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| XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary CMOS Low Operating Supply Voltage Output Frequency Oscillation Frequency Built-In Divider Circuit Output Ultra Small Package Chip Form GENERAL DESCRIPTION The XC25BS6 is a low operating voltage, low current consumption series of CMOS ICs with built-in crystal oscillator and divider circuits designed for clock generators. Oscillation capacitors Cg and Cd are externally set up. Output is selectable from any one of the following values for f0:f0/1024, f0/512, f0/256, and f0/128. With oscillation feedback resistors built-in, it is possible to configure a stable fundamental oscillator using about 10pF of external oscillation capacitor and an external crystal. The series has a stand-by function. The oscillation completely stops in the stand-by state and output will be one of high-impedance. September 17, 2003 V1 Low Power Consumption 2.3V (MIN.) 32.768kHz 2MHz ~ 36MHz (fundamental) Selectable from divisions of 1024, 512, 256, 128 3-State SOT-26 APPLICATIONS Crystal Oscillation Modules Clocks for Micro-computers, DSPs, etc. Communication Equipment Various System Clocks Clock Time-Base FEATURES Oscillation Frequency 2MHz ~ 36MHz (fundamental) - Oscillation feedback resistor built-in - External oscillation capacitor Divider Ratio Output Operating Supply Voltage Range Supply Current Chip Form Package 0.5A (MAX.) when stand-by mode Chip size 1.3 x 0.8mm SOT-26 mini mold f0/1024, f0/ 512, f0/256, f0/128 3-State 2.3 ~ 4.0V PIN CONFIGURATION PIN ASSIGNMENT PIN NUMBER PIN NAME / XT VSS Q0 CE VDD XT FUNCTIONS Crystal Oscillator Connection (Output) Ground Clock Output Stand-by Control * Power Supply Crystal Oscillator Connection (Input) /XT 1 VSS 2 Q0 3 6 XT 5 VDD 4 CE 1 2 3 4 5 6 * The stand-by control pin (pin #4) has a pull-down resistor built-in. PAD LAYOUT FOR CHIP FORM (1300,800) VSS /XT (NC) Q0 PAD LOCATIONS PIN NUMBER (Unit:m) FUNCTIONS Crystal Oscillator Connection (Output) Ground No Connection Ground Clock Output Power Supply Stand-by Control * Crystal Oscillator Connection (Input) Power Supply PAD DIMENSIONS PIN NAME / XT VSS (NC) VSS Q0 VDD CE XT VDD X 128.0 328.0 741.0 952.0 1172.0 1172.0 1172.0 128.0 128.0 Y 610.0 672.0 672.0 672.0 672.0 430.0 189.0 187.0 399.0 VSS 1 Note) There are two VSS pads and two VDD pads. Please connect both VSS pads to GND, and connect both VDD pads to a power supply. 2 3 4 5 6 7 8 9 VDD XT (0,0) VDD CE Chip Size : 1300 x 800m Chip Thickness : 28020m Chip Back : VDD level Pad Aperture : 88 x 88 m * The stand-by control pin (pin #4) has a pull-down resistor built-in. BLOCK DIAGRAM VDD /XT CE, Q0 PIN FUNCTION CE 'H' Counter Q0 CE Q0 Clock Output High Impedance 'L' or Open XT VSS Semiconductor Ltd. Data Sheet 1 XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary ABSOLUTE MAXIMUM RATINGS Ta=25OC PARAMETER Supply Voltage CE Pin Voltage Q0 Pin Voltage Q0 Output Current Continuous Power Dissipation Operating Temperature Range Storage Temperature Range SYMBOL VDD VCE VQ0 IQ0 Pd Topr Tstg RATINGS VSS -0.3 ~ VSS +7.0 VSS -0.3 ~ VDD +0.3 VSS -0.3 ~ VDD +0.3 50 150 ** - 40 ~ + 85 - 65 ~ + 150 (Chip Form) - 55 ~ + 125 (SOT-26) ** SOT-26 package, When implemented on a glass epoxy PCB. UNITS V V V mA mW O C C O PRODUCT CLASSIFICATION Ordering Information XC25BS6 12345 DESIGNATOR Divider Ratio: 128 = 128 divider 256 = 256 divider 512 = 512 divider DESCRIPTION DESIGNATOR Package: DESCRIPTION 4 C : Chip Form W : Wafer Form M : SOT-26 Device Orientation: R : Embossed Tape : Standard Feed 123 A24 = 1024 divider 5 L : Embossed Tape : Reverse Feed T : Chip Tray W : Wafer MARKING RULE 1 Represents XC25BS6 Series 6 5 4 MARK B Product Name XC25BS6 1234 1 2 3 2 Represents XC25BS6 Series MARK 6 Product Name XC25BS6 3 Represents divider ratio MARK 1 5 Divider Ratio f0/128 f0/512 MARK 2 A Divider Ratio f0/256 f0/1024 4 Represents the assembly lot no. (Based on internal standards) PACKAGING INFORMATION SOT-26 Semiconductor Ltd. Data Sheet 2 XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary WIRE BONDING CONNECTION VSS VSS /XT (NC) VDD XT Q0 VDD CE * There are two VSS pads and VDD pads. Please connect both VSS pads to GND, and connect both VDD pads to a power supply. TYPICAL APPLICATION CIRCUIT Rq0 VDD /XT XT Cd Cg 0.1uF VSS CE Q0 fQ0 measurement * Please use oscillation capacitors Cg, Cd =10pF externally * The same power supply can be used for VDD and CE. NOTES ON USE (1) The oscillation circuit of this IC does not have internal oscillation capacitors. Please make the oscillation circuitry using an external crystal transducer and oscillation capacitors Cg and Cd. *) A higher harmonic wave oscillation may occur without Cg and Cd. *) Cg and Cd can be connected either to GND or VDD. (Cg and Cd in the above circuit example are connected to GND.) *) It is recommended to use around for 10pF of Cg and Cd. For trimmer capacitors, 10pF as a standard value is appropriate. *) The crystal oscillation frequency should be measured at the output of the Q0 pin. When a probe is directly connected to the XT pin or the /XT pin, oscillation frequency will change and a precise value can not be taken. (2) Please insert a by-pass capacitor of 0.1F between VDD and GND. (3) The use of a matching resistor Rq0 of 50 connected in series to the Q0 pin is recommended in order to counter unwanted radiations. (4) Please place a by-pass capacitor and the matching resistor as close to the IC as possible. If the by-pass capacitor is placed away from the IC, it may cause abnormal oscillation. If the matching resistor is placed away from the IC, it may cause unwanted radiations in the pattern between the Q0 pin and the resistor. (5) When the CE pin is not controlled by external signals, please connect the CE pin to VDD power supply. *) When the CE pin is not connected, the IC goes into stand-by mode due to the internal pull-down resistor. (6) As for the supply voltage, it is recommended to apply a low noise power supply, such as a series regulator. Using a power supply like a switching regulator might lead to an unstable oscillation jitter which in turn may lead the oscillation frequency to fluctuate due to the ripple of the switching regulator. Semiconductor Ltd. Data Sheet 3 XC25BS6 Series Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit Preliminary DC ELECTRICAL CHARACTERISTICS XC25BS6xxxxx PARAMETER Operating Supply Voltage Crystal Oscillation Frequency H Level Output Voltage L Level Output Voltage SYMBOL 3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, No load, Ta=25OC) FUNCTIONS MIN VDD fOSC VOH VOL Cf=Cd=10pF (External) VDD=2.7V, IOH= - 4mA VDD=2.7V, IOL=4mA fOSC=4MHz, XC25BS6128 fOSC=8MHz, XC25BS6256 fOSC=16MHz, XC25BS6512 fOSC=36MHz, XC25BS6A24 (2.3) 2 2.3 2.4 CE=3.0V CE=0.3V XT Pin, CE=/XT=3.0V Q0 Pin, VDD=4.0V, CE=0V 0.5 22 0.2 STANDARD VALUE TYP 3.0 (0.4) (0.5) (0.8) (1.0) 1.6 55 0.5 MAX 4.0 36 0.4 (0.8) (1.0) (1.6) (1.8) 0.5 0.6 3.0 90 1.0 0.5 A V V M K M A mA V MHz V V UNIT Supply Current 1 IDD1 CE=3.0V Supply Current 2 CE H Level Voltage CE L Level Voltage CE Pull-Down Resistance 1 CE Pull-Down Resistance 2 Internal Oscillation Feedback Resistance Output Disable Leakage Current IDD2 VCEH VCEL Rp1 Rp2 Rf IOZ CE=0V * External oscillation capacitor AC ELECTRICAL CHARACTERISTICS XC25BS6xxxxx PARAMETER Output Rise Time Output Fall Time Duty Cycle Output Start Time SYMBOL 3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, CL=15pF, Ta=25OC) FUNCTIONS MIN Tr Tf DUTY Ton *1 VDD=3.0V (10% to 90%) *1 VDD=3.0V (10% to 90%) *1 45 STANDARD VALUE TYP 10 10 50 MAX 15 15 55 3.0 ns ns % ms UNIT *1 R&D guarantee AC ELECTRICAL CHARACTERISTICS MEASUREMENT WAVE FORMS (1) Output Rise Time , Output Fall Time 0.9VDD 0.9VDD 0.1VDD 0.1VDD tr tf (2) Duty Cycle DUTY Measurement Level 0.5VDD TW T DUTY = (TW/T) x 100 [%] Semiconductor Ltd. Data Sheet 4 |
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