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CXD3152R Signal Processor LSI for Single-chip CCD B/W Camera Description The CXD3152R is a digital signal processor LSI for CCD black-and-white cameras. In addition to the CDS and AGC circuits of conventional analog signal processor LSI, this chip also features the ease of use and functions of digital signal processing. Features * Supports 510H/760H system CCD image sensors * Supports EIA/CCIR modes * Built-in CDS and AGC circuits * Built-in 10-bit A/D converter * Analog and digital signal output * Right/left inverted (mirror image) output function * Horizontal and vertical aperture correction function * Gamma correction curve variable function * Serial communication function (I2C bus) * Supports external sync functions (when using the CXD2463R) -- Line lock/Vreset HPLL * Supports backlight compensation functions (when using the CXD2463R) * Character input pin * Blemish detection and compensation function Absolute Maximum Ratings * Supply voltage VDD (3.3V) VSS - 0.3 to +4.6 VDD (5.0V) VSS - 0.3 to +6.0 * Input voltage VI (3.3V) VSS - 0.3 to VDD3 + 0.3 VI (5.0V) VSS - 0.3 to VDD5 + 0.3 * Output voltage VO (3.3V) VSS - 0.3 to VDD3 + 0.3 VO (5.0V) VSS - 0.3 to VDD5 + 0.3 * Storage temperature Tstg -55 to +125 64 pin LQFP (Plastic) Applications Various CCD black-and-white cameras Applicable CCD Image Sensors 510H system CCDs ICX054BL/055BL (Type 1/3 EIA/CCIR) ICX254AL/255AL (Type 1/3 EIA/CCIR) ICX206AL/207AL (Type 1/4 EIA/CCIR) ICX226AL/227AL (Type 1/4 EIA/CCIR) 760H system CCDs ICX038DLA/039DLA (Type 1/2 EIA/CCIR) ICX248AL/249AL (Type 1/2 EIA/CCIR) ICX058CL/059CL (Type 1/3 EIA/CCIR) ICX258AL/259AL (Type 1/3 EIA/CCIR) ICX208AL/209AL (Type 1/4 EIA/CCIR) ICX228AL/229AL (Type 1/4 EIA/CCIR) Supported Related LSIs TG : CXD2463R EEPROM : S-24C01B (Seiko Instruments Co., Ltd.) or equivalent product V V V V V V C Applicable CCD Image Sensors are applicable products as of preparing this data sheet. They may be changed according to the version up and production stop of CCD image sensor. Recommended Operating Conditions * Supply voltage VDD (3.3V) 3.0 to 3.6 4.75 to 5.25 VDD (5.0V) V V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E00565-PS Block Diagram SHP SHD 2MCKI CCD, EIA BLCW1, 2 AGC, DGC CSYNC_IN SDA, SCL, REGRES Y0 to Y7 63, 62 55 58, 57 60, 61, 25, 26 59 41, 42, 40 44 to 48, 50 to 52 37, 33, 34 9bit DAC PREF, CVREF, COMP CDS Register CAP1, CAPA2 3, 4 Timing Generator Sync Separator GAIN CCDIN 39, 38 2 ANA, ANAB Over Sampling CSYNC IRISOUT AGC Controller 5 AMP DAC Blemish Detector HV AP. Con REFH, REFL REFHIN, REFLIN MONITOR MIRROR CHARA -2- CLP Blemish Correction AMP 3H Memory 15, 16 27 54 WC SW PED BLK GOUT 64 AGC YOUT 6 YIN 7 CLP 10bit ADC CAPB2 8 Gamma Y. Gain V. follower GAIN 10 13, 14 CXD3152R CXD3152R Description of Functions by Block CDS & AGC * CDS VDD1 = 5.0V SHD/SHP external input: CXD3152R D/A Converter * DAC 9 bits VDD6 = 3.3V Supports -40 to +130 IRE output Timing Generation * Timing Generation of various DSP internal signal processing pulses Input clock frequencies: EIA (510 x 492) : 19.0699MHz CCIR (500 x 582) : 18.9375MHz EIA (768 x 494) : 28.63636MHz CCIR (752 x 582) : 28.375MHz Slave operation according to the sync signal -4- CXD3152R Pin Configuration VDD6 (3.3V) REGRES 48 VSS7 49 Y5 50 Y6 51 Y7 52 MCKO 53 CHARA 54 2MCKI 55 VDD7 (3.3V) 56 EIA 57 CCD 58 CSYNC_IN 59 BLCW1 60 BLCW2 61 SHD 62 SHP 63 GOUT 64 1 VDD1 (5V) 47 46 45 44 43 42 41 40 39 38 37 36 35 VSS6 34 33 32 VSS5 31 MCKPHS 30 GAMMA2 29 GAMMA1 28 APCON 27 MIRROR 26 DGC 25 AGC 24 VDD5 (3.3V) 23 DEFECT 22 TEST 21 VSS4 20 VDD4 (3.3V) 19 REFBIAS 18 VDD3 (3.3V) 17 VSS3 2 CCDIN 3 CAP1 4 CAPA2 5 IRISOUT 6 YOUT 7 YIN 8 CAPB2 9 VSS1 10 MONITOR 11 VSS2 12 VDD2 (5V) 13 REFHIN 14 REFLIN 15 REFH 16 REFL -5- CVREF COMP ANAB RREF OEB SDA ANA SCL Y4 Y3 Y2 Y1 Y0 CXD3152R Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Symbol VDD1 CCDIN CAP1 CAPA2 IRISOUT YOUT YIN CAPB2 VSS1 MONITOR VSS2 VDD2 REFHIN REFLIN REFH REFL VSS3 VDD3 REFBIAS VDD4 VSS4 TEST DEFECT VDD5 AGC DGC MIRROR APCON GAMMA1 GAMMA2 I/O P I O(A) O(A) Analog power supply (5.0V) Image signal input from CCD CDS DC bias output Connect to GND via an approximately 0.1F capacitor. Gain control amplifier DC bias output Connect to GND via an approximately 0.1F capacitor. Description O(A) Image signal output for iris detection O(A) AGC image signal output I(A) I(A) P Image signal input to ADC Normally input YOUT via an approximately 0.01F capacitor. ADC input clamp level (DC) input High reference (REFHIN) reference level Analog GND O(A) Output for monitoring the signal input to ADC P P I(A) I(A) O(A) O(A) P P O(A) P P I I P I I I I I I Analog GND Analog power supply (5.0V) ADC high reference input ADC low reference input ADC high reference output Connect to GND via an approximately 0.1F capacitor. ADC low reference output Connect to GND via an approximately 0.1F capacitor. Analog GND Analog power supply (3.3V) ADC DC bias output Connect to GND via an approximately 0.1F capacitor. Digital power supply (3.3V) Digital GND Test pin. Normally fix high. Blemish compensation function switching 0: Off, 1: On Digital power supply (3.3V) Analog gain switching 0: Fixed, 1: Auto Digital gain switching 0: Fixed, 1: Auto Mirror inversion switching 0: Standard, 1: Mirror Aperture correction switching 0: Off, 1: On Gamma correction characteristics switching 00: 0.45, 01: 0.6 (register setting), 10: 1.0, 11: S curve -6- CXD3152R Pin No. 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 Symbol MCKPHS VSS5 CVREF COMP VSS6 VDD6 (3.3V) RREF ANAB ANA REGRES SDA SCL OEB Y0 Y1 Y2 Y3 Y4 VSS7 Y5 Y6 Y7 MCKO CHARA 2MCKI VDD7 EIA CCD CSYNC_IN BLCW1 BLCW2 SHD I/O I P O(A) 2MCKI input polarity switching 0: Through, 1: Inverted Digital GND DAC reference voltage output Connect to GND via 0.1F. Description O(A) DAC phase compensation. Connect to GND via 0.1F. P P O(A) Digital GND Digital power supply (3.3V) DAC reference voltage generation Normally connect to GND via 3.3k. O(A) DAC negative output. Normally connect to GND via 200. O(A) DAC positive output. Normally connect to GND via 200. Register reset. All registers reset to the default when low. I I/O I/O I O O O O O P O O O O I I P I I I I I I I2C bus data line I2C bus clock line Digital output (Y0 to Y7) control. 0: Output, 1: Hi-Z Digital signal output (LSB) Digital signal output Digital signal output Digital signal output Digital signal output Digital GND Digital signal output Digital signal output Digital signal output (MSB) Y0 to Y7 latch clock output Character signal input Reference clock input Digital power supply (3.3V) TV mode switching 0: EIA, 1: CCIR CCD number of horizontal pixels switching 0: 510H system, 1: 760H system Composite sync input Backlight compensation window switching 00: Full-screen photometry, 01: Bottom photometry 10: Center photometry, 11: Bottom + center photometry Data block sampling pulse input -7- CXD3152R Pin No. 63 64 Symbol SHP GOUT I/O I O(A) Description Precharge block sampling pulse input AGC gain control voltage output (DAC output) Connect to GND via an approximately 0.1F capacitor. Note 1) Asterisks () indicate that either 3.3V or 5.0V input is possible. Note 2) The I/O column symbol meanings are as follows. I : Digital input O : Digital output I/O : Digital input/output I(A) : Analog input O(A) : Analog output P : Power supply/GND -8- CXD3152R Logic Block Electrical Characteristics DC Characteristics 3.3V Block Item Input high level voltage Input low level voltage Input high level voltage Input low level voltage Output low level voltage Output high level voltage Output low level voltage Input leak current Output leak current Symbol VIH VIL VIH VIL VOL VOH VOL IIL IOZ Conditions CMOS supported Min. 0.7VDD -- 0.75VDD -- -- VDD - 0.8 -- -10 -10 Typ. -- -- -- -- -- -- -- -- -- (VDD = 3.0 to 3.6V, VSS = 0V) Max. -- 0.2VDD -- 0.15VDD 0.4 -- 0.4 +10 +10 Unit V V V V V V V A A Applicable pins 1 2, 4 4 3 1, 2, 4 3, 4 CMOS Schmitt supported IOL = 4mA IOH = -4mA IOL = 4mA VI = VDD, VSS At high impedance output Note 1) The applicable pins correspond to the following symbols. 1 AGC, APCON, BLCW1, BLCW2, CCD, CHARA, MCKPHS, CSYNC_IN, DEFECT, DGC, EIA, GAMMA1, GAMMA2, 2MCKI, MIRROR, TEST, OEB (input) 2 REGRES 3 MCKO, Y0 to Y7 (output) 4 SCL, SDA (I/O) Note 2) The ANA, ANAB, COMP, CVREF, REFBIAS, REFH, REFL and RREF pins are not included in the DC characteristics. 5.0V Block Item Input high level voltage Input low level voltage Input leak current Symbol VIH VIL IIL Conditions CMOS supported VI = VDD, VSS Min. 0.7VDD -- -10 (VDD = 4.75 to 5.25V, VSS = 0V) Typ. -- -- -- Max. -- 0.3VDD +10 Unit V V A Applicable pins 5 5 Note 1) The applicable pins correspond to the following symbols. 5 SHD, SHP (input) Note 2) The CAP1, CAPA2, CAPB2, CCDIN, REFHIN, REFLIN, YIN, GOUT, IRISOUT, MONITOR and YOUT pins are not included in the DC characteristics. -9- CXD3152R AC Characteristics Item CSYNC_IN fall setup time, activated by the falling edge of 2MCKI CSYNC_IN fall hold time, activated by the falling edge of 2MCKI Delay time from the falling edge of 2MCKI to MCKO output CSYNC_IN fall setup time, activated by the rising edge of 2MCKI CSYNC_IN fall hold time, activated by the rising edge of 2MCKI Delay time from the rising edge of 2MCKI to MCKO output CHARA setup time, activated by the falling edge of MCKO CHARA hold time, activated by the falling edge of MCKO Delay time from the falling edge of MCKO to Y0 to Y7 output Power-on reset time Reset pulse width SCL clock frequency SCL clock high level width SCL clock low level width SDA setup time, activated by the rising edge of SCL SDA hold time, activated by the falling edge of SCL Delay time from the falling edge of SCL to SDA low level output Delay time from the falling edge of SCL to SDA output floating SHP rise time, activated by the falling edge of 2MCKI SHD rise time, activated by the falling edge of 2MCKI Symbol Min. 10 10 -- 10 10 -- 0 20 -- 1 1 -- 700 700 30 0 -- -- -- 0 (Output load: CL = 50pF) Typ. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Max. -- -- 20 -- -- 20 -- -- 15 -- -- 500 -- -- -- -- 20 15 -- 30 Unit ns ns ns ns ns ns ns ns ns s s kHz ns ns ns ns ns ns ns ns tsu1 thd1 tdly1 tsu2 thd2 tdly2 tsu3 thd3 tdly3 tpor trst fscl thigh tlow tsu4 thd4 tdly4 tdly5 tdly6 tdly7 - 10 - CXD3152R Master Clock Generation Timing (1) MCKPHS = low 2MCKI thd1 CSYNC_IN tsu1 tdly1 MCKO tdly1 tdly1 (2) MCKPHS = high 2MCKI thd2 CSYNC_IN tsu2 tdly2 MCKO tdly2 tdly2 Video Signal related Input/Output Timing MCKO tsu3 CHARA thd3 tdly3 Y0 to Y7 - 11 - CXD3152R Reset Timing 3V VDD tpor VIH trst REGRES I2C bus Timing SCL thigh SDA (input) tsu4 SDA (output) Hi-Z tdly4 tdly5 thd4 tlow Analog Signal Processing Sampling Pulse Timing 2MCKI SHP tdly6 SHD tdly7 ADCLK tdly8 tdly8 Note 1) When MCKPHS = low - 12 - CXD3152R Analog Block Electrical Characteristics 10-bit A/D Converter Electrical Characteristics Item Resolution Conversion frequency Nonlinearity error Differential nonlinearity error Symbol RES Fs I.L. D.L. Min. -- -- -- -- Typ. -- 15 -- -- Max. 10 20 2.0 1.0 (VDD3 = 3.3V, VSS = 0V, Ta = 25C) Unit Bits MSPS LSB LSB DC accuracy DC accuracy Test conditions For the test circuit conditions, refer to the Analog Characteristics Test Circuit. For the power supply names, refer to the symbols in the Pin Description. 9-bit D/A Converter Electrical Characteristics Item Resolution Conversion frequency Zero scale output voltage Full scale output voltage Full scale output current Nonlinearity error Differential nonlinearity error Symbol RES Fs VZERO VFULL IFULL I.L. D.L. Min. -- -- -15 1.21 0 -- -- Typ. -- -- 0 1.30 6.6 -- -- Max. 10 20.0 15 1.43 16.5 2.0 1.0 (VDD6 = 3.3V, VSS = 0V, Ta = 25C) Unit Bits MSPS mW V mA LSB LSB DC accuracy DC accuracy Test conditions For the test circuit conditions, refer to the Analog Characteristics Test Circuit. For the power supply names, refer to the symbols in the Pin Description. - 13 - CXD3152R CDS-AGC Electrical Characteristics Item CAP1 DC level Symbol CAP1 Min. 1.5 (VDD1, 2 = 5.0V, VDD3 = 3.3V, VSS = 0V, Ta = 25C) Typ. 1.6 Max. 1.7 Unit V Test conditions CAP1 output DC level CCDIN = 1.6V (DC) GOUT = 1.5V CAPA2 output DC level CCDIN = 1.6V (DC) GOUT = 1.5V YOUT output DC level CCDIN = 1.6V (DC) GOUT = 2.5V GCOF1 = V4 - CDSDC V4 = YOUT output DC level CCDIN = 1.6V (DC) GOUT = 1.5V GCOF2 = V5 - CDSDC V5 = YOUT output DC level CCDIN = 1.6V (DC) GOUT = 0.5V YOUT output gain CCDIN = S1 (Note 2) GOUT = 3.3V YOUT output gain CCDIN = S1 (Note 2) GOUT = 0V YOUT output AC level CCDIN = S1 (Note 3) GOUT = 0.5V YOUT output AC level CCDIN = S1 (Note 3) GOUT = 2.5V IRISOUT DC level CCDIN = 1.6V (DC) GOUT = 3.3V IRISOUT gain CCDIN = S2 (Note 4) GOUT = 3.3V IRISOUT AC level CCDIN = S2 (Note 5) GOUT = 3.3V CAPA2 DC level CAPA2 2.5 3.0 3.5 V CDS DC level CDSDC 2.9 3.4 3.9 V AGC DC offset 1 GCOF1 -0.2 0 0.2 mV AGC DC offset 2 GCOF2 -0.4 0 0.4 mV AGC minimum gain characteristics (Note 1) AGC maximum gain characteristics (Note 1) AGCG1 3.3 6.4 8.7 dB AGCG2 15.7 18.8 21.1 dB AGC D range 1 AGCD1 1.9 2.2 2.7 V AGC D range 2 AGCD2 1.6 2.0 2.7 V IRIS DC level IRISDC 1.6 2.2 2.6 V IRIS gain IRISG 8.3 9.5 10.7 dB IRIS D range IRISDR 1.6 2.1 2.7 V For the test circuit conditions, refer to the Analog Characteristics Test Circuit. For the power supply names, refer to the symbols in the Pin Description. Note 1) Refer to the AGC Gain Characteristics. Note 2) S1: Va = 100 to 400mV, Vb = 1.6V (Va = peak to peak, Vb = peak to GND) Note 3) S1: Va = 1000mV, Vb = 1.6V Note 4) S2: Va = 400mV, Vb = 1.6V Note 5) S2: Va = 1000mV, Vb = 1.6V - 14 - CXD3152R CLP Electrical Characteristics Item CAPB2 DC level Symbol CAPB2 Min. 2.6 (VDD1, 2 = 5.0V, VDD3 = 3.3V, VSS = 0V, Ta = 25C) Typ. 2.7 Max. 2.8 Unit V Test conditions CAPB2 output DC level SW1 = A, SW2 = A MONITOR output DC level CLP = "H" SW1 = A, SW2 = A MONITOR output gain SW1 = B, SW2 = B YIN = S4 (Note 1) MONITOR output AC level SW1 = B, SW2 = A YIN = S3 (Note 2) CLP DC level CLPDC1 2.6 2.7 2.8 V CLP gain CLPG 0 0.6 1.2 dB CLP D range CLPD 2.0 2.4 2.7 V For the test circuit conditions, refer to the Analog Characteristics Test Circuit. For the power supply names, refer to the symbols in the Pin Description. Note 1) S4: Va = 1000mV, Vb = 2.75V (Va = peak to peak, Vb = peak to GND) Note 2) S3: Va = 2000mV, Vb = 3.6V OPAMP Electrical Characteristics Item OPAMP DC H OPAMP DC L Symbol OPH OPL Min. 2.8 0.8 (VDD1, 2 = 5.0V, VDD3 = 3.3V, VSS = 0V, Ta = 25C) Typ. 2.9 0.9 Max. 3.0 1.0 Unit V V Test conditions REFH output DC level SW1 = A, SW2 = A REFL output DC level SW1 = A, SW2 = A For the test circuit conditions, refer to the Analog Characteristics Test Circuit. For the power supply names, refer to the symbols in the Pin Description. AGC Gain Characteristics (VDD1, 2 = 5.0V, VDD3 = 3.3V, VSS = 0V, Ta = 25C) 25 20 AGC gain [dB] 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.3 GOUT voltage [V] AGC Gain Characteristics - 15 - Analog Characteristics Test Circuit 0.1F 0.1F 0.1F CAPB2 REFBIAS CVREF COMP CLK CAPA2 TEST CHARA APCON 0.1F 0.1F 0.1F 0.1F V CAP1 GOUT IRISOUT TEST AMP ADCLK GAMMA1 MCKO Y7 to Y0 CCDIN AGC CLP 10-bit ADC 9-bit DAC ANA CDS YIN YOUT 0.1F A SW1 B SW2 DEFECT AGC MONITOR REFH REFL B 0.1F REFHIN - 16 - CLP 0.1F 2.925V V 0.1F 0.1F 200 ANAB 200 REFLIN RREF SHD SHP SHD SHP DGC 3.2k A V 0.825V CXD3152R CXD3152R Analog Input/Output Pin Equivalent Circuits Pin No. 5 Symbol I/O Equivalent circuit Description Video signal output pin for iris detection Maximum output amplitude = 2.10Vp-p (typ.) Video signal output pin of gain control amplifier (AGC) Maximum output amplitude = 2.25Vp-p (typ.) Black level = 3.40V DC (typ.) Video signal output of analog clamp circuit Monitor pin for input signal to ADC Black level = 2.75V DC (typ.) VDD1, 2 IRISOUT O VDD1, 2 5 6 YOUT O 6 10 10 MONITOR O 2 CCDIN I 2 13 Maximum input amplitude = 3.40Vp-p (Maximum video signal amplitude from precharge level = 2.00Vp-p) DC input bias = 1.80 0.1V High reference input pin for ADC 2.92V DC input (typ.) Low reference input pin for ADC 0.82V DC input (typ.) 13 14 REFHIN REFLIN I I 14 VDD1, 2 7 7 YIN I Input pin for video signal to undergo A/D conversion Maximum input amplitude = 2.30Vp-p (typ.) Black level = 2.73V DC (typ.) VDD1, 2 4 CAPA2 O 4 1k 10k 10k DC bias output pin of the gain control amplifier 3.00V DC output (typ.) 3 CAP1 O 3 8 VDD1, 2 DC bias output pin of the CDS circuit 1.58V DC output (typ.) 8 CAPB2 O Clamp level (DC) output pin of the clamp circuit for A/D conversion 2.73V DC output (typ.) - 17 - CXD3152R Pin No. Symbol I/O Equivalent circuit VDD7 1.5k VDD1, 2 64 Description 64 GOUT O Gain control signal (8-bit DAC for gain control) output pin for AGC VDD7 15 REFH O 15 High reference output pin for ADC Voltage follower output 2.90V DC output (typ.) VDD3 16 REFL O 16 Low reference output pin for ADC Voltage follower output 0.80V DC output (typ.) VDD3 19 REFBIAS O 19 DC bias output pin for ADC 1.55V DC output (typ.) VDD6 38 ANAB O D/A converter negative output 0 to 1.24V output 38 39 ANA O 39 D/A converter positive output 0 to 1.24V output - 18 - CXD3152R Pin No. Symbol I/O Equivalent circuit VDD6 Description 37 RREF O 37 DAC reference voltage generation pin 1.32V DC output (typ.) VDD6 33 CVREF O 33 DAC reference voltage output pin 1.32V DC output (typ.) VDD6 34 COMP O 34 DAC phase compensation pin 2.18V DC output (typ.) Note) For the power supply names in the equivalent circuits, refer to the symbols in the Pin Description. - 19 - CXD3152R Timing Chart Horizontal Direction Timing 2MCK: MCK: MCKO: CCDIN: SHP: SHD: cblk: CSYNC: A_CLP: D_CLP: DOUT[7:0]: ANA: Master clock input for the CXD3152R Internal reference clock produced by dividing the input reference clock (2MCK) in half. Latch clock for digital output signal (Inverted MCK signal) Imaging signal from CCD Precharge level sampling pulse input Video level sampling pulse input Internal composite blanking pulse (for VIDEO output signal) Composite sync pulse input (in phase for CSYNC_IN and the VIDEO output signal) Internal pulse for analog clamp Internal pulse for digital clamp 8-bit digital output signal Analog output signal Vertical Direction Timing HD: cblk: CSYNC: A_CLP: D_CLP: CCDIN: DOUT[7:0]: Internal horizontal sync signal Internal composite blanking pulse (for VIDEO output signal) Composite sync pulse input (in phase for CSYNC_IN and the VIDEO output signal) Internal pulse for analog clamp Internal pulse for digital clamp Video signal from the CCD 8-bit digital output signal - 20 - Horizontal Direction Timing Chart Count CLK = 606fH = 19.0699/2MHz EIA 510H System 0 20 90 110 100 80 10 60 30 120 2MCK MCK MCKO CCDIN SHP ANA 2 6 11 16 19 499 499 500 501 502 503 504 505 DOUT[7:0] 505 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 - 21 - 14 59 14 24 16 SHD CSYNC A_CLP 506 507 508 509 510 8 D_CLP 104 cblk 17.5 clocks 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CXD3152R Horizontal Direction Timing Chart Count CLK = 606fH = 18.9375/2MHz CCIR 510H System 0 110 120 10 20 30 60 90 100 130 2MCK MCK MCKO CCDIN SHP ANA 2 6 11 16 19 489 489 490 491 492 493 494 495 DOUT[7:0] 495 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 - 22 - 14 59 14 24 16 SHD CSYNC A_CLP 496 497 498 499 500 8 D_CLP 114 cblk 17.5 clocks 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CXD3152R Horizontal Direction Timing Chart Count CLK = 910fH = 28.63636/2MHz EIA 760H System 0 20 30 40 90 150 160 140 10 170 2MCK MCK MCKO CCDIN SHP ANA 7 11 16 21 24 758 758 759 760 761 762 763 764 DOUT[7:0] 764 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 - 23 - 22 SHD CSYNC A_CLP 764 765 766 767 768 12 D_CLP 154 cblk 15.5 clocks 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 CXD3152R Horizontal Direction Timing Chart Count CLK = 908fH = 28.375/2MHz CCIR 760H System 0 20 30 40 90 170 150 160 10 180 2MCK MCK MCKO CCDIN SHP ANA 9 13 18 21 743 743 744 745 746 747 748 749 DOUT[7:0] 749 9 10 11 12 13 14 15 16 17 18 19 20 21 - 24 - 22 12 SHD CSYNC A_CLP D_CLP 169 cblk 13.5 clocks 748 749 750 751 752 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 CXD3152R 258 260 262 (520) (522) (524) 0 476 478 480 482 484 486 475 477 479 481 483 485 480 482 484 486 488 490 492 494 OB 479 481 483 485 487 489 491 493 OB 3 5 7 9 11 13 15 17 19 21 23 25 2 4 6 8 10 12 14 16 18 20 22 24 OB OB OB OB OB OB 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 OB OB OB OB OB OB 2 4 6 8 10 12 14 16 18 20 22 24 26 28 475 474 477 476 479 478 481 480 483 482 485 484 487 486 479 481 483 485 487 489 491 493 OB 478 480 482 484 486 488 490 492 494 OB 2 4 6 8 10 12 14 16 18 20 22 24 26 28 1 3 5 7 9 11 13 15 17 19 21 23 25 27 OB OB OB OB OB OB 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 OB OB OB OB OB OB 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 - 25 - HD cblk A_CLP CSYNC D_CLP CCDIN Vertical Direction Timing Chart DOUT[7:0] 2H Even field Odd field Odd field Even field 2 4 6 8 10 15 20 25 30 258 0 4 8 2 10 6 260 (262) (264) (266) (268) (270) (272) 15 (277) 20 (282) 25 (287) 30 (292) EIA 510H/760H System CXD3152R 564 566 568 570 572 574 576 563 565 567 569 571 573 575 568 570 572 574 576 578 580 582 OB 567 569 571 573 575 577 579 581 OB 1 3 5 7 9 11 13 15 OB 2 4 6 8 10 12 14 OB OB OB OB OB OB 1 3 5 7 9 11 13 15 17 OB OB OB OB OB OB 2 4 6 8 10 12 14 16 565 567 569 571 573 575 564 566 568 570 572 574 569 571 573 575 577 579 581 OB 568 570 572 574 576 578 580 582 OB 2 4 6 8 10 12 14 16 18 1 3 5 7 9 11 13 15 17 OB OB OB OB OB OB 2 4 6 8 10 12 14 16 18 20 22 OB OB OB OB OB OB 1 3 5 7 9 11 13 15 17 19 21 - 26 - HD cblk A_CLP CSYNC D_CLP CCDIN Vertical Direction Timing Chart DOUT[7:0] 2H Even field 308 310 312 (620) (622) (624)0 2 4 6 8 10 15 20 25 30 308 310 10 6 8 2 4 0 (313) (315) (317) (319) (321) (323) 15 (328) 20 (333) 25 (338) 30 (343) Odd field Odd field Even field CCIR 510H/760H System CXD3152R CXD3152R I2C Serial Communication 1. Description of communication The CXD3152R performs serial communication between a PC or an external EEPROM via the I2C bus. In communication with a PC, the PC is the master device and the CXD3152R is the slave device. On the other hand, in communication with an EEPROM, the CXD3152R is the master device and the EEPROM is the slave device. Communication is performed using two signal lines: SDA and SCL. SDA is a bidirectional serial data transfer line, and is used to transfer addresses from master to slave and to transfer data between master and slave. SDA is normally pulled up to VDD by external resistance of several k. (Therefore, SDA is high at high impedance.) SCL is a bidirectional serial clock transfer line, and is used as the data transfer synchronization clock. SCL is driven by the master device, and like SDA is pulled up to VDD by external resistance of several k. 2. Slave address The CXD3152R I2C slave address is as follows. [A6:A0] = 0011111 (b) 3. I2C protocol Communication conforms to the I2C bus protocol. Data transfer is started when the bus is not in the busy status. During the data transfer period, the data line must be kept stable while the clock line is high. Otherwise, data line changes while the clock line is high are interpreted as START or STOP conditions. * START condition The START condition occurs before all commands to the device, and is defined as SDA changing from high to low when SCL is high. * STOP condition The STOP condition is defined as SDA changing from low to high when SCL is high. All operations must end in the stop condition. 4. Communication timing During read, the SDA data is taken in sync with the falling edge of SCL. During write, the data is output to SDA after a certain delay time from the falling edge of SCL. The communication data is MSB first. An overview of the byte-write and byte-read timings are described below. * Byte-write timing In the byte-write mode, the master device transmits the START condition and the slave address information (the R/W bit is set to 0) to the slave device. After the slave returns an acknowledgement, the master transmits the byte address to be written in the slave address pointer. After receiving the next acknowledgement from the slave, the master transfers the data to be written to the preceding address. The slave device returns an acknowledgement again, and the master generates the STOP condition. SLAVE ADDRESS BYTE ADDRESS STOP P ACK ACK ACK BUS ACTIVITY MASTER SDA LINE START DATA S BUS ACTIVITY - 27 - CXD3152R * Byte-read timing In the byte-read mode, the master device first transmits the START condition, the slave address, and the byte address of the position to be read to the slave device as a write operation. After the slave returns an acknowledgement, the master transmits the START condition and slave address (at this time the R/W bit is set to 1) again. After that, the slave issues an acknowledgement and transfers the read data. The master generates the STOP condition without transmitting an acknowledgement. START START MASTER SDA LINE SLAVE ADDRESS BYTE ADDRESS SLAVE ADDRESS DATA S ACK ACK S NO ACK ACK P BUS ACTIVITY Note 1) The upper 7 bits of the slave address indicate the device address, while the lowermost bit indicates the R/W mode. (Read mode when this bit is high, and write mode when it is low.) Note 2) The CXD3152R slave address is [A6:A0] = 0011111 (b). Note 3) ACK is the response acknowledgement signal, and the slave device goes to low. Note 4) NO ACK means that a response acknowledgement signal is not returned. Note 5) S: START condition, P: STOP condition - 28 - STOP BUS ACTIVITY CXD3152R Description of Registers Address Symbol Part symbol REGRES bit 0 1 2 00 (h) REGRES dummy 3 4 5 6 7 0 1 2 3 0F (h) WSTART WSTART 4 5 6 7 0 1 2 3 10 (h) RSTART RSTART 4 5 6 7 0 1 YGAM1 14 (h) YGAM1 2 3 4 5 dummy 6 7 Gamma correction curve adjustment-1 Sets the intersection between the 1st approximation line (slope = 1) and the 2nd approximation line (slope = 3). Setting range: 00 (h) to 1F (h) Horizontal timing for read start from line memory Set in MCKI clock units 0x00 : Earliest (advanced) position 0xFE : Latest (delayed) position 0xFF : Internal fixed value EIA510 system = 5C (h) CCIR510 system = 66 (h) EIA760 system = 89 (h) CCIR760 system = 96 (h) Horizontal timing for write start to line memory Set in MCKI clock units 0x00 : Earliest (advanced) position 0xFE : Latest (delayed) position 0xFF : Internal fixed value EIA510 system = 67 (h) CCIR510 system = 71 (h) EIA760 system = 95 (h) CCIR760 system = A3 (h) W Description Register reset 0: Reset, 1: Normal (The REGRES pin (Pin 40) has precedence.) Default R/W -- FF (h) W FF (h) W 00 (h) W - 29 - CXD3152R Address Symbol Part symbol bit 0 1 2 Description Default R/W YGAM2 15 (h) YGAM2 3 4 5 6 Gamma correction curve adjustment-2 Sets the intersection between the 2nd approximation line (slope = 3) and the 3rd approximation line (slope = 3/2). Setting range: 00 (h) to 3F (h) 0A (h) W dummy 7 0 1 2 Gamma correction curve adjustment-3 Sets the intersection between the 3rd approximation line (slope = 3/2) and the 4th approximation line (slope = 1). Setting range: 00 (h) to 7F (h) 16 (h) YGAM3 YGAM3 3 4 5 6 20 (h) W dummy 7 0 1 2 Gamma correction curve adjustment-4 Sets the intersection between the 4th approximation line (slope = 1) and the 5th approximation line (slope = 3/4). Setting range: 00 (h) to 7F (h) 17 (h) YGAM4 YGAM4 3 4 5 6 2E (h) W dummy 7 0 1 2 Gamma correction curve adjustment-5 Sets the intersection between the 5th approximation line (slope = 3/4) and the 6th approximation line (slope = 1/2). Setting range: 00 (h) to 7F (h) 18 (h) YGAM5 YGAM5 3 4 5 6 36 (h) W dummy 7 - 30 - CXD3152R Address Symbol Part symbol bit 0 1 2 Description Default R/W 19 (h) YGAM6 YGAM6 3 4 5 6 Gamma correction curve adjustment-6 Sets the intersection between the 6th approximation line (slope = 1/2) and the 7th approximation line (slope = 1/8). Setting range: 00 (h) to 7F (h) The 7th approximation line is used for knee processing. 41 (h) W dummy 7 0 1 Horizontal aperture correction signal gain setting The gain changes linearly from 0 (h) to 7 (h). 0 (h): x0 F (h): Maximum gain HAPGAIN 2 3 4 5 09 (h) 1A (h) HAPGAIN W dummy 6 7 0 1 2 Horizontal aperture correction signal noise suppression (coring) characteristics setting OUTPUT = INPUT - HAPCORE1 If (OUTPUT < 0), OUTPUT = 0 00 (h): Noise suppression off 3F (h): Maximum noise suppression level HAPCORE1 3 4 02 (h) 1B (h) HAPCORE 5 6 HAPCORE2 7 0 1 VAPGAIN 2 3 Horizontal aperture correction signal noise suppression (coring) characteristics setting OUTPUT = INPUT If (OUTPUT HAPCORE2), OUTPUT = 0 00 (h): Noise suppression off 3F (h): Maximum noise suppression level Vertical aperture correction signal gain setting The gain changes linearly from 0 (h) to F (h). 0 (h): x0 F (h): Maximum gain W 00 (h) 04 (h) 1C (h) VAPGAIN 4 5 dummy 6 7 W - 31 - CXD3152R Address Symbol Part symbol bit 0 1 2 Description Vertical aperture correction signal noise suppression (coring) characteristics setting OUTPUT = INPUT - VAPCORE1 If (OUTPUT < 0), OUTPUT = 0 00 (h): Noise suppression off 3F (h): Maximum noise suppression level Default R/W VAPCORE1 3 4 02 (h) 1D (h) VAPCORE 5 6 VAPCORE2 7 0 1 LCLIP 2 3 Vertical aperture correction signal noise suppression (coring) characteristics setting OUTPUT = INPUT If (OUTPUT VAPCORE2), OUTPUT = 0 00 (h): Noise suppression off 3F (h): Maximum noise suppression level Aperture correction signal minus side clip level setting OUTPUT = INPUT If (INPUT LCLIP), OUTPUT = LCLIP 0 (h): Maximum clip level F (h): Minimum clip level Aperture correction signal plus side clip level setting OUTPUT = INPUT If (INPUT HCLIP), OUTPUT = HCLIP 0 (h): Maximum clip level F (h): Minimum clip level W 00 (h) 04 (h) 1E (h) APCLIP 4 5 HCLIP 6 7 0 1 AT_APCORE 2 3 W 06 (h) Aperture correction signal coring level DGC link setting 0x0: Coring off 0x1F: Maximum coring level 1F (h) W 1F (h) AT_APCORE 4 5 dummy 6 7 0 1 2 YGAIN1 Signal gain setting when GAMMA1 and GAMMA2 are set to 00 (gamma = 0.45) 3C (h) 20 (h) 3 4 5 6 YGAIN1 W dummy 7 - 32 - CXD3152R Address Symbol Part symbol bit 0 1 2 Description Default R/W YGAIN2 21 (h) YGAIN2 3 4 5 6 Signal gain setting when GAMMA1 and GAMMA2 are set to 10 (gamma = 0.6) 1F (h) W dummy 7 0 1 2 YGAIN3 22 (h) YGAIN3 3 4 5 6 Signal gain setting when GAMMA1 and GAMMA2 are set to 01 (gamma = 1.0) 18 (h) W dummy 7 0 1 2 YGAIN4 23 (h) YGAIN4 3 4 5 6 Signal gain setting when GAMMA1 and GAMMA2 are set to 11 (gamma = S) 3A (h) W dummy 7 0 1 2 Pedestal level setting The pedestal level changes linearly from 0 (h) to F (h). 00 (h): Low 17 (h): 7.5 IRE 3F (h): High 24 (h) PED PED 3 4 5 6 17 (h) W dummy 7 - 33 - CXD3152R Address Symbol Part symbol LCLIP bit 0 1 2 Description Clip level setting for the black level and lower 0: -20 IRE, 1: Pedestal level Default R/W 00 (h) 25 (h) LOWCLIP dummy 3 4 5 6 7 0 1 2 CHARA_G Externally input 1-bit character signal gain setting 00 (h): -85 IRE 20 (h): 0 3F (h): +85 IRE W 27 (h) CHARA_G 3 4 5 6 32 (h) W dummy 7 0 1 2 28 (h) WT_CLIP 3 WT_CLIP 4 5 6 7 0 1 2 BK_CLIP White clip level setting C4 (h) W Video signal minus component clip level setting 1D (h) W 29 (h) 3 4 5 6 BK_CLIP dummy 7 - 34 - CXD3152R Address Symbol Part symbol bit 0 1 2 Description Aperture signal gamma correction characteristics setting Sets the intersection of the 1st approximation line (slope = 2) which passes through the origin and the 2nd approximation line (slope = 1). Setting range: 00 (h) to 3F (h) Default R/W APGAM1 2A (h) APGAM1 3 4 5 6 3F (h) W dummy 7 0 1 2 Aperture signal gamma correction characteristics setting Sets the intersection of the 2nd approximation line (slope = 1) and the 3rd approximation line (slope = 7F (h) 1/2). Setting range: 00 (h) to 7F (h) 2B (h) APGAM2 APGAM2 3 4 5 6 W dummy APSW 7 0 1 2 Aperture correction signal added position setting 01 (h) 0: After gamma correction, 1: Before gamma correction 2C (h) APSW dummy 3 4 5 6 7 0 1 2 Reference level setting for auto gain control integral value W 32 (h) AGC_REF AGC_REF 3 4 5 6 18 (h) W dummy 7 - 35 - CXD3152R Address Symbol Part symbol bit 0 1 2 Description Default R/W 33 (h) DGCMIN 3 DGCMIN 4 5 6 7 0 1 2 Digital gain control (DGC) minimum gain limiter setting Valid when DGC = 1 When DGC = 0, this is the digital gain manual 20 (h) setting register. 20 (h) : x1.0 times (1F (h) and lower settings are prohibited) FF (h) : x8.0 times W 34 (h) DGCMAX 3 DGCMAX 4 5 6 7 0 1 2 Digital gain control (DGC) maximum gain limiter setting Valid when DGC = 1 20 (h) : x1.0 times A0 (h) (1F (h) and lower settings are prohibited) 0xA0 : x5.0 times 0xFF : x8.0 times W 35 (h) AGCMIN AGCMIN 3 4 5 6 Analog gain control (AGC) minimum gain limiter setting Valid when AGC = 1 When AGC = 0, this is the analog gain manual setting register. 00 (h) : Min 7F (h) : Max 00 (h) W dummy 7 0 1 2 Analog gain control (AGC) maximum gain limiter setting Valid when AGC = 1 00 (h) : Min 7F (h) : Max 36 (h) AGCMAX AGCMAX 3 4 5 6 59 (h) W dummy 7 - 36 - CXD3152R Address Symbol Part symbol bit 0 1 Description Auto gain control time constant setting Hold time (Hold_time) or feedback time (FB_time) can be selected by the SW setting. Hold_time = (AGCWAIT x 2 + 2) x Vt Vt: 1/60 (EIA), 1/50 (CCIR) (FB_time also uses the above formula.) Hold time/feedback time selection 0: Hold_time, 1: FB_time Default R/W AGCWAIT 37 (h) AGCWAIT SW dummy 2 3 4 5 6 7 0 1 2 1D (h) W 00 (h) AGCTM Auto gain control feedback time setting 0: Low speed, 1: High speed 00 (h) 38 (h) AGCTM dummy 3 4 5 6 7 AGCHD 0 1 2 Auto gain control hold setting 0: Normal operation, 1: Hold 00 (h) W 39 (h) AGCHD dummy 3 4 5 6 7 0 1 MAX_N_DEF 2 3 Maximum number of registered blemishes setting Maximum 10 points 0A (h) W 4C (h) MAX_N_DEF 4 5 dummy 6 7 W - 37 - CXD3152R Address Symbol Part symbol DEFRES bit 0 1 2 Description Blemish detection operation reset 0: Reset, 1: Normal Default R/W 01 (h) 5A (h) DEFRES dummy 3 4 5 6 7 0 1 2 W 64 (h) DEF01 3 X[0:7] 4 5 6 7 0 X[8:9] 1 2 Lower 8 bits of blemish pixel X address 00 (h) R/W Upper 2 bits of blemish pixel X address 00 (h) 65 (h) DEF02 Y[0:5] 3 4 5 6 7 0 Y[6:8] 1 2 3 D0: EVEN Y address offset data relative to ODD 0: Offset value 0, 1: Offset value 1 Fixed to 1 D2: Valid data/invalid data 0: Invalid data, 1: Valid data D3: Internal data/external data 0: External, 1: Internal dummy 00 (h) Upper 3 bits of blemish pixel Y address 00 (h) Lower 6 bits of blemish pixel Y address 00 (h) R/W 66 (h) DEF03 D[0:4] 4 5 6 7 R/W - 38 - CXD3152R Address 67 (h) 68 (h) 69 (h) 6A (h) 6B (h) 6C (h) 6D (h) 6E (h) 6F (h) 70 (h) 71 (h) 72 (h) 73 (h) 74 (h) 75 (h) 76 (h) 77 (h) 78 (h) 79 (h) 7A (h) 7B (h) 7C (h) 7D (h) 7E (h) 7F (h) 80 (h) 81 (h) Symbol DEF11 DEF12 DEF13 DEF21 DEF22 DEF23 DEF31 DEF32 DEF33 DEF41 DEF42 DEF43 DEF51 DEF52 DEF53 DEF61 DEF62 DEF63 DEF71 DEF72 DEF73 DEF81 DEF82 DEF83 DEF91 DEF92 DEF93 Part symbol bit Description Default R/W Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 Omitted: Same as DEF01 Omitted: Same as DEF02 Omitted: Same as DEF03 - 39 - CXD3152R Address Symbol Part symbol DGC bit 0 Description Digital gain switching (Same function as DGC pin) 0: Fixed, 1: Auto Analog gain switching (Same function as AGC pin) 0: Fixed, 1: Auto Register setting/pin setting selection 0: Pin setting, 1: Register setting Default R/W 00 (h) AGC 1 00 (h) 96 (h) ADGC SW 2 3 4 00 (h) W dummy 5 6 7 GAM1 GAM2 SW 97 (h) GAMMA 0 1 2 3 4 Gamma correction characteristics switching (Same function as GAMMA1 and GAMMA2 pins) 00: 0.45, 01: 0.6, 10: 1.0, 11: S curve Register setting/pin setting selection 0: Pin setting, 1: Register setting 00 (h) 00 (h) W dummy 5 6 7 BLCW1 BLCW2 SW 98 (h) BLCW 0 1 2 3 4 Backlight compensation window switching (Same function as BLCW1 and BLCW2 pins) 00 (h) 00: Full-screen photometry, 01: Lower photometry 10: Center photometry, 11: Lower + center photometry Register setting/pin setting selection 0: Pin setting, 1: Register setting 00 (h) W dummy 5 6 7 - 40 - CXD3152R Address Symbol Part symbol EIA bit 0 Description TV mode switching (Same function as EIA pin) 0: EIA, 1: CCIR Register setting/pin setting selection 0: Pin setting, 1: Register setting Default R/W 00 (h) SW 99 (h) EIA 1 2 3 4 00 (h) W dummy 5 6 7 CCD 0 CCD number of horizontal pixels switching (Same function as CCD pin) 0: 510H system, 1: 760H system Register setting/pin setting selection 0: Pin setting, 1: Register setting 00 (h) SW 9A (h) CCD 1 2 3 4 00 (h) W dummy 5 6 7 MIR 0 Mirror inversion switching (Same function as MIRROR pin) 0: Standard, 1: Mirror Register setting/pin setting selection 0: Pin setting, 1: Register setting 00 (h) SW 9B (h) MIRROR 1 2 3 4 00 (h) W dummy 5 6 7 - 41 - CXD3152R Address Symbol Part symbol APCON bit 0 Description Aperture correction switching (Same function as APCON pin) 0: Off, 1: On Register setting/pin setting selection 0: Pin setting, 1: Register setting Default R/W 00 (h) SW 9C (h) APCON 1 2 3 00 (h) W dummy 4 5 6 7 DACSW 0 1 2 DA conversion frequency setting 0: 2MCKI/2, 1: 2MCKI 01 (h) 9D (h) OVSA 3 dummy 4 5 6 7 DEFECT 0 Blemish compensation function switching (Same function as DEFECT pin) 0: Off, 1: On Register setting/pin setting selection 0: Pin setting, 1: Register setting 00 (h) W SW 9E (h) DEFECT 1 2 3 00 (h) W dummy 4 5 6 7 DSCSW 0 1 2 Video output DAC on/off 0: On, 1: Off 00 (h) 9F (h) DACSW dummy 3 4 5 6 7 - 42 - W CXD3152R Address Symbol Part symbol OEB bit 0 Description Digital output (Y0 to Y7) switching (Same function as OEB pin) 0: Output, 1: Hi-Z Register setting/pin setting selection 0: Pin setting, 1: Register setting Default R/W 00 (h) SW A0 (h) OEB 1 2 3 00 (h) W dummy 4 5 6 7 CHARA SW 0 1 2 1-bit character signal input switching (Same function as CHARA pin) Register setting/pin setting selection 0: Pin setting, 1: Register setting 00 (h) 00 (h) A1 (h) CHARA dummy 3 4 5 6 7 W - 43 - CXD3152R Using the EEPROM The CXD3152R can connect an external EEPROM which supports the I2C bus. Normally, read and write to and from the EEPROM are performed from the PC master via the I2C bus to the slave EEPROM. Also, this IC can automatically read the user-set register values during power-on by writing the addresses and setting values for up to 64 registers in the EEPROM. (At this time this IC is the master device and the EEPROM is the slave device.) The serial EEPROM S-24C01B made by Seiko Instruments Co., Ltd. or equivalent product can be used as the external EEPROM. The external EEPROM load timing during power-on or register reset is shown below for when an EEPROM is mounted and not mounted. The I2C bus is occupied by the EEPROM load at this period, so when using the I2C bus, other communication by the master device is prohibited for the following times from the rising edge of REGRESS. When an EEPROM is mounted REGRES SCL/SDA Max. 135ms active (read from the EEPROM) When an EEPROM is not mounted REGRES SCL/SDA Max. 2ms active (checking for EEPROM presence) - 44 - CXD3152R Package Outline Unit: mm 64PIN LQFP (PLASTIC) 12.0 0.2 10.0 0.2 48 49 33 32 0.15 0.05 0.1 A 64 17 1 1.25 0.5 + 0.08 0.18 - 0.03 16 1.7 MAX 0.1 M 0.1 0.1 0 to 10 DETAIL A 0.5 0.2 (0.5) PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING 42 ALLOY 0.3g LEAD TREATMENT LEAD MATERIAL PACKAGE MASS SONY CODE EIAJ CODE JEDEC CODE LQFP-64P-L061 LQFP064-P-1010-AY - 45 - Sony Corporation |
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