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5-Bit GaAs Digital Attenuator DC - 2 GHz
Features
q q
MADA2030G
V 2.00
q
Attenuation 0.5-dB Steps to 15.5 dB Temperature Stability 0.1 dB from -55 to +85C Typical Fast Switching Speed, 3 ns Typical to 90%
Guaranteed Specifications (From -55C to +85C)
Frequency Range Nominal Attenuation Attenuation Accuracy 0.15 dB DC - 2.0 GHz 0.5 dB Steps to 15.5 dB Max 3% of Attenuation Setting 1.6:1 Max 2.3 dB Max 1.9 dB Max
Typical Performance
VSWR Worst Case Setting Reference Insertion Loss
DC - 2 GHz DC - 2 GHz DC - 1 GHz
Operating Characteristics
Impedance 50 Nominal Phase Balance (For any bit or combinations of bits per unit) 2 GHz +4/-6 Degrees Typ 1 GHz +2/-3 Degrees Typ 500 MHz +1/-2 Degrees Typ Switching Characteristics Switching Time (50% CTL to 90/10% RF) Switching Transients (Unfiltered) Input Power for 1 dB Compression Above 500 MHz 100 MHz Intermodulation Intercept Point (for two-tone input power up to +5 dBm) Intercept Points Above 500 MHz 100 MHz 3 ns Typ 7 mV Typ +27 dBm Typ +24 dBm Typ
IP2 +68 dBm Typ +45 dBm Typ
IP3 +45 dBm Typ +40 dBm Typ
Control Voltages (Complementary Logic) VINLow 0 to -0.2 V @ 5 A Max VINHi -5 V @ 75 A Typ to -8 V @ 250 A Max Die Size 0.045" x 0.039" x 0.010" (1.14mm x 0.99mm x 0.25mm
Handling, Mounting and Bonding Procedure Handling Precautions
Permanent damage to the MADA2030 may occur if the following precautions are not adhered to: A. Cleanliness - The MADA2030 should be handled in a clean environment. DO NOT attempt to clean unit after the MADA2030 is installed. B. Static Sensitivity - All chip handling equipment and personnel should be DC grounded. C. Transient - Avoid instrument and power supply transients while bias is applied to the MADA2030. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply voltage to either complementary control ports only when the other is grounded. Neither port should be allowed to "float". E. General Handling - It is recommended that the MADA2030 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers.
DA2030 Truth Table Control Input
VC1 VC2 VC3 VC3 Vin Low VinLow VinLow VC4 VinHi VinHi VinHi VC4 Vin Low VinLow VinLow
MADA2030G
V 2.00
Schematic
VC5 VinHi VinHi VinHi
VC5 Vin Low VinLow VinLow
Attenuation Settings Reference .5dB 1dB 2dB 4dB 8dB
VinHi VinHi VinHi VinLow VinHi VinHi VinHi VinLow VinHi VinHi VinHi VinLow VinHi VinHi VinHi VinHi VinHi VinHi
Mounting
The MADA2030 is back-metallized with Pd/Ni/Au (100/1,000/10,000A) metallization. It can be die-mounted with AuSn eutectic preforms or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255C and a tool temperature of 265C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290C. B. DO NOT expose the MADA2030 to a temperature greater than 320C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MADA2030 into position. A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy may be used but is not required.
VinHi VinHi VinLow VinHi VinLow Vin Low VinLow VinHi VinHi Vin Low VinLow VinHi VinLow Vin Low VinHi
VinLow VinHi
0 to -0.2V -5V to -8V
Maximum Ratings A. Control Voltage : -8.5 Vdc B. Max Input RF Power: +34 dBm (500 MHz - 4 GHz) C. Storage Temperature: -65C to +175C D. Maximum Operating Temperature: +175C
BondPad Dimensions Inches (mm)
Wire Bonding
A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermo- sonic wirebonding with a nominal stage temperature of 150C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels to achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended.
RFin, RFout: 0.004" x 0.004" (0.100mm x 0.100mm) VC1,VC2,VC3,VC3,VC4,VC4: 0.004" x 0.004" (0.100mm x 0.100mm) GND1,GND2,GND3: 0.009" x 0.004" GND4: 0.004" x 0.004" (0.100mm x 0.100mm)
Die Size Inches (mm) 0.045" x 0.039" x 0.010" (1.14mm x 0.99mm x 0.25mm)

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