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Wireless Components Dual LNA PMB 2362 Version 1.1 Specification January 2000 preliminary CONFIDENTIAL Revision History: Current Version: January 2000 Previous Version:Data Sheet Page (in previous Version) Page (in current Version) Subjects (major changes since last revision) ABM(R), AOP(R), ARCOFI(R), ARCOFI(R)-BA, ARCOFI(R)-SP, DigiTape(R), EPIC(R)-1, EPIC(R)-S, ELIC(R), FALC(R)54, FALC(R)56, FALC(R)-E1, FALC(R)-LH, IDEC(R), IOM(R), IOM(R)-1, IOM(R)-2, IPAT(R)-2, ISAC(R)-P, ISAC(R)-S, ISAC(R)-S TE, ISAC(R)-P TE, ITAC(R), IWE(R), MUSAC(R)-A, OCTAT(R)-P, QUAT(R)-S, SICAT(R), SICOFI(R), SICOFI(R)2, SICOFI(R)-4, SICOFI(R)-4C, SLICOFI(R) are registered trademarks of Infineon Technologies AG. ACETM, ASMTM, ASPTM, POTSWIRETM, QuadFALCTM, SCOUTTM are trademarks of Infineon Technologies AG. Edition 03.99 Published by Infineon Technologies AG i. Gr., SC, Balanstrae 73, 81541 Munchen (c) Infineon Technologies AG i. Gr. 26.01.00. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Infineon Technologies AG, may only be used in life-support devices or systems2 with the express written approval of the Infineon Technologies AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that lifesupport device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. PMB 2362 preliminary Confidential Product Info Product Info General Description Package The PMB2362 is a dual band LNA circuit with excellent performance and minimum component count for GSM900 and GSM1800. s Features Worldclass B6HF technology, fT = 25GHz Lowest external component count Extreme small outline P-TSSOP-10-2 package with heat sink for grounding Both LNAs with prematched input, only 2 external matching components required GSM900 LNA output matched to 50 Ohm Both LNAs with switchable gain, 20dB gain step LNA1: 17dB gain, 1.5dB noise figure @ 0.95GHz LNA2: 19dB gain, 2.0dB noise figure @ 1.85GHz Dual band wireless frontends GSM900/1800 s s s s s P TSSOP 10 s s Supply voltage range from 2.7V to 3.6V Power down function Temperature range -40 to 85C s s s s Application s Excellent combination with Infineon GSM single chip SMARTi PMB 6250 Ordering Information Type PMB 2362 V1.1 Ordering Code T2362-XV11-P1-7600 Package P-TSSOP-10-2 Wireless Components Product Info Specification, January 2000 1 Table of Contents 1 2 2.1 2.2 2.3 2.4 3 3.1 3.2 3.3 3.4 4 4.1 5 5.1 5.2 5.3 5.4 5.5 5.6 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 Absolute Maximum Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Operating Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 S-Parameters / Noise Parameters / Diagramms . . . . . . . . . . . . . . . 5-10 2 Product Description Contents of this Chapter 2.1 2.2 2.3 2.4 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 PMB 2362 preliminary Confidential Product Description 2.1 General Description The PMB2362 is a dual band LNA circuit with excellent performance and minimum component count for GSM900 and GSM1800. 2.2 Features s s s s Worldclass B6HF technology, fT = 25GHz Lowest external component count Extreme small outline P-TSSOP-10-2 package with heat sink for grounding Both LNAs with prematched input, only 2 external matching components required GSM900 LNA output matched to 50 Ohm Both LNAs with switchable gain, 20dB gain step LNA1: 17dB gain, 1.5dB noise figure @ 0.95GHz LNA2: 19dB gain, 2.0dB noise figure @ 1.85GHz Supply voltage range from 2.7V to 3.6V Power down function Temperature range -40 to 85C s s s s s s s 2.3 Application s s Dual band wireless frontends GSM900/1800 Excellent combination with Infineon GSM single chip SMARTi PMB6250 Wireless Components 2-2 Specification, January 2000 PMB 2362 preliminary Confidential Product Description 2.4 Package Outlines P-TSSOP-10 (with Heat Sink): Wireless Components 2-3 Specification, January 2000 3 Functional Description Contents of this Chapter 3.1 3.2 3.3 3.4 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Pin Definition and Function. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Functional Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 PMB 2362 preliminary Confidential Functional Description 3.1 Pin Configuration PD 1 10 GC Al1 2 9 AO1 GND 3 PMB 2362 8 VCC Al2 4 7 AO2 BSW 5 6 VCCLNA Heat Sink Connection for IC Grounding Pin_config.wmf Figure 3-1 Pin Configuration 3.2 Pin Definition and Function Table 3-1 Pin Definition and Function Pin No. 1 2 3 4 5 6 7 8 9 10 Heat Sink Symbol PD AI1 GND AI2 BSW VCCLNA AO2 VCC AO1 GC Equivalent I/O-Schematic Function Power down total circuit LNA1 GSM900 signal base input Internal not connected, external GND connection recommended LNA2 GSM1800 signal base input Band switch, LNA1/LNA2 RF shunt open collector output LNA1/2 LNA2 amplifier output, open collector Supply voltage total circuit LNA1 amplifier output, matched LNA1/2 gain control Ground total circuit Wireless Components 3-2 Specification, January 2000 PMB 2362 preliminary Confidential Functional Description 3.3 Functional Block Diagram 1 PD 10 GC 2 Al1 LNA1 9 AO1 GND BIAS 3 8 VCC 4 Al2 LNA2 7 AO2 5 BSW 6 VCCLNA Heat Sink Connection for IC Grounding Funct_block.wmf Figure 3-2 Functional Block Diagram Wireless Components 3-3 Specification, January 2000 PMB 2362 preliminary Confidential Functional Description 3.4 Circuit Description 1. General Description The PMB2362 is a dual band LNA circuit designed for dual band wireless frontends with excellent performance. 2. LNA1 The LNA1 is designed for input frequencies between 0.9 and 1.0GHz. Entering the IC at the base input pin AI1 the RF input signal is amplified in the LNA1 stage. The gain of this LNA stage is controlled by the DC level at pin GC and can be adjusted in a 20 dB step. The LNA output is internal matched and at pin AO1 the amplified and matched signal is available for further use. 3. LNA2 The LNA2 is designed for input frequencies between 1.8 and 1.9GHz. Entering the IC at the base input pin AI2 the RF input signal is amplified in the LNA2 stage. The gain of this LNA stage is also controlled by the DC level at pin GC and can be adjusted in a fixed gain step. The open collector LNA output at pin AO2 has to be connected to VCC and external matching elements. 4. COMMON VCC is the supply voltage for both LNAs. The grounding is done with the heat sink at the bottom side of the package. An internal bias driver generates supply voltage and temperature compensated reference voltages. The PD pin allows the circuit to be switched in a low power consuming (sleeping) mode. All pins with the exception of GND are ESD protected. Wireless Components 3-4 Specification, January 2000 4 Applications Contents of this Chapter 4.1 Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 PMB 2362 preliminary Confidential Applications 4.1 Circuits PD 1 10 GC Al1 2 1 9 AO1 GND 3 8 VCC Al2 4 2 7 AO2 BSW 5 6 VCCLNA Appl_circuit.wmf Figure 4-1 Application Circuit LNA 1:925 MHz - 960 MHz LNA 2:1805 MHz - 1880 MHz Refer to PMB2362 Application Note Wireless Components 4-2 Specification, January 2000 5 Reference Contents of this Chapter 5.1 5.2 5.3 5.4 5.5 5.6 Absolute Maximum Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Operating Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 S-Parameters / Noise Parameters / Diagramms . . . . . . . . . . . . . . . 5-10 PMB 2362 preliminary Confidential Reference 5.1 Absolute Maximum Range The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the IC will result. Table 5-1 Absolute Maximum Range, Ambient temperature TAMB= -40C ... + 85C Parameter Symbol Limit Values min max Unit Remarks Supply Voltage Input Voltage Input Voltage Input Voltage Input Voltage Input Voltage (AC Peak, Freq.>1MHz) Open Collector Output Voltage Input Current Junction Temperature Storage Temperature Thermal Resistance Thermal Resistance ESD integrity VVCC VPD VBSW VGC VGC VAI1/2 VAO2/VCCLNA IAI1/2 Tj TS RthJA RthJL VESD -0.3 -0.3 -0.3 -0.3 -0.3 VS -5.5, -2.0min. VS -5.5, -0.3min 5.0 VS +0.3, 5.0max. VS +0.3, 5.0max. VS +0.3, 5.0max. 3.8 V V V V V V VPD>0.5V VPD=0V VPD=0V IAI1/2 V mA C C K/W K/W V Junction to Ambient Junction to Lead ** * DC and AC -40 125 100 12 -1000 +1000 * * ** Heat Sink Temperature Fixed At 25 Celsius According to MIL STD 883D, method 3015.7 and ESD Assn. Standard S5.1 - 1993. Wireless Components 5-2 Specification, January 2000 PMB 2362 preliminary Confidential Reference 5.2 Operating Ratings Within the operational range the IC operates as described in the circuit description. The AC/DC characteristic limits are not guaranteed. Supply voltage VS = 2.7V...3.6V, Ambient temperature Tamb = -40C...85C Table 5-2 Operating Ratings Parameter Symbol Limit Values min max Unit Test Conditions L Item AI1 Input Frequency LNA1 AI2 Input Frequency LNA2 Total Circuit On Total Circuit Off Gain Control Low Gain Gain Control High Gain Bandswitch LNA1 On Bandswitch LNA2 On fAI1 fAI2 VPD VPD VGC VGC VBSW VBSW 0.9 1.8 1.5 0 1.5 0 0 1.5 1.0 1.9 VS 0.5 VS 0.5 0.5 VS GHz GHz V V V V V V s This value is guaranteed by design Power levels refer to 50 Ohms impedance Wireless Components 5-3 Specification, January 2000 PMB 2362 preliminary Confidential Reference 5.3 AC/DC Characteristics AC/DC characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. Typical characteristics are the median of the production. Supply voltage VVCC = 2.7V...3.6V, Ambient temperature Tamb = +25C Table 5-3 AC/DC Characteristics Symbol min Supply Current Supply current, 0.95GHz Supply current, 1.85GHz Supply current, sleep I6,8,9 I6,7,8 I8 6.6 5.5 9.5 8.5 <5 13 11.5 <20 mA mA A VPD high, VBSW low VPD high,VBSW high VPD low 1.1 1.2 1.3 Limit Values typ max Unit Test Conditions L Item LNA1, Signal Input AI1, high gain Input impedance vs. freq. Max. input level, 1db comp. Input intercept, third order Noise figure S11 PAI1 IICPAI1 FAI1 Table 1 -20.5 -12 -18.5 -10 1.5 2.2 dBm dBm dB Diagramm1 f=0.95GHz f=0.95GHz f=0.95GHz s s s s 2.1** 2.2 2.3* 2.4* LNA1, Signal Input AI1, low gain Input impedance vs. freq. Max. input level, 1db comp. Input intercept, third order Noise figure S11 PAI1 IICPAI1 FAI1 Table 1 -20.5 -12 -18.5 -10 8.0 10.0 dBm dBm dB Diagramm1 f=0.95GHz f=0.95GHz f=0.95GHz s s s s 2.5 2.6 2.7* 2.8* LNA1, Signal Output AO1, high gain Output impedance Output impedance vs. freq. Power gain VSWR S22 S21 1.5 Table 1 16 17 dB f=0.95GHz Diagramm1 f=0.95GHz s s 2.9 2.10** 2.11* LNA1, Signal Output AO1, low gain Output impedance Output impedance vs. freq. Power Gain VSWR S22 S21 1.5 Table 1 -4 -3 dB f=0.95GHz Diagramm1 f=0.95GHz s s s 2.12 13 2.14* s This value is guaranteed by design. ** S21 low/high gain; S11, S22 @f = 950 MHz measured in production Wireless Components 5-4 Specification, January 2000 PMB 2362 preliminary Confidential Reference Table 5-3 AC/DC Characteristics (continued) Symbol min LNA2, Signal Input AI2, high gain Input impedance vs. freq. Max. input level, 1db comp. Input intercept, third order Noise figure S11 PAI2 IICPAI2 FAI2 Limit Values typ max Unit Test Conditions L Item Table 2 -19 -9.5 -17 -7.5 2.0 2.7 dBm dBm dB Diagramm2 f=1.85GHz f=1.85GHz f=1.85GHz s s s s 3.1** 3.2 3.3* 3.4* LNA2, Signal Input AI2, low gain Input impedance vs. freq. Max. input level, 1db comp. Input intercept, third order Noise figure S11 PAI2 IICPAI2 FAI2 Table 2 -19 -9.5 -17 -7.5 11 13 dBm dBm dB Diagramm f=1.85GHz f=1.85GHz f=1.85GHz s s s s 3.5 3.6 3.7* 3.8* LNA2, Signal Output AO2, Open Collector, high gain Output impedance vs. freq. Power gain S22 S21 Table 2 17 19 dB Diagramm f=1.85GHz s s 3.9** 3.10* LNA2, Signal Output AO2, Open Collector, low gain Output impedance vs. freq. Power gain S22 S21 Table 2 -3 -3 dB Diagramm f=1.85GHz s s 3.11 3.12* s This value is guaranteed by design. * ** Measured with Application Circuit (Matched In- and Output) S21 low/high gain; S11, S22 @f=1.85GHz measured in production Remark: IICP3 Measured with 800kHz differential tone Wireless Components 5-5 Specification, January 2000 PMB 2362 preliminary Confidential Reference 5.4 Diagrams High Gain 0.95GHz Low Gain 0.95GHz Figure 5-1 Diagramm1: S11 / S22 LNA1 Wireless Components 5-6 Specification, January 2000 PMB 2362 preliminary Confidential Reference High Gain 1.85GHz Low Gain 1.85GHz Figure 5-2 Diagramm2: S11 / S22 LNA2 Wireless Components 5-7 Specification, January 2000 PMB 2362 preliminary Confidential Reference 5.5 Test Circuits 1. S-Parameter Test Circuit PD 1 10 GC Al1 2 1 9 AO1 GND 3 8 VCC Al2 4 2 7 AO2 BSW 5 6 VCCLNA Test_circuit_1_2.wmf Figure 5-3 S-Parameter Test Circuit Test Circuit 1: Test Circuit 2: 925 MHz - 960 MHz 1805 MHz - 1880 MHz Component values for blocking capacitors 10p @ VCC, 27p else Blocking capacitors at Pin: 1, 5, 6, 8 and 10 DC Biasing LNA2 via Network Analyzer Wireless Components 5-8 Specification, January 2000 PMB 2362 preliminary Confidential Reference 2. S-Parameter Measurement Conditions Pin x Port 1 Network analyzer ZL=50 W Port 2 Pin y DUT Test_circuit_3.wmf Figure 5-4 S-Parameter Measurement of LNA1/2 : S11, S12, S21, S22 The S-Parameters are tested at the indicated frequency on Duroid 5880 Teflon Boards. Via the NWA the capacitive coupling is done. The output levels at port1 and 2 for pin x and y are -30dbm. S11 and S22 have to be considered as design hints and are measured with Infineon testboards All S-Parameters are measured Table 5-4 Test Amp. S11, S12, S21, S22 Amp. S11, S12, S21, S22 Amp. S11, S12, S21, S22 Test frequency [MHz] 30 - 3000 900 - 1000 1800 - 1900 Pin X Al 1/2 Al 1 Al 2 Pin Y AO 1/2 AO 1 AO 2 Wireless Components 5-9 Specification, January 2000 PMB 2362 preliminary Confidential Reference 5.6 S-Parameters / Noise Parameters / Diagramms 1. Table 1: S-Parameter LNA1 S-Parameters are available on 3.5" disk or by E-mail High Gain Frequency [GHz] 0.81 0.84 0.87 0.9 0.93 0.96 0.99 1.02 1.05 1.08 1.11 S11 MAG 0.57468 0.57036 0.55963 0.54796 0.52863 0.5219 0.51085 0.49465 0.48186 0.46918 0.45961 ANG -89.9 -94.4 -98.7 -103.2 -106.7 -109.5 -113.3 -116.4 -118.7 -120.9 -122.8 S21 MAG 6.91583 7.13553 7.29022 7.39837 7.45604 7.40121 7.32031 7.25988 7.21209 7.21321 7.2465 ANG 131.3 126.7 121.9 116.7 112 107 102.8 98.8 95.2 91.4 87.4 S12 MAG 0.003029 0.003754 0.005167 0.006071 0.006278 0.007097 0.007674 0.007487 0.007213 0.007444 0.007427 ANG 108.8 109.1 91.5 78.7 88.5 82.7 71.5 66.2 65 55.4 61.9 S22 MAG 0.19661 0.16465 0.13922 0.12151 0.11372 0.12553 0.13011 0.13604 0.14442 0.15835 0.17981 ANG -161 -160.3 -155.6 -146.3 -134.4 -125.5 -122.2 -116.5 -110.5 -104.7 -100.4 Low Gain Frequency [GHz] 0.81 0.84 0.87 0.9 0.93 0.96 0.99 1.02 1.05 1.08 1.11 S11 MAG 0.5257 0.51998 0.51502 0.51035 0.50507 0.50343 0.50052 0.49629 0.49323 0.48924 0.48684 ANG -92 -94.9 -97.9 -100.7 -103.5 -106.5 -109.4 -112.1 -114.9 -117.4 -120 S21 MAG 0.67474 0.69912 0.70104 0.70771 0.71506 0.71056 0.70932 0.70358 0.69611 0.69115 0.68395 ANG 133.8 130.1 124.8 121.5 117.2 113 109 104.8 100.9 96.8 92.7 S12 MAG 0.00148 0.00291 0.002866 0.00296 0.003721 0.004777 0.005215 0.005844 0.005821 0.006178 0.006651 ANG 129.6 152.6 142.9 127.3 129.3 127 115.4 112.1 107.1 102.7 97.5 S22 MAG 0.19295 0.15726 0.12124 0.08884 0.06165 0.05343 0.06368 0.08836 0.11838 0.1497 0.18416 ANG -166.1 -170.7 -171.1 -165.8 -152.2 -123.2 -96.2 -83 -78 -77.3 -78.6 Noise Parameters @ 920MHz: Fmin = 1.33dB Rn = 6.17 opt: Mag: 0.132 Ang: 132.9 Wireless Components 5 - 10 Specification, January 2000 PMB 2362 preliminary Confidential Reference 2. Table 2: S-Parameter LNA2 S-Parameters are available on 3.5" disk or by E-mail High Gain Frequency [GHz] 1.71 1.74 1.77 1.8 1.83 1.86 1.89 1.92 1.95 1.98 2.01 S11 MAG 0.49242 0.49159 0.49287 0.49257 0.49122 0.4897 0.49049 0.49163 0.48904 0.48789 0.48725 ANG -152.6 -154.5 -156.5 -158.1 -160 -161.9 -163.8 -165.6 -167.1 -169 -171.3 S21 MAG 6.88619 6.78958 6.67339 6.54866 6.44234 6.35383 6.22605 6.11839 6.01005 5.90915 5.81244 ANG 44 42.2 40.3 38.5 36.8 34.8 33 31.3 29.5 27.7 25.9 S12 MAG 0.009319 0.010126 0.010619 0.010952 0.011616 0.012092 0.011617 0.013675 0.013032 0.013869 0.01401 ANG 106.7 112.5 107.5 103.6 109.8 100.5 104.6 102.4 101.7 99.9 99.3 S22 MAG 0.97152 0.97075 0.96835 0.96761 0.97078 0.97236 0.97083 0.96812 0.96681 0.96768 0.96638 ANG -52.6 -53.6 -54.9 -55.9 -57.1 -58.1 -59.5 -60.6 -61.6 -62.7 -63.9 Low Gain Frequency [GHz] 1.71 1.74 1.77 1.8 1.83 1.86 1.89 1.92 1.95 1.98 2.01 S11 MAG 0.49151 0.49043 0.49071 0.48723 0.4821 0.48296 0.48488 0.48525 0.48228 0.47885 0.47693 ANG -156.7 -158.9 -161 -162.9 -164.6 -166.4 -168.5 -170.6 -172.4 -174.6 -177 S21 MAG 0.61223 0.59784 0.58151 0.56316 0.5627 0.5553 0.53698 0.52048 0.50395 0.48973 0.47446 ANG 43.4 41.5 39.8 38.4 37.7 34.4 32.1 30.1 28 26.3 24.4 S12 MAG 0.005883 0.006472 0.006974 0.007237 0.008687 0.008648 0.009628 0.008635 0.009701 0.009804 0.009466 ANG 137.2 130.3 127.6 127.7 123.6 126.1 121.2 119.8 116.5 117.5 111.3 S22 MAG 0.95592 0.95576 0.95311 0.95262 0.95109 0.94994 0.94908 0.94747 0.94531 0.94528 0.94391 ANG -49.2 -50.2 -51.3 -52.2 -53.2 -54.2 -55.2 -56.1 -57 -57.9 -58.8 Noise Parameters @ 1.82GHz: Fmin = 1.86dB Rn = 6.76 opt: Mag: 0.197 Ang: -164.4 Wireless Components 5 - 11 Specification, January 2000 |
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