frequency impedance. Output ripple due to capacitance (neglecting ESR) is approximately: IL(PEAK ) VRIPPLE = 2 x fOSC x COUT Additional ripple due to capacitor ESR is: VRIPPLE(ESR) = IL(PEAK) x ESR Refer to the MAX8660 EV kit data sheet for specific output capacitor recommendations. MAX8660/MAX8660A/MAX8661 Inductor Selection Calculate the inductor value (LIDEAL) for each of REG1 through REG4 as follows: 4 x VIN x D x (1 - D) LIDEAL = IOUT(MAX) x fOSC This sets the peak-to-peak inductor current ripple to 1/4 the maximum output current. The oscillator frequency, fOSC, is 2MHz, and the duty cycle, D, is: V D = OUT VIN Given LIDEAL, the peak-to-peak inductor ripple current is 0.25 x IOUT(MAX). The peak inductor current is 1.125 x IOUT(MAX). Make sure that the saturation current of the inductor exceeds the peak inductor current, and the rated maximum DC inductor current exceeds the maximum output current (I OUT(MAX)). Inductance values smaller than LIDEAL can be used to reduce inductor size; however, if much smaller values are used, peak inductor current rises and a larger output capacitance may be required to suppress output ripple. Larger inductance values than LIDEAL can be used to obtain higher output current, but typically require physically larger inductor size. Refer to the MAX8660 EV kit data sheet for specific inductor recommendations. Applications Information Power Dissipation The MAX8660/MAX8661 have a thermal-shutdown feature that protects the IC from damage when the die temperature exceeds +160C (see the Thermal-Overload Protection section for more information). To prevent thermal overload and allow the maximum load current on each regulator, it is important to ensure that the heat generated by the MAX8660/MAX8661 can be dissipated into the PC board. The exposed pad must be soldered to the PC board, with multiple vias under the exposed pad (EP) conducting heat to a ground plane. The junction-to-case thermal resistance (JC) of the MAX8660/MAX8661 is 2.7C/W. When properly mounted on a multilayer PC board, the junction-to-ambient thermal resistance (JA) is typically 28C/W. Input Capacitor Selection The input capacitor in a step-down DC-DC converter reduces current peaks drawn from the battery or other input power source and reduces switching noise in the controller. The impedance of the input capacitor at the switching frequency should be less than that of the input source so that high-frequency switching currents do not pass through the input source. The input capacitor must meet the input-ripple-current requirement imposed by the step-down converter. Ceramic capacitors are preferred due to their resilience to power-up surge currents. Choose the input capacitor so that the temperature rise due to input ripple current does not exceed approximately 10C. For a step-down DC-DC converter, the maximum input ripple current is 1/2 of the output. This maximum input ripple current occurs when the step-down converter operates at 50% duty factor (VIN = 2 x VOUT). Refer to the MAX8660 EV kit data sheet for specific input capacitor recommendations. PCB Layout and Routing Good printed circuit board (PCB) layout is necessary to achieve optimal performance. Conductors carrying discontinuous currents and any high-current path must be made as short and wide as possible. Refer to the MAX8660 EV kit data sheet for an example of a good PCB layout. Place the bypass capacitors for each power input pair (IN to AGND, PV1 to PG1, PV2 to PG2, PV3, to PG3, and PV4 to PG4) as close as possible to the IC. The exposed pad (EP) is the main path for heat to exit the IC. Connect EP to the ground plane with multiple vias to allow heat to dissipate from the device. ______________________________________________________________________________________ 39 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Package Marking TOP VIEW Chip Information PROCESS: BiCMOS 8660E TLyww + aaaa 8660AE TLyww + aaaa 8661E TLyww + aaaa "yww" is a date code. "aaaa" is an assembly code. + Denotes lead-free packaging and marks pin 1 location. 40 ______________________________________________________________________________________ High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) MAX8660/MAX8660A/MAX8661 ______________________________________________________________________________________ QFN THIN.EPS 41 High-Efficiency, Low-IQ, PMICs with Dynamic Voltage Management for Mobile Applications MAX8660/MAX8660A/MAX8661 Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.) Revision History Pages changes at Rev 1: 1, 37, 42 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 42 (c) 2006 Maxim Integrated Products is a registered trademark of Maxim Integrated Products, Inc. |
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