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| SURFACE MOUNT MICROPROCESSOR CRYSTAL FEATURES AT CUT CRYSTAL PERFORMANCE THERMOPLASTIC PACKAGE SUITED FOR REFLOW SOLDERING EXCELLENT FOR HIGH DENSITY CIRCUIT BOARDS SERIES TT-SMDC SPECIFICATIONS MODEL TYPE FREQUENCY RANGE MODE OF OSCILLATION FUNDAMENTAL THIRD OVERTONE FREQUENCY TOLERANCE AT 25 C FREQUENCY STABILITY OVER TEMPERATURE TEMPERATURE RANGE LOAD CAPACITANCE SHUNT CAPACITANCE EQUIVALENT SERIES RESISTANCE (ESR) DRIVE LEVEL SHOCK RESISTANCE REFLOW CONDITIONS OPERATING EXTENDED TT-SMDC 3.579545 MHz TO 70.000 MHz 3.579545 MHz TO 30.000 MHz 30.10 MHz TO 70.000 MHz 50 PPM MAX (30 PPM AVAILABLE) 50 PPM MAX (30 PPM AVAILABLE) -10 C TO +60 C -40 C TO +85 C 12 pF TO 32 pF OR SERIES 7 pF MAXIMUN SEE TABLE 1 100 W MAXIMUM 5 PPM MA XIMUM 75 cm DROP TEST IN 3 AXES ONTO A HARD SURFACE OR 3000 g/0.3 ms x SINEWAVE IN 3 AXES 240 C FOR 10 S MAXIMUM FREQUENCY (MHz) 3.50 TO 3.999 4.00 TO 5.999 6.00 TO 9.999 10.00 TO 30.00 30.10 TO 90.00 TABLE 1 MODE FUNDAMENTAL FUNDAMENTAL FUNDAMENTAL FUNDAMENTAL THIRD OVERTONE MAXIMUM ESR (OHM) 200 150 100 50 100 REFLOW SOLDERING PROFILE 240 C - 5 REFLOW TEMPERATURE 10 s 150 C PREHEATING 100 s COOLING OUTLINE DRAWINGS mm inch Scale none Dimension in 25 C 180s MAX TIME (SECONDS) 4 M A R K IN G A R E A 3 1.8 .071 1.8 .071 CARRIER TAPE DIMENSIONS 1.8 .071 1.7 .067 1 12.5 M A X .492 M A X 9.4 .370 3.7 M A X .146 M A X 2 4.6 M A X .181 M A X 12.8 .504 24 .945 4.8 .189 12.0 .472 5.0 .197 0.8 .03 0.8 .03 PACKAGING PART NUMBERING SYSTEM HOLDER TYPE TT-SMDC FREQUENCY IN MHz 330 mm REEL DIAMETER, 24mm TAPE WIDTH. QUANTITY: 1000 PIECES PER REEL LOAD CAPACITANCE - 12 TO 32 pF FOR PARALLEL F S FOR SERIES 3OT MODE FUNDAMENTAL THIRD OVERTONE TAPE AND REEL TR EXAMPLE: TT-SMDC-12.288-22-TR Raltron Electronics Corporation 10651 NW 19th St. Miami, Florida 33172 U.S.A. Tel: 305-593-6033 Fax: 305-594-3973 e-mail: sales@raltron.com Internet: http://www.raltron.com 11.5 .453 1.75 .069 7.6 .299 S O LD E R PAT T E R N 1.5 D IA .06 D IA 2.0 .079 4.0 .16 |
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