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AM1214-250 RF POWER TRANSISTORS L-BAND RADAR APPLICATIONS TARGET DATA * REFRACTORY /GOLD METALLIZATION * EMITTER SITE BALLASTING * LOW RF THERMAL RESISTANCE * INPUT/OUTPUT MATCHING * OVERLAY GEOMETRY * METAL/CERAMIC HERMETIC PACKAGE * POUT = 300 W MIN. WITH 8.0 dB GAIN * 1215-1400 MHz OPERATION M259 hermetically sealed ORDER CODE AM1214-250 BRANDING XAM1214-250 PIN CONNECTION 1 DESCRIPTION The AM1214-250 is a rugged, Class C common base device designed for new L - Band medium & long pulse radar applications. Minimal amplitude droop over a long pulse of 500 microsec. is guaranteed by a thermal design incorporating an overlay site-ballasted die geometry. 4 3 1. Collector 2. Base 2 3. Emitter 4. Base ABSOLUTE MAXIMUM RATINGS (TCASE = 25C) Symbol PDISS IC VCBO Tj TSTG Parameter Power Dissipation (TC 85C)* Device Current* Collector-Base Voltage Operating Junction Temperature Storage Temperature Value 786 21 70 +250 -65 to +200 Unit W A V C C THERMAL DATA Rth(j-c) Junction -Case Thermal Resistance* 0.21 C/W * Applies only to rated RF amplifier operation: 150 microsec / 10% July 2000 1/4 AM1214-250 ELECTRICAL SPECIFICATION (TCASE = 25C) STATIC Symbol BVCBO BVCES BVEBO ICES hFE IC = 50 mA IC = 50 mA IE = 20 mA VCE = 40 V VCE = 5 V Test Conditions IE = 0 mA VBE = 0 V IC = 0 mA VBE = 0 V IC = 0.5 A 10 Min. 70 70 3.5 10 Typ. Max. Unit V V V mA DYNAMIC @ 150 MICROSEC / 10 % Symbol POUT C GP f = 1215 - 1400 MHz f = 1215 - 1400 MHz f = 1215 - 1400 MHz Test Conditions PIN = 40 W PIN = 40 W PIN = 40 W VCC = 50 V VCC = 50 V VCC = 50 V Min. 300 40 8.75 Typ. 350 45 9.4 Max. Unit W % dB DYNAMIC @ 500 MICROSEC / 10 % Symbol POUT C GP f = 1215 - 1400 MHz f = 1215 - 1400 MHz f = 1215 - 1400 MHz Test Conditions PIN = 40 W PIN = 40 W PIN = 40 W VCC = 42 V VCC = 42 V VCC = 42 V Min. 225 40 7.5 Typ. 250 45 8.0 Max. Unit W % dB 2/4 AM1214-250 M259 (.400 x .500 SUPER WIDE 2/L HERM. W/FLG) MECHANICAL DATA mm Inch MAX 7.75 21.08 9.91 3.43 4.90 10.03 12.45 16.38 3.18 22.61 0.05 1.40 2.79 23.11 0.15 1.65 3.30 5.84 .890 .002 .055 .110 10.34 12.95 16.64 .395 .490 .645 .125 .910 .006 .065 .130 .230 MIN. .295 .770 .380 .125 .193 .407 .510 .655 TYP. MAX .305 .830 .390 .135 DIM. A B C D E F G H I J K L M N MIN. 7.49 19.56 9.65 3.18 TYP. M259, Package Outline Ref. 1019147D 3/4 AM1214-250 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics (R) 2000 STMicroelectronics - All Rights Reserved All other names are the property of their respective owners. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 4/4 |
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