View HLB121I_409971.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9027 Issued Date : 1996.11.06 Revised Date : 2004.09.24 Page No. : 1/4
HLB121I
NPN Triple Diffused Planar Type High Voltage Transistor
Description
The HLB121I is a medium power transistor designed for use in switching applications. TO-251
Features
* High breakdown voltage * Low collector saturation voltage * Fast switching speed
Absolute Maximum Ratings (TA=25C)
* Maximum Temperatures Storage Temperature ........................................................................................................................... -55 ~ +150 C Junction Temperature .................................................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (TC=25C) .................................................................................................................... 10 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage....................................................................................................................... 600 V BVCEO Collector to Emitter Voltage.................................................................................................................... 400 V BVEBO Emitter to Base Voltage.............................................................................................................................. 6 V IC Collector Current (DC) ............................................................................................................................... 300 mA IC Collector Current (Pulse)............................................................................................................................ 600 mA IB Base Current (DC)........................................................................................................................................ 40 mA IB Base Current (Pulse).................................................................................................................................. 100 mA
Electrical Characteristics (TA=25C)
Symbol BVCBO BVCEO BVEBO ICBO ICEO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) *hFE1 *hFE2 Min. 600 400 6 8 10 Typ. Max. 10 10 10 400 750 1 36 Unit V V V uA uA uA mV mV V IC=100uA IC=10mA IE=10uA VCB=550V VCB=400V VEB=6V IC=50mA, IB=10mA IC=100mA, IB=20mA IC=50mA, IB=10mA VCE=10V, IC=10mA VCE=10V, IC=50mA
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions
HLB121I
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Dc Current Gain & Collector Current
100 100000
Spec. No. : HE9027 Issued Date : 1996.11.06 Revised Date : 2004.09.24 Page No. : 2/4
Saturation Voltage & Collector Current
hFE @ VCE=10V
10
Saturation Voltage (mV)
10000
hFE
1000 VBE(sat) @ IC=5IB
100 VCE(sat) @ IC=5IB
1 1 10 100 1000
10 1 10 100 1000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000
Capacitance Reverse Biased Voltage
1000
Collector Current (mA)
On Voltage-Bton
100 Cib
1000 Bton @ VCE=10V
10
Cob
100 0 100 200 300 400 500 600
1 0.1 1 10 100
Collector Current (mA)
Reverse Biased Voltage (V)
Switching Time & Collector Current
10 VCC=100V, IC=5IB1=-5IB2 10000
Safe Operating Area
Switching Time (us)
Collector Current (mA)
1000
Ton 1
Tstg
100
PT=1ms PT=100ms PT=1s
Tf
0.1 0 100 200 300 400 500 600
10 0 50 100 150 200 250
Collector Current (mA)
Forward Biased Voltage (V)
HLB121I
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-251 Dimension
Marking:
A
Tab
Spec. No. : HE9027 Issued Date : 1996.11.06 Revised Date : 2004.09.24 Page No. : 3/4
M
Pb Free Mark
F
a1
Pb-Free: " . " (Note) H Normal: None
LB
C G
Date Code
121 I Control Code
Note: Green label is used for pb-free packing
1
2
3
H L
Pin Style: 1.Base 2/Tab.Collector 3.Emitter Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A C F G H H1 K K1 L M a1 a2
Min. 6.40 5.20 1.40 5.40 1.50 7.20 0.60 0.50 0.90 2.20 0.45 -
Max. 6.80 5.50 1.60 6.25 1.80 9.80 1.10 0.90 1.50 2.40 0.65 *2.30
*: Typical, Unit: mm
K K1
H1
a1
a2
a2
3-Lead TO-251 Plastic Package HSMC Package Code: I
A B C D a1 E G
Marking:
M F y1 a1
Pb Free Mark
Pb-Free: " . " (Note) H Normal: None
LB
121 I Date Code Control Code
I H y1 y1
Note: Green label is used for pb-free packing Pin Style: 1.Base 2.Collector 3.Emitter Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
J K K1 H1
a2 y2
a2 y2
a1
DIM A B C D E F G H H1 I J K K1 M a1 a2 y1 y2
Min. 6.40 5.04 0.40 0.50 5.90 2.20 0.40 2.10 -
Max. 6.80 6.00 5.64 *4.34 0.80 0.90 6.30 *1.80 *9.30 *16.10 *0.80 0.96 *0.76 2.40 0.60 2.50 5o 3o
3-Lead TO-251 Plastic Package HSMC Package Code: I
*: Typical, Unit: mm
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HLB121I
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC's Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile
tP TP Ramp-up TL Tsmax Temperature tL
Spec. No. : HE9027 Issued Date : 1996.11.06 Revised Date : 2004.09.24 Page No. : 4/4
Critical Zone TL to TP
Tsmin tS Preheat
Ramp-down
25 t 25oC to Peak Time
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25oC to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices.
Sn-Pb Eutectic Assembly <3 C/sec 100oC 150oC 60~120 sec <3oC/sec 183oC 60~150 sec 240 C +0/-5 C 10~30 sec <6oC/sec <6 minutes
o o o
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 sec <3oC/sec 217oC 60~150 sec 260oC +0/-5oC 20~40 sec <6oC/sec <8 minutes
Peak temperature 245 C 5 C
o o
Dipping time 5sec 1sec 5sec 1sec
260 C +0/-5 C
o
o
HLB121I
HSMC Product Specification

▲Up To Search▲

Price & Availability of HLB121I

	To Download HLB121I Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .