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DATA SHEET
CX77140: PA Module for CDMA / AMPS (824-849 MHz)
Applications
* Digital cellular (CDMA) * Analog cellular (AMPS) * Wireless local loop (WLL) The CX77140 Power Amplifier Module (PAM) is a dual-mode, fully matched, 10-pin surface mount module developed for Code Division Multiple Access (CDMA) / Advanced Mobile Phone Service (AMPS) cellular handsets and Wireless Local Loop (WLL) applications. This small and efficient power amplifier module packs full coverage of the 824-849 MHz bandwidth into a single compact package. The device meets the stringent IS95 CDMA linearity requirements up to at least 28 dBm output power, and can be driven to levels beyond 31 dBm for high efficiency in FM mode operation. A low current digital pin (VCONT) provides improved efficiency for the low RF power range of operation. The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match is realized off-chip and within the module package to optimize efficiency and power performance into a 50 load. This device is manufactured with Skyworks' GaAs Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply operation while maintaining high efficiency and good linearity. Primary bias to the CX77140 is supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the range of 3.2 to 4.2 volt. Power down is accomplished by setting the voltage on the low current reference pin to zero volts. No external supply side switch is needed as typical "off" leakage is a few microamperes with full primary voltage supplied from the battery.
Features
* Low voltage positive bias supply - 3.2 V to 4.2 V * Low VREF - 2.85 V, nominal * Good linearity * High efficiency * Dual mode operation * Large dynamic range * 10-pin package - 4 mm x 4 mm x 1.5 mm * Power down control * Low power-state control * InGaP * IS95/CDMA2000
Figure 1. Functional Block Diagram
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DATA SHEET * CX77140
PA MODULE FOR CDMA / AMPS (824-849 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the CX77140 Power Amplifier Module. Table 1 lists the absolute maximum ratings. Table 2 specifies the recommended operating conditions for the CX77140 to achieve the electrical performance under the recommended operating conditions listed in Table 4. Table 3 is a power range truth table.
Table 1. Absolute Maximum Ratings (1)
Parameter RF Input Power Supply Voltage Reference Voltage Case Operating Temperature Case Storage Temperature
(1)
Symbol PIN VCC VREF TC TSTG
Minimum -- -- -- -30 -55
Nominal 4.0 3.4 2.85 25 --
Maximum 7.0 6.0 3.1 +110 +125
Unit dBm Volts Volts C C
No damage assuming only one parameter is set at limit at a time with all other parameters set at or below nominal value.
Table 2. Recommended Operating Conditions
Parameter Supply Voltage Reference Voltage PA On PA Off Mode Input Impedance >2.5 k Operating Frequency Case Operating Temperature High Bias Mode Low Bias Mode Symbol VCC VREF VREF VCONT VCONT FO TC Minimum 3.2 2.75 -- 0.0 2.0 824.0 -30 Nominal 3.4 2.85 < 0.5 0.5 2.5 836.5 -- Maximum 4.2 2.95 -- 1.0 3.0 849.0 +85 MHz C Volts Unit Volts Volts
Table 3. Power Range Truth Table
Power Mode High Power Low Power Shut Down VREF 2.85 V 2.85 V 0.0 V VCONT 0.5 V 2.5 V 0.0 V Range 16 dBm to 28.0 dBm 16 dBm --
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PA MODULE FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * CX77140
Table 4. Electrical Specifications for CDMA / AMPS Nominal Operating Conditions (1)
Characteristics Symbol GLOW Gain conditions Digital Mode GHIGH Analog Mode GP PAELOW Digital Mode Power Added Efficiency Analog Mode Total Supply Current Quiescent Current Reference Current Control Current Total Supply current in Power-down Mode PAEHIGH PAEA ICC_LOW ICC_HIGH IQ_LOW IQ_HIGH IREF ICONT IPD ACP1LOW 885 kHz offset ACP1HIGH Adjacent Channel Power (2)(3) ACP2LOW 1.98 MHz offset ACP2HIGH Harmonic Suppression Noise Power in RX Band 869-894 MHz Noise Figure Input Voltage Standing Wave Ratio (4) Stability (Spurious output) Ruggedness - No damage (5)
(1) (2) (3)
Condition VCONT = 2.5 V PO = 16 dBm VCONT = 0.5 V PO = 28 dBm VCONT = 0.5 V PO = 31 dBm VCONT = 2.5 V PO = 16 dBm VCONT = 0.5 V PO = 28 dBm VCONT = 0.5 V PO = 31 dBm PO = 16 dBm PO = 28 dBm VCONT = 2.5 V VCONT = 0.5 V -- VCONT = 2.5 V VCC = 3.4 V VREF = 0 V VCONT = 2.5 V PO 16 dBm VCONT = 0.5 V PO 28 dBm VCONT = 2.5 V PO 16 dBm VCONT = 0.5 V PO 28 dBm PO 31.0 dBm PO 31.0 dBm PO 28.0 dBm -- -- 5:1 VSWR all phases PO 28.0 dBm
Minimum 23.0 27.0 26.5 7.0 37.0 48.0 -- -- 30 65 -- -- -- -- -- -- -- -- -- -- -- -- -- 10:1
Typical 26.0 29.0 28.0 8.0 40.0 54.0 145 460 50 75 4.5 0.25 3.0 -49.0 -50.0 -65.0 -61.0 -35.0 -50.0 -137 5.0 -- -- --
Maximum 27.0 31.0 30.0 -- -- -- 150 505 65 120 5.0 0.7 5.0 -46.0 -48.0
Unit
dB
%
mA mA mA mA A
dBc -59.0 -58.5 -29.0 -35.0 -136 -- 2.0:1 -60.0 -- dBm/Hz dB -- dBc VSWR dBc
Second Third
FO2 FO3 RxBN NF VSWR S Ru
VCC = +3.4 V, VREF = +2.85 V, Freq = 836.5 MHz, TC = +25 C, unless otherwise specified. ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = -3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, back-off of 0.5 dB output power is required. For low power mode, VSWR = 2.5:1. All phases, time = 10 seconds.
(4) (5)
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DATA SHEET * CX77140
PA MODULE FOR CDMA / AMPS (824-849 MHZ)
Table 5. Electrical Specifications for CDMA / AMPS Recommended Operating Conditions (1)
Characteristics Symbol GLOW Digital Mode Gain conditions Analog Mode GHIGH GP ACP1LOW 885 kHz offset ACP1HIGH Adjacent Channel Power
(2)(3)
Condition VCONT = 2.5 V PO = 16 dBm VCONT = 0.5 V PO = 28 dBm VCONT = 0.5 V PO = 31 dBm VCONT = 2.5 V PO 16 dBm VCONT = 0.5 V PO 28 dBm VCONT = 2.5 V PO 16 dBm VCONT = 0.5 V PO 28 dBm PO 31.0 dBm PO 31.0 dBm PO 28.0 dBm -- -- 5:1 VSWR all phases PO 28.0 dBm
Minimum 22.5 26.0 24.5 -- -- -- -- -- -- -- -- -- -- 10:1
Maximum 28.0 32.0 31.0 -43.5 -44.0
Unit
dB
dBc -56.0 -56.0 -28.5 -35.0 -134 7 2.0:1 -60.0 -- dBm/Hz dB -- dBc VSWR dBc
ACP2LOW 1.98 MHz offset ACP2HIGH Harmonic Suppression Noise Power in RX Band 869-894 MHz Noise Figure Input Voltage Standing Wave Ratio Stability (Spurious output) Ruggedness - No damage (4)
(1) (2) (3)
Second Third
FO2 FO3 RxBN NF VSWR S Ru
Per Table 2, unless otherwise specified. ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW. CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = -3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, 0.5 dB back-off of output power is required. All phases, time = 10 seconds.
(4)
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PA MODULE FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * CX77140
Characterization Data
The graphs in Figure 2 through Figure 8 illustrate the characteristics of a typical CX77140 power amplifier designed for operation in the CDMA/AMPS frequency band (824-849 MHz). This amplifier was selected by characterizing a group of devices and choosing a part with average electrical performance for both nominal and the full range of recommended operating conditions, including worst case limits. The graphs illustrate the digital signal characteristics of the CX77140. Shown are power sweep characteristics for key performance parameters over temperature and frequency, up to 28 dBm output power. The data was taken up to and including 16 dBm output power with the bias mode control pin setting of VCONT = 2.5 volts. Beyond 16 dBm output power, the VCONT was set to 0 volts.
Figure 2. Digital Mode Gain vs. Output Power
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DATA SHEET * CX77140
PA MODULE FOR CDMA / AMPS (824-849 MHZ)
Figure 3. Primary Bias Current vs. Output Power
Figure 4. Power Added Efficiency vs. Output Power
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PA MODULE FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * CX77140
Figure 5. Adjacent Channel Power for 0.885 MHz Offset vs. Output Power
Figure 6. Adjacent Channel Power for 1.98 MHz Offset vs. Output Power
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DATA SHEET * CX77140
PA MODULE FOR CDMA / AMPS (824-849 MHZ)
Figure 7. Second Harmonic Rejection vs. Output Power
Figure 8. Third Harmonic Rejection vs. Output Power
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PA MODULE FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * CX77140
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the interface testing of the CX77140, the evaluation board schematic and diagrams are included for preliminary analysis and design. Figure 9 shows the basic schematic of the board for the 824 MHz to 849 MHz range and Figure 10 shows the layout of the board assembly.
Figure 9. Evaluation Board Schematic
Figure 10. Evaluation Board Assembly Diagram
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DATA SHEET * CX77140
PA MODULE FOR CDMA / AMPS (824-849 MHZ)
Package Dimensions and Pin Descriptions
The CX77140 is a multi-layer laminate base, overmold encapsulated modular package designed for surface mount solder attachment to a printed circuit board. Figure 11 is a mechanical drawing of the pad layout for this package. Figure 12 shows the pin names and numbering convention, which starts with pin 1 in the upper left, as indicated, and increments counter-clockwise around the package. Figure 13 illustrates typical case markings.
Figure 11. CX77140 Package Dimensional Drawing
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PA MODULE FOR CDMA / AMPS (824-849 MHZ)
DATA SHEET * CX77140
procedures recommended by Skyworks, please refer to Skyworks Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles can also be found in the JEDEC Standard J- STD-020B. Production quantities of this product are shipped in the standard tape-and-reel format. For packaging details, refer to Skyworks Application Note: Tape and Reel, Document Number 101568.
Electrostatic Discharge Sensitivity
The CX77140 is a Class 2 device. Figure 14 lists the Electrostatic Discharge (ESD) immunity level for each pin of the CX77140 product. The numbers in Figure 14 specify the ESD threshold level for each pin where the I-V curve between the pin and ground starts to show degradation. ESD testing was performed in compliance with MIL-STD-883E Method 3015.7 using the Human Body Model. If ESD damage threshold magnitude is found to consistently exceed 2000 volts on a given pin, this so is indicated. If ESD damage threshold below 2000 volts is measured for either polarity, numbers are indicated that represent worst case values observed in product characterization.
Figure 12. Pin Configuration and Pin Names (Top View)
Figure 13. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum-packed prior to shipment. Instructions on the shipping container label must be followed regarding exposure to moisture after the container seal is broken, otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The CX77140 is capable of withstanding an MSL3/240 C solder reflow. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. If the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 C per second; maximum temperature should not exceed 240 C. If the part is manually attached, precaution should be taken to insure that the part is not subjected to temperatures exceeding 240 C for more than 10 seconds. For details on both attachment techniques, precautions, and handling
Figure 14. ESD Sensitivity Areas (Top View)
Various failure criteria can be utilized when performing ESD testing. Many vendors employ relaxed ESD failure standards, which fail devices only after "the pin fails the electrical specification limits" or "the pin becomes completely nonfunctional". Skyworks employs most stringent criteria, fails devices as soon as the pin begins to show any degradation on a curve tracer. To avoid ESD damage, both latent and visible, it is very important that the product assembly and test areas follow the Class-1 ESD handling precautions listed in Table 5.
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DATA SHEET * CX77140
PA MODULE FOR CDMA / AMPS (824-849 MHZ)
Table 5. Precautions for Handling GaAs IC-based Products to Avoid Induced Damage
Personnel Grounding Wrist Straps Conductive Smocks, Gloves and Finger Cots Antistatic ID Badges Protective Workstation Dissipative Table Tops Protective Test Equipment (Properly Grounded) Grounded Tip Soldering Irons Conductive Solder Suckers Static Sensors Facility Relative Humidity Control and Air Ionizers Dissipative Floors (less than 109 to GND) Protective Packaging & Transportation Bags and Pouches (Faraday Shield) Protective Tote Boxes (Conductive Static Shielding) Protective Trays Grounded Carts Protective Work Order Holders
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Ordering Information
Model Number CX77140 Manufacturing Part Number CX77140 Product Revision Package 4x4LM Operating Temperature -30 C to +85 C
Revision History
Revision A B Level Date September 8, 2003 December 3, 2003 Initial Release Revise: Figure 1 Description
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752. Application Note: Tape and Reel, Document Number 101568 Standard SMT Reflow Profiles: JEDEC Standard J-STD-020B.
(c) 2002-2003, Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever. These materials are provided "as is" without warranty of any kind, either express or implied, relating to sale and/or use of SKYWORKSTM products including warranties relating to fitness for a particular purpose, merchantability, PERFORMANCE, QUALITY or NON-infringement of any patent, copyright or other intellectual property right. SKYWORKS further does not warrant the accuracy or completeness of the information, text, graphics or other items contained within these materials. SKYWORKS shall not be liable for any special, indirect, incidental, or consequential damages, including without limitation, lost revenues or lost profits THAT may result from the use of these materials. SkyworksTM products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks' customers using or selling SkyworksTM products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. The following are trademarks of Skyworks Solutions, Inc.: SkyworksTM, the Skyworks symbol, "Single Package Radio"TM, SPRTM, and "Breakthrough Simplicity"TM. Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at www.skyworksinc.com, is incorporated by reference.

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