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0.635mm Pitch S.O. DIMM Socket
SX1 Series
Variation in Mounting Height
q Low Profile Type (Mounting Height: 4.0mm)
q Standard Type (Mounting Height: 5.5mm)
sFeatures
1. 72pos. Small Outline DIMM Socket
SX1 series is a 0.635mm pitch horizontal SMT type socket applicable to Small Outline DIMM standardized in JEDEC. The size is about half as large as the conventional 72 contacts DRAM SIMM socket. Corresponding to double density (both surfaces), this socket realizes high functionality and density of the module board. q High Profile Type (Mounting Height: 8.0mm)
2. Variation in Mounting Height
Three grades of variation are available for the mounting height.
3. Easy Insertion and Extraction of Module Board
One-touch operation to insert the module board slantly and push it downward. Widen latches right and left, and the module board will be automatically raised. This mechanism allows easy automatic insertion and extraction.
4. Achieve High Performance
This socket achieves high performance by the wiping effect in the insertion and the unique press-fit face contact.
Easy Insertion and Extraction Operation of Module Board
5. Insertion and Extraction Operation with Click Sensibility
The unique mold twin-latch allows excellent insertion and extraction operation with a sensible click.
sApplications
Personal computers, business equipment, Measuring instrument, telecommunication equipment, FA, game, etc.
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sProduct Specifications
Current rating Rating Voltage rating Operating Temperature Range Item 1. Contact Resistance 2. Insulation Resistance 3. Withstanding voltage 4. Vibration 5. Humidity (Steady state) 6. Temperature Cycle 7. Durability (Insertion/withdrawal) 8. Salt spray -55c+85c 125V AC 0.5A Condition 100mA 250V DC 250V AC / 1 minute Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 50 minutes in each of the 3 directions. 96 hours at temperature of 40c and humidity of 90% to 95% 5 cycles under following condition; Temperature : -55 +5 to 35 +85 +5 to 35c Time 30 cycles Exposed to density 5% salt water for 48 hours : -30 10 to 15 +30 10 to 15 Operating Humidity Range -55c to +85c
Specification 35m ohms min. 1000M ohms min. No flashover or insulation breakdown. No electrical discontinuity of 1s or more Contact resistance: 55m ohms max. Insulation Resistance: 1000M ohms min Contact resistance: 55m ohms max. Insulation Resistance: 1000M ohms min:
Contact resistance: 55m ohms max. Contact resistance: 55m ohms max.
sMaterial
Part Contact Insulator Metal Fitting Material Phosphor copper PA(UL94V-0) Phosphor copper Finish Selictive Gold plating ---------Solder plating
sOrdering Information
SX1 C A - 72 S - 0.635 SH
q w e r t y u q Series Name w Mounting Height B : Standard type (Height: 5.5mm) C : High profile type (Height: 8.0mm) E : Low profile type (Height: 4.0mm) e DIMM Key None : 3.3V type A : 5V type : SX1
r Number of Contacts t Contact Type y Contact Pitch u Contact type SH : SMT type
: 72
: Female contact : 0.635mm
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sStandard Type
Part Number SX1B-72S-0.635SH SX1BA-72S-0.635SH
CL No. 530-0018-9 530-0019-1
Number of Contacts 72
Key 3.3V Type 5V Type
D 3.1 5.4
Remarks
Selective gold plating Selective gold plating
Note 1: The tube packaging product is provided for products marked with *. In order to designate the tube package product, add (20) to the tail of the Part Number (Delivery unit: 20 pcs per set) Note 2: The 3.3V and 5V keys correspond to the Small Outline DIMM key.
sHigh Profile Type
Part Number SX1C-72S-0.635SH SX1CA-72S-0.635SH
CL No. 530-0003-1 530-0004-4
Number of Contacts 72
Key 3.3V Type 5V Type
D 3.1 5.4
Remarks
Selective gold plating Selective gold plating
Note 2: The 3.3V and 5V keys correspond to the Small Outline DIMM key.
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sLow Profile Type
Part Number SX1E-72S-0.635SH SX1EA-72S-0.635SH
CL No. 530-0006-0 530-0007-2
Number of Contacts 72
Key 3.3V Type 5V Type
D 3.1 5.4
Remarks
Selective gold plating Selective gold plating
Note 2: The 3.3V and 5V keys correspond to the Small Outline DIMM key.
BRecommended Temperature Profile
q IR Reflow: Recommended Temperature Profile (Up to second reflow) q Manual Soldering
Soldering iron temperature: 30010c Manual soldering time: 3 seconds max. Temperature This temperature profile is recommended. The temperature may be slightly changed according to solder paste types and amount.
250 240 220 200 180 150 140
235
5 seconds max.
(c)
qApplicable Conditions
Reflow system : IR reflow Solder : Paste type 63 Sn/37 Pb (Flux content 11 wt%) Test board Glass epoxy 110mm x 85mm x 1.6 mm Metal mask thickness: 0.15 mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and amount.
Preheating time, 80 seconds (Time) Soldering time, Naturally 30 seconds exposed
D34
BRecommended Module Board Dimensions
Unit: mm A 25.40 31.75 38.10 B 3.3V 3.18 3.18 3.18 5V 6.35 6.35 6.35
BPCB mounting pattern
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BPrecautions for use
Latch knob Latch claw Latch arm Polarizing key Latch section Side notch
Procedures for Board Insertion
Key
Procedures for Board Insertion
1. Adjust the socket polarizing key and the board key to the same direction. 2. Insert the board obliquely. Moreover, lay the board in parallel to the opening at angle of 20 to 30 , and softly insert the board so as to hit the socket bottom. Stopping insertion halfway will result in improper insertion. 3. Applying the board side notch in parallel to the socket bottom so that the board position cannot be displaced, press the board side notch up, and fix it to the latch portion at both socket edges. Press the board side notch, and release the notch with a snap "click" tone, if the printed board exceeds the latch claw head. 3. With this action, the board has been completely installed in the socket. At this time, pressing force is equivalent to the extent to turn on the electric product switch. If the stronger pressing force is needed, check whether the direction and depth to insert the board is adequate or not, and then re-push the board.
q
Procedures for Board Extraction
Standard type and high profile type Apply the thumb nail to the latch knob at both socket edges. Forcibly widen the latch knobs to right and left ways, and release the latch. Then, draw the board out along an angle where the board is raised. Low profile type Press the top of the latch unit down with fingers to release the latch, and directly draw the board out. Cautions 1. The latch has strength enough to endure. However, if force is applied according to other operation methods instead of the Procedures for Handling Sockets, or if further force is given in the state where the module board is raised, products could be damaged. Be sure to observe the Procedures for Handling Sockets. 2. The board is designed in compliance with JEDEC "Small Outline DIMM (Dual Inline Memory Module". However, if the board is used instead of the recommended module board, or if the mounting product is used for other devices than DRAM memory IC, troubles due to vibration or other failures could occur. If needed, consult the HRS company. 3. The above illustration shows SX1B. 4. The recommended module board pad or sharp angle edges could cause failure in contacts. Therefore, it is recommended to offset the tie-bar from the center line, set the internal pad (0.1mm), or remove sharp corners or burrs according to the recommended sizes. 5. Don't provide the external contact surface of the module board with the convex/concave and chamfer areas at both edges. Comply with the recommended sizes. 6. When the board is mounted or housing is installed, if warpage or flexure has occurred, an excessive load could cause changes in the solder bonding area and the strength. Check individual conditions.
w
e
Procedures for Board Extraction
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