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| APM3195PU P-Channel Enhancement Mode MOSFET Features * -30V/-11.8A , RDS(ON)=100m (typ.) @ VGS=-10V RDS(ON)=170m (typ.) @ VGS=-4.5V Pin Description G D S * * * Super High Dense Cell Design Reliable and Rugged Lead Free Available (RoHS Compliant) Top View of TO-252 S Applications * Power Management in Desktop Computer or DC/DC Converters G D P-Channel MOSFET Ordering and Marking Information APM3195P Lead Free Code Handling Code Temp. Range Package Code Package Code U : TO-252 Operating Junction Temp. Range C : -55 to 150 C Handling Code TU : Tube TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device XXXXX - Date Code APM3195P U : APM3195P XXXXX Note: ANPEC lead-free products contain molding compounds and 100% matte tin plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 1 www.anpec.com.tw APM3195PU Absolute Maximum Ratings Symbol Common Ratings (TA = 25C) VDSS VGSS TJ TSTG IS Drain-Source Voltage Gate-Source Voltage Maximum Junction Temperature Storage Temperature Range Diode Continuous Forward Current TC=25C TC=25C TC=100C TC=25C TC=100C TC=25C TC=100C -30 20 150 -55 to 150 -8 -20 -15 -11.8 -7.5 50 20 2.5 W C/W V C C A Parameter Rating Unit Mounted on Large Heat Sink IDP ID PD RJC 300s Pulse Drain Current Tested A Continuous Drain Current Maximum Power Dissipation Thermal Resistance-Junction to Case 2 A Mounted on PCB of 1in Pad Area IDP ID PD RJA 300s Pulse Drain Current Tested Continuous Drain Current Maximum Power Dissipation Thermal Resistance-Junction to Ambient TA=25C TA=100C TA=25C TA=100C TA=25C TA=100C TA=25C TA=100C TA=25C TA=100C TA=25C TA=100C -20 -15 -3 -2 2.5 1 50 -50 -30 -2 -1 1.6 0.6 75 W C/W W C/W A A Mounted on PCB of Minimum Footprint IDP ID PD RJA 300s Pulse Drain Current Tested Continuous Drain Current A A Maximum Power Dissipation Thermal Resistance-Junction to Ambient Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 2 www.anpec.com.tw APM3195PU Electrical Characteristics Symbol Static Characteristics BVDSS IDSS VGS(th) IGSS RDS(ON) a (TA = 25C unless otherwise noted) APM3195PU Min. Typ. Max. Parameter Test Condition Unit Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance VGS=0V, IDS=-250A VDS=-24V, VGS=0V TJ=85C VDS=VGS, IDS=-250A VGS=20V, VDS=0V VGS=-10V, IDS=-4A VGS=-4.5V, IDS=-3A ISD=-0.5A, VGS=0V VGS=0V,VDS=0V,F=1MHz VGS=0V VDS=-25V Frequency=1.0MHz -30 -1 -30 -1 -1.5 100 170 -2 100 240 460 V A V nA m Diode Characteristics VSD a Diode Forward Voltage -0.8 -1.3 V pF Dynamic Characteristics b RG Ciss Coss Crss td(ON) Tr td(OFF) Tf Qg Qgs Qgd Notes: a : Pulse test ; pulse width300s, duty cycle2%. b : Guaranteed by design, not subject to production testing. Gate Resistance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time b 11 510 70 36 10 20 20 50 15 8 25 5 VDD=-15V, RL=15, IDS=-1A, VGEN=-10V, RG=6 ns Gate Charge Characteristics Total Gate Charge 8.1 VDS=-15V, VGS=-10V, IDS=-4A 2 1.1 10.5 nC Gate-Source Charge Gate-Drain Charge Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 3 www.anpec.com.tw APM3195PU Typical Characteristics Power Dissipation 60 14 12 Drain Current 50 40 -ID - Drain Current (A) Ptot - Power (W) 10 8 6 4 2 30 20 10 TC=25 C 0 20 40 60 80 100 120 140 160 180 o TC=25 C,VG=-10V 0 0 20 40 60 80 100 120 140 160 180 o 0 Tj - Junction Temperature (C) Tj - Junction Temperature (C) Safe Operation Area Normalized Transient Thermal Resistance 50 2 1 Thermal Transient Impedance Duty = 0.5 0.2 0.1 0.05 0.1 0.02 0.01 -ID - Drain Current (A) 10 Lim it Rd s(o n) 10ms 100ms 1s DC 1 Single Pulse 0.01 1E-4 Mounted on 1in pad o RJA :50 C/W 2 TC=25 C 0.1 0.1 o 1 10 100 1E-3 0.01 0.1 1 10 100 -VDS - Drain - Source Voltage (V) Square Wave Pulse Duration (sec) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 4 www.anpec.com.tw APM3195PU Typical Characteristics (Cont.) Output Characteristics 20 -VGS=7,8,9,10V -6V 16 Drain-Source On Resistance 300 VGS=-4.5V RDS(ON) - On - Resistance (m) 250 -ID - Drain Current (A) -5V 12 200 150 VGS=-10V 100 8 -4V 4 -3V 50 0 0 2 4 6 8 10 0 0 4 8 12 16 20 -VDS - Drain - Source Voltage (V) -ID - Drain Current (A) Transfer Characteristics 20 18 16 Gate Threshold Voltage 1.8 IDS =-250A 1.6 Normalized Threshold Vlotage 10 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -ID - Drain Current (A) 14 12 10 8 6 4 2 0 0 Tj=-55 C o Tj=25 C o Tj=125 C o 2 4 6 8 0.0 -50 -25 0 25 50 75 100 125 150 -VGS - Gate - Source Voltage (V) Tj - Junction Temperature (C) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 5 www.anpec.com.tw APM3195PU Typical Characteristics (Cont.) Drain-Source On Resistance 1.8 VGS = -10V 1.6 IDS = -4A 10 20 Source-Drain Diode Forward Normalized On Resistance -IS - Source Current (A) 1.4 1.2 1.0 0.8 0.6 0.4 -50 -25 RON@Tj=25 C: 100m 0 25 50 75 100 125 150 o Tj=150 C o 1 Tj=25 C o 0.1 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Tj - Junction Temperature (C) -VSD - Source - Drain Voltage (V) Capacitance 1000 Frequency=1MHz 900 800 9 10 VDS=-10V IDS= -4A Gate Charge -VGS - Gate-source Voltage (V) 30 8 7 6 5 4 3 2 1 C - Capacitance (pF) 700 600 Ciss 500 400 300 200 100 Crss 0 0 5 10 15 20 25 Coss 0 0 1 2 3 4 5 6 7 8 9 -VDS - Drain - Source Voltage (V) QG - Gate Charge (nC) Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 6 www.anpec.com.tw APM3195PU Package Information TO-252 (Reference JEDEC Registration TO-252) E b2 L2 A C1 D H L1 L b e1 D1 C A1 E1 Dim A A1 b b2 C C1 D D1 E E1 e1 H L L1 L2 Millimeters Min. 2.18 0.89 0.508 5.207 0.46 0.46 5.334 5.2 REF 6.35 5.3 REF 3.96 9.398 0.51 0.64 0.89 1.02 2.032 7 Inches Max. 2.39 1.27 0.89 5.461 0.58 0.58 6.22 6.73 5.18 10.41 Min. 0.086 0.035 0.020 0.205 0.018 0.018 0.210 0.205 REF 0.250 0.209 REF 0.156 0.370 0.020 0.025 0.035 0.040 0.080 www.anpec.com.tw Max. 0.094 0.050 0.035 0.215 0.023 0.023 0.245 0.265 0.204 0.410 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 APM3195PU Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition TP (IR/Convection or VPR Reflow) tp Critical Zone T L to T P Ramp-up Temperature TL Tsmax tL Tsmin Ramp-down ts Preheat 25 t 25 C to Peak Time Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (T L) - Time (tL) Peak/Classificatioon Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds 6C/second max. 6C/second max. 6 minutes max. 8 minutes max. Time 25C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. 8 www.anpec.com.tw Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 APM3195PU Classification Reflow Profiles(Cont.) Table 1. SnPb Entectic Process - Package Peak Reflow Temperature s Package Thickness Volume mm 3 Volume mm 3 <350 350 <2.5 mm 240 +0/-5C 225 +0/-5C 2.5 mm 225 +0/-5C 225 +0/-5C Table 2. Pb-free Process - Package Classification Reflow Temperatures Package Thickness Volume mm 3 Volume mm 3 Volume mm 3 <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Reliability Test Program Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles Carrier Tape & Reel Dimensions t E Po P P1 D F W Bo Ao D1 Ko Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 9 www.anpec.com.tw APM3195PU Carrier Tape & Reel Dimensions (Cont.) T2 J C A B T1 Application A 330 3 B 100 2 D 1.5 +0.1 C 13 0. 5 D1 J 2 0.5 Po T1 T2 16.4 + 0.3 2.5 0.5 -0.2 P1 2.0 0.1 Ao 6.8 0.1 W 16+ 0.3 - 0.1 Bo 10.4 0.1 P 8 0.1 Ko 2.5 0.1 E 1.75 0.1 t 0.30.05 TO-252 F 7.5 0.1 1.5 0.25 4.0 0.1 (mm) Cover Tape Dimensions Application TO- 252 Carrier Width 16 Cover Tape Width 13.3 Devices Per Reel 2500 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright (c) ANPEC Electronics Corp. Rev. B.2 - Oct., 2005 10 www.anpec.com.tw |
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