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HUF76131SK8
TM
Data Sheet
June 2000
File Number
4396.5
10A, 30V, 0.013 Ohm, N-Channel, Logic Level UltraFET Power MOSFET
This N-Channel power MOSFET is (R) manufactured using the innovative UltraFET process. This advanced process technology achieves the lowest possible on-resistance per silicon area, resulting in outstanding performance. This device is capable of withstanding high energy in the avalanche mode and the diode exhibits very low reverse recovery time and stored charge. It was designed for use in applications where power efficiency is important, such as switching regulators, switching converters, motor drivers, relay drivers, lowvoltage bus switches, and power management in portable and battery-operated products. Formerly developmental type TA76131.
Features
* Logic Level Gate Drive * 10A, 30V * Ultra Low On-Resistance, rDS(ON) = 0.013 * Temperature Compensating PSPICE(R) Model * Thermal Impedance SPICE Model * Peak Current vs Pulse Width Curve * UIS Rating Curve * Related Literature - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards"
Symbol
SOURCE(1) DRAIN(8)
Ordering Information
PART NUMBER HUF76131SK8 PACKAGE MS-012AA BRAND 76131SK8
SOURCE(2)
DRAIN(7)
NOTE: When ordering, use the entire part number. Add the suffix T to obtain the variant in tape and reel, e.g., HUF76131SK8T.
SOURCE(3) DRAIN(6)
GATE(4)
DRAIN(5)
Packaging
JEDEC MS-012AA
BRANDING DASH
5 1 2 3 4
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures. UltraFET(R) is a registered trademark of Intersil Corporation. PSPICE(R) is a registered trademark of MicroSim Corporation. 1-888-INTERSIL or 321-724-7143 | Copyright (c) Intersil Corporation 2000.
HUF76131SK8
Absolute Maximum Ratings
TA = 25oC, Unless Otherwise Specified HUF76131SK8 30 30 16 10 Figure 5 Figure 6 2.5 0.02 -55 to 150 300 260 UNITS V V V A
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Drain Current Continuous (Figure 2) (Notes 2, 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM Pulsed Avalanche Rating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
W W/oC oC
oC oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 1. TJ = 25oC to 150oC.
Electrical Specifications
PARAMETER
TA = 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IDSS IGSS rDS(ON) TEST CONDITIONS ID = 250A, VGS = 0V (Figure 11) VGS = VDS, ID = 250A (Figure 10) VDS = 25V, VGS = 0V VDS = 25V, VGS = 0V, TA = 150oC VGS = 16V ID = 10A, VGS = 4.5V (Figures 9,14) ID = 10A, VGS = 5V ID = 10A, VGS = 10V MIN 30 1 VGS = 0V to 10V VDD = 15V, ID 10A, VGS = 0V to 5V RL = 1.5, Ig(REF) = 1.0mA (Figure 13) VGS = 0V to 1V VDS = 25V, VGS = 0V, f = 1MHz (Figure 12) Pad Area = 0.76 in2 (Note 2) Pad Area = 0.054 in2 (See TB377) Pad Area = 0.0115 in2 (See TB377) TYP 0.017 0.015 0.011 15 61 33 36 39 22 1.53 4.00 9.50 1605 685 115 MAX 1 250 100 0.018 0.017 0.013 115 105 47 26 1.85 50 143.4 177.3 UNITS V V A A nA ns ns ns ns ns ns nC nC nC nC nC pF pF pF
oC/W oC/W oC/W
Drain to Source Breakdown Voltage Gate to Source Threshold Voltage Zero Gate Voltage Drain Current Gate to Source Leakage Current Drain to Source On Resistance
Turn-On Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-Off Time Total Gate Charge Gate Charge at 5V Threshold Gate Charge Gate to Source Gate Charge Gate to Drain "Miller" Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Thermal Resistance Junction to Ambient
tON td(ON) tr td(OFF) tf tOFF Qg(TOT) Qg(5) Qg(TH) Qgs Qgd CISS COSS CRSS RJA
VDD = 15V, ID 10A, RL = 1.5, VGS = 5V, RGS = 6.8 (Figure 15)
Source to Drain Diode Specifications
PARAMETER Source to Drain Diode Voltage Reverse Recovery Time Reverse Recovered Charge NOTES: 2. 50oC/W measured using FR-4 board with 0.76 in2 footprint at 10 seconds. 3. 177.3oC/W measured using FR-4 board with 0.0115 in2 footprint at 1000 seconds. SYMBOL VSD trr QRR ISD = 10A ISD = 2.3A ISD = 2.3A, dISD/dt = 100A/s ISD = 2.3A, dISD/dt = 100A/s TEST CONDITIONS MIN TYP MAX 1.25 1.1 57 81 UNITS V V ns nC
2
HUF76131SK8 Typical Performance Curves
1.2 POWER DISSIPATION MULTIPLIER 1.0 0.8 0.6 0.4 0.2 0 0 25 50 75 100 125 150 TA , AMBIENT TEMPERATURE (oC) ID, DRAIN CURRENT (A) 12 10 8 6 4 2 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs AMBIENT TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs AMBIENT TEMPERATURE
10
THERMAL IMPEDANCE
ZJA, NORMALIZED
1
DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM
0.1
t1 0.01 t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA 10-2 10-1 100 101 102 103
SINGLE PULSE 0.001 10-5 10-4 10-3
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
500
TJ = MAX RATED TA = 25oC
1000
TRANSCONDUCTANCE MAY LIMIT CURRENT IN THIS REGION
100 100s
IDM, PEAK CURRENT (A)
ID, DRAIN CURRENT (A)
100
VGS = 5V
10
OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON)
1ms
10
FOR TEMPERATURES ABOVE 25oC DERATE PEAK CURRENT AS FOLLOWS: I = I25 150 - TA 125 TA = 25oC 10-1 t, PULSE WIDTH (s) 10-2 100 101
10ms VDSS(MAX) = 30V 1 1 10 VDS , DRAIN TO SOURCE VOLTAGE (V) 100
1 10-5
10-4
10-3
FIGURE 4. FORWARD BIAS SAFE OPERATING AREA
FIGURE 5. PEAK CURRENT CAPABILITY
3
HUF76131SK8 Typical Performance Curves
100 IAS, AVALANCHE CURRENT (A) If R = 0 tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD) If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1] ID, DRAIN CURRENT (A)
(Continued)
50 VGS = 10V VGS = 5V VGS = 4.5V VGS = 4V VGS = 3.5V
40
10 STARTING TJ = 150oC
STARTING TJ = 25oC
30
20
VGS = 3V
10
1 0.1
1
10
100
0 0
PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX TA = 25oC 0.5 1.0 1.5 2.0 VDS, DRAIN TO SOURCE VOLTAGE (V) 2.5
tAV, TIME IN AVALANCHE (ms)
NOTE: Refer to Intersil Application Notes AN9321 and AN9322. FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY
50 NORMALIZED DRAIN TO SOURCE ON RESISTANCE PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX ID, DRAIN CURRENT (A) 40
FIGURE 7. SATURATION CHARACTERISTICS
1.75 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX VGS = 10V, ID = 10A 1.5
30
1.25
20
1.0
10
150oC 25oC -55oC VDD = 15V 3.5 4.0
0 0 0.5
1.0 1.5 2.0 2.5 3.0 VGS, GATE TO SOURCE VOLTAGE (V)
0.75 -80
-40
0
40
80
120
160
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 8. TRANSFER CHARACTERISTICS
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE
1.2 VGS = VDS, ID = 250A NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE
1.2 ID = 250A
NORMALIZED GATE THRESHOLD VOLTAGE
1.0
1.1
0.8
1.0
0.6
0.9
0.4 -80
-40
0 40 80 120 TJ, JUNCTION TEMPERATURE (oC)
160
0.8 -80
-40
0 40 80 120 TJ , JUNCTION TEMPERATURE (oC)
160
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN VOLTAGE vs JUNCTION TEMPERATURE
4
HUF76131SK8 Typical Performance Curves
2500 VGS , GATE TO SOURCE VOLTAGE (V) VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS = CDS + CGD
(Continued)
10
C, CAPACITANCE (pF)
2000 CISS 1500
8
6
1000 COSS 500 CRSS 0 0 5 10 15 20 25 VDS , DRAIN TO SOURCE VOLTAGE (V) 30
4
2 VDD = 15V 0 0 10
WAVEFORMS IN DESCENDING ORDER: ID = 20A ID = 10A ID = 5A ID = 2.5A 40 50
30 20 Qg, GATE CHARGE (nC)
NOTE: Refer to Intersil Application Notes 7254 and 7260. FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT
80 rDS(ON), ON-STATE RESISTANCE (m)
200 VDD = 15V, ID = 10A, RL= 1.5
60 ID = 5A
SWITCHING TIME (ns)
ID = 10A ID = 20A
150 tr td(OFF) 100 tf
40
ID = 2.5A
20 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX 0 0 2 6 8 4 VGS, GATE TO SOURCE VOLTAGE (V) 10
50
td(ON)
0
0
10 20 30 40 RGS, GATE TO SOURCE RESISTANCE ()
50
FIGURE 14. DRAIN TO SOURCE ON RESISTANCE vs GATE VOLTAGE AND DRAIN CURRENT
FIGURE 15. SWITCHING TIME vs GATE RESISTANCE
Test Circuits and Waveforms
VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD
+
0V
IAS 0.01
0 tAV
FIGURE 16. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 17. UNCLAMPED ENERGY WAVEFORMS
5
HUF76131SK8 Test Circuits and Waveforms
VDS
(Continued)
tON td(ON) RL VDS
+
tOFF td(OFF) tr tf 90%
90%
VGS
DUT RGS
VDD 0
10% 90%
10%
VGS VGS 0 10%
50% PULSE WIDTH
50%
FIGURE 18. SWITCHING TIME TEST CIRCUIT
VDS RL VDD
FIGURE 19. SWITCHING TIME WAVEFORM
Qg(TOT) VDS VGS = 10V
VGS
+
Qg(5) VDD VGS VGS = 1V 0 Qg(TH) Ig(REF) 0 VGS = 5V
DUT Ig(REF)
FIGURE 20. GATE CHARGE TEST CIRCUIT
FIGURE 21. GATE CHARGE WAVEFORMS
6
HUF76131SK8 Thermal Resistance vs Mounting Pad Area
The maximum rated junction temperature TJMAX constrains the maximum allowable device power dissipation PDmax in an application. The application ambient temperature TA (oC) and thermal impedance ZJA (oC/W) must be reviewed to ensure that TJMAX (oC) is never exceeded. Equation 1 mathematically represents the relationship.
( T JMAX - T A ) P DMAX = --------------------------------------Z JA
Thermal resistance values corresponding to other component side copper areas can be obtained from Figure 22 or by calculation using Equation 2. Area in Equation 2 is the top copper area including the gate and source pads.
R JA = 79.3 - 21.8 x ln ( Area ) (EQ. 2)
250
(EQ. 1)
200 RJA (oC/W)
RJA = 79.3 - 21.8*ln(AREA)
Intersil provides thermal information to assist the designer's preliminary application evaluation. Precise determination of PDMAX is complex and influenced by many factors: 1. PC heat sink area and location (top and bottom), copper leads and mounting pad area. 2. Air Flow, board orientation and type. 3. Power pulse width and duty factor. Figure 22 addresses these points by depicting RJA values vs. top copper (component side) heat sink area. The measurements were performed in still air using a horizontally positioned FR-4 board with 1oz copper after 1000 seconds of steady state power. Figure 22 also displays the two RJA values listed in the Electrical Specifications table. The two points were chosen to graphically depict the compromise between copper board area, thermal resistance and ultimately power dissipation.
177.3oC/W - 0.0115in2 143.4oC/W - 0.054in2 150
100
50 0.001
0.01 0.1 AREA, TOP COPPER AREA (in2)
1.0
IGURE 22. THERMAL RESISTANCE vs MOUNTING PAD AREA
Figure 22 provides the necessary information for steady state junction temperature or power dissipation calculations. Transient pulse applications are best studied using the Intersil device SPICE thermal model.
7
HUF76131SK8 PSPICE Electrical Model
SUBCKT HUF76131 2 1 3 ;
CA 12 8 2.22-9 CB 15 14 2.13e-9 CIN 6 8 1.52e-9
10
rev 12/31/97
LDRAIN DPLCAP 5 RLDRAIN DBREAK 11 + 17 EBREAK 18 DRAIN 2 RSLC1 51 ESLC 50
RSLC2
5 51
EBREAK 11 7 17 18 37.4 EDS 14 8 5 8 1 EGS 13 8 6 8 1 ESG 6 10 6 8 1 EVTHRES 6 21 19 8 1 EVTEMP 20 6 18 22 1 IT 8 17 1 LDRAIN 2 5 1e-9 LGATE 1 9 1.04e-9 LSOURCE 3 7 1.29e-10 MMED 16 6 8 8 MMEDMOD MSTRO 16 6 8 8 MSTROMOD MWEAK 16 21 8 8 MWEAKMOD RBREAK 17 18 RBREAKMOD 1 RDRAIN 50 16 RDRAINMOD 1.94e-3 RGATE 9 20 2.20 RLDRAIN 2 5 10 RLGATE 1 9 10.4 RLSOURCE 3 7 1.29 RSLC1 5 51 RSLCMOD 1e-6 RSLC2 5 50 1e3 RSOURCE 8 7 RSOURCEMOD 8.75e-3 RVTHRES 22 8 RVTHRESMOD 1 RVTEMP 18 19 RVTEMPMOD 1 S1A S1B S2A S2B 6 12 13 8 S1AMOD 13 12 13 8 S1BMOD 6 15 14 13 S2AMOD 13 15 14 13 S2BMOD
GATE 1
ESG + LGATE EVTEMP RGATE + 18 22 9 20 6 8 EVTHRES + 19 8 6
RLGATE CIN
MSTRO LSOURCE 8 RSOURCE RLSOURCE 7 SOURCE 3
S1A 12 S1B CA 13 + EGS 6 8 13 8
S2A 14 13 S2B CB + EDS 5 8 14 IT 15 17
-
-
VBAT 22 19 DC 1 ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*275),3))} .MODEL DBODYMOD D (IS = 2.25e-12 RS = 6.05e-3 IKF=16.00 TRS1 = 1.14e-4 TRS2 = 1.23e-6 CJO = 2.35e-9 TT = 2.71e-8 M = 0.44) .MODEL DBREAKMOD D (RS = 1.05e-1 TRS1 = 1.01e-4 TRS2 = 1.11e-7) .MODEL DPLCAPMOD D (CJO = 1.08e-9 IS = 1e-30 N = 10 M = 0.69) .MODEL MMEDMOD NMOS (VTO = 1.89 KP = 5.05 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 2.20) .MODEL MSTROMOD NMOS (VTO = 2.22 KP = 125.00 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u) .MODEL MWEAKMOD NMOS (VTO = 1.62 KP = 0.10 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 22.0 RS = 0.1) .MODEL RBREAKMOD RES (TC1 = 9.54e-4 TC2 = 1.07e-7) .MODEL RDRAINMOD RES (TC1 = 1.61e-2 TC2 = 5.17e-5) .MODEL RSLCMOD RES (TC1 = 1.03e-5 TC2 = 7.67e-7) .MODEL RSOURCEMOD RES (TC1 = 0 TC2 = 0) .MODEL RVTHRESMOD RES (TC = -2.81e-3 TC2 = -8.75e-6) .MODEL RVTEMPMOD RES (TC1 = -6.68e-4 TC2 = 8.80e-7) .MODEL S1AMOD VSWITCH (RON = 1e-5 .MODEL S1BMOD VSWITCH (RON = 1e-5 .MODEL S2AMOD VSWITCH (RON = 1e-5 .MODEL S2BMOD VSWITCH (RON = 1e-5 .ENDS ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 ROFF = 0.1 VON = -5.80 VOFF= -1.50) VON = -1.50 VOFF= -5.80) VON = -0.50 VOFF= -0.00) VON = 0.00 VOFF= -0.50)
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
8
+
DBODY 7 5 DBODYMOD DBREAK 5 11 DBREAKMOD DPLCAP 10 5 DPLCAPMOD
-
RDRAIN 21 16
DBODY
MWEAK MMED
RBREAK 18 RVTEMP 19
VBAT +
8 22 RVTHRES
HUF76131SK8 SPICE Thermal Model
REV 20 Feb 98 HUF76131 CTHERM1 7 6 3.75e-4 CTHERM2 6 5 3.05e-3 CTHERM3 5 4 3.70e-2 CTHERM4 4 3 2.52e-2 CTHERM5 3 2 8.50e-2 CTHERM6 2 1 7.95e-1 RTHERM1 7 6 3.95e-2 RTHERM2 6 5 2.50e-1 RTHERM3 5 4 4.00e-1 RTHERM4 4 3 6.35 RTHERM5 3 2 2.02e1 RTHERM6 2 1 4.80e1
RTHERM1 CTHERM1 7 JUNCTION
6
RTHERM2
CTHERM2
5
RTHERM3
CTHERM3
4
RTHERM4
CTHERM4
3
RTHERM5
CTHERM5
2
RTHERM6
CTHERM6
1
CASE
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com 9
HUF76131SK8 MS-012AA
8 LEAD JEDEC MS-012AA SMALL OUTLINE PLASTIC PACKAGE
E E1 1 e 2 A A1
INCHES SYMBOL A A1 b c MIN 0.0532 0.004 0.013 0.0075 0.189 0.2284 0.1497 MAX 0.0688 0.0098 0.020 0.0098 0.1968 0.244 0.1574
MILLIMETERS MIN 1.35 0.10 0.33 0.19 4.80 5.80 3.80 MAX 1.75 0.25 0.51 0.25 5.00 6.20 4.00 NOTES 2 3 4
D 6
D
b
E E1 e H
5
h x 45o
0.050 BSC 0.0099 0.016 0.0196 0.050
1.27 BSC 0.25 0.40 0.50 1.27
c
L
L 0.060 1.52 0o-8o
0.004 IN 0.10 mm
0.050 1.27 0.024 0.6
0.155 4.0 0.275 7.0 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE-MOUNTED APPLICATIONS
NOTES: 1. All dimensions are within allowable dimensions of Rev. C of JEDEC MS-012AA outline dated 5-90. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.006 inches (0.15mm) per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.010 inches (0.25mm) per side. 4. "L" is the length of terminal for soldering. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. Controlling dimension: Millimeter. 7. Revision 8 dated 5-99.
1.5mm DIA. HOLE
4.0mm USER DIRECTION OF FEED 2.0mm 1.75mm C L
MS-012AA
12mm TAPE AND REEL
12mm
8.0mm
40mm MIN. ACCESS HOLE 18.4mm COVER TAPE 13mm 330mm 50mm
GENERAL INFORMATION 1. 2500 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
12.4mm
10

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