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NCP5010 500 mW Boost Converter for White LEDs The NCP5010 is a fixed frequency PWM boost converter with integrated rectification optimized for constant current applications such as driving white LEDs. This device features small size, minimal external components and high-efficiency for use in portable applications and is capable of providing up to 500 mW output power to 2-5 series connected white LEDs. A single resistor sets the LED current and the CTRL pin can be pulse width modulated (PWM) to reduce the LED Current. The device can also be configured as a fixed output voltage boost converter for applications such as OLED bias where it is capable of generating voltage up to 20 V. The device includes True-Cutoff circuitry to disconnect the load from the battery when the device is put into standby mode. To protect the device, an output overvoltage protection, and short circuit protection have been incorporated. The NCP5010 is housed in a low profile, space efficient 1.7 x 1.7 mm Flip-Chip package. The device has been optimized for use with small inductors and ceramic capacitors. Features http://onsemi.com MARKING DIAGRAM A1 8-Pin Flip-Chip FC SUFFIX CASE 499AJ DAX G A Y WW DAXG AYWW 1 = Specific Device Code = Pb-Free Package = Assembly Location = Year = Work Week * 2.7 to 5.5 V Input Voltage Range * Efficiency: 84% for 5 LED (VF = 3.5 V by LED) at 30 mA and * * * * * * * * * * * 4.2 V VIN Low Noise 1 MHz PWM DC-DC Converter with Damping Switch Open LED Protection and Short Circuit Protection Serial LEDs Architecture for Uniform Current Matching 1 mA Shutdown Current Facility with True-Cutoff Very Small 8-Pin Flip-Chip 1.7 x 1.7 mm Package This is a Pb-Free Device PIN CONNECTIONS A1 A2 A3 NC B3 FB C2 SW C3 PGND AGND CTRL B1 VIN C1 VOUT Top View Typical Applications ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 16 of this data sheet. White LED Backlighting for Small Color LCD Displays Cellular Phones Digital Cameras MP3 Players High Efficiency Step-up Converter EFFICIENCY (%) 90 80 70 60 50 40 30 20 10 0 1 10 IOUT (mA) VIN = 4.2 V 100 VOUT = 5 LED (18 V) VOUT = 3 LED (11 V) Figure 1. Efficiency vs. Output Current (c) Semiconductor Components Industries, LLC, 2006 1 March, 2006 - Rev. 0 Publication Order Number: NCP5010/D NCP5010 Vbat 2.7 to 5.5 V Cin 4.7 mF 0603 X5R 6.3V C2 B1 L1 22 mH LED ENABLE A2 A3 CTRL AGND NC VOUT PGND C1 Cout 1 mF 0805 X5R 25V LED A1 NCP5010 C3 B3 FB Rfb 24 Figure 2. Typical Application Circuit PIN FUNCTION DESCRIPTION PIN A1 B1 PIN NAME AGND VIN TYPE POWER POWER DESCRIPTION System ground for the analog circuitry. A high quality ground must be provided to avoid spikes and/ or uncontrolled operations. This pin is to be connected to the PGND pin. Power Supply Input. A ceramic capacitor with a minimum value of 1 mF/6.3 V (X5R or X7R) must be connected to this pin. This capacitor should be placed as close as possible to this pin. In addition, one end of the external inductor is to be connected at this point. DC-DC converter output. This pin should be directly connected to the load and a low ESR (<30 mW) 1 mF (min) 25 V bypass capacitor. This capacitor is required to smooth the current flowing into the load, thus limiting the noise created by the fast transients present in this circuit. Since this is a current regulated output, this pin has over voltage protection to protect from open load conditions. Care must be taken to avoid EMI through the PCB copper tracks connected to this pin. An Active High logic level on this pin enables the device. A built-in pulldown resistor disables the device if the pin is left open. This pin can also be used to control the average current into the load by applying a low frequency PWM signal. If a PWM signal is applied, the frequency should be high enough to avoid optical flicker but be no greater than 1 kHz. Power switch connection for inductor. Typical application will use a coil from 10 mH to 22 mH and must be able to handle at least 350 mA. If the desired output power is above 300 mW, the inductor should have a DCR < 1.4 W. Not Connected Feedback voltage input used to close the loop by means of a sense resistor connected between the primary LED branch and the ground. The output current tolerance is depends upon the accuracy of this resistor and a 5% or better accuracy metal film resistor is recommended. An analog dimming signal can be applied to this point to reduce the output current. Please refer to the application section for additional details. Power ground. A high quality ground must be used to avoid spikes and/or uncontrolled operation. Care must be taken to avoid high-density current flow in a limited PCB copper track. This pin is to be connected to the AGND pin. C1 VOUT POWER A2 CTRL INPUT C2 SW POWER A3 B3 NC FB N/A INPUT C3 PGND POWER http://onsemi.com 2 2 to 5 LEDs SW VIN NCP5010 MAXIMUM RATINGS Rating Power Supply Voltage (Note 2) Over Voltage Protection Human Body Model (HBM) ESD Rating (Note 3) Machine Model (MM) ESD Rating (Note 3) Digital Input Voltage Digital Input Current Power Dissipation @ TA = +85 C Thermal Resistance Junction-to-Air 8-Pin Flip-Chip Package Operating Ambient Temperature Range Operating Junction Temperature Range Storage Temperature Range Symbol VIN VOUT ESD HBM ESD MM CTRL PD RqJA (Note 6) TA TJ Tstg -40 to +85 -40 to +125 -65 to +150 C C C Value 7.0 24 2000 200 -0.3 < VIN < Vbat+0.3 1.0 Internally Limited Unit V V V V V mA mW C/W Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = 25C. 2. According to JEDEC standard JESD22-A108B. 3. This device series contains ESD protection and passes the following tests: Human Body Model (HBM) 2.0 kV per JEDEC standard: JESD22-A114 for all pins. Machine Model (MM) 200 V per JEDEC standard: JESD22-A115 for all pins. 4. Latchup Current Maximum Rating: 100 mA per JEDEC standard: JESD78. 5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J-STD-020A. 6. For the 8-Pin Flip-Chip CSP Package, the RqJA is highly dependent on the PCB Heatsink area. For example RqJA can be to 195C/W with 50 mm total area and also 135C/W with 500 mm. All the bumps have the same thermal resistance and need to be connected thereby optimizing the power dissipation. http://onsemi.com 3 NCP5010 ELECTRICAL CHARACTERISTICS (Limits apply for TA between -40C to +85C and VIN = 3.6 V, unless otherwise noted) Pin B1 C2 VIN IPEAK_MAX NMOS RDS(on) FOSC MDUTY EFF C1 C1 C1 OVPON OVPH POUT Symbol Supply Voltage Switch Current Limit Internal Switch On Resistor PWM Oscillator Frequency Maximum Duty Cycle Efficiency (Note 7) Overvoltage Clamp Voltage Overvoltage Clamp Hysteresis Output power (Note 8) VIN = 3.1 V VIN < 3.1 V Minimum Output Current Controlled No Skip Mode (Note 9) Feedback Voltage Threshold in Steady State Overtemperature range At 25C Feedback Voltage Line Regulation (Notes 9 and 10) From DC to 100 Hz VIN Undervoltage Lockout measured at 25C Threshold to Enable the Converter Threshold to Disable the Converter Undervoltage Lockout Hysteresis Short Circuit Output Current Short Circuit Protection Threshold Detected Released Stand by Current, IOUT = 0 mA, CTRL = Low Vbat = 4.2 V Quiescent Current Device Not Switching (BF = VIN) Device Switching (RFB disconnected) Voltage Input Logic Low Voltage Input Logic High CTRL Pin Pulldown Resistance 1.2 175 370 0.4 1.0 0.3 V V kW 35 47 2.2 2.0 475 490 500 300 1.0 mA mV 500 500 0.2 2.4 2.2 200 20 50 67 65 87 2.0 mA mA 525 510 %/V 0.5 V 2.6 2.4 mV mA % of VIN 20 0.8 91 Rating Min 2.7 280 420 0.6 1.0 95 84 22 1.0 Typ Max 5.5 560 1.0 1.2 Unit V mA W MHz % % V V mW C1 B3 IOUT FBV C1 B1 FBVLR UVLO B1 C1 B1 UVLOH IOUTSC SCPT B1 C2 ISTDB IQ A2 A2 A2 VIL VIH RCTRL 7. Efficiency is defined by 100 * (Pout / Pin) at 25C VIN = 4.2 V with L= Coilcraft DT1608C-223 IOUT = 30 mA, Load = 5 LEDs (VF = 3.5 V per LED) bypassed by 1 mF X5R 8. Guaranteed by design and characterized with L = 22 mH, DCR = 0.7 W max. 9. Load = 4 LEDs (VF = 3.5 V by LED), COUT = 1 mF X5R, L= Coilcraft DT1608C-223. 10. VIN = 3.6 V, Ripple = 0.2 V P-P, IOUT = 15 mA. http://onsemi.com 4 NCP5010 TYPICAL OPERATING CHARACTERISTICS Condition: Efficiency = 100 x (Number of LED stacked x VLED x ILED)/PIN 90 90 80 EFFICIENCY (%) VIN = 3.3 V VIN = 4.2 V EFFICIENCY (%) 80 70 VIN = 2.7 V 70 VIN = 2.7 V VIN = 3.3 V VIN = 4.2 V 60 60 50 0 10 20 30 40 50 60 70 IOUT (mA) 50 0 10 20 30 40 IOUT (mA) 50 60 70 Figure 3. Efficiency vs. Current @ 3 LEDS (10.5 V) L = Coilcraft DT1608C-223 90 Figure 4. Efficiency vs. Current @ 3 LEDS (10.5 V) L = TDK VLF4012AT-220 90 80 EFFICIENCY (%) VIN = 2.7 V 70 VIN = 3.3 V VIN = 4.2 V EFFICIENCY (%) 80 70 VIN = 2.7 V VIN = 3.3 V VIN = 4.2 V 60 60 50 0 10 20 30 40 IOUT (mA) 50 60 70 50 0 10 20 30 40 50 60 70 IOUT (mA) Figure 5. Efficiency vs. Current @ 4 LEDS (14 V) L = Coilcraft DT1608C-223 90 Figure 6. Efficiency vs. Current @ 4 LEDS (14 V) L = TDK VLF4012AT-220 90 80 EFFICIENCY (%) VIN = 2.7 V 70 VIN = 3.3 V VIN = 4.2 V EFFICIENCY (%) 80 70 VIN = 2.7 V VIN = 3.3 V VIN = 4.2 V 60 60 50 0 10 20 30 40 50 60 70 IOUT (mA) 50 0 10 20 30 40 50 60 70 IOUT (mA) Figure 7. Efficiency vs. Current @ 5 LEDS (17.5 V) L = Coilcraft DT1608C-223 Figure 8. Efficiency vs. Current @ 5 LEDS (17.5 V) L = TDK VLF4012AT-220 http://onsemi.com 5 NCP5010 TYPICAL OPERATING CHARACTERISTICS Condition: Efficiency = 100 x (Number of LED stacked x VLED x ILED)/PIN 90 IOUT = 33 mA 80 IOUT = 10 mA EFFICIENCY (%) EFFICIENCY (%) 70 60 50 40 30 20 2.5 IOUT = 1 mA IOUT = 23 mA 70 60 50 40 30 20 2.5 IOUT = 1 mA 80 IOUT = 23 mA 90 IOUT = 33 mA IOUT = 10 mA 3.0 3.5 4.0 VIN (V) 4.5 5.0 5.5 3.0 3.5 4.0 VIN (V) 4.5 5.0 5.5 Figure 9. Efficiency vs. VIN @ 3 LEDS (10.5 V) L = Coilcraft DT1608C-223 90 IOUT = 28 mA IOUT = 10 mA IOUT = 23 mA FEEDBACK VOLTAGE (mV) 80 EFFICIENCY (%) 70 60 50 40 30 20 2.5 IOUT = 1 mA 510 Figure 10. Efficiency vs. VIN @ 4 LEDS (14 V) L = Coilcraft DT1608C-223 505 VIN = 3.6 V 500 VIN = 5.5 V VIN = 2.7 V 495 3.0 3.5 4.0 VIN (V) 4.5 5.0 5.5 490 -40 -20 0 20 40 60 80 100 TEMPERATURE (C) Figure 11. Efficiency vs. VIN @ 5 LEDS (17.5 V) L = Coilcraft DT1608C-223 1.04 VIN = 3.6 V FREQUENCY (MHz) VIN = 5.5 V 1.00 NMOS RDS(on) (mW) 1.02 900 800 Figure 12. Feedback Voltage vs. Temperature VIN = 3.6 V 700 600 500 VIN = 5.5 V 400 300 -40 VIN = 2.7 V 0.98 VIN = 2.7 V 0.96 -40 -20 0 20 40 60 80 100 -20 0 20 40 60 80 100 TEMPERATURE (C) TEMPERATURE (C) Figure 13. Oscillator Frequency vs. Temperature Figure 14. NMOS RDS(on) vs. Temperature http://onsemi.com 6 NCP5010 TYPICAL OPERATING CHARACTERISTICS 3 2 IOUT (mA) 3 LEDs 1 4 LEDs 5 LEDs 0 2.5 3.0 3.5 4.0 VIN (V) 4.5 5.0 5.5 Figure 15. Typical Skip Mode Threshold vs. VIN (COUT = 1 mF X5R 25 V) Figure 16. Typical VOUT Ripple in OVP Conditions 1 VOUT, 500 mV/div, AC 3 VOUT, 5 V/div, DC Figure 17. Continuous Current Mode (CCM) 1 SW, 5 V/div DC, 4 ILED, 50 mA/div, DC, IOUT = 15 mA Figure 18. Discontinuous Current Mode (DCM) 1 SW, 5 V/div DC, 4 ILED, 50 mA/div, DC, IOUT = 1 mA Figure 19. Startup for LED Operating, 4 LEDS RBF = 22 W, 1 CTRL, 2 V/div DC, 2 FB, 500 mV/div DC, 4 IL 100 mA/div, T = 100 ms/div http://onsemi.com 7 Figure 20. Duty Cycle Control Waveforms 1 CTRL, 2 V/div DC, 2 FB, 500 mV/div DC, 4 IL 100 mA/div, T = 1 ms/div NCP5010 TYPICAL OPERATING CHARACTERISTICS Figure 21. Typical Ripple for Voltage Operation 1 SW, 10 V/div DC, 2 FB, 500 mV/div DC, 3 VOUT 20 mV/div AC, T = 500 ns/div http://onsemi.com 8 NCP5010 DETAIL OPERATING DESCRIPTION VBat 2.7 to 5.5 V Cin 1 mF, 6.3 V X5R 0603 A1 L VIN B1 22 mH C2 SW AGND - UVLO REF + UVLO COMP UVLO MAX DUTY CYCLE COMP - MAX D + - PWM COMP + CTRL OVP COMP OVP + - M DUTY REF THERMAL PROTECTION OVP REF DAMP VOUT C1 FB B3 FB REF - ERROR AMP + SC DRIVER DRIVER RAMP COMP SET SHORT CIRCUIT PROTECTION ONE SHOT CLOCK OSC 1 Mhz IPEAK MAX 250 k A2 + IPEAK COMP - SENSE CURRENT VIN RFB IPEAK MAX CTRL PGND C3 Figure 22. Functional Block Diagram Operation The NCP5010 DC-DC converter is based on a Current Mode PWM architecture which regulates the feedback voltage at 500 mV under normal operating conditions. The boost converter operates in two separate phases (See Figure 23). The first one is TON when the inductor is charged by current from the battery to store up energy, followed by TOFF step where the power is transmitted through the internal rectifier to the load. The capacitor COUT is used to store energy during the TOFF time and to supply current to the load during the TON stage thus constantly powering the load. Start Cycle SW 1 MHz IL Ton Toff Ipeak Ivalley ISW Iout The internal oscillator provides a 1 MHz clock signal to trigger the PWM controller on each rising edge (SET signal) which starts a cycle. During this phase the low side NMOS switch is turned on thus increasing the current through the inductor. The switch current is measured by the SENSE CURRENT and added to the RAMP COMP signal. Then PWM COMP compares the output of the adder and the signal from ERROR AMP. When the comparator threshold is exceeded, the NMOS switch is turned off until the rising edge of the next clock cycle. In addition, there are six functions which can reset the flip-flop logic to switch off the NMOS. The MAX DUTY CYCLE COMP monitors the pulse width and if it exceeds 95% (nom) of the cycle time the switch will be turned off. This limits the switch from being on for more than one cycle. Due to IPEAK COMP, the current through the inductor is monitored and compared with the IPEAK_MAX threshold set at 440 mA (nom). If the current exceeds this value, the controller is will turn off the NMOS switch for the remainder of the cycle. This is a safety function to prevent any excessive current that could overload the inductor and the power stage. The four other safety circuits are SHORT CIRCUIT PROTECTION, OVP, UVLO, and THERMAL PROTECTION. Please refer to the detail in following sections. The loop stability is compensated by the ERROR AMP built in integrator. The gain and the loop bandwidth are fixed internally and provides a phase margin greater than 45 whatever the current supplied. Figure 23. Basic DC-DC Operation http://onsemi.com 9 Up to 22 V RST Cout 1 mF 25 V X5R 0805 NMOS NCP5010 LED Current Selection 300 250 IPEAK (mA) 200 150 100 50 10 L = 15 mH L = 22 mH 20 30 40 50 60 V IN = 3.1 V V IN = 4.2 V 70 80 L = 10 mH The feedback resistor (RFB) determines the average maximum current through the LED string. The control loop regulated the current such that the average voltage at the FB input is 500 mV (nom). For example, should one need a 20 mA output current in the primary branch, RFB should be selected according to the following equation: F RFB + BV + 500 mV + 25 W IOUT 20 mA IPEAK (mA) In white LED applications it is desirable to operate the LEDs at a specific operating current as the color will shift as the bias current is changed. As a result of this effect, it is recommended to dim the LED string by a pulse width modulation techniques. A low frequency PWM signal can be applied to the CTRL input and by varying the duty cycle the brightness of the LED can be changed. To avoid any optical flicker, the frequency must be higher than 100 Hz and preferably less than 1 kHz. Due to the soft-start function set at 600 ms (nom) with higher frequency the device remains active but the brightness can decrease. Nevertheless in this case, a dimming control using a filtered PWM signal (See Figure 33) can be used. Also for DC voltage control the same technique is suitable and the filter is takes away. Inductor Selection IOUT (mA) Figure 24. Peak Inductor Currents vs. IOUT (mA) @ 3 LEDs, 10.5 V 300 L = 10 mH 250 200 150 L = 15 mH 100 50 10 L = 22 mH 20 30 40 50 IOUT (mA) 60 V IN = 3.1 V V IN = 4.2 V 70 80 To choose the inductor there are three different electrical parameters that need to be considered, the absolute value of the inductor, the saturation current and the DCR. In normal operation, this device is intended to operate in Continuous Conduction Mode (CCM) so the following equation below can be used to calculate the peak current: I VD IPEAK + OUT ) IN 2LF h(1 * D) Figure 25. Peak Inductor Currents vs. IOUT (mA) @ 4 LEDs, 14 V 300 250 IPEAK (mA) 200 150 100 50 10 In the equation above, VIN is the battery voltage, IOUT is the load current, L the inductor value, F the switching frequency, and the duty cycle D is given by: D + 1 * VIN VOUT h is the global converter efficiency which can vary with load current (see Figure 3 thru Figure 8). A good approximation is to use h = 0.8. Figure 24 - Figure 26 are a graphical representation of the above equations, as a function of the desired IOUT, VIN, and number of LEDs in series (VF = 3.5 V nominal). The curves are limited to an IPEAK_MAX of 300 mA. It is important to analyze this at worst case Vf conditions to ensure that the inductor current rated is high enough such that it not saturate. The recommended inductor value should range between 10 mH and 22 mH. As can be seen from the curves, as the inductor size is reduced, the peak current for a given set of conditions increases along with higher current ripple so it is not possible to deliver maximum output power at lower inductor values. L = 10 mH L = 15 mH L = 22 mH V IN = 3.1 V V IN = 4.2 V 40 50 60 70 80 20 30 IOUT (mA) Figure 26. Peak Inductor Currents vs. IOUT (mA) @ 5 LEDs, 17.5 V http://onsemi.com 10 NCP5010 Finally an acceptable DCR must be selected regarding losses in the coil and must be lower than 1.4 W to limit excessive voltage drop. In addition, as DCR is reduced, overall efficiency will improve. Some recommended inductors include but are not limited to: TDK VLF4012AT-220MR51 TDK VLP4612T-220MR34 TDK VLP5610T-220MR45 Coilcraft LPO6610-223M Coilcraft DO1605T-223MX Coilcraft DT1608C-223 Capacitor Selection Short-Circuit Protection If VOUT is falls below 50% of VIN then a short-circuit condition is detected. When this event is detected, the PWM circuitry is disabled and the NMOS power switch is not turned on. Power will be supplied to the load through the inductor, rectifier and high side switch. Once VOUT reaches 66% of VIN, then the PWM circuitry is enabled. In normal conditions when the device is enabled by an active high signal on CTRL, the short circuit condition continues until the output capacitor is charged by the limited current up to 66% of VIN. To minimize the output ripple, a low ESR multi-layer ceramic capacitor type X5R or equivalent should be selected. For LED driver applications a 1 mF (min) 25 V is adequate. The NCP5010 can be operated in a voltage mode configuration (see Figure 34) for applications such as OLED power. Under these conditions, COUT can be increased to 2.2 mF, 25 V or more to reduce the output ripple. The input needs to be bypassed by a X5R or an equivalent low ESR ceramic capacitor near the VIN pin. A 1 mF, 6.3 V is enough for most applications. However, if the connection between VIN and the battery is too long then a 4.7 mF or higher ceramic capacitor may be needed. Some recommended capacitors include but are not limited to: TDK C1608X5R1E105MT TDK C2012X5R1E105MT TDK C1608X5R0J105MT TDK C2012X5R1E225MT Murata GRM185R61A105KE36D Murata GRM188R60J475KE19D Murata GRM216R61E105KA12D Damping Switch VOUT 2/3 VIN 1/2 VIN Normal Running SC Short-Circuit Condition End of Short-Circuit Occurs Current limited at 20mA Detected Converter Converter in Standby Starts Again T Figure 27. Example of the VOUT Voltage Behavior When Short-Circuit Arises Overvoltage Protection (OVP) If the NCP5010 supplies a very light load (< 1 mA), the converter switches enters a Discontinuous Conduction Mode (DCM) and the current through the inductor is no longer continuous (see Figure 18). The converter has a RingKiller circuit which detects entry into DCM mode and turns on the damping switch until the next clock cycle thus minimizing stray oscillations and EMI generation. If there is an open load condition such as a loose connection to the White LED string, the converter will provide current to the Cout capacitor and the voltage at the output will rise rapidly. This could cause damage to the part if there was not some external clamping Zener clamping circuit. To eliminate the need for these external components, the NCP5010 incorporates an OVP circuit which monitors the output voltage with a resistive divider network and a comparator and voltage reference. If the output reaches 22 V (nominal), the OVP circuit will detect a fault and inhibit PWM operation. This comparator has 1 V of hysteresis so when the load is reconnected and the voltage drops below 21 V, the PWM operation will resume automatically. The 22 V OVP threshold allows the use of 25 V ceramic capacitors for the output filter capacitor. Undervoltage Lock Out (UVLO) To ensure proper operation under all conditions, the device has a built-in undervoltage lock out (UVLO) circuit. During power-up, the device will remain disabled until the input voltage exceeds 2.4 V nominal. This circuit has 200 mV of hysteresis to provide noise immunity to transient conditions. http://onsemi.com 11 NCP5010 Layout Recommendations As with all switching DC/DC converter, care must be observed to the PCB board layout and component placement. To prevent electromagnetic interference (EMI) problems and reduce voltage ripple of the device any copper trace which see high frequency switching path should be optimized. So the input and output bypass ceramic capacitor, CIN and COUT as depicted Figure 2 must be placed as close as possible the NCP5010 and connected directly between pins and ground plane. In additional, the track connection between the inductor and the switching input, SW pin must be minimized to reduce EMI radiation. Finally it is always good practice to keep way sensitive tracks such as feedback connection from switched signal like SW or VOUT connections. Figure 28 shown an example of optimized PCB layout. Figure 28. Recommended PCB Layout http://onsemi.com 12 NCP5010 TYPICAL APPLICATION CIRCUITS Basic Feedback Figure 29 is a basic application where a regulated courant is drive in a string of LEDs. A 20.8 mA current is fixed by R1 and LEDs are dim with PWM apply on CTRL pin. VBat 2.7 to 5.5 V L1 22 mH Cin 4.7 mF 0603 X5R 6.3 V A2 LED C2 1 mF 0805 X5R 25 V PWM CTRL AGND VOUT PGND FB C1 LED L1: C1: C2: TDK VLF4012AT-220MR51 TDK C1608X5R0J475MT TDK C2012X5R1E105MT A1 NCP5010 C3 B3 R1 24 Figure 29. Typical Semi-Pulsed Mode of Operation Different Supply The NCP5010 can operate from two different supply: One end of the inductor (VBAT) can be directly connected to a battery like 4 cell alkaline or 2 cell Li-Ion. And VIN pin VBat Vin 2.7 to 5.5 V need a power delivered for example from an LDO. Care must be observed to have always VBAT above VIN and minimum output voltage range will be VBAT voltage. 2 to 5 LEDs VIN SW C2 B1 L1 22 mH LED C2 1 mF 0805 X5R 25 V ENABLE A2 CTRL AGND VOUT PGND FB C1 LED L1: C1: C2: TDK VLF4012AT-220MR51 TDK C1608X5R0J475MT TDK C2012X5R1E105MT A1 NCP5010 C3 B3 R1 24 Figure 30. Operate from Different Supply http://onsemi.com 13 2 to 5 LEDs VIN SW C2 B1 Cin 4.7 mF 0603 X5R 6.3 V NCP5010 Multiple LEDs String Since the output voltage in limited at 22 V (nom.), one can arrange the LEDs in 2 or more string. Figure 31 shows VBat 2.7 to 5.5 V L1 22 mH C2 two LEDs branches where the constant current is regulated in primary branch and the secondary branch is selected by Q1. The number of LED in each string have to be the same. LED LED X5R 6.3 V C1 4.7 mF 0603 X5R 6.3 V A2 C2 1 mF 0805 X5R 25 V ENABLE CTRL AGND VOUT PGND FB C1 LED 2 to 5 LEDs B1 VIN SW LED L1: C1: C2: TDK VLF4012AT-220MR51 TDK C1608X5R0J475MT TDK C2012X5R1E105MT A1 NCP5010 C3 B3 R1 24 PRIMARY BRANCH ENABLE SECONDARY BRANCH R2 24 Q1 N Figure 31. Multiple LED String Application Matched LEDs Branches Should one need to control precisely the current in two LEDs branches the schematic Figure 32 can be used. An dual NPN BC847BD is used to form a current mirror Q1 VBat 2.7 to 5.5 V L1 22 mH C2 LED like this the current in the secondary branch I2 equal the current in primary branch I1. Thank to this current mirror the number of LEDs in secondary branch could be lower or equal than primary one. LED X5R 6.3 V C1 4.7 mF 0603 X5R 6.3 V A2 C2 1 mF 0805 X5R 25 V ENABLE CTRL AGND VOUT PGND FB C1 LED I1 2 to 5 LEDs B1 VIN SW LED I2 Q1 Q1: L1: C1: C2: ON SEMICONDUCTOR BC847BDW1T1 TDK VLF4012AT-220MR51 TDK C1608X5R0J475MT TDK C2012X5R1E105MT NPN Duals A1 NCP5010 C3 B3 R1 24 R2 24 Figure 32. Matched 2 Branches of LEDs http://onsemi.com 14 NCP5010 Analog Dimming Control When the NCP5010 is in steady state the output voltage is controlled in order to have 500 mV to the feedback input (FB pin). The principle of this schematic is bias by a resistive network R2/R3 the feedback voltage. If not any VBat 2.7 to 5.5 V L1 22 mH C1 4.7 mF 0603 X5R 6.3 V A2 signal is put from outside to R2 there is no voltage drop across R3 and IOUT = VFB/R4. When the voltage put to R2 is increasing the loop balance output voltage to get always 500 mV to FB pin. Thereby voltage across R4 decreases like this the current in the string of LEDs. LED C2 1 mF 0805 X5R 25 V ENABLE CTRL AGND VOUT PGND FB C1 R3 18 k R2 100 k LED A1 C3 B3 NCP5010 R1 10 k PWM SIGNAL R4 24 L1: C1: C2: C3: DC VOLTAGE TDK VLF4012AT-220MR51 TDK C1608X5R0J475MT TDK C2012X5R1E105MT Standard Capacitor C3 470 nF Average Network Select Figure 33. Dimming Control Using a Filtered PWM Signal or a DC Voltage DC/DC Boost Application The NCP5010 can be used as DC/DC Boost converter to deliver constant voltage to powering load like OLED or VBat 2.7 to 5.5 V L1 22 mH C2 B1 LCD biasing. An external resistive network is connected to sense the output voltage and close the loop. Vout + 0.5 R1 ) R2 R1 C1 4.7 mF 0603 X5R 6.3 V VIN SW ENABLE A2 CTRL AGND VOUT PGND FB C1 R 290 k 15 V / 35 mA C2 2.2 mF 0805 X5R 25 V L1: C1: C2: TDK VLF4012AT-220MR51 TDK C1608X5R0J475MT TDK C2012X5R1E225MT A1 NCP5010 C3 B3 R 10 k Figure 34. OLED or LCD Bias Supply http://onsemi.com 15 2 to 5 LEDs VIN SW C2 B1 NCP5010 ORDERING INFORMATION Device NCP5010FCT1G Marking DAX Operating Temperature Range -40C to +85C Package 8-Pin Flip-Chip CSP (Pb-Free) Shipping 3000 Tape and Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Two type of demo boards available: * The NCP5010EVB board which configures the device driving a string of 2-5 White LEDs in series. * The NCP5010BIASEVB board for applications such as powering an OLED panel or LCD biasing. Finally in addition to these demo boards, Application Note "ANDXXXX/D" deals with configuring the NCP5010 with a high side sense resistor. http://onsemi.com 16 NCP5010 PACKAGE DIMENSIONS 8-PIN FLIP-CHIP FC SUFFIX CASE 499AJ-01 ISSUE A -A- D -B- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX 0.6 BSC 0.210 0.270 0.330 0.390 1.70 BSC 1.70 BSC 0.290 0.340 0.500 BSC 1.000 BSC 1.000 BSC 4X 0.10 C PIN 1 INDICATOR E DIM A A1 A2 D E b e D1 E1 0.10 C 0.05 C -C- SEATING PLANE TOP VIEW A A2 A1 SIDE VIEW D1 e C B SOLDERING FOOTPRINT 0.50 0.0197 DIE SIZE MAY VARY 8X b e A 1 2 3 E1 0.50 0.0197 0.05 C A B 0.03 C BOTTOM VIEW 0.265 0.01 SCALE 20:1 mm inches http://onsemi.com 17 NCP5010 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 18 NCP5010/D |
Price & Availability of NCP5010
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