View IRHMS597160_495153.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PD - 94283B
RADIATION HARDENED POWER MOSFET THRU-HOLE (Low-Ohmic TO-254AA)
Product Summary
Part Number Radiation Level RDS(on) IRHMS597160 100K Rads (Si) 0.05 IRHMS593160 300K Rads (Si) 0.05 ID -45A* -45A*
IRHMS597160 100V, P-CHANNEL
5
TECHNOLOGY
Low-Ohmic TO-254AA
International Rectifier's R5TM technology provides high performance power MOSFETs for space applications. These devices have been characterized for Single Event Effects (SEE) with useful performance up to an LET of 80 (MeV/(mg/cm2)). The combination of low RDS(on) and low gate charge reduces the power losses in switching applications such as DC to DC converters and motor control. These devices retain all of the well established advantages of MOSFETs such as voltage control, fast switching, ease of paralleling and temperature stability of electrical parameters.
Features:
n n n n n n n n n n n n
Single Event Effect (SEE) Hardened Neutron Tolerant Identical Pre- and Post-Electrical Test Conditions Repetitive Avalanche Ratings Dynamic dv/dt Ratings Simple Drive Requirements Ease of Paralleling Hermetically Sealed Electically Isolated Ceramic Eyelets Light Weight High Electrical Conductive Package
Absolute Maximum Ratings
Parameter
ID @ V GS = -12V, TC = 25C ID @ VGS = -12V, TC = 100C IDM PD @ TC = 25C VGS EAS IAR EAR dv/dt TJ T STG Continuous Drain Current Continuous Drain Current Pulsed Drain Current A Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy A Avalanche Current A Repetitive Avalanche Energy A Peak Diode Recovery dv/dt A Operating Junction Storage Temperature Range Lead Temperature Weight * Current is limited by package For footnotes refer to the last page -45* -30 -180 208 1.67 20 480 -45 20.8 -6.0 -55 to 150
Pre-Irradiation
Units A
W
W/C
V mJ A mJ V/ns
o
C
300 (0.063in./1.6mm from case for 10s) 9.3 ( Typical )
g
www.irf.com
1
07/20/04
IRHMS597160
Pre-Irradiation
Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified)
Parameter
BVDSS Drain-to-Source Breakdown Voltage
Min
-100
Typ Max Units
-- -0.13 -- -- -- -- -- -- -- -- -- -- -- -- -- -- 6.8 -- -- 0.05 -4.0 -- -10 -25 -100 100 170 65 30 35 140 70 45 -- V V/C V S( ) A
Test Conditions
VGS = 0V, ID = -1.0mA Reference to 25C, ID = -1.0mA VGS = -12V, ID = -30A A VDS = VGS, ID = -1.0mA VDS > -15V, IDS = -30A A VDS= -80V ,VGS=0V VDS = -80V, VGS = 0V, TJ = 125C VGS = -20V VGS = 20V VGS =-12V, ID = -45A VDS = -50V VDD = -50V, ID = -45A VGS =-12V, RG = 1.2
BVDSS /T J Temperature Coefficient of Breakdown -- Voltage RDS(on) Static Drain-to-Source On-State -- Resistance VGS(th) Gate Threshold Voltage -2.0 gfs Forward Transconductance 24 IDSS Zero Gate Voltage Drain Current -- -- IGSS IGSS Qg Q gs Q gd td(on) tr td(off) tf LS + LD Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance -- -- -- -- -- -- -- -- -- --
nA nC
ns
nH Measured from Drain lead (6mm /0.25in.
from package) to Source lead (6mm /0.25in. from package) with Source wires internally bonded from Source Pin to Drain Pad
Ciss Coss Crss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
-- -- --
6110 1574 115
-- -- --
pF
VGS = 0V, VDS = -25V f = 1.0MHz
Source-Drain Diode Ratings and Characteristics
Parameter
IS ISM VSD t rr Q RR ton Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) A Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Min Typ Max Units
-- -- -- -- -- -- -- -- -- -- -45* -180 -5.0 200 1.6
Test Conditions
A
V ns C Tj = 25C, IS = -45A, VGS = 0V A Tj = 25C, IF =-45A, di/dt -100A/s VDD -25V A
Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.
* Current is limited by package
Thermal Resistance
Parameter
RthJC RthCS RthJA Junction-to-Case Case-to-Sink Junction-to-Ambient
Min Typ Max Units
-- -- -- -- 0.21 -- 0.6 -- 48 C/W
Test Conditions
Typical socket mount
Note: Corresponding Spice and Saber models are available on International Rectifier Website. For footnotes refer to the last page
2
www.irf.com
Radiation Characteristics Pre-Irradiation
IRHMS597160
International Rectifier Radiation Hardened MOSFETs are tested to verify their radiation hardness capability. The hardness assurance program at International Rectifier is comprised of two radiation environments. Every manufacturing lot is tested for total ionizing dose (per notes 5 and 6) using the TO-3 package. Both pre- and post-irradiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison.
Table 1. Electrical Characteristics @ Tj = 25C, Post Total Dose Irradiation AA
Parameter
BVDSS VGS(th) IGSS IGSS IDSS RDS(on) RDS(on) VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source A On-State Resistance (TO-3) Static Drain-to-Source On-State A Resistance(Low-OhmicTO-254AA) Diode Forward Voltage A 100K Rads(Si)1 Min Max -100 -2.0 -- -- -- -- -- -- -- -4.0 -100 100 -10 0.05 0.05 -5.0 300KRads(Si)2 Min Max -100 -2.0 -- -- -- -- -- -- -- -5.0 -100 100 -10 0.05 0.05 -5.0 Units V nA A V
Test Conditions
VGS = 0V, ID = -1.0mA V GS = VDS, ID = -1.0mA VGS = -20V VGS = 20 V VDS = -80V, VGS =0V VGS = -12V, ID = -30A VGS = -12V, ID = -30A VGS = 0V, IS = -45A
1. Part number IRHMS597160 2. Part number IRHMS593160
International Rectifier radiation hardened MOSFETs have been characterized in heavy ion environment for Single Event Effects (SEE). Single Event Effects characterization is illustrated in Fig. a and Table 2.
Table 2. Single Event Effect Safe Operating Area
Ion Br I Au LET (MeV/(mg/cm2)) 37.9 59.7 82.3 Energy (MeV) 252.6 314 350 VDS (V) Range (m) @VGS=0V @VGS=5V @VGS=10V @VGS=15V @VGS=17.5V @VGS=20V 33.1 -100 -100 -100 -100 -100 -100 30.5 -100 -100 -100 -100 -75 -25 28.4 -100 -100 -100 -30 -- --
-120 -100
-80
VDS
-60
Br I Au
-40 -20
0 0 5 10 15 20 25
VGS
Fig a. Single Event Effect, Safe Operating Area
For footnotes refer to the last page
www.irf.com
3
IRHMS597160
Pre-Irradiation
1000
-I D , Drain-to-Source Current (A)
100
-5.0V
-I D , Drain-to-Source Current (A)
VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP
1000
100
VGS -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V TOP
-5.0V
10
10
1 0.1
20s PULSE WIDTH TJ = 25 C
1 10 100
1 0.1
20s PULSE WIDTH TJ = 150 C
1 10 100
-VDS , Drain-to-Source Voltage (V)
-VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
RDS(on) , Drain-to-Source On Resistance (Normalized)
1000
2.5
ID = -45A
-I D , Drain-to-Source Current (A)
2.0
TJ = 25 C TJ = 150 C
1.5
100
1.0
0.5
10 5.0
V DS = 15 -50V 20s PULSE WIDTH 5.5 6.0 6.5 7.0
0.0 -60 -40 -20
VGS = -12V
0 20 40 60 80 100 120 140 160
-VGS , Gate-to-Source Voltage (V)
TJ , Junction Temperature ( C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
4
www.irf.com
Pre-Irradiation
IRHMS597160
10000
-VGS , Gate-to-Source Voltage (V)
8000
VGS = 0V, f = 1MHz Ciss = Cgs + Cgd , Cds SHORTED Crss = Cgd Coss = Cds + Cgd
20
ID = -45A VDS =-80V VDS =-50V VDS =-20V
16
C, Capacitance (pF)
6000
Ciss
12
4000
Coss
8
2000
4
Crss
0 1 10 100
0
FOR TEST CIRCUIT SEE FIGURE 13
0 40 80 120 160 200 240
-VDS , Drain-to-Source Voltage (V)
QG, Total Gate Charge (nC)
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
1000
1000 OPERATION IN THIS AREA LIMITED BY R DS(on)
-ISD , Reverse Drain Current (A)
100
TJ = 150 C TJ = 25 C
-I D, Drain-to-Source Current (A)
100
100s 1ms
Tc = 25C Tj = 150C Single Pulse 1 10 100
10
10
1
10ms
0.1 0.0
V GS = 0 V
1.5 3.0 4.5 6.0
1
-VSD ,Source-to-Drain Voltage (V)
1000
-VDS , Drain-toSource Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
www.irf.com
5
IRHMS597160
Pre-Irradiation
50
LIMITED BY PACKAGE
40
V DS V GS RG V GS
Pulse Width 1 s Duty Factor 0.1 %
RD
D.U.T.
+
-ID , Drain Current (A)
30
20
Fig 10a. Switching Time Test Circuit
10
VGS
td(on) tr t d(off) tf
0
10%
25
50
75
100
125
150
TC , Case Temperature ( C)
90% VDS
Fig 9. Maximum Drain Current Vs. Case Temperature
Fig 10b. Switching Time Waveforms
1
Thermal Response (Z thJC )
D = 0.50 0.20 0.1 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE)
PDM t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJC + TC
0.01
0.001 0.00001
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
6
www.irf.com
-
V DD
1
Pre-Irradiation
IRHMS597160
EAS , Single Pulse Avalanche Energy (mJ)
VDS
L
1000
RG
D.U.T
IAS
+
DRIVER
V DD VDD
A
800
ID -20A -28.5A BOTTOM -45A TOP
VGS -20V
tp
0.01
600
15V
400
Fig 12a. Unclamped Inductive Test Circuit
I AS
200
0
25
Starting TJ , Junction Temperature ( C)
50
75
100
125
150
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
tp V(BR)DSS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator Same Type as D.U.T.
QG
50K
VG
VGS
-3mA
Charge
IG
ID
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
www.irf.com
+
D.U.T.
-
-12 V
-12V 12V
.2F .3F
QGS
QGD
VDS
7
IRHMS597160
Pre-Irradiation
Footnotes:
A Repetitive Rating; Pulse width limited by
maximum junction temperature. A VDD = -25V, starting TJ = 25C, L=0.48 mH Peak IL = -45A, VGS = -12V A ISD -45A, di/dt -365A/s, VDD -100V, TJ 150C
A Pulse width 300 s; Duty Cycle 2% A Total Dose Irradiation with VGS Bias.
-12 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, method 1019, condition A. A Total Dose Irradiation with VDS Bias. -80 volt VDS applied and VGS = 0 during irradiation per MlL-STD-750, method 1019, condition A.
Case Outline and Dimensions -- Low-Omic TO-254AA
0.12 [.005] 3.78 [.149] 3.53 [.139] A 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 1.27 [.050] 1.02 [.040]
17.40 [.685] 16.89 [.665] 1 2 3
20.32 [.800] 20.07 [.790]
13.84 [.545] 13.59 [.535]
B
C
17.40 [.685] 16.89 [.665]
0.84 [.033] MAX.
3X 3.81 [.150] NOT ES : 1. 2. 3. 4. 2X
1.14 [.045] 0.89 [.035] 0.36 [.014] BA PIN AS S IGNMENTS 1 = DRAIN 2 = S OURCE 3 = GATE
3.81 [.150]
DIMENS IONING & T OLERANCING PER AS ME Y14.5M-1994. ALL DIMENS IONS ARE S HOWN IN MILLIMET ERS [INCHES ]. CONT ROLLING DIMENS ION: INCH. CONFORMS T O JEDEC OUT LINE T O-254AA.
CAUTION BERYLLIA WARNING PER MIL-PRF-19500 Packages containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids that will produce fumes containing beryllium.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 IR LEOMINSTER : 205 Crawford St., Leominster, Massachusetts 01453, USA Tel: (978) 534-5776 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information. Data and specifications subject to change without notice. 07/2004
8
www.irf.com

▲Up To Search▲

Price & Availability of IRHMS597160

	To Download IRHMS597160 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .