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APX9131 Hall Effect Micro Switch IC Features * * * * * Micro Power Operation for Battery Applications Chopper Stabilized Amplifier Independent of North or South Pole Magnet, Easy for Manufacture Small Size Package Lead Free Available (RoHS Compliant) General Description The APX9131 integrated circuit is an ultra-sensitive, pole independent Hall-effect switch with a latched digital output. 2.5 volt to 3.5 volt operation and a unique clocking scheme reduce the average operating power requirements. Either a north or south pole of sufficient flux will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allow this device to be easily replaced reed switch for superior for signal conditioning. Advanced CMOS processing is used to take adv antage of low-voltage and low-power requirements, SOT-23 and TO-92 packages provide an optimized package for most applications. Applications * * * * Micro Switch Handheld Wireless Application Wake Up Switch Clamp Shell Type Application Switch Magnet Switch in Low Duty Cycle Applications Pin Description GND APX9131 1 : VDD 2 : GND 3 : VOUT 123 TO-92M3 Front View VDD VOUT Ordering Information APX9131 Lead Free Code Handling Code Temp. Range Package Code APX9131 A/AT: X31X X: Date Code SOT-23 Package Code A: SOT-23 AT : SOT-23 Thin E : TO-92M3 Operating Ambient Temp. Range I : -40 to 85 C Handling Code TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device APL9131 E: APX 9131 XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 1 www.anpec.com.tw APX9131 Function Pin Descriptions No 1 Name VDD Function Power Input When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than BOPN) the output turns on (output is low). When the magnetic field is below the release point BRPS (or above BRPN), the output turns off (output is high). It is design with open drain configuration and connecting a pull up resistor from VOUT to VDD is necessary. It cannot be floating. Ground Connection 2 VOUT 3 GND Block Diagram VDD Awake & Sleep Timing Logic VOUT Hall Plane Dynamic Offset Cancellation Latch Circuit Chopper Amplifier Hysteresis Control GND Typical Applications 50K VOUT VDD + 2.5V-3.5V 0.1uF APX9131 GND - SOT-23 (Top View) Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 2 www.anpec.com.tw APX9131 Absolute Maximum Ratings Symbol VDD VOUT TJ TSTG Parameter Supply Voltage Output Voltage Junction Temperature Range Storage Temperature Range (T A = 25C unless otherwise noted) Rating 5 5 150 -65 to +150 Unit V V C Electrical Characteristics Symbol VDD IDD IOFF VOL tawake tperiod d.c. fc Characteristic Supply Voltage Range Supply Current (TA = 25C, VDD=3V unless otherwise noted) APX9131 Min. 2.5 5 1.2 2 20 180 60 0.3 11 Typ. Max. 3.5 10 2 8 1.0 40 Test Condition Operating Average Awake sleep VOUT = 3.5V, BRPNUnit V A mA A A mV s mS % KHz Output Leakage Current Output Low Voltage Wake up Time Period Duty Cycle Chopping Frequency Magnetic Characteristics (TA = 25C, VDD=3V unless otherwise noted) Symbol BOPS BOPN BRPS BRPN Bhys Characteristic Test Condition APX9131 Min. -75 10 Typ. 50 -50 35 -35 15 -10 Max. 75 Unit G G G G G Operate Points Release Points Hysteresis Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 3 www.anpec.com.tw APX9131 Typical Characteristics Switching Points vs. Ambient Temperature 80 60 BOPS Switching Points vs. Supply Voltage 80 TA=25C 60 BOPS Switching Points (G) 40 BRPS Switching Points (G) 40 BRPS 20 0 -20 -40 -60 -80 -40 -20 0 20 40 60 80 100 BOPN BRPN 20 0 -20 -40 BOPN BRPN -60 2.5 3 3.5 4 4.5 5 Ambient Temperature (C) Supply Voltage (V) Average Supply Current vs. Ambient Temperature 10 Average Supply Current vs.Supply Voltage 20 18 16 14 12 10 8 6 4 2 0 2.5 3 3.5 4 4.5 5 TA=25C Average Supply Current (uA) 8 6 4 2 0 -40 -20 0 20 40 60 80 100 Ambient Temperature (C) Average Supply Current (uA) Supply Voltage (V) Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 4 www.anpec.com.tw APX9131 Typical Characteristics Output Sink Current vs. Output Low Voltage 20 18 VDD=5V Output Switch Waveform Output Sink Current (mA) 16 14 12 10 8 6 4 2 0 0 0.2 0.4 0.6 0.8 1 VDD=3V Output Sink Voltage (0.5V/div) VDD=4V VDD=3V RL=5.1k CL=12pF VOUT=0.5V/div 0 Output Low Voltage (V) Time (2us/div) Output Switch Waveform Output Sink Voltage (0.5V/div) VDD=3V RL=5.1k CL=12pF VOUT=0.5V/div Time (50us/div) Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 5 www.anpec.com.tw APX9131 Function Description Operation The output of APX9131 switches low (turns on) when in presence of strong flux density facing the marked side of package exceeds the operate point BOPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1 mA and the output voltage is low (turns on). In absence of flux density below the release point BRPS (or increased above BRPN), the APX9131 output switches high (turns off). The difference in the magnetic operated and released point is the hysteresis (Bhys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical bouncing vibration and electrical noise. Pole-independent The pole-independent sensing technique allows for operation with either a north or south pole magnet orientation, enhancing the manufacturability of the device. The state-of-the-art technology provides the same output polarity for either pole in presence. Awake & Sleep Internal awake & sleep timing block circuit activates the sensor for 180 us and deactivates it for the remainder of the period (60 ms). A short "awake" time allows for stabilization prior to the sensor sampling and data latching on the falling edge of the timing pulse. While in sleep cycle the output is latched in its previous state. Chopper Stabilized Technique BOPS OUTPUT OFF 5V MAX OUTPUT VOLTAGE BOPN The chopper stabilized technique cancels the mismatching of the hall element, the amplifier offset voltage and temperature sensitive drift by the dynamic offset cancellation and switched capacitor technique. This technique produces devices have an extremely stable Hall output voltage, therefore the magnetic switch points are stable. BRPN 0 -B 0 MAGNETIC FLUX BRPS OUTPUT ON +B Application Information It is strongly recommended that an external bypass capacitor be connected (in close to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies.The output is an open drain output, it must be connected a pull-up resistor to a supply voltage which is lower than 5V, connect a 50k resistor to VDD in common use. Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 6 www.anpec.com.tw APX9131 Packaging Information SOT-23 D B 3 E 1 2 H e A A1 L C Dim A A1 B C D E e H L Millimeters Min. 1.00 0.00 0.35 0.10 2.70 1.40 1.90/2.1 BSC. 2.40 0.37 3.00 Max. 1.30 0.10 0.51 0.25 3.10 1.80 Min. 0.039 0.000 0.014 0.004 0.106 0.055 Inches Max. 0.051 0.004 0.020 0.010 0.122 0.071 0.075/0.083 BSC. 0.094 0.118 0.015 Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 7 www.anpec.com.tw APX9131 Package Information SOT-23 Thin D b 3 E1 1 2 E e e1 L1 R A A2 c A1 L Dim A A1 A2 b c D E E1 e e1 L L1 R Millimeters Min. 0.70 0.00 0.70 0.35 0.10 2.80 2.60 1.50 0.95 BSC 1.90 BSC 0.37 0.60 REF 0.10 0 8 0.004 0 0.015 Max. 0.90 0.10 0.80 0.51 0.25 3.00 3.00 1.70 Min. 0.028 0.000 0.028 0.014 0.004 0.110 0.102 0.059 Inches Max. 0.035 0.004 0.031 0.020 0.010 0.118 0.118 0.067 0.0374 BSC 0.0748 BSC 0.0236 REF 8 Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 8 www.anpec.com.tw APX9131 Package Information TO-92M3 B 1 C OVERLOOK D 3 e 2 E F 3 1 FRONT H PIN 1 : VDD PIN 2 : GND PIN 3 : OUTPUT RIGHT-SIDE LOOK 2 H S A Dim A B C D e E F G H I S 1 2 3 Millimeters Min. 1.40 10 14 0.35 2.80 1.24 3.90 2.34 4.04 0.35 2.51 0.63 5 3 45 Max. 1.60 11 15 0.41 3.20 1.30 4.30 2.64 4.24 0.41 2.57 0.81 Min. 0.055 0.394 0.551 0.014 0.110 0.049 0.154 0.092 0.159 0.014 0.099 0.025 Inches Max. 0.063 0.433 0.591 0.016 0.126 0.051 0.169 0.104 0.167 0.016 0.101 0.032 5 3 45 Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 9 www.anpec.com.tw APX9131 Physical Specifications Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. 3000 devices per reel Reflow Condition TP (IR/Convection or VPR Reflow) tp Critical Zone T L to T P Ramp-up Temperature TL Tsmax tL Tsmin Ramp-down ts Preheat 25 t 25 C to Peak Time Classificatin Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (T L) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Note: All temperatures refer to topside of the package .Measured on the body surface. 10 www.anpec.com.tw Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 APX9131 Classificatin Reflow Profiles(Cont.) Table 1. SnPb Entectic Process - Package Peak Reflow Temperature s 3 3 Package Thickness Volume mm Volume mm <350 350 <2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Table 2. Pb-free Process - Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Reliability test program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245C , 5 SEC 1000 Hrs Bias @ 125 C 168 Hrs, 100 % RH , 121C -65C ~ 150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA t D P1 Carrier Tape & Reel Dimensions Po E P F W Bo Ao Ko D1 Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 11 www.anpec.com.tw APX9131 Carrier Tape & Reel Dimensions(Cont.) T2 J C A B T1 Application A 1781 B 60 1.0 D C 12.0 D1 p0.1MIN C 12.0 D1 1.10.1 A2 761 D1 J 2.5 0.15 Po 4.0 J 2.5 0.15 Po 4.00.1 A3 301 D2 T1 9.0 0.5 P1 2.0 0.05 T1 9.0 0.5 P1 2.0 0.05 B0 901 F1=F2 2.5+0.2 -0.1 H5=H0+M 18.50.5 T3 15 T2 1.4 Ao 3.1 T2 1.4 Ao 3.30.1 B1 311 F1-F2 0.3 L 11.0 MAX T4 1.7 SOT-23 F W 8.0+ 0.3 - 0.3 Bo 3.0 W 8.0+ 0.2 Bo 3.20.1 B2 761 M 2.50.5 L1 2.5 MIN W 18.00.2 P 4.0 Ko 1.3 P 4.00.1 Ko 1.10.1 C0 5.8 H 160.5 P 12.70.3 W1 6.00.2 E 1.75 t 0.20.03 E 1.750.1 t 0.250.05 C1 3.8 H1 90.5 P1 6.350.4 W2 1 3.5 0.05 1.5 +0.1 Application A B 1781 SOT-23 Thin F 3.5 0.05 Application A0 3.18~12 C2 7.8 TO-92 H2 60 1.0 D 1.55+ 0.05 A1 901 D 4.00.2 H2A 0.36~0.53 9.0 MAX H3 H4 0.5 MAX 0.5 MAX 27.0 MAX 20.0 MAX P2 T T1 T2 50.80.5 0.55 MAX 1.42 MAX 0.36~0.68 (mm) Cover Tape Dimensions Application SOT- 23 SOT- 23 Thin TO-92 Carrier Width 8 8 17.5~19 Cover Tape Width 5.3 5.3 5.0~7.0 Devices Per Reel 3000 3000 2000 (mm) Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 12 www.anpec.com.tw APX9131 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright (c) ANPEC Electronics Corp. Rev. A.7 - Sep., 2005 13 www.anpec.com.tw |
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