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LZ2353B/LZ2354BJ
LZ2353B/ LZ2354BJ
DESCRIPTION
The LZ2353B/LZ2354BJ are 1/3-type (6.0 mm) solid-state image sensors that consist of PN photodiodes and CCDs (charge-coupled devices). With approximately 410 000 pixels (811 horizontal x 507 vertical), the sensor provides a stable high-resolution color (LZ2353B)/B/W (LZ2354BJ) image.
OV4 1 OV3 2 OV2 3
1/3-type CCD Area Sensors with 410 k Pixels
PIN CONNECTIONS
16-PIN HALF-PITCH WDIP TOP VIEW
16 OH2 15 OH1 14 OLH1 13 ORS 12 PW 11 OFD 10 GND 9 OD
FEATURES
* Number of effective pixels : 768 (H) x 494 (V) * Number of optical black pixels - Horizontal : 3 front and 40 rear - Vertical : 11 front and 2 rear * Pixel pitch : 6.4 m (H) x 7.5 m (V) * Mg, G, Cy, and Ye complementary color filters (For LZ2353B) * Low fixed-pattern noise and lag * No burn-in and no image distortion * Blooming suppression structure * Built-in output amplifier * Variable electronic shutter (1/60 to 1/10 000 s) * Compatible with NTSC standard (LZ2353B)/ EIA standard (LZ2354BJ) * Package : 16-pin half-pitch WDIP [Ceramic] (WDIP016-N-0450) Row space : 11.43 mm
OV1 4 GND 5 NC1 6 NC2 7 OS 8
(WDIP016-N-0450)
PRECAUTIONS
* The exit pupil position of lens should be more than 25 mm (LZ2353B)/20 mm (LZ2354BJ) from the top surface of the CCD. * Refer to "PRECAUTIONS FOR CCD AREA SENSORS" for details.
COMPARISON TABLE
TV standard Characteristics LZ2353B NTSC standard (Color) LZ2354BJ EIA standard (B/W)
Refer to each following specification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
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LZ2353B/LZ2354BJ
PIN DESCRIPTION
SYMBOL OD OS ORS OV1, OV2, OV3, OV4 OH1, OH2 OLH1 OFD PW GND NC1, NC2 PIN NAME Output transistor drain Output signals Reset transistor clock Vertical shift register clock Horizontal shift register clock Horizontal shift register final stage clock Overflow drain P-well Ground No connection
ABSOLUTE MAXIMUM RATINGS
PARAMETER Output transistor drain voltage Overflow drain voltage Reset gate clock voltage Vertical shift register clock voltage Horizontal shift register clock voltage Horizontal shift register final stage clock voltage Voltage difference between P-well and vertical clock Storage temperature Ambient operating temperature SYMBOL VOD VOFD VORS VOV VOH VOLH VPW-VOV TSTG TOPR RATING 0 to +18 0 to +55 -0.3 to +18 VPW to +18 -0.3 to +18 -0.3 to +18 -28 to 0 -40 to +85 -20 to +70
(TA = +25 C)
UNIT V V V V V V V C C 1 NOTE
NOTE :
1. The OFD clock OOFD is excluded.
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LZ2353B/LZ2354BJ
RECOMMENDED OPERATING CONDITIONS
PARAMETER Ambient operating temperature Output transistor drain voltage Overflow drain voltage Ground P-well voltage LOW level Vertical shift register clock INTERMEDIATE level HIGH level LOW level HIGH level LOW level HIGH level LOW level HIGH level When DC is applied When pulse is applied p-p level SYMBOL TOPR VOD VOFD VOOFD GND VPW VOV1L, VOV2L VOV3L, VOV4L VOV1I, VOV2I VOV3I, VOV4I VOV1H, VOV3H VOH1L, VOH2L VOH1H, VOH2H VOLH1L VOLH1H VORSL VORSH fOV1, fOV2 fOV3, fOV4 fOH1, fOH2, fOLH1 fORS 14.5 -0.05 4.7 -0.05 4.7 0.0 VOD - 9.5 15.73 14.32 14.32 MIN. 14.5 5.0 21.5 0.0 -10.0 -9.5 -9.0 0.0 15.0 0.0 5.0 0.0 5.0 17.0 0.05 6.0 0.05 6.0 VOD - 14.0 10.0 VOVL -7.5 TYP. 25.0 15.0 MAX. 16.0 19.0 UNIT C V V V V V V V V V V V V V V kHz MHz MHz 1 2 NOTE
Horizontal shift register clock Horizontal shift register final stage clock Reset gate clock
Vertical shift register clock frequency Horizontal shift register clock frequency Reset gate clock frequency
NOTES :
* Connect NC1 and NC2 to GND directly or through a capacitor larger than 0.047 F. 1. When DC voltage is applied, shutter speed is 1/60-second. 2. When pulse is applied, shutter speed is less than 1/60-second. * To apply power, first connect GND and then turn on VOFD. After turning on VOFD, turn on PW first and then turn on other powers and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.
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LZ2353B/LZ2354BJ
CHARACTERISTICS FOR LZ2353B (Drive method : Field accumulation)
(TA = +25 C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)
PARAMETER Standard output voltage Photo response non-uniformity Saturation output voltage Dark output voltage Dark signal non-uniformity Sensitivity Smear ratio Image lag Blooming suppression ratio Output transistor drain current Output impedance Dark noise OB difference in level Vector breakup Line crawling Luminance flicker SYMBOL VO PRNU VSAT VDARK DSNU R SMR AI ABL IOD RO VNOISE MIN. TYP. 150 MAX. 10 700 0.5 0.5 350 -84 3.0 2.0 -76 1.0 8.0 0.3 1.0 5.0 1.5 2.0 UNIT mV % mV mV mV mV dB % mA $ mV mV , % % % NOTE 2 3 4 1, 5 1, 6 7 8 9 10
260
1 000 4.0 350 0.2
11 1, 12 13 14 15
NOTES :
* VOFD should be adjusted to the minimum voltage such that ABL satisfy the specification, or to the value displayed on the device. 1. TA = +60 C 2. The average output voltage under uniform illumination. The standard exposure conditions are defined as when Vo is 150 mV. 3. The image area is divided into 10 x 10 segments under the standard exposure conditions. Each segment's voltage is the average output voltage of all pixels within the segment. PRNU is defined by (Vmax - Vmin)/Vo, where Vmax and Vmin are the maximum and minimum values of each segment's voltage respectively. 4. The image area is divided into 10 x 10 segments. Each segment's voltage is the average output voltage of all pixels within the segment. VSAT is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 5. The average output voltage under non-exposure conditions. 6. The image area is divided into 10 x 10 segments under non-exposure conditions. DSNU is defined by (Vdmax - Vdmin), where Vdmax and Vdmin are the maximum and minimum values of each segment's voltage respectively. 7. The average output voltage when a 1 000 lux light source with a 90% reflector is imaged by a lens of F4, f50 mm. 8. The sensor is exposed only in the central area of V/10 square with a lens at F4, where V is the vertical image size. SMR is defined by the ratio of the output voltage detected during the vertical blanking period to the maximum output voltage in the V/10 square. 9. The sensor is exposed at the exposure level corresponding to the standard conditions. AI is defined by the ratio of the output voltage measured at the 1st field during the non-exposure period to the standard output voltage. 10. The sensor is exposed only in the central area of V/10 square, where V is the vertical image size. ABL is defined by the ratio of the exposure at the standard conditions to the exposure at a point where blooming is observed. 11. The RMS value of the dark noise (after CDS). (100 kHz to 4.2 MHz, SC trap on.) 12. The difference of the average output voltage between the effective area and the OB area under non-exposure conditions. 13. Observed with a vector scope when the color bar chart is imaged under the standard exposure conditions. 14. The difference between the average output voltage of the (Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G + Ye) line under the standard exposure conditions. 15. The difference between the average output voltage of the odd field and that of the even field under the standard exposure conditions.
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LZ2353B/LZ2354BJ
CHARACTERISTICS FOR LZ2354BJ (Drive method : Field accumulation) (TA = +25 C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)
PARAMETER Standard output voltage Photo response non-uniformity Saturation output voltage Dark output voltage Dark signal non-uniformity Sensitivity Gamma Smear ratio Image lag Blooming suppression ratio Output transistor drain current Output impedance Dark noise OB difference in level SYMBOL VO PRNU VSAT VDARK DSNU R SMR AI ABL IOD RO VNOISE 1 000 4.0 350 0.2 0.3 1.0 8.0 mA $ mV mV 11 1, 12 410 MIN. TYP. 150 MAX. 10 700 0.5 0.5 550 1 -84 3.0 2.0 UNIT mV % mV mV mV mV dB % NOTE 2 3 4 1, 5 1, 6 7 8 9 10
-76 1.0
NOTES :
* VOFD should be adjusted to the minimum voltage such that ABL satisfy the specification, or to the value displayed on the device. 1. TA = +60 C 2. The average output voltage under uniform illumination. The standard exposure conditions are defined as when Vo is 150 mV. 3. The image area is divided into 10 x 10 segments under the standard exposure conditions. Each segment's voltage is the average output voltage of all pixels within the segment. PRNU is defined by (Vmax - Vmin)/Vo, where Vmax and Vmin are the maximum and minimum values of each segment's voltage respectively. 4. The image area is divided into 10 x 10 segments. Each segment's voltage is the average output voltage of all pixels within the segment. VSAT is the minimum segment's voltage under 10 times exposure of the standard exposure conditions. 5. The average output voltage under non-exposure conditions. 6. The image area is divided into 10 x 10 segments under non-exposure conditions. DSNU is defined by (Vdmax - Vdmin), where Vdmax and Vdmin are the maximum and minimum values of each segment's voltage respectively. 7. The average output voltage when a 1 000 lux light source with a 90% reflector is imaged by a lens of F4, f50 mm. 8. The sensor is exposed only in the central area of V/10 square with a lens at F4, where V is the vertical image size. SMR is defined by the ratio of the output voltage detected during the vertical blanking period to the maximum output voltage in the V/10 square. 9. The sensor is exposed at the exposure level corresponding to the standard conditions. AI is defined by the ratio of the output voltage measured at the 1st field during the non-exposure period to the standard output voltage. 10. The sensor is exposed only in the central area of V/10 square, where V is the vertical image size. ABL is defined by the ratio of the exposure at the standard conditions to the exposure at a point where blooming is observed. 11. The RMS value of the dark noise after CDS. (100 kHz to 4.2 MHz, SC trap on.) 12. The difference between the average output voltage of the effective area and that of the OB area under nonexposure conditions.
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LZ2353B/LZ2354BJ
PIXEL STRUCTURE
OPTICAL BLACK (3 PIXELS)
yyyyyyyyy ,,,,,,,,, yyyyyyyyy ,,,,,,,,, yyyyyyyyy ,,,,,,,,, yyyyyyyyy ,,,,,,,,, yyyyyyyyy ,,,,,,,,, yyyyyyyyy ,,,,,,,,, yyyyyyyyy ,,,,,,,,,
OPTICAL BLACK (2 PIXELS) 1 pin 768 (H) x 494 (V) OPTICAL BLACK (11 PIXELS)
OPTICAL BLACK (40 PIXELS)
COLOR FILTER ARRAY (FOR LZ2353B)
(1, 494) (768, 494)
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy
ODD field
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
Cy Mg Cy G Cy Mg
Ye G Ye Mg Ye G
EVEN field
G Cy Mg
(1, 1)
(768, 1)
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LZ2353B/LZ2354BJ
TIMING CHART
(ODD FIELD)
HD VD OV1 OV2 OV3 OV4 OOFD
489 491 493 OB1 + + + + 490 492 494 OB2 OB1 OB3 OB5 OB7 OB9 OB11 2 + + + + + + + OB2 OB4 OB6 OB8 OB10 1 3 4 + 5 6 + 7 8 + 9 10 + 11 12 + 13 14 + 15 16 + 17
VERTICAL TRANSFER TIMING
525 1 10
Shutter speed 1/2 000 s
OS
(EVEN FIELD)
HD VD OV1 OV2 OV3 OV4 OOFD
263
272
488 490 492 494 OB2 + + + + 489 491 493 OB1
OB2 OB4 OB6 OB8 OB10 1 + + + + + + OB1 OB3 OB5 OB7 OB9 OB11 2
3 + 4
5 + 6
7 + 8
9 + 10
11 + 12
13 + 14
15 + 16
OS
HORIZONTAL TRANSFER TIMING
910, 1 HD OH1 OLH1 OH2 ORS OS 768 OB (40) 42 OV1 58 OV2 OV3 OV4 OOFD 34 50 66 86 82 98 90 74 PRE SCAN (22) OB (3) OUTPUT (768) 1 91
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LZ2353B/LZ2354BJ
(ODD FIELD)
HD OV1 OV2 OV3 OV4 34 50 1 91 42 74 58 90 82 98 208 240
READOUT TIMING
910, 1 336 404 644 404 472 50 91 42 74 58 90 82 98
(EVEN FIELD)
HD OV1 OV2 OV3 OV4 34 50 1 91 42 74 58 90 82 98 208 240 404 472 644 336 404 90 82 98 910, 1 91
8
VOD
+ 1 M$ + 100 $ 1 000 pF 270 pF 0.1 F 100 k$
+ + ORS GND OLH1 V1A V1B V3A V3B OH2 OH1 OFD POFD VMa VMb OD PW NC VH V4 V2 VL
ORS OLH1 OH1 OH2
VL (VPW)
SYSTEM CONFIGURATION EXAMPLE
VH
12 11 10
9
8
7
6
5
4
3
2
1
16 15 14 13 12 11 10
9
+
9
LR36685
1
VOFDH V4X + V3X V1X V2X VDD GND VH1BX VH3AX VH1AX VH3BX OFDX
LZ2353B LZ2354BJ
2
OV4 OV3
or
13 14 15 16 17 18 19 20 21 22 23 24
3
OV2
4
OV1
5
GND
6
NC1
7
NC2
8
OS
V4X
CCD OUT
VH3AX
+5 V V3X VH1AX V1X V2X OFDX
LZ2353B/LZ2354BJ
PACKAGES FOR CCD AND CMOS DEVICES
PACKAGE
16 WDIP (WDIP016-N-0450)
12.200.15 0.850.45 16 (1) 2.5 10.500.10 (2) 9 Center of effective imaging area and center of package (1 : Reference area) (2 : Lid's size) Glass Lid 10.500.10 (2) 11.400.15
(Unit : mm)
0.50R
1.460.10
CCD
8.4
5.700.15
CCD Package (Cerdip)
0.5
(1) 1
2.5
0.450.45
8 (1)
0.04 Cross Section A-A' Rotation error of die : = 1.5MAX. 0.600.05 (2) 11.430.25 1.250.20
4-0.20RMAX. 6.100.15 3.370.25 2.750.20 9.2 1.3 A 2.5 1.270.25 2.230.20
5.29MAX.
A' P-1.27TYP. 0.25 0.30TYP. 0.46TYP. M
3.500.30
0.250.05
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PRECAUTIONS FOR CCD AREA SENSORS
PRECAUTIONS FOR CCD AREA SENSORS 1. Package Breakage
In order to prevent the package from being broken, observe the following instructions : 1) The CCD is a precise optical component and the package material is ceramic or plastic. Therefore, o Take care not to drop the device when mounting, handling, or transporting. o Avoid giving a shock to the package. Especially when leads are fixed to the socket or the circuit board, small shock could break the package more easily than when the package isn't fixed. 2) When applying force for mounting the device or any other purposes, fix the leads between a joint and a stand-off, so that no stress will be given to the jointed part of the lead. In addition, when applying force, do it at a point below the stand-off part. (In the case of ceramic packages) - The leads of the package are fixed with low melting point glass, so stress added to a lead could cause a crack in the low melting point glass in the jointed part of the lead.
Low melting point glass Lead
(In the case of plastic packages) - The leads of the package are fixed with package body (plastic), so stress added to a lead could cause a crack in the package body (plastic) in the jointed part of the lead.
Glass cap Package Lead Fixed
Stand-off
3) When mounting the package on the housing, be sure that the package is not bent. - If a bent package is forced into place between a hard plate or the like, the package may be broken. 4) If any damage or breakage occurs on the surface of the glass cap, its characteristics could deteriorate. Therefore, o Do not hit the glass cap. o Do not give a shock large enough to cause distortion. o Do not scrub or scratch the glass surface. - Even a soft cloth or applicator, if dry, could cause dust to scratch the glass.
2. Electrostatic Damage
Fixed
Stand-off
As compared with general MOS-LSI, CCD has lower ESD. Therefore, take the following anti-static measures when handling the CCD : 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1 M$ between the human body and the ground to be on the safe side. 2) When directly handling the device with the fingers, hold the part without leads and do not touch any lead.
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PRECAUTIONS FOR CCD AREA SENSORS
3) To avoid generating static electricity, a. do not scrub the glass surface with cloth or plastic. b. do not attach any tape or labels. c. do not clean the glass surface with dustcleaning tape. 4) When storing or transporting the device, put it in a container of conductive material. o The contamination on the glass surface should be wiped off with a clean applicator soaked in Isopropyl alcohol. Wipe slowly and gently in one direction only. - Frequently replace the applicator and do not use the same applicator to clean more than one device. Note : In most cases, dust and contamination are unavoidable, even before the device is first used. It is, therefore, recommended that the above procedures should be taken to wipe out dust and contamination before using the device.
3. Dust and Contamination
Dust or contamination on the glass surface could deteriorate the output characteristics or cause a scar. In order to minimize dust or contamination on the glass surface, take the following precautions : 1) Handle the CCD in a clean environment such as a cleaned booth. (The cleanliness level should be, if possible, class 1 000 at least.) 2) Do not touch the glass surface with the fingers. If dust or contamination gets on the glass surface, the following cleaning method is recommended : o Dust from static electricity should be blown off with an ionized air blower. For antielectrostatic measures, however, ground all the leads on the device before blowing off the dust.
4. Other
1) Soldering should be manually performed within 5 seconds at 350 C maximum at soldering iron. 2) Avoid using or storing the CCD at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the CCD. 3) Do not expose the device to strong light. For the color device, long exposure to strong light will fade the color of the color filters.
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