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XC9500XV Family High-Performance CPLD
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DS049 (v2.0) January 15, 2001
Advance Product Specification
Features
* Optimized for high-performance 2.5V systems * * 3.5 ns pin-to-pin logic delays Small footprint packages including VQFPs, TQFPs and CSPs (Chip Scale Package) Lower power operation Multi-voltage operation FastFLASH technology In-system programmable Output banking (XC95144XV, XC95288XV) Superior pin-locking and routability with FastCONNECT IITM switch matrix Extra wide 54-input Function Blocks Up to 90 product-terms per macrocell with individual product-term allocation Local clock inversion with three global and one product-term clocks Individual output enable per output pin with local inversion Input hysteresis on all user and boundary-scan pin inputs Bus-hold circuitry on all user pin inputs Full IEEE Standard 1149.1 boundary-scan (JTAG) support on all devices 36 to 288 macrocells, with 800 to 6400 usable gates
Family Overview
The XC9500XV family is a 2.5V CPLD family targeted for high-performance, low-voltage applications in leading-edge communications and computing systems, where high device reliability and low power dissipation is important. Each XC9500XV device supports in-system programming (ISP) and the full IEEE 1149.1 (JTAG) boundary-scan, allowing superior debug and design iteration capability for small form-factor packages. The XC9500XV family is designed to work closely with the Xilinx Spartan-XL and Virtex FPGA families, allowing system designers to partition logic optimally between fast interface circuitry and high-density general purpose logic. As shown in Table 1, logic density of the XC9500XV devices ranges from 800 to 6400 usable gates with 36 to 288 registers, respectively. Multiple package options and associated I/O capacity are shown in Table 2. The XC9500XV family members are fully pin-compatible, allowing easy design migration across multiple density options in a given package footprint. The XC9500XV architectural features address the requirements of in-system programmability. Enhanced pin-locking capability avoids costly board rework. In-system programming throughout the full commercial operating range and a high programming endurance rating provide worry-free reconfigurations of system field upgrades. Extended data retention supports longer and more reliable system operating life. Advanced system features include output slew rate control and user-programmable ground pins to help reduce system noise. Each user pin is compatible with 3.3V, 2.5V, and 1.8V inputs, and the outputs may be configured for 3.3V, 2.5V, or 1.8V operation. The XC9500XV device exhibits symmetric full 2.5V output voltage swing to allow balanced rise and fall times.
Advanced system features
Four pin-compatible device densities -
* * * *
Fast concurrent programming Slew rate control on individual outputs Enhanced data security features Excellent quality and reliability 10,000 program/erase cycles endurance rating 20 year data retention
Architecture Description
Each XC9500XV device is a subsystem consisting of multiple Function Blocks (FBs) and I/O Blocks (IOBs) fully interconnected by the FastCONNECT II switch matrix. The IOB provides buffering for device inputs and outputs. Each FB provides programmable logic capability with extra wide 54 inputs and 18 outputs. The FastCONNECT II switch matrix connects all FB outputs and input signals to the FB inputs. For each FB, up to 18 outputs (depending on package pin-count) and associated output enable signals drive directly to the IOBs. See Figure 1.
* *
Pin-compatible with 3.3V core XC9500XL family in common package footprints Hot Plugging capability
(c) 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS049 (v2.0) January 15, 2001 Advance Product Specification
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XC9500XV Family High-Performance CPLD
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3 JTAG Port
JTAG Controller
In-System Programming Controller
54 I/O I/O I/O I/O 18
Function Block 1 Macrocells 1 to 18
FastCONNECT II Switch Matrix
54 18
Function Block 2 Macrocells 1 to 18
I/O Blocks I/O I/O I/O I/O 3 I/O/GCK 1 I/O/GSR 2 or 4 I/O/GTS
54 18
Function Block 3 Macrocells 1 to 18
54 18
Function Block N Macrocells 1 to 18
DS049_01_041400
Figure 1: XC9500XV Architecture Note: Function block outputs (indicated by the bold lines) drive the I/O blocks directly.
Table 1: XC9500XV Device Family XC9536XV Macrocells Usable Gates Registers TPD (ns) TSU (ns) TCO (ns) fSYSTEM (MHz) Output Banks 36 800 36 3.5 2.8 1.8 278 1 XC9572XV 72 1,600 72 4 3.1 2.0 250 1 XC95144XV 144 3,200 144 4 3.1 2.0 250 2 XC95288XV 288 6,400 288 5 3.7 2.5 222 4
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Table 2: XC9500XV Packages and User I/O Pins (not including four dedicated JTAG pins) XC9536XV 44-pin PLCC 44-pin VQFP 100-pin TQFP 144-pin TQFP 208-pin PQFP 48-pin CSP 144-pin CSP 280-pin CSP 256-pin FBGA 34 34 36 XC9572XV 34 34 72 38 XC95144XV 81 117 117 XC95288XV 117 168 192 192
Function Block
Each Function Block, as shown in Figure 2 is comprised of 18 independent macrocells, each capable of implementing a combinatorial or registered function. The FB also receives global clock, output enable, and set/reset signals. The FB generates 18 outputs that drive the FastCONNECT II switch matrix. These 18 outputs and their corresponding output enable signals also drive the IOB. Logic within the FB is implemented using a sum-of-products representation. Fifty-four inputs provide 108 true and complement signals into the programmable AND-array to form 90 product terms. Any number of these product terms, up to the 90 available, can be allocated to each macrocell by the product term allocator.
Macrocell 1
Programmable AND-Array From FastCONNECT II Switch Matrix
54
Product Term Allocators
18 18 18
To FastCONNECT II Switch Matrix OUT To I/O Blocks PTOE
Macrocell 18
1 3
Global Global Set/Reset Clocks
DS049_02_041400
Figure 2: XC9500XV Function Block
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Macrocell
Each XC9500XV macrocell may be individually configured for a combinatorial or registered function. The macrocell and associated FB logic is shown in Figure 3. Five direct product terms from the AND-array are available for use as primary data inputs (to the OR and XOR gates) to implement combinatorial functions, or as control inputs including clock, clock enable, set/reset, and output enable. The product term allocator associated with each macrocell selects how the five direct terms are used. The macrocell register can be configured as a D-type or T-type flip-flop, or it may be bypassed for combinatorial operation. Each register supports both asynchronous set and reset operations. During power-up, all user registers are initialized to the user-defined preload state (default to 0 if unspecified).
54
Global Set/Reset
Global Clocks
3
Additional Product Terms (from other macrocells)
Product Term Set 1 0
S D/T Q
To FastCONNECTII Switch Matrix
Product Term Allocator
EC Product Term Clock Enable Product Term Clock Product Term Reset OUT Product Term OE PTOE To I/O Blocks
R
Additional Product Terms (from other macrocells)
DS049_03_041400
Figure 3: XC9500XV Macrocell Within Function Block Note: See Figure 8 for additional clock enable details
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XC9500XV Family High-Performance CPLD term clock. Both true and complement polarities of the selected clock source can be used within each macrocell. A GSR input is also provided to allow user registers to be set to a user-defined state.
All global control signals are available to each individual macrocell, including clock, set/reset, and output enable signals. As shown in Figure 4, the macrocell register clock originates from either of three global clocks or a product
Macrocell Product Term Set
Product Term Clock
S D/T EC R
Product Term Reset
I/O/GSR
Global Set/Reset
I/O/GCK1
Global Clock 1
I/O/GCK2
Global Clock 2
I/O/GCK3
Global Clock 3
DS049_04_041400
Figure 4: Macrocell Clock and Set/Reset Capability
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Product Term Allocator
The product term allocator controls how the five direct product terms are assigned to each macrocell. For example, all five direct terms can drive the OR function as shown in Figure 5.
Product Term Allocator
Note that the incremental delay affects only the product terms in other macrocells. The timing of the direct product terms is not changed..
Product Term Allocator
Macrocell Product Term Logic
Product Term Allocator
DS049_05_041400
Figure 5: Macrocell Logic Using Direct Product Term The product term allocator can re-assign other product terms within the FB to increase the logic capacity of a macrocell beyond five direct terms. Any macrocell requiring additional product terms can access uncommitted product terms in other macrocells within the FB. Up to 15 product terms can be available to a single macrocell with only a small incremental delay of TPTA, as shown in Figure 6.
Macrocell Logic With 15 Product Terms
Product Term Allocator
DS049_06_041400
Figure 6: Product Term Allocation With 15 Product Terms
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The product term allocator can re-assign product terms from any macrocell within the FB by combining partial sums of products over several macrocells, as shown in Figure 7. In this example, the incremental delay is only 2*TPTA. All 90 product terms are available to any macrocell, with a maximum incremental delay of 8*TPTA.
Product Term Allocator
Macrocell Logic With 2 Product Terms Product Term Allocator
Product Term Allocator
Macrocell Logic With 18 Product Terms
Product Term Allocator
DS049_07 _041400
Figure 7: Product Term Allocation Over Several Macrocells
DS049 (v2.0) January 15, 2001 Advance Product Specification
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XC9500XV Family High-Performance CPLD The internal logic of the product term allocator is shown in Figure 8.
From Upper Macrocell To Upper Macrocell
R
Product Term Allocator
Product Term Set Global Set/Reset
1 0
S D/T Q CE Global Clocks Product Term Clock R
Product Term Reset
Global Set/Reset Product Term OE
From Lower Macrocell
To Lower Macrocell
DS049_08_041400
Figure 8: Product Term Allocator Logic
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XC9500XV Family High-Performance CPLD
FastCONNECT II Switch Matrix
The FastCONNECT II Switch Matrix connects signals to the FB inputs, as shown in Figure 9. All IOB outputs (corresponding to user pin inputs) and all FB outputs drive the FastCONNECT II matrix. Any of these (up to a fan-in limit of 54) may be selected to drive each FB with a uniform delay.
FastCONNECT II Switch Matrix
Function Block
I/O Block (54) D/T Q 18 I/O
Function Block
I/O Block (54) D/T Q 18 I/O
DS049_09_041400
Figure 9: FastCONNECT II Switch Matrix
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I/O Block
The I/O Block (IOB) interfaces between the internal logic and the device user I/O pins. Each IOB includes an input buffer, output driver, output enable selection multiplexer, and user programmable ground control. See Figure 10 for details.
To other Macrocells
I/O Block
To FastCONNECT Switch Matrix
Macrocell OUT (Inversion in AND-array) Product Term OE PTOE
Bus-Hold I/O
1
UserProgrammable Ground
0 Slew Rate Control
I/O/GTS1
Global OE 1
I/O/GTS2
Global OE 2
I/O/GTS3
Global OE 3
Available in XC95144XV and XC95288XV
I/O/GTS4
Global OE 4
DS049_10_041400
Figure 10: I/O Block and Output Enable Capability
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XC9500XV Family High-Performance CPLD Each IOB provides user programmable ground pin capability. This allows device I/O pins to be configured as additional ground pins in order to force otherwise unused pins to a low voltage state, as well as provide for additional device grounding capability. This grounding of the pin is achieved by internal logic that forces a logic Low output regardless of the internal macrocell signal, so the internal macrocell logic is unaffected by the programmable ground pin capability. Each IOB also provides for bus-hold circuitry that is active during valid user operation. The bus-hold feature eliminates the need to tie unused pins either High or Low by holding the last known state of the input until the next input signal is present. The bus-hold circuit drives back the same state via a nominal resistance (RBH) of 50K ohms. See Figure 13. Note: The bus-hold output will drive no higher than VCCIO to prevent overdriving signals when interfacing to 2.5V components. When the device is not in valid user operation, the bus-hold circuit defaults to an equivalent 50K ohm pull-up resistor in order to provide a known repeatable device state. This occurs when the device is in the erased state, in programming mode, in JTAG INTEST mode, or during initial power-up. A pull-down resistor (1K ohm) may be externally added to any pin to override the default R BH resistance to force a Low state during power-up or any of these other modes.
The input buffer is compatible with 3.3V CMOS, 2.5V CMOS, and 1.8V CMOS signals. The input buffer uses the internal 2.5V voltage supply (VCCINT) to ensure that the input thresholds are constant and do not vary with the VCCIO voltage. Each input buffer provides input hysteresis (50 mV typical) to help reduce system noise for input signals with slow rise or fall edges. Each output driver is designed to provide fast switching with minimal power noise. All output drivers in the device may be configured for driving either 3.3V, 2.5V, or 1.8V CMOS levels by connecting the device output voltage supply (VCCIO) to a 3.3V, 2.5V, or 1.8V voltage supply. Figure 11(a) shows how the XC9500XV device can be used in a 2.5V only system. Each output driver can also be configured for slew-rate limited operation. Output edge rates may be slowed down to reduce system noise (with an additional time delay of TSLEW) under user control. See Figure 12. The output enable may be generated from one of four options: a product term signal from the macrocell, any of the global output enable signals (GTS), always "1", or always "0". There are two global output enables for devices with 72 or fewer macrocells, and four global output enables for devices with 144 or more macrocells. Any selected output enable signal may be inverted locally at each pin output to provide maximum design flexibility.
2.5V 3.3V CMOS or
3.3V 0V
2.5V VCCIO1 VCCIO2 3.3V CMOS or
3.3V
1.8V
3.3V 1.8V CMOS
1.8V
VCCINT
VCCINT VCCIO1 VCCIO2 OUT1
2.5V CMOS
2.5V 0V
IN
XC9500XV CPLD OUT
2.5V CMOS
2.5V 0V 2.5V 0V 0V
0V
2.5V CMOS or
IN
XC9500XV CPLD OUT2 GND
3.3V CMOS
3.3V 0V
GND
1.8V CMOS
1.8V
(a)
0V
(b)
DS049_11_041400
Figure 11: XC9500XV Devices in (a) 2.5V only and (b) Mixed 3.3V/2.5V/1.8V Systems
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XC9500XV Family High-Performance CPLD
Output Voltage Output Voltage
R
VCCIO
Standard Slew-Rate Limited TSLEW 1.2V Standard
Slew-Rate Limited TSLEW 1.2V
0 (a)
Time
0 (b)
Time
DS049_12_041400
Figure 12: Output Slew-Rate Control For (a) Rising and (b) Falling Outputs
Set to PIN during valid user operation
Output Banking
Drive to VCCIO Level
0
PIN
RBH
I/O
XC95288XV and XC95144XV devices are designed with a split-rail I/O structure. This permits the utilization of multiple output drive levels for systems able to operate best in that environment. The output partitioning is by function blocks (FB). With this arrangement, designers can have some sets of outputs driving to 2.5V and others set to 1.8V. Naturally, it is possible to tie all rails to a single output voltage and get all outputs driving to that level. Should designs be migrated from one density to another in the same package, care should be taken to remember the voltage assignments chosen at the outset to assure consistency (Figure 14).
VCCINTs
DS049_13_041400
Figure 13: Bus-Hold Logic
VCCIO1
VCCIO2
GNDs
DS049_14_011501
Figure 14: Split Rail VCC Output Power Connections in XC95144XV and XC95288XV Devices
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XC9500XV Family High-Performance CPLD used with a higher density device without the expense of board rework.
Mixed Voltage
The I/Os on each XC9500XV device are fully 3.3V tolerant even though the core power supply is 2.5V. This allows 3.3V CMOS signals to connect directly to the XC9500XV inputs without damage. In addition, the 2.5V VCCINT power supply can be applied before or after 2.5V signals are applied to the I/Os. In mixed 3.3V/2.5V/1.8V systems, the user pins, the core power supply (VCCINT), and the output power supply (VCCIO) may have power applied in any order. This makes the XC9500XV devices immune to power supply sequencing problems (see Figure 11b). Xilinx proprietary ESD circuitry and high impedance initial state permit hot plugging cards using XC9500XV CPLDs.
In-System Programming
One or more XC9500XV devices can be daisy chained together and programmed in-system via a standard 4-pin JTAG protocol, as shown in Figure 15. In-system programming offers quick and efficient design iterations and eliminates package handling. The Xilinx development system provides the programming data sequence using a Xilinx download cable, a third-party JTAG development system, JTAG-compatible board tester, or a simple microprocessor interface that emulates the JTAG instruction sequence. All I/Os are set to a high-impedance state and pulled High by the bus-hold circuitry during in-system programming. If a particular signal must remain Low during this time, then a pull-down resistor may be added to the pin.
Pin-Locking Capability
The capability to lock the user defined pin assignments during design iteration depends on the ability of the architecture to adapt to unexpected changes. The XC9500XV devices incorporate architectural features that enhance the ability to accept design changes while maintaining the same pinout. The XC9500XV architecture provides for superior pin-locking characteristics with a combination of large number of routing switches in the FastCONNECT II switch matrix, a 54-wide input Function Block, and flexible, bi-directional product term allocation within each macrocell. These features address design changes that require adding or changing internal routing, including additional signals into existing equations, or increasing equation complexity, respectively. For extensive design changes requiring higher logic capacity than is available in the initially chosen device, the new design may be able to fit into a larger pin-compatible device using the same pin assignments. The same board may be
Reliability and Endurance
All XC9500XV CPLDs provide a minimum endurance level of 10,000 in-system program/erase cycles and a minimum data retention of 20 years. Each device meets all functional, performance, and data retention specifications within this endurance limit.
IEEE 1149.1 Boundary-Scan (JTAG)
XC9500XV devices fully support IEEE 1149.1 boundary-scan (JTAG). EXTEST, SAMPLE/PRELOAD, BYPASS, USERCODE, INTEST, IDCODE, HIGHZ and CLAMP instructions are supported in each device. Additional instructions are included for in-system programming operations.
V CC
GND
(a)
(b)
X5902
Figure 15: In-System Programming Operation (a) Solder Device to PCB and (b) Program Using Download Cable
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Design Security
XC9500XV devices incorporate advanced data security features which fully protect the programming data against unauthorized reading or inadvertent device erasure/reprogramming. Table 3 shows the four different security settings available. The read security bits can be set by the user to prevent the internal programming pattern from being read or copied. When set, they also inhibit further program operations but allow device erase. Erasing the entire device is the only way to reset the read security bit. The write security bits provide added protection against accidental device erasure or reprogramming when the JTAG pins are subject to noise, such as during system power-up. Once set, the write-protection may be deactivated when the device needs to be reprogrammed with a valid pattern with a specific sequence of JTAG instructions Table 3: Data Security Options
Read Security
Low Power Mode
All XC9500XV devices offer a low-power mode for individual macrocells or across all macrocells. This feature allows the device power to be significantly reduced. Each individual macrocell may be programmed in low-power mode by the user. Performance-critical parts of the application can remain in standard power mode, while other parts of the application may be programmed for low-power operation to reduce the overall power dissipation. Macrocells programmed for low-power mode incur additional delay (TLP) in pin-to-pin combinatorial delay as well as register setup time. Product term clock to output and product term output enable delays are unaffected by the macrocell power-setting.
Timing Model
The uniformity of the XC9500XV architecture allows a simplified timing model for the entire device. The basic timing model, shown in Figure 16, is valid for macrocell functions that use the direct product terms only, with standard power setting, and standard slew rate setting. Table 4 shows how each of the key timing parameters is affected by the product term allocator (if needed), low-power setting, and slew-limited setting. The product term allocation time depends on the logic span of the macrocell function, which is defined as one less than the maximum number of allocators in the product term path. If only direct product terms are used, then the logic span is "0". The example in Figure 6 shows that up to 15 product terms are available with a span of "1". In the case of Figure 7, the 18 product term function has a span of "2". Detailed timing information may be derived from the full timing model shown in Figure 17. The values and explanations for each parameter are given in the individual device data sheets.
Default Read Allowed
Write Security
Set Read Inhibited Program/Erase Inhibited Read Inhibited Program/Erase Inhibited
Default
Program/Erase Allowed Read Allowed
Set
Program/Erase Allowed
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XC9500XV Family High-Performance CPLD
Combinatorial Logic
Combinatorial Logic
D/T Q
TCO Propagation Delay = TPD (a) TPSU Combinatorial Logic P-Term Clock Path TPCO Setup Time = TPSU Clock to Out Time = TPCO (c) Internal System Cycle Time = TSYSTEM (d)
DS049_16_061200
Clock to Out Time = TCO Setup Time = TSU (b)
D/T Q Combinatorial Logic D/T Q
Figure 16: Basic Timing Model
Table 4: Timing Model Parameters Product Term Description Propagation Delay Global Clock Setup Time Global Clock-to-output Product Term Clock Setup Time Product Term Clock-to-Output Internal System Cycle Period Parameter TPD TSU TCO TPSU TPCO TSYSTEM Allocator(1) + TPTA * S + TPTA * S + TPTA * S + TPTA * S Macrocell Low-Power Setting + TLP + TLP + TLP + TLP Output Slew-Limited Setting + TSLEW + TSLEW + TSLEW -
Notes: 1. S = the logic span of the function, as defined in the text.
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TF
TLOGILP TIN TLOGI
S*TPTA D/T
TPDI
TSLEW Q TOUT
TPTCK TGCK TPTSR TGSR TPTTS
TSUI TCOI THI
EC TAOI
TRAI
TEN
SR
Macrocell TGTS
DS049_17_061200
Figure 17: Detailed Timing Model
Power-Up Characteristics
The XC9500XV devices are well behaved under all operating conditions. During power-up each XC9500XV device employs internal circuitry which keeps the device in the quiescent state until the VCCINT supply voltage is at a safe level (approximately 1.9V). During this time, all device pins and JTAG pins are disabled and all device outputs are disabled with the pins weakly pulled High, as shown in Table 5. When the supply voltage reaches a safe level, all user registers become initialized (typically within 300 s), and the device is immediately available for operation, as shown in Figure 18. If the device is in the erased state (before any user pattern is programmed), the device outputs remain disabled with weak pull-up. The JTAG pins are enabled to allow the device to be programmed at any time. All devices are shipped in the erased state from the factory. If the device is programmed, the device inputs and outputs take on their configured states for normal operation. The Table 5: XC9500XV Device Characteristics Device Circuitry IOB Bus-Hold Device Outputs Device Inputs and Clocks Function Block JTAG Controller Quiescent State Pull-up Disabled Disabled Disabled Disabled Erased Device Operation Pull-up Disabled Disabled Disabled Enabled Valid User Operation Bus-Hold As Configured As Configured As Configured Enabled JTAG pins are enabled to allow device erasure or boundary-scan tests at any time.
VCCINT
1.9V 3.8 V (Typ) (Typ)
0V No Power Quiescent State User Operation Quiescent State No Power
Initialization of User Registers
DS049_18_061200
Figure 18: Device Behavior During Power-up
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XC9500XV Family High-Performance CPLD bits. It is in this voltage neighborhood the POR circuits begin transferring EPROM bits to the latches. XC9500XV POR begins about 1.8V.
Supply arrives at final value
Power-Up Guidelines
Figure 19 shows a block diagram of the internal configuration controller, which transfers the EPROM bits to the latches. Some important things to note are: * * * * * The VCCINT is sensed to determine when to begin the loading. An internal clock source drives a state machine that controls the overall process. The bit loading process takes about 100 microseconds. Internal configuration latches are automatically reset at the beginning of the process. The state machines, counters and strobes are built from CMOS transistors, so they need voltage, setup time, hold time, and propagation delay time to work properly.
VCC
Configuration completes, part comes "alive"
VPOR
Reset pulse delivered configuration begins Logic alive, latches working Transistors waking up Inactive silicon, slight leakage
0
Time
DS049_20_061200
Figure 20: Power-up Activity
When VCCINT passes a threshold, it automatically enables. The state machine cycles through addresses, delivers load strobes to internal latches and completes the process by enabling the I/O pins.
Strobes VCCINT VPOR
Development System Support
The XC9500XV family and associated in-system programming capabilities are fully supported in either software solutions available from Xilinx. The Foundation Series is an all-in-one development system containing schematic entry, HDL (VHDL, Verilog, and ABEL), and simulation capabilities. It supports the XC9500XV family as well as other CPLD and FPGA families. The Alliance Series includes CPLD and FPGA implementation technology as well as all necessary libraries and interfaces for Alliance partner EDA solutions. The Xilinx WebPOWERED Software Solution offer designers the flexibility to target the XC9500 and CoolRunner(R) Series CPLDs on-line with WebFITTER or on the desktop with WebPACK. WebFITTER is an on-line device fitting and evaluation tool which accepts HDL, ABEL, or netlist files and provides all reports, simulation models, and programming files. WebPACK downloadable desktop solutions offer FREE CPLD software modules for ABEL and HDL synthesis, device fitting and JTAG programming.
+ -
State Machine
Address
Clock
DS049_19_061200
Figure 19: Configuration Controller Figure 20 describes what happens inside the chip as the supply rises to its final value. At low voltage, the transistors do not behave like transistors. As VCC passes about a volt, the transistors begin to wake up, but are not yet fully functional. Above 1V, they can amplify and form basic gates. Near 1.8V, they work correctly and can make reliable latches. Above 2V, they can be reliably loaded with EPROM
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Revision History
The following table shows the revision history for this document.. Date 01/19/99 06/12/00 01/15/01 Version 1.0 1.1 2.0 Revision Initial Xilinx release. Advance Information Specification. Updated 3.3V information, added Output Banking, added DS049 number. Added WebPACK information and minor edits. Added "Power-Up Guidelines" on page 17. New performance and package options, removed references to "Fast Flash".
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