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TDA8947J
4-channel audio amplifier (SE: 1 W to 25 W; BTL: 4 W to 50 W)
Rev. 01 -- 06 February 2004 Preliminary data
1. General description
The TDA8947J contains four identical audio power amplifiers. The TDA8947J can be used as: four Single-Ended (SE) channels with a fixed gain of 26 dB, two times Bridge-Tied Load (BTL) channels with a fixed gain of 32 dB or two times SE channels (26 dB gain) plus one BTL channel (32 dB gain) operating as a 2.1 system. The TDA8947J comes in a 17-pin Dil-Bent-Sil (DBS) power package. The TDA8947J is pin compatible with the TDA8944AJ and TDA8946AJ. The TDA8947J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it.
2. Features
s s s s s s s s s SE: 1 W to 25 W, BTL: 4 W to 50 W operation possibility (2.1 system) Soft clipping Standby and mute mode No on/off switching plops Low standby current High supply voltage ripple rejection Outputs short-circuit protected to ground, supply and across the load Thermally protected Pin compatible with TDA8944AJ and TDA8946AJ.
3. Applications
s s s s Television PC speakers Boom box Mini and micro audio receivers.
Philips Semiconductors
TDA8947J
4-channel audio amplifier
4. Quick reference data
Table 1: VCC Iq Istb Po(SE) Quick reference data Conditions operating no (clipping) signal quiescent supply current standby supply current SE output power THD = 10 %; RL = 4 VCC = 18 V VCC = 22 V Po(BTL) BTL output power THD = 10 %; RL = 8 VCC = 18 V VCC = 22 V THD Gv(max) SVRR total harmonic distortion maximum voltage gain supply voltage ripple rejection SE; Po = 1 W BTL; Po = 1 W SE BTL SE; f = 1 kHz BTL; f = 1 kHz 16 25 31 18 29 0.1 26 32 60 65 0.5 27 33 W W % % dB dB dB dB 7 8.5 14 W W VCC = 18 V; RL =
[1]
Symbol Parameter supply voltage
Min 9 -
Typ 18 100 -
Max Unit 26 28 145 10 V V mA A
0.05 0.5
[1]
The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not exceeded.
5. Ordering information
Table 2: Type number TDA8947J Ordering information Package Name Description Version SOT243-1 DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)
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TDA8947J
4-channel audio amplifier
6. Block diagram
VCC1 3 IN1+ 8 60 k 6 60 k 9 60 k 12 60 k 13 VCC SHORT-CIRCUIT AND TEMPERATURE PROTECTION 17 14 4 VCC2 16 1 OUT1+
IN2+
OUT2-
IN3+
OUT3-
IN4+
OUT4+
CIV
SVR
11 0.5V CC Vref
SGND
7 STANDBY ALL MUTE ALL ON 1+2 MUTE 3+4 ON 3+4 2 GND1 15 GND2
MDB014
MODE1
10
TDA8947J
MODE2
5
Fig 1. Block diagram.
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TDA8947J
4-channel audio amplifier
7. Pinning information
7.1 Pinning
OUT1+ GND1 VCC1 OUT2- MODE2 IN2+ SGND IN1+ IN3+
1 2 3 4 5 6 7 8 9
TDA8947J
MODE1 10 SVR 11 IN4+ 12 CIV 13 OUT3- 14 GND2 15 VCC2 16 OUT4+ 17
MDB015
Fig 2. Pin configuration.
7.2 Pin description
Table 3: Symbol OUT1+ GND1 VCC1 OUT2- MODE2 IN2+ SGND IN1+ IN3+ MODE1 SVR IN4+
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Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 Description non inverted loudspeaker output of channel 1 ground of channels 1 and 2 supply voltage channels 1 and 2 inverted loudspeaker output of channel 2 mode selection 2 input: mute and on for channels 3 and 4 input channel 2 signal ground input channel 1 input channel 3 mode selection 1 input: standby, mute and on for all channels half supply voltage decoupling (ripple rejection) input channel 4
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Preliminary data
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Philips Semiconductors
TDA8947J
4-channel audio amplifier
Pin description...continued Pin 13 14 15 16 17 Description common input voltage decoupling inverted loudspeaker output of channel 3 ground of channels 3 and 4 supply voltage channels 3 and 4 non inverted loudspeaker output of channel 4 back side tab or heats spreader has to be connected to ground
Table 3: Symbol CIV OUT3- GND2 VCC2 OUT4+ TAB
8. Functional description
8.1 Input configuration
The input cut-off frequency is: 1 f i ( cut - off ) = ---------------------------2 ( R i x C i ) For SE application Ri = 60 k and Ci = 220 nF: 1 f i ( cut - off ) = ---------------------------------------------------------------- = 12 Hz 3 -9 2 ( 60 x 10 x 220 x 10 ) For BTL application Ri = 30 k and Ci = 470 nF: 1 f i ( cut - off ) = ---------------------------------------------------------------- = 11 Hz 3 -9 2 ( 30 x 10 x 470 x 10 )
(1)
(2)
(3)
As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior.
8.2 Power amplifier
The power amplifier is a BTL and/or SE amplifier with an all-NPN output stage, capable of delivering a peak output current of 4 A. Using the TDA8947J as a BTL amplifier offers the following advantages:
* * * *
Low peak value of the supply current Ripple frequency on the supply voltage is twice the signal frequency No expensive DC-blocking capacitor Good low frequency performance.
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TDA8947J
4-channel audio amplifier
8.2.1
Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 8. The maximum output power is limited by the supply voltage (VCC = 26 V) and the maximum output current (Io = 4 A repetitive peak current). For supply voltages VCC > 22 V, a minimum load is required; see Figure 5:
* SE: RL = 3 * BTL: RL = 6 .
8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. The Average Listening Level (ALL) music power, without any distortion, yields:
* SE at Po(SE) = 5 W, VCC = 18 V, RL = 4 and THD = 0.2 %:
5 10 P o ( ALL )SE = --------------- = 315 mW 15.85
3
(4)
* BTL at Po(BTL) = 10 W, VCC = 18 V, RL = 8 and THD = 0.1 %:
10 10 P o ( ALL )BTL = ------------------ = 630 mW 15.85
3
(5)
The power dissipation can be derived from Figure 9 (SE and BTL) for a headroom of 0 dB and 12 dB, respectively.
Table 4: Headroom 0 dB 12 dB Power rating as function of headroom Power output SE Po = 5 W Po(ALL) = 315 mW BTL Po = 10 W Po(ALL) = 630 mW Power dissipation (all channels driven) PD = 17 W PD = 9 W
For heatsink calculation at the average listening level, a power dissipation of 9 W can be used.
8.3 Mode selection
The TDA8947J has three functional modes which can be selected by applying the proper DC voltage to pin MODE1. Standby -- The current consumption is very low and the outputs are floating. The device is in the standby mode when VMODE1 < 0.8 V, or when the MODE1 pin is grounded. In the standby mode, the function of pin MODE2 has been disabled.
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TDA8947J
4-channel audio amplifier
Mute -- The amplifier is DC-biased, but not operational (no audio output). This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in the mute mode when 4.5 V < VMODE1 < (VCC - 3.5 V). On -- The amplifier is operating normally. The on mode is activated at VMODE1 > (VCC - 2.0 V). The output of channels 3 and 4 can be set to mute or on mode. The output channels 3 and 4 can be switched on/off by applying a proper DC voltage to pin MODE2, under the condition that the output channels 1 and 2 are in the on mode (see Figure 3).
Table 5: MODE1 0 to 0.8 V 4.5 to (VCC - 3.5 V) (VCC - 2.0 V) to VCC Mode selection Channel 1 and 2 MODE2 0 to VCC 0 to VCC 0 to (VCC - 3.5 V) (VCC - 2 V) to VCC standby mute on on Channel 3 and 4 (sub woofer) standby mute mute on
Voltage on pin
all standby
all mute
channels 1+2: on channels 3+4: on or mute
0.8
4.5
VCC-3.5
VCC-2.0 VCC VMODE1
channels 3+4: mute
channels 3+4: on
VCC-3.5
MDB016
VCC-2.0 VCC VMODE2
Fig 3. Mode selection.
8.4 Supply voltage ripple rejection
The Supply Voltage Ripple Rejection (SVRR) is measured with an electrolytic capacitor of 150 F on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 11 illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies.
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TDA8947J
4-channel audio amplifier
8.5 Built-in protection circuits
The TDA8947J contains two types of detection sensors: one measures local temperatures of the power stages and one measures the global chip temperature. At a local temperature of approximately 185 C or a global temperature of approximately 150 C, this detection circuit switches off the power stages for 2 ms. High impedance of the outputs is the result. After this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. This protects the TDA8947J against shorts to ground, to the supply voltage and across the load, and against too high chip temperatures. The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be flowing through the short, just as much as the power stage can handle without exceeding the critical temperature level.
9. Limiting values
Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC VI IORM Tstg Tamb Ptot VCC(sc)
[1]
Conditions operating no (clipping) signal
[1]
Min -0.3 -0.3 -0.3 -
Max +26 +28 4 +150 +85 69 24
Unit V V A C C W V
supply voltage input voltage repetitive peak output current storage temperature ambient temperature total power dissipation supply voltage to guarantee short-circuit protection
VCC + 0.3 V
non-operating
-55 -40 -
The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not exceeded.
10. Thermal characteristics
Table 7: Rth(j-a) Rth(j-c) Thermal characteristics Conditions in free air all channels driven Value 40 1.3 Unit K/W K/W thermal resistance from junction to ambient thermal resistance from junction to case Symbol Parameter
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TDA8947J
4-channel audio amplifier
11. Static characteristics
Table 8: Static characteristics VCC = 18 V; Tamb = 25 C; RL = 8 ; VMODE1 = VCC; VMODE2 = VCC; Vi = 0 V; measured in test circuit Figure 12; unless otherwise specified. Symbol Supply VCC Iq Istb VO VOUT VMODE1 supply voltage quiescent supply current standby supply current DC output voltage differential output voltage offset BTL mode
[4] [5]
Parameter
Conditions operating no (clipping) signal RL =
[1] [2] [3]
Min 9 -
Typ 18 100 9 -
Max 26 28 145 10 170 VCC 0.8 VCC 20 20
Unit V V mA A V mV V V V A A
Output pins
Mode selection pins selection voltage on pin MODE1 on mute standby VMODE2 IMODE1 IMODE2
[1] [2] [3] [4] [5] [6]
VCC - 2.0 4.5 0
[6]
-
VCC - 3.5 V
selection voltage on pin MODE2 on: channels 3 and 4 mute: channels 3 and 4 selection current on pin MODE1 0 < VMODE1 < (VCC - 3.5 V) selection current on pin MODE2 0 < VMODE2 < (VCC - 3.5 V)
VCC - 2.0 0 -
VCC - 3.5 V
A minimum load is required at supply voltages of VCC > 22 V: RL = 3 for SE and RL = 6 for BTL. The amplifier can deliver output power with non clipping output signals into nominal loads as long as the ratings of the IC are not exceeded. With a load connected at the outputs the quiescent current will increase. The DC output voltage, with respect to ground, is approximately 0.5VCC. VOUT = VOUT+ - VOUT- Channels 3 and 4 can only be set to mute or on by MODE2 when VMODE1 > VCC - 2.0 V.
12. Dynamic characteristics
Table 9: Dynamic characteristics SE VCC = 18 V; Tamb = 25 C; RL = 4 ; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol Po(SE) Parameter SE output power Conditions VCC = 18 V; see Figure 8a THD = 10 %; RL = 4 THD = 0.5 %; RL = 4 VCC = 22 V THD = 10 %; RL = 4 THD Gv Zi Vn(o)
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Min 7 25 40
[1]
Typ 8.5 6.5 14 0.1 26 60 150
Max 0.5 27 -
Unit W W W % dB k V
total harmonic distortion voltage gain input impedance noise output voltage
Po = 1 W
-
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Philips Semiconductors
TDA8947J
4-channel audio amplifier
Table 9: Dynamic characteristics SE...continued VCC = 18 V; Tamb = 25 C; RL = 4 ; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol SVRR Vo(mute) cs |Gv|
[1] [2]
Parameter supply voltage ripple rejection output voltage in mute mode channel separation channel unbalance
Conditions fripple = 1 kHz fripple = 100 Hz to 20 kHz Rsource = 0
[2] [2] [3]
Min 50 -
Typ 60 60 60 -
Max 150 1
Unit dB dB V dB dB
[3]
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 at the input. Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise.
Table 10: Dynamic characteristics BTL VCC = 18 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE1 = VCC; VMODE2 = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol Po(BTL) Parameter BTL output power Conditions VCC = 18 V; see Figure 8b THD = 10 %; RL = 8 THD = 0.5 %; RL = 8 VCC = 22 V THD = 10 %; RL = 8 THD Gv Zi Vn(o) SVRR Vo(mute) cs |Gv|
[1] [2]
Min 16 31 20
[1]
Typ 18 14 29 0.05 32 30 200 65 65 65 -
Max 0.5 33 250 1
Unit W W W % dB k V dB dB V dB dB
total harmonic distortion voltage gain input impedance noise output voltage supply voltage ripple rejection output voltage in mute mode channel separation channel unbalance
Po = 1 W
50 -
fripple = 1 kHz fripple = 100 Hz to 20 kHz Rsource = 0
[2] [2] [3]
[3]
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 at the input. Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode is measured with VMODE1 = VMODE2 = 7 V, and Vi = 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise.
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TDA8947J
4-channel audio amplifier
107 Vo (V) 106 105 104 103 102 10 1
coc005
0
4
8
12
16 20 VMODE1 (V)
BTL; VCC = 18 V; Vi = 50 mV.
Fig 4. AC output voltage as function of voltage on pin MODE1.
60 Po (W) 40
MCE485
60 Po (W) 4 40 8 6
MCE484
2 20
3 20 4 RL = 2 16
RL = 1 8 0 8 12 16 20 24 28 VCC (V) 0 8 12 16 20 24 28 VCC (V)
THD = 10 %; one channel.
THD = 10 %; one channel.
a.
SE
b.
BTL
Fig 5. Output power as function of supply voltage at various loads
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TDA8947J
4-channel audio amplifier
102 THD+N (%) 10
MCE488
102 THD+N (%) 10
MCE487
1
1
10-1
10-1
10-2 10-1
1
10
Po (W)
102
10-2 10-1
1
10
Po (W)
102
VCC = 18 V; f = 1 kHz; RL = 4 .
VCC = 18 V; f = 1 kHz; RL = 8 .
a.
SE
b.
BTL
Fig 6. Total harmonic distortion-plus-noise as function of output power.
10 THD+N (%)
MCE489
10 THD+N (%)
MCE490
1
1
10-1
10-1
10-2 10
102
103
104
f (Hz)
105
10-2 10
102
103
104
f (Hz)
105
VCC = 18 V; Po = 1 W; RL = 4 .
VCC = 18 V; Po = 1 W; RL = 8 .
a.
SE
b.
BTL
Fig 7. Total harmonic distortion-plus-noise as function of frequency.
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TDA8947J
4-channel audio amplifier
50 Po (W) 40
MCE491
50 Po (W) 40
MCE492
30
30
20
20
10
10
0 8 12 16 20 24 28 VCC (V)
0 8 12 16 20 24 28 VCC (V)
THD = 10%; RL = 4 ; f = 1 kHz.
THD = 10%; RL = 8 ; f = 1 kHz.
a.
SE
b.
BTL
Fig 8. Output power as function of supply voltage.
20 PD (W) 16
MCE493
20 PD (W) 16
MCE494
12
12
8
8
4
4
0 0 4 8 12 16 Po (W) 20
0 0 4 8 12 16 Po (W) 20
VCC = 18 V; RL = 4 .
VCC = 18 V; RL = 8 .
a.
SE
b.
BTL
Fig 9. Total power dissipation as function of channel output power per channel (worst case, all channels driven).
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TDA8947J
4-channel audio amplifier
cs (dB)
0
MCE495
cs (dB)
0
MCE496
-20
-20
-40
-40
-60
-60
-80
-80
-100 10
102
103
104 f (Hz)
105
-100 10
102
103
104 f (Hz)
105
VCC = 18 V; RL = 4 .
VCC = 18 V; RL = 8 .
a.
SE
b.
BTL
Fig 10. Channel separation as function of frequency (no bandpass filter applied).
0 SVRR (dB) -20
MCE497
0 SVRR (dB) -20
MCE498
-40
-40
-60
-60
-80 10
102
103
104
f (Hz)
105
-80 10
102
103
104
f (Hz)
105
VCC = 18 V; Rsource = 0 ; Vripple = 300 mV (RMS). A bandpass filter of 20 Hz to 22 kHz has been applied. Inputs short-circuited.
VCC = 18 V; Rsource = 0 ; Vripple = 300 mV (RMS). A bandpass filter of 20 Hz to 22 kHz has been applied. Inputs short-circuited.
a.
SE
b.
BTL
Fig 11. Supply voltage ripple rejection as function of frequency.
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TDA8947J
4-channel audio amplifier
13. Application information
13.1 Application diagrams
VCC VCC1 3 220 nF Vi 220 nF Vi IN3+ 9 470 nF Vi 60 k IN4+ 12 60 k CIV 13 VCC VCC 10 k 50 k 100 k SHORT-CIRCUIT AND TEMPERATURE PROTECTION IN2+ 6 60 k IN1+ 8 60 k 4 OUT2- - + 14 OUT3- - + 17 OUT4+ 470 F RL 8 VCC2 16 1 OUT1+ + - RL 4 100 nF 1000 F
RL 4
22 F SVR 11 0.5V CC 47 F SGND 7 STANDBY ALL MUTE ALL ON 1 + 2 MUTE 3 + 4 ON 3 + 4 Vref
270
7.5 V microcontroller 1.5 k BC547
BC547
2.2 F
MODE1 10
VCC
MODE2 5
TDA8947J
2 GND1 15 GND2
mdb017
Fig 12. Typical application diagram without on/off switching plops. Table 11: Amplifier selection by microcontroller Microcontroller with open-collector output; see Figure 12 Microcontroller LOW HIGH Channels 1 and 2 on mute Channels 3 and 4 on mute
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TDA8947J
4-channel audio amplifier
VCC VCC1 3 220 nF Vi 220 nF Vi IN3+ 9 470 nF Vi 60 k IN4+ 12 60 k CIV 13 VCC SHORT-CIRCUIT AND TEMPERATURE PROTECTION 17 OUT4+ IN2+ 6 60 k 14 OUT3- - + 450 F RL 8 IN1+ 8 60 k 4 OUT2- - + RL 4 VCC2 16 1 OUT1+ + - RL 4 100 nF 1000 F
22 F SVR 11 0.5V CC 150 F SGND 7 STANDBY ALL MUTE ALL ON 1+2 MUTE 3+4 ON 3+4 2 GND1 15 GND2
MDB018
Vref
MICROCONTROLLER VCC
MODE1 10
TDA8947J
MODE2 5
Fig 13. Application diagram with one pin control and reduction of capacitor.
Remark: Because of switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 V. At high supply voltages, it is recommended to use (Schottky) diodes to the supply voltage and ground.
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TDA8947J
4-channel audio amplifier
13.2 Printed-circuit board
13.2.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power.
PF / 3002 .naJ 72 220 nF 100 nF
AUDIO POWER CS NIJMEGEN 220 nF
TVA
4
4
1 1
220 nF 220 nF
220 nF 4 BTL4/3 4 CIV
220 nF 4
Fig 14. Printed-circuit board layout (single-sided); components view.
BTL1/2
1000 F
4
1000 F
4.7 nF
SVF
22 220 F F
+SE3-
+SE2- +SE1-
10 k + Vp IN2+ IN1+ IN3+ IN4+ VOL.Sgnd
1000 F
1000 F
-SE4+
150 F
MODE1
BTL3/4 MODE2
OFF 10 k SB ON MUTE ON
MCE483
13.2.2
Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations. For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR, typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 F or greater, must be placed close to the device. The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance a low ESR capacitor is recommended.
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4-channel audio amplifier
13.3 Thermal behavior and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb), is 1.3 K/W. A calculation for the heatsink can be made, with the following parameters: Tamb(max) = 60 C (example) VCC = 18 V and RL = 4 (SE) Tj(max) = 150 C (specification) Rth(tot) is the total thermal resistance between the junction and the ambient including the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation: Rth(tot) = (Tj(max) - Tamb(max))/PD At VCC = 18 V and RL = 4 (4 x SE) the measured worst-case sine-wave dissipation is 17 W; see Figure 9. For Tj(max) = 150 C the temperature raise, caused by the power dissipation, is: 150 - 60 = 90 C: P x Rth(tot) = 90 C Rth(tot) = 90/17 = 5.29 K/W Rth(h-a) = Rth(tot) - Rth(j-mb) = 5.29 - 1.3 = 3.99 K/W This calculation is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation of 9 W (see Section 8.2.2). This allows for the use of a smaller heatsink: P x Rth(tot) = 90 C Rth(tot) = 90/9 = 10 K/W Rth(h-a) = Rth(tot) - Rth(j-mb) = 10 - 1.3 = 8.7 K/W
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TDA8947J
4-channel audio amplifier
150 Tj (C)
(1) (2) (3) (4)
mce499
150 Tj (C)
mce500
(5)
(1)
(2)
(3)
(4)
(5)
100
100
50
50
0 8 12 16 20 24 28 VCC (V)
0 8 12 16 20 24 28 VCC (V)
Tamb = 25 C; external heatsink of 5 K/W. (1) RL = 1 . (2) RL = 2 . (3) RL = 3 . (4) RL = 4 . (5) RL = 8 .
Tamb = 25 C; external heatsink of 5 K/W. (1) RL = 2 . (2) RL = 4 . (3) RL = 6 . (4) RL = 8 . (5) RL = 16 .
a.
4 times various SE loads with music signals.
b.
2 times various BTL loads with music signals.
Fig 15. Junction temperature as function of supply voltage for various loads with music signals.
14. Test information
14.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
9397 750 10779
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Preliminary data
Rev. 01 -- 06 February 2004
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Philips Semiconductors
TDA8947J
4-channel audio amplifier
15. Package outline
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) SOT243-1
non-concave D x Dh
Eh
view B: mounting base side A2
d
B j E A
L3
L
Q c vM
1 Z e e1 wM
17 m e2
bp
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e e1 e2 5.08 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
2.54 1.27
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-17 03-03-12
Fig 16. Package outline.
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Preliminary data
Rev. 01 -- 06 February 2004
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Philips Semiconductors
TDA8947J
4-channel audio amplifier
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
16.4 Package related soldering information
Table 12: Package DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP[2]
[1] [2]
Suitability of through-hole mount IC packages for dipping and wave soldering methods Soldering method Dipping suitable - Wave suitable[1] not suitable
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable.
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Preliminary data
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Philips Semiconductors
TDA8947J
4-channel audio amplifier
17. Revision history
Table 13: Rev Date 01 20040206 Revision history CPCN Description Preliminary data (9397 750 10779)
9397 750 10779
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Preliminary data
Rev. 01 -- 06 February 2004
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Philips Semiconductors
TDA8947J
4-channel audio amplifier
18. Data sheet status
Level I II Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
20. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
9397 750 10779
Fax: +31 40 27 24825
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Preliminary data
Rev. 01 -- 06 February 2004
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Philips Semiconductors
TDA8947J
4-channel audio amplifier
Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.2 13.2.1 13.2.2 13.3 14 14.1 15 16 16.1 16.2 16.3 16.4 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Input configuration . . . . . . . . . . . . . . . . . . . . . . 5 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 5 Output power measurement . . . . . . . . . . . . . . . 6 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 6 Supply voltage ripple rejection . . . . . . . . . . . . . 7 Built-in protection circuits . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Application information. . . . . . . . . . . . . . . . . . 15 Application diagrams . . . . . . . . . . . . . . . . . . . 15 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 17 Layout and grounding . . . . . . . . . . . . . . . . . . . 17 Power supply decoupling . . . . . . . . . . . . . . . . 17 Thermal behavior and heatsink calculation . . 18 Test information . . . . . . . . . . . . . . . . . . . . . . . . 19 Quality information . . . . . . . . . . . . . . . . . . . . . 19 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . 21 Soldering by dipping or by solder wave . . . . . 21 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 21 Package related soldering information . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
(c) Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 06 February 2004 Document order number: 9397 750 10779

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