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DATA SHEET
TDA3681 Multiple voltage regulator with switch and ignition buffer
Product specification Supersedes data of 2001 Aug 24 2002 Apr 10
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
FEATURES General * Extremely low noise behaviour and good stability with very small output capacitors * Second supply pin for regulators 3 and 4 to reduce power dissipation (e.g. via a DC-to-DC converter) * Three VP-state controlled regulators (regulators 1, 3 and 4) and a power switch * Regulator 2, reset and ignition buffer operational during load dump and thermal shutdown * Combined control pin for switching regulators 1 and 3 * Separate control pins for switching regulator 4 and the power switch * Supply voltage range from -18 to +50 V * Low quiescent current in standby mode (when regulators 1, 3 and 4 and power switch are switched off and ignition input is low) * Hold output for low VP (regulators 1, 3 and 4 and power switch off) * Hold output when one of regulators 1 and 3 and/or 4 is out of regulation * Hold output for foldback mode of power switch and regulators 1, 3 and 4 * Hold output for load dump and temperature protection * Reset (push-pull output stage) for regulator 2 and hold output (open-collector output) * Adjustable reset delay time * High supply voltage ripple rejection * Backup capacitor for regulator 2 * One independent ignition buffer (active HIGH). Protections * Reverse polarity safe (down to -18 V without high reverse current) * Able to withstand voltages up to 18 V at the outputs (supply line may be short-circuited) ORDERING INFORMATION TYPE NUMBER TDA3681J TDA3681JR TDA3681TH 2002 Apr 10 PACKAGE NAME DBS17P DBS17P HSOP20 DESCRIPTION plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) plastic, heatsink small outline package; 20 leads; low stand-off height 2 * ESD protection on all pins * Thermal protections * Load dump protection
TDA3681
* Foldback current limit protection for regulators 1, 2, 3 and 4 * Delayed second current limit protection for the power switch (at short-circuit) * The regulator outputs and the power switch are DC short-circuit safe to ground and supply (VP). GENERAL DESCRIPTION The TDA3681 is a multiple output voltage regulator with a power switch and an ignition buffer. It is intended for use in car radios with or without a microcontroller. The TDA3681 contains the following: * Four fixed voltage regulators with a foldback current protection (regulators 1, 2, 3 and 4). Regulator 2, which is intended to supply a microcontroller, also operates during load dump and thermal shutdown * Regulators 3 and 4 have a second supply pin that can be connected to a lower supply voltage (>6.5 V) to reduce the power dissipation * A power switch with protection, operated by a control input * Reset and hold outputs that can be used to interface with the microcontroller; the reset signal can be used to call up the microcontroller * Both supply pins can withstand load dump pulses and negative supply voltages * Regulator 2, which is in regulation at a backup voltage above 6.5 V * A provision for the use of a reserve supply capacitor that will hold enough energy for regulator 2 (5 V continuous) to allow a microcontroller to prepare for loss of voltage * An ignition input Schmitt trigger with push-pull output stage.
VERSION SOT243-3 SOT475-1 SOT418-2
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
QUICK REFERENCE DATA SYMBOL Supplies VP1 supply voltage 1 operating reverse polarity regulator 2 on jump start load dump protection VP2 supply voltage 2 operating reverse polarity regulator 2 on jump start load dump protection Iq(tot) Tj Vo(REG1) Vo(REG2) Vo(REG3) Vo(REG4) Vdrop(SW) IM(SW) total quiescent supply current junction temperature 1 mA IREG1 600 mA; VP = 14.4 V 1 mA IREG2 300 mA; VP = 14.4 V 1 mA IREG3 1400 mA; VP = 14.4 V 1 mA IREG4 1 A; VP = 14.4 V ISW = 1 A; VP1 = 13.5 V ISW = 1.8 A; VP1 = 13.5 V peak current t 10 minutes t 50 ms; tr 2.5 ms standby mode non-operating 6.5 - 0 - - - - 8.0 4.75 4.75 3.14 - - 3 14.4 - - - - 110 - 8.5 5.0 5.0 3.3 t 10 minutes t 50 ms; tr 2.5 ms non-operating 9.5 - 4 - - 14.4 - 14.4 - - PARAMETER CONDITIONS MIN. TYP.
TDA3681
MAX.
UNIT
18 18 50 30 50 18 18 50 30 50 150 150
V V V V V V V V V V A C V V V V
Voltage regulators output voltage of regulator 1 output voltage of regulator 2 output voltage of regulator 3 output voltage of regulator 4 9.0 5.25 5.25 3.46
Power switch drop-out voltage 0.45 1.0 - 0.65 1.8 - V V A
2002 Apr 10
3
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
BLOCK DIAGRAMS
TDA3681
handbook, full pagewidth
VP1
(14.4 V)
17
POWER SWITCH
16
(14 V/ 3 A)
SW
ENSW
11
&
TEMPERATURE LOAD DUMP PROTECTION
BACKUP SWITCH
(14 V/ 14 100 mA)
BU
BACKUP CONTROL
REGULATOR 2 3
15
(5 V/ 300 mA)
REG2
VP2
&
9 EN4
REGULATOR 4
(3.3 V/ 4 1 A)
REG4
&
REGULATOR 3
2
(5 V/ 1400 mA)
REG3
TDA3681J TDA3681JR
&
10 EN1/3 12 REGULATOR 1 (8.5 V/ 1 600 mA) REG1
HOLD
OR
+
&
7 RES
CRES IGNIN
8 5 IGNITION BUFFER 13 GND
MGL902
6
IGNOUT
Fig.1 Block diagram of TDA3681J and TDA3681JR.
2002 Apr 10
4
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
handbook, full pagewidth
VP1
(14.4 V)
14
POWER SWITCH
16
(14 V/ 3 A)
SW
ENSW
8
&
TEMPERATURE LOAD DUMP PROTECTION
BACKUP SWITCH
(14 V/ 13 100 mA)
BU
BACKUP CONTROL
REGULATOR 2 20
12
(5 V/ 300 mA)
REG2
VP2
&
6 EN4 HEATTAB n.c. n.c. 11 15 18
REGULATOR 4
(3.3 V/ 1 1 A)
REG4
&
REGULATOR 3
19
(5 V/ 1400 mA)
REG3
TDA3681TH
REGULATOR 1 (8.5 V/ 17 600 mA) REG1
&
7 EN1/3
9
HOLD
OR
+
&
4 RES
CRES IGNIN
5 2 IGNITION BUFFER 10 GND
MGU353
3
IGNOUT
Fig.2 Block diagram of TDA3681TH.
2002 Apr 10
5
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
PINNING Pin description of TDA3681J and TDA3681JR SYMBOL REG1 REG3 VP2 REG4 IGNIN IGNOUT RES CRES EN4 EN1/3 ENSW HOLD GND BU REG2 SW VP1 heat tab PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 - DESCRIPTION regulator 1 output regulator 3 output second supply voltage regulator 4 output ignition input ignition output (active HIGH) reset output (active LOW) reset delay capacitor enable input for regulator 4 enable input for regulators 1 and 3 enable input for power switch hold output (active LOW) ground backup switch output regulator 2 output power switch output supply voltage heat tab; it is strongly recommended to connect the heat tab to ground
EN1/3 10 ENSW 11 HOLD 12 GND 13 BU 14 REG2 15 SW 16 VP1 17
MGL903
TDA3681
handbook, halfpage
REG1 REG3 VP2 REG4 IGNIN IGNOUT RES CRES EN4
1 2 3 4 5 6 7 8 9
TDA3681J TDA3681JR
Fig.3
Pin configuration for TDA3681J and TDA3681JR.
2002 Apr 10
6
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
Pin description of TDA3681TH SYMBOL REG4 IGNIN IGNOUT RES CRES EN4 EN1/3 ENSW HOLD GND HEATTAB REG2 BU VP1 n.c. SW REG1 n.c. REG3 VP2 Note 1. The pin is used for final test purposes. In the application it should be connected directly to ground. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION regulator 4 output ignition input ignition output (active HIGH) reset output (active LOW) reset delay capacitor enable input for regulator 4 enable input for regulators 1 and 3 enable input for power switch hold output (active LOW) ground heat tab connection; note 1 regulator 2 output backup switch output supply voltage
MGU329
TDA3681
handbook, halfpage
VP2 20 REG3 19 n.c. 18 REG1 17 SW 16
1 2 3 4 5
REG4 IGNIN IGNOUT RES CRES EN4 EN1/3 ENSW HOLD
TDA3681TH
n.c. 15 VP1 14 BU 13 REG2 12 HEATTAB 11 6 7 8 9
10 GND
not connected power switch output regulator 1 output not connected regulator 3 output second supply voltage Fig.4 Pin configuration for TDA3681TH.
2002 Apr 10
7
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
FUNCTIONAL DESCRIPTION The TDA3681 is a multiple output voltage regulator with a power switch, intended for use in car radios with or without a microcontroller. Because of the low voltage operation of the car radio, low voltage drop regulators are used. Regulator 2 is in regulation when the backup voltage exceeds 6.5 V for the first time. When regulator 2 is switched on and its output voltage is within its voltage range, the reset output is disabled to release the microcontroller. The reset delay time before release can be extended by an external capacitor (CRES). This start-up feature is included to secure a smooth start-up of the microcontroller at first connection, without uncontrolled switching of regulator 2 during the start-up sequence. The charge on the backup capacitor can be used to supply regulator 2 for a short period when the external supply voltage drops to 0 V (the time depends on the value of the backup capacitor). The output stages of all switchable regulators have an extremely low noise behaviour and good stability, even for small values of the output capacitors. When both regulator 2 and the supply voltages (VP1 and VP2 > 4.5 V) are available, regulators 1 and 3 can be operated by means of one enable input. Regulator 4 and the power switch have a separate enable input. Pin HOLD is normally HIGH but is active LOW. Pin HOLD is connected to an open-collector NPN transistor and must have an external pull-up resistor to operate. The hold output is controlled by a low voltage detection circuit which, when activated, pulls the hold output LOW (enabled). The hold outputs of the regulators are connected to an OR gate inside the IC so that the hold circuit is activated when one or more regulators (1, 3 or 4) are out of regulation for any reason. Each regulator enable input controls its own hold triggering circuit, so that if a regulator is disabled or switched off, the hold circuit for that regulator is disabled. The hold circuit is also controlled by the temperature and load dump protection. Activating the temperature or load dump protection causes a hold (LOW) during the time that the protection is activated. When all regulators are switched off, the hold output is controlled by the battery line VP1, temperature protection and load dump protection. The hold circuit is enabled at low battery voltages. This indicates that it is not possible to get regulator 1 into regulation when switching it on: regulator 1 has the highest output voltage (8.5 V) of all switchable regulators. 2002 Apr 10 8
TDA3681
Therefore, regulator 1 is the most critical regulator with respect to an out of regulation condition caused by a low battery voltage. The hold function includes hysteresis to avoid oscillations when the regulator voltage crosses the hold threshold level. The hold output also becomes active when the power switch is in foldback protection mode, see Fig.8. The block diagram of the hold function is illustrated in Fig.5. All output pins are fully protected. The regulators are protected against load dump (regulators 1, 3 and 4 switch off at supply voltages >18 V) and short-circuit (foldback current protection). The power switch contains a current protection. However, this protection is delayed at short-circuit by the reset delay capacitor (it should be noted that this is the second function of the reset delay capacitor CRES). During this time, the output current is limited to a peak value of at least 3 A (after a delay, the power switch can deliver 1.8 A continuous if VP 18 V). In a normal situation, the voltage on the reset delay capacitor is approximately 3.5 V (depending on the temperature). The power switch output is approximately VP - 0.4 V. At operating temperature, the power switch can deliver at least 3 A. At high temperature, the switch can deliver approximately 2 A. During an overload condition or a short circuit (VSW < VP - 3.7 V), the voltage on the reset delay capacitor rises 0.6 V above the voltage of regulator 2. This rise time depends on the capacitor connected to pin CRES. During this time, the power switch can deliver more than 3 A. When regulator 2 is out of regulation and generates a reset, the power switch can only deliver 2 A and will immediately go into foldback protection. At supply voltages >17 V, the power switch is clamped at 16 V maximum (to avoid externally connected circuits being damaged by an overvoltage) and the power switch will switch off at load dump. Interfacing with the microcontroller (simple full or semi on/off logic applications) can be realized with an independent ignition Schmitt trigger and ignition output buffer (push-pull output). The timing diagrams are illustrated in Figs 6 and 7. The second supply voltage VP2 is used for the switchable regulators 3 and 4. This input can be connected to a lower supply voltage of 6 V to reduce the power dissipation of the TDA3681. A DC-to-DC converter could be used for this purpose.
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
handbook, full pagewidth
VP1
low battery detector
internal voltage reference 1
TDA3681
internal voltage reference 2
output stage REG1
enable EN1/3
output of regulation detector REGULATOR 1 output stage REG3
enable
output of regulation detector REGULATOR 3 output stage
OR
&
REG4
OR
HOLD output of regulation detector REGULATOR 4 TEMPERATURE PROTECTION LOAD DUMP buffer POWER SWITCH FOLDBACK MODE
MGL904
enable EN4
Fig.5 Block diagram of the hold circuit.
2002 Apr 10
9
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
handbook, full pagewidth
load dump
VP1
VBU
6.5 V 5.4 V
regulator 2 reset delay capacitor reset
5.0 V 0V 5.0 V 3.0 V 0V 5.0 V
Back-up Schmitt trigger and reset behaviour
load dump VP1 = VP2
50 V
ignition input
0V -100 V
ignition output
5.0 V 0V
Enable Schmitt trigger ignition
>22 V
VP1 = VP2 enable regulator 4
>1.8 V <1.3 V
>1.8 V enable regulator 1/3 <1.3 V
regulator 1 and 3 regulator 4 temperature active protection 150 C passive HOLD
HIGH LOW
Hold behaviour
MGL905
Fig.6 Timing diagram of ignition Schmitt triggers and hold circuit.
2002 Apr 10
10
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
handbook, full pagewidth
18 V
load dump
8.9 V 7.0 V 4.0 V
VP1 = VP2
1.8 V enable regulator 1/3 1.3 V 8.5 V
regulator 1
0V 5.0 V
regulator 3
0V >1.8 V enable regulator 4 <1.3 V 3.3 V
regulator 4
0V
VP and enable Schmitt trigger
load dump
16.9 V
VP
7.0 V 4.0 V
enable power switch power switch output
>1.8 V <1.3 V 16 V
0V
Power switch behaviour
MGL906
Fig.7 Timing diagram of regulators and power switch.
2002 Apr 10
11
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP1 operating reverse polarity jump start load dump protection VP2 supply voltage 2 operating reverse polarity jump start load dump protection Ptot Tstg Tamb Tj total power dissipation storage temperature ambient temperature junction temperature non-operating operating operating non-operating t 10 minutes t 50 ms; tr 2.5 ms - - - - - -55 -40 -40 18 18 30 50 62 non-operating t 10 minutes t 50 ms; tr 2.5 ms PARAMETER supply voltage 1 - - - - 18 18 30 50 CONDITIONS MIN.
TDA3681
MAX. V V V V V V V V W
UNIT
+150 +85 +150
C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-c) Rth(j-a) PARAMETER thermal resistance from junction to case thermal resistance from junction to ambient in free air CONDITIONS VALUE 2 50 UNIT K/W K/W
QUALITY SPECIFICATION In accordance with "General Quality Specification For Integrated Circuits (SNW-FQ-611D)".
2002 Apr 10
12
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
CHARACTERISTICS VP = VP1 =VP2 = 14.4 V; Tamb = 25 C; measured in test circuits of Figs 10 and 11; unless otherwise specified. SYMBOL Supplies VP1 supply voltage 1 operating reverse polarity regulator 2 on jump start load dump protection VP2 supply voltage 2 operating reverse polarity regulator 2 on jump start load dump protection Vbat(loaddump) battery overvoltage shutdown Iq(tot) total quiescent supply current t 10 minutes t 50 ms; tr 2.5 ms VP1 and/or VP2 VP = 12.4 V; note 2 VP = 14.4 V; note 2 VP1 rising VP1 falling non-operating 6.5 - 0 - - 18 - - 6.5 4.0 - 1.4 0.9 IREG = ISW = 1 mA VEN = 5 V VP1 rising; IREG1 = 50 mA; note 3 VP1 falling; IREG1 = 50 mA; note 3 - 1 14.4 - - - - 20 105 110 18 18 50 30 50 22 145 150 V V V V V V A A V V V non-operating note 1 t 10 minutes t 50 ms; tr 2.5 ms 9.5 - 4 - - 14.4 - 14.4 - - 18 18 50 30 50 V V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Schmitt trigger for power supply (regulators 1, 3 and 4) Vth(r) Vth(f) Vhys Vth(r) Vth(f) Vhys ILI Vth(r) Vth(f) rising threshold voltage falling threshold voltage hysteresis voltage 7.0 4.5 2.5 7.5 5.0 - 2.4 1.9 - 20
Schmitt trigger for enable input (regulators 1, 3, 4 and power switch) rising threshold voltage falling threshold voltage hysteresis voltage input leakage current 1.8 1.3 0.5 5 V V V A V V
Reset trigger level of regulator 2 rising threshold voltage falling threshold voltage 4.43 4.4 VREG2 - 0.15 VREG2 - 0.1 VREG2 - 0.25 VREG2 - 0.13
Schmitt triggers for hold circuit output Vth(r)(REG1) Vth(f)(REG1) Vhys(REG1) rising threshold voltage of regulator 1 falling threshold voltage of regulator 1 hysteresis voltage due to regulator 1 VP1 rising; note 3 VP1 falling; note 3 - 7.67 - VREG1 - 0.15 VREG1 - 0.075 V VREG1 - 0.35 - 0.2 - V V
2002 Apr 10
13
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
SYMBOL Vth(r)(REG3) Vth(f)(REG3) Vhys(REG3) Vth(r)(REG4) Vth(f)(REG4) Vhys(REG4) Vth(r)(VP) Vth(f)(VP) Vhys(VP) PARAMETER rising threshold voltage of regulator 3 falling threshold voltage of regulator 3 hysteresis voltage due to regulator 3 rising threshold voltage of regulator 4 falling threshold voltage of regulator 4 hysteresis voltage due to regulator 4 rising threshold voltage of supply voltage falling threshold voltage of supply voltage hysteresis voltage of supply voltage VEN = 0 V VEN = 0 V VEN = 0 V VP2 rising; note 3 VP2 falling; note 3 CONDITIONS VP2 rising; note 3 VP2 falling; note 3 MIN. - 4.3 - - 2.7 - 9.1 9.0 - TYP.
TDA3681
MAX.
UNIT
VREG3 - 0.15 VREG3 - 0.075 V VREG3 - 0.35 - 0.2 - V V
VREG4 - 0.15 VREG4 - 0.075 V VREG4 - 0.3 0.15 9.7 9.4 0.3 - - 10.3 9.8 - V V V V V
Reset and hold buffer Isink(L) ILO Isource(H) tr tf Reset delay Ich Idch Vth(r)(RES) Vth(f)(RES) td(RES) td(SW) reset delay capacitor charge current reset delay capacitor discharge current rising voltage threshold reset signal falling voltage threshold reset signal delay reset signal delay power switch foldback protection CRES = 47 nF; note 5 CRES = 47 nF; note 6 VCRES = 0 V VCRES = 3 V; VP1 = VP2 = 4.3 V 2 1.0 2.5 1.0 20 8 4 1.6 3.0 1.2 35 17.6 8 - 3.5 1.4 70 40 A mA V V ms ms LOW-level sink current output leakage current HIGH-level source current rise time fall time VRES 0.8 V; VHOLD 0.8 V VP2 = 14.4 V; VHOLD = 5 V VP2 = 14.4 V; VRES = 5 V note 4 note 4 2 - 240 - - - 0.1 400 7 1 - 5 900 50 50 mA A A s s
Regulator 1 (IREG1 = 5 mA; unless otherwise specified) Vo(off) Vo(REG1) Vline Vload 2002 Apr 10 output voltage off output voltage line regulation load regulation 1 mA IREG1 600 mA 9.5 V VP1 18 V 9.5 V VP1 18 V 1 mA IREG1 600 mA 14 - 8.0 8.0 - - 1 8.5 8.5 2 20 400 9.0 9.0 75 85 mV V V mV mV
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
SYMBOL Iq SVRR Vdrop(REG1) Im(REG1) Isc(REG1) PARAMETER quiescent current supply voltage ripple rejection drop-out voltage current limit short-circuit current CONDITIONS IREG1 = 600 mA fi = 3 kHz; Vi = 2 V (p-p) MIN. - 60 25 70 0.4 1.2 800 TYP. 60 - 0.7 - -
TDA3681
MAX.
UNIT mA dB V A mA
IREG1 = 550 mA; VP1 = 8.55 V; - note 7 VREG1 > 7 V; note 8 RL 0.5 ; note 9 0.5 mA IREG2 300 mA 7 V VP1 18 V 18 V VP1 50 V; IREG2 150 mA 0.65 250
Regulator 2 (IREG2 = 5 mA; unless otherwise specified) Vo(REG2) output voltage 4.75 4.75 4.75 - - - - 50 5.0 5.0 5.0 2 15 20 - 55 0.4 0.8 0.2 0.8 0.37 120 5.25 5.25 5.25 50 75 50 100 - 0.6 1.2 0.5 1.0 - - V V V mV mV mV mV dB V V V V A mA
Vline Vload SVRR Vdrop(REG2)
line regulation load regulation supply voltage ripple rejection drop-out voltage
6 V VP1 18 V 6 V VP1 50 V 1 mA IREG2 150 mA 1 mA IREG2 300 mA fi = 3 kHz; Vi = 2 V (p-p)
IREG2 = 100 mA; VP1 = 4.75 V; - note 7 IREG2 = 200 mA; VP1 = 5.75 V; - note 7 IREG2 = 100 mA; VBU = 4.75 V; - note 10 IREG2 = 200 mA; VBU = 5.75 V; - note 10
Im(REG2) Isc(REG2)
current limit short-circuit current
VREG2 > 4.5 V; note 8 RL 0.5 ; note 9
0.32 95 -
Regulator 3 (IREG3 = 5 mA; unless otherwise specified) Vo(off) Vo(REG3) Vline Vload Iq SVRR Vdrop(REG3) Im(REG3) Isc(REG3) output voltage off output voltage line regulation load regulation quiescent current supply voltage ripple rejection drop-out voltage current limit short-circuit current 1 mA IREG3 1400 mA 7 V VP1 and/or VP2 18 V 7 V VP1 and/or VP2 18 V 1 mA IREG3 1400 mA IREG3 = 1400 mA fi = 3 kHz; Vi = 2 V (p-p) IREG3 = 1400 mA ; VP2 = 6 V; note 7 VREG3 > 4.5 V; note 8 RL 0.5 ; note 9 1 5.0 5.0 2 20 19 70 1 1.7 750 400 5.25 5.25 50 150 45 - 1.5 - - mV V V mV mV mA dB V A mA 4.75 4.75 - - - 60 - 1.5 430
2002 Apr 10
15
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
SYMBOL PARAMETER CONDITIONS MIN. - 1 mA IREG4 1 A 6.5 V VP1 and/or VP2 18 V Vline Vload Iq SVRR Vdrop(REG4) Im(REG4) Isc(REG4) Power switch Vdrop(SW) drop-out voltage ISW = 1 A; VP1 = 13.5 V; note 11 ISW = 1.8 A; VP1 = 13.5 V; note 11 IDC(SW) Vclamp(SW) IM(SW) Vfb(SW) Isc(SW) continuous current clamping voltage peak current flyback voltage behaviour short-circuit current VP1 = 16 V; VSW = 13.5 V VP1 17 V; 1 mA < ISW < 1.8 A VP1 < 17 V; notes 6, 12 and 13 ISW = -100 mA VP1 = 14.4 V; VSW < 1.2 V; note 13 - - 1.8 13.5 3 - 0.5 0.45 1.0 2.0 15.0 - VP1 + 3 1.7 0.65 1.8 - 16.0 - 22 - line regulation load regulation quiescent current supply voltage ripple rejection drop-out voltage current limit short-circuit current 6.5 V VP1 and/or VP2 18 V 1 mA IREG4 1 A IREG4 = 1 A fi = 3 kHz; Vi = 2 V (p-p) IREG4 = 1 A; VP2 = 5 V; note 7 VREG4 > 3.0 V; note 8 RL 0.5 ; note 9 3.14 3.14 - - - 60 - 1.1 470 TYP.
TDA3681
MAX.
UNIT
Regulator 4 (IREG4 = 5 mA; unless otherwise specified) Vo(off) Vo(REG4) output voltage off output voltage 1 3.3 3.3 2 20 15 70 1.7 1.5 750 400 3.46 3.46 50 50 40 - 2.4 - - mV V V mV mV mA dB V A mA
V V A V A V A
Backup switch IDC(BU) Vclamp(BU) Ir(BU) Vth(r)(IGNIN) Vth(f)(IGNIN) Vhys(IGNIN) ILI Ii(clamp) VIH(clamp) continuous current clamping voltage reverse current VBU > 5 V VP1 16.7 V; IREG2 = 100 mA VP1 = 0 V; VBU = 12.4 V VP1 > 3.5 V VP1 > 3.5 V VP > 3.5 V VIGNIN = 5 V VIGNIN > 50 V 0.3 - - 1.9 1.7 0.1 - - VP1 0.35 - - 2.2 2.0 0.2 - - - - 16 900 A V A V V V A mA V
Schmitt trigger for enable ignition input rising threshold voltage of ignition input falling threshold voltage of ignition input hysteresis voltage input leakage current input clamp current HIGH-level input clamping voltage 2.5 2.3 0.5 1.0 50 50
2002 Apr 10
16
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
SYMBOL VIL(clamp) PARAMETER LOW-level input clamping voltage CONDITIONS MIN. -0.6 - TYP. 0
TDA3681
MAX.
UNIT V
Ignition buffer VOL VOH IOL IOH ILO tPLH tPHL LOW-level output voltage IIGNOUT = 0 mA HIGH-level output voltage HIGH-level output current output leakage current (source) LOW-to-HIGH propagation time HIGH-to-LOW propagation time IIGNOUT = 0 mA 0 4.5 0.45 0.2 5.0 0.8 0.8 5.25 - - 1.0 500 500 V V mA mA A s s
LOW-level output current VIGNOUT 0.8 V VIGNOUT 4.5 V VIGNOUT = 5 V; VIGNIN = 0 V VIGNIN rising from 1.7 to 2.5 V
-0.45 -2.0 - - - - -
VIGNIN falling from 2.5 to 1.7 V -
Temperature protection Tj(sd) Tj(hold) Notes 1. Minimum operating voltage, only if VP1 has exceeded 6.5 V. 2. The total quiescent current is measured in the standby mode. Therefore, the enable inputs of regulators 1, 3, 4 and the power switch are grounded and RL(REG2) = ; see Figs 10 and 11. 3. The voltage of the regulator drops as a result of a VP1 drop for regulators 1 and 2. Regulators 3 and 4 drop as a result of VP2 drop. 4. The rise and fall times are measured with a 10 k pull-up resistor and a 50 pF load capacitor. C 3 5. The delay time depends on the value of the reset delay capacitor: t d(RES) = ----- x V C(th) = C x ( 750 x 10 ) [ s ] I ch C 3 6. The delay time depends on the value of the reset delay capacitor: t d(SW) = ----- x V C(th) = C x ( 375 x 10 ) [ s ] I ch 7. The drop-out voltage of regulators 1 and 2 is measured between pins VP1 and REGn. The drop-out voltage of regulators 3 and 4 is measured between pins VP2 and REGn. 8. At current limit, Im(REGn) is held constant (see Fig.8). 9. The foldback current protection limits the dissipated power at short-circuit (see Fig.8). 10. The drop-out voltage is measured between pins BU and REG2. 11. The drop-out voltage of the power switch is measured between pins VP1 and SW. 12. The maximum output current of the power switch is limited to 1.8 A when the supply voltage exceeds 18 V. 13. At short-circuit, Isc(SW) of the power switch is held constant to a lower value than the continuous current after a delay of at least 10 ms. junction temperature for shutdown junction temperature for hold trigger 150 150 160 160 170 170 C C
2002 Apr 10
17
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
handbook, halfpage
MGL907
handbook, halfpage
8.5 V
Vo(REG2) 5.0 V
MGL908
Vo(REG1)
Isc(REG2) IREG2 Isc(REG1) IREG1 Im(REG1)
Im(REG2)
a. Regulator 1.
b. Regulator 2.
handbook, halfpage
handbook, halfpage
Vo(REG3) 5.0 V
MGL909
Vo(REG4) 3.3 V
MGL910
Isc(REG3) IREG3
Im(REG3)
Isc(REG4) IREG4
Im(REG4)
c. Regulator 3.
d. Regulator 4.
Fig.8 Foldback current protection of the regulators.
handbook, full pagewidth
MGR931
VSW VP - 3.3 V
generates hold 2VBE 1A
delayed
not delayed
>1.8 A ISW
>3 A
Fig.9 Current protection of the power switch.
2002 Apr 10
18
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TEST AND APPLICATION INFORMATION Test information
TDA3681
handbook, full pagewidth
supply voltage 1 17 16 C1 220 nF
(1)
power switch output C2 10 F regulator 2 output C3 10 F 5V RL(REG2) 5 k RL(SW) 12 k
VP1
enable input power switch 11 VENSW enable input regulator 1/3 VEN1/3 enable input regulator 4 9 VEN4 2 15
10
1
regulator 1 output
8.5 V C4 10 F RL(REG1) 10 k 5V C5 10 F RL(REG3) 5 k
regulator 3 output
supply voltage 2 3 VP2 C7 220 nF
(1)
TDA3681J TDA3681JR
4
regulator 4 output
3.3 V C6 10 F RL(REG4) 5 k
reset delay capacitor C8 47 nF
8 7
reset output
(3)
C9 50 pF
backup VBU R6 VIGNIN 10 k
(2)
14
hold output 12
R3 10 k
(3)
C10 100 F ignition input C11 1 nF ignition output 6 13 ground
C12 50 pF
5
MGL911
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability. (2) A minimum capacitor of 1 F for backup supply is required for stability. (3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
Fig.10 Test circuit of TDA3681J and TDA3681JR.
2002 Apr 10
19
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
handbook, full pagewidth
supply voltage 1 14 16 C1 220 nF
(1)
power switch output C2 10 F regulator 2 output C3 10 F 5V RL(REG2) 5 k RL(SW) 12 k
VP1
enable input power switch 8 VENSW enable input regulator 1/3 VEN1/3 enable input regulator 4 6 VEN4 19 12
7
17
regulator 1 output
8.5 V C4 10 F RL(REG1) 10 k 5V C5 10 F RL(REG3) 5 k
regulator 3 output
TDA3681TH
supply voltage 2 20 VP2 C7 220 nF
(1)
1
regulator 4 output
3.3 V C6 10 F RL(REG4) 5 k
reset delay capacitor C8 47 nF
5 4
reset output
(3)
C9 50 pF
backup VBU R6 VIGNIN 10 k
(2)
13
hold output 9
R3 10 k
(3)
C10 100 F ignition input C11 1 nF 2 11 heat tab 10 ground ignition output 3
C12 50 pF
MGU355
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability. (2) A minimum capacitor of 1 F for backup supply is required for stability. (3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
Fig.11 Test circuit of TDA3681TH.
2002 Apr 10
20
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
Application information NOISE Table 1 Noise figures NOISE FIGURE (V)(1) REGULATOR 1 2 3 4 Note 1. Measured at a bandwidth of 30 kHz. The noise on the supply line depends on the value of the supply capacitor and is caused by a current noise (the output noise of the regulators is translated to a current noise by the output capacitors). The noise is minimal when a high frequency capacitor of 220 nF in parallel with an electrolytic capacitor of 100 F is connected directly to the supply pins VP1, VP2 and GND. STABILITY The regulators are stabilized by the externally connected output capacitors. Co = 10 F Co = 47 F 170 440 120 85 110 240 100 70 Co = 100 F 110 190 80 55
TDA3681
The output capacitors can be selected by using the graphs given in Figs 12 and 13. When an electrolytic capacitor is used, its temperature behaviour can cause oscillations at a low temperature. The two examples below show how an output capacitor value is selected.
Example 1
Regulators 1, 3 and 4 are stabilized with an electrolytic output capacitor of 220 F (ESR = 0.15 ). At Tamb = -30 C, the capacitor value is decreased to 73 F and the ESR is increased to 1.1 . The regulator remains stable at Tamb = -30 C (see Fig.12).
Example 2
Regulator 2 is stabilized with a 10 F electrolytic capacitor (ESR = 3 ). At Tamb = -30 C, the capacitor value is decreased to 3 F and the ESR is increased to 23.1 . As can be seen from Fig.13, the regulator will be unstable at Tamb = -30 C.
Solution
To avoid problems with stability at low temperatures, the use of tantalum capacitors is recommended. Use a tantalum capacitor of 10 F or a larger electrolytic capacitor.
handbook, halfpage
20
MGL912
handbook, halfpage
ESR () 15 maximum ESR 10
14 ESR () 12 10 8 6 4
MGL913
maximum ESR
stable region
5
stable region
2 0 minimum ESR
0 0.1 1 10 C (F) 100
-2 0.22 1 10 C (F) 100
Fig.12 Curve for selecting the value of the output capacitor for regulators 1, 3 and 4.
Fig.13 Curve for selecting the value of the output capacitor for regulator 2.
2002 Apr 10
21
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
PACKAGE OUTLINES DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm)
TDA3681
SOT243-3
non-concave x Dh
D Eh
view B: mounting base side
d
A2
B j E A
L3 L Q 1 Z e e1 bp wM 17 m e2 c vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 8.4 7.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.6 w 0.25 x 0.03 Z (1) 2.00 1.45
1.27 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-3 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-12-16 99-12-17
2002 Apr 10
22
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
DBS17P: plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm)
SOT475-1
non-concave D x Dh
Eh
view B: mounting base side
d
A2
B j E A
L3
L
Q
1 Z e e1 bp wM
17 c m e2 vM
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 17.0 15.5 A2 4.6 4.4 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT475-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-20 99-12-17
2002 Apr 10
23
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
TDA3681
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-2
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 20 Z e bp 11 wM (A3) A 10
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.5 2.0 8 0
+0.12 0.53 0.32 16.0 13.0 -0.02 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT418-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 98-02-25 99-11-12
2002 Apr 10
24
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
TDA3681
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 25
2002 Apr 10
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
Suitability of IC packages for wave, reflow and dipping soldering methods
TDA3681
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
2002 Apr 10
26
Philips Semiconductors
Product specification
Multiple voltage regulator with switch and ignition buffer
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
TDA3681
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Apr 10
27
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753503/05/pp28
Date of release: 2002
Apr 10
Document order number:
9397 750 09266

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