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HANBit
HMF1M32M4GL
FLASH-ROM MODULE 4MByte (1M x 32-Bit),72pin-SIMM, 5V Part No. HMF1M32M4GL
GENERAL DESCRIPTION
The HMF1M32M4GL is a high-speed flash read only memory (FROM) module containing 1,048,576 words organized in a x32bit configuration. The module consists of four 1M x 8 FROM mounted on a 72 -pin, single-sided, FR4-printed circuit board. The HMF1M32M4GL is entirely pin and command set compatible with JEDEC single-power-supply flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine, which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from 12.0V flash or EPROM devices. Four chip enable inputs, (/WE0, /WE1, /WE2, /WE3) are used to enable the module's 8bits independently. Output enable (/OE) and write enable (/WE) can set the memory input and output. When FROM module is disable condition the module is becoming power standb y mode, system designer can get low-power design. All module components may be powered from a single +5V DC power supply and all inputs and outputs are TTL-compatible.
FEATURES
w Access time : 75, 90 and 120ns w High-density 4MByte design w High-reliability, low-power design w Single + 5V 0.5V power supply w Easy memory expansion w All inputs and outputs are TTL-compatible w FR4-PCB design w Low profile 72-pin SIMM w Minimum 1,000,000 write/erase cycle w Sector erase architecture w Sector group protection w Temporary sector group unprotection w The used device is AM29F080
PIN
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
PIN ASSIGNMENT
SYMBOL
Vss NC DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 Vcc DQ7 /WE0 RY-/BY DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 /WE1 NC DQ16
PIN
25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
SYMBOL
DQ17 DQ18 DQ19 DQ20 DQ21 Vcc DQ22 DQ23 /WE2 NC DQ24 DQ25 DQ26 DQ27 Vss DQ28 DQ29 DQ30 DQ31 /WE3 NC /Reset A19 /OE
PIN
49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72
SYMBOL
/BANK-E0 A18 A17 A16 A15 A14 A13 A12 A11 A10 Vcc A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 NC NC Vss
OPTIONS
w Timing 75ns access 90ns access 120ns access w Packages 72-pin SIMM
MARKING
-75 -90 -120
18 19 20 21 22 23 24
M
72-PIN SIMM TOP VIEW
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HMF1M32M4GL
FUNCTIONAL BLOCK DIAGRAM
32 DQ0 - DQ31 20 A0 - A19 A0-19 DQ 0-7
/WE0
/WE /OE
/CE RY-BY
U1
/Reset
A0-19 DQ 8-15 /WE1
/WE /OE
/CE RY-BY
U2
/Reset
A0-19
/WE2
/WE
/OE /CE RY-BY /Reset
DQ16-23
U3
A0-19
/WE3
/OE /BANK-E0 RY-/BY
DQ24-31 /WE /OE /CE RY-BY /Reset
U4
/Reset
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HMF1M32M4GL
TRUTH TABLE
MODE STANDBY NOT SELECTED READ WRITE or ERASE NOTE: X means don't care /OE X H L X /CE H L L L /WE X H H L DQ HIGH-Z HIGH-Z Q D POWER STANDBY ACTIVE ACTIVE ACTIVE
ABSOLUTE MAXIMUM RATINGS
PARAMETER Voltage with respect to ground all other pins Voltage with respect to ground Vcc Storage Temperature SYMBOL VIN,OUT VCC TSTG RATING -2.0V to +7.0V -2.0V to +7.0V -65oC to +125oC
Operating Temperature TA -55oC to +125 oC w Stresses greater than those listed under " Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operating section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
PARAMETER Vcc for 5% device Supply Voltages Vcc for 10% device Supply Voltages Ground SYMBOL VCC Vcc VSS MIN 4.75V 4.5V 0 0 TYP. MAX 5.25V 5.5V 0
DC AND OPERATING CHARACTERISTICS (0oC TA 70 oC ; Vcc = 5V 0.5V )
PARAMETER Input Leakage Current Output Leakage Current Output High Voltage Output Low Voltage Vcc Active Current for Read(1) Vcc Active Current for Program /CE = VIL, /OE=VIH or Erase(2) Vcc Standby Current Low Vcc Lock-Out Voltage Notes:
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TEST CONDITIONS Vcc=Vcc max, V IN= GND to Vcc Vcc=Vcc max, VOUT= GND to Vcc IOH = -2.5mA, Vcc = Vcc min IOL = 12mA, Vcc =Vcc min /CE = VIL, /OE=VIH,
SYMBOL IL1 IL0 VOH VOL ICC1 ICC2 ICC3 VLKO
MIN
MAX 1.0 1.0
UNITS A A V
2.4 0.45 40 60 1.0 3.2 4.2
V mA mA mA V
/CE= VIH
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1. The Icc current listed is typically less than than 2mA/MHz, with /OE at V IH. 2. Icc active while embedded algorithm (program or erase) is in progress 3. Maximum Icc current specifications are tested with Vcc =Vcc max
HMF1M32M4GL
ERASE AND PROGRAMMING PERFORMANCE
LIMITS PARAMETER MIN. Sector Erase Time TYP. 1 MAX. Excludes 00H programming 8 sec prior to erasure Byte Programming Time 7 300 s Excludes system-level overhead Excludes system-level Chip Programming Time 7.2 21.6 sec overhead UNIT COMMENTS
CAPACITANCE
PARAMETER SYMBOL CIN COUT CIN2 PARAMETER TEST SETUP DESCRIPTION Input Capacitance Output Capacitance Control Pin Capacitance VIN = 0 VOUT = 0 VIN = 0 6 8.5 7.5 7.5 12 9 pF pF pF MIN MAX UNIT
Notes : Test conditions TA = 25o C, f=1.0 MHz.
AC CHARACTERISTICS u Read Only Operations Characteristics
PARAMETER SYMBOLS JEDEC tAVAV tAVQV STANDARD tRC tACC Address to Output Delay /OE = VIL tELQV tGLQV tEHQZ tGHQZ tAXQX tCE tOE tDF tDF tQH /CE or /OE, Whichever Occurs First Chip Enable to Output Delay Chip Enable to Output Delay Chip Enable to Output High-Z Output Enable to Output High-Z Output Hold Time From Addresses, Min 0 0 /OE = VIL Max Max Max Max 70 40 20 20 90 40 20 20 Read Cycle Time /CE = V IL Max 70 90 Min 70 90 DESCRIPTION TEST SETUP -75 -90
UNIT
ns ns ns ns ns ns ns
TEST SPECIFICATIONS 4
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TEST CONDITION Output load Output load capacitance, 30 CL (Including jig capacitance) Input rise and full times Input pulse levels Input timing measurement reference levels Output timing measurement reference levels 5 0.0 - 3.0 1.5 1.5 75
HMF1M32M4GL
ALL OTHERS 1TTL gate 100 20 0.45-2.4 0.8, 2.0 0.8, 2.0 pF ns V V V UNIT
5.0V
2.7k Device Under Test CL IN3064 or Equivalent
6.2k
Diodes = IN3064 or Equivalent
Note : CL = 100pF including jig capacitance
u Erase/Program Operations
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX STANDARD tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH
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-75 Min Min Min Min Min Min Min Min Min 70 0 40 40 0 0 0 0 0
-90 90 0 45 45 0 0 0 0 0
UNIT ns ns ns ns ns ns ns ns ns
Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recover Time Before Write /CE Setup Time /CE Hold Time
tGHWL tCS tCH
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tWLWH tWHWL tWHWH1 tWHWH2 tWP tWPH tWHWH1 tWHWH2 tVCS Notes : 1. This does not include the preprogramming time 2. This timing is only for Sector Protect operations Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation (Note1) Vcc set up time Min Min Typ Typ Min
HMF1M32M4GL
40 20 7 1 50 45 20 7 1 50 ns ns s sec s
u Erase/Program Operations Alternate /CE Controlled Writes
PARAMETER SYMBOLS DESCRIPTION JEDEC tAVAV tAVWL tWLAX tDVWH tWHDX STANDARD tWC tAS tAH tDS tDH tOES tGHWL tELWL tWHEH tWLWH tWHWL tWHWH1 tWHWH2 Notes : 1. This does not include the preprogramming time 2. This timing is only for Sector Protect operations tGHWL tCS tCH tWP tWPH tWHWH1 tWHWH2 Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recover Time Before Write /CE Setup Time /CE Hold Time Write Pulse Width Write Pulse Width High Byte Programming Operation Sector Erase Operation (Note1) Min Min Min Min Min Min Min Min Min Min Min Typ Typ 70 0 40 40 0 0 0 0 0 40 20 7 1 90 0 45 45 0 0 0 0 0 45 20 7 1 ns ns ns ns ns ns ns ns ns ns ns s sec -75 -90 UNIT
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u READ OPERATIONS TIMING
HMF1M32M4GL
u RESET TIMING
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u PROGRAM OPERATIONS TIMING
HMF1M32M4GL
u CHIP/SECTOR ERASE OPERATION TIMINGS
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u DATA# POLLING TIMES(DURING EMBEDDED ALGORITHMS)
HMF1M32M4GL
u TOGGLE# BIT TIMINGS (DURING EMBEDDED ALGORITHMS)
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u SECTOR PROTECT UNPROTECT TIMEING DIAGRAM
HMF1M32M4GL
u ALTERNATE CE# CONTROLLED WRITE OPERATING TIMINGS
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PACKAGE DIMENSIONS
HMF1M32M4GL
108mm 3.2
6.35 mm
2.03 mm
1
72
1.02 mm
6.35 mm
1.27 mm
3.34 mm
95.25 mm
0.25 mm MAX
2.54 mm MIN
1.27
Gold: 1.040.10 mm Solder: 0.9140.10 mm
1.27(0.08)
(Solder & Gold Plating)
ORDERING INFORMATION
Part Number
Density
Org.
Package
Component Number 4EA 4EA 4EA
Vcc
SPEED
HMF1M32M4GL-75 HMF1M32M4GL-90 HMF1M32M4GL-120
4MByte 4MByte 4MByte
1Mx32bit 1Mx32bit 1Mx32bit
72Pin-SIMM 72Pin-SIMM 72Pin-SIMM
5.0V 5.0V 5.0V
75ns 90ns 120ns
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