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Data sheet acquired from Harris Semiconductor SCHS070B - Revised June 2003
The CD4508B types are supplied in 24-lead hermetic dual-in-line ceramic packages (F3A suffix), 24-lead dual-in-line plastic packages (E suffix), 24-lead small-outline packages (M, M96, and NSR suffixes), and 24-lead thin shrink small-outline packages (PW and PWR suffixes). The CD4508B is similar to industry type MC14508.
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device CD4508BD3 CD4508BE CD4508BF3A CD4508BM CD4508BM96 CD4508BNSR CD4508BPW CD4508BPWR
(1)
Status (1) ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE
Package Type CDIP SB PDIP CDIP SOIC SOIC SO TSSOP TSSOP
Package Drawing JD N J DW DW NS PW PW
Pins Package Eco Plan (2) Qty 24 24 24 24 24 24 24 24 1 15 1 25 2000 2000 60 2000 None Pb-Free (RoHS) None Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS) Pb-Free (RoHS)
Lead/Ball Finish Call TI CU NIPDAU Call TI CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-NC-NC-NC Level-NC-NC-NC Level-NC-NC-NC Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-250C-1 YEAR/ Level-1-235C-UNLIM Level-2-260C-1 YEAR/ Level-1-235C-UNLIM Level-1-250C-UNLIM Level-1-250C-UNLIM
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MCDI004A - JANUARY 1995 - REVISED NOVEMBER 1997
J (R-GDIP-T**)
24 PINS SHOWN B 24 13
CERAMIC DUAL-IN-LINE PACKAGE
C
1
0.065 (1,65) 0.045 (1,14) 0.090 (2,29) 0.060 (1,53)
12 Lens Protrusion (Lens Optional) 0.010 (0.25) MAX 0.175 (4,45) 0.140 (3,56) A
Seating Plane 0.018 (0,46) MIN 0.022 (0,56) 0.014 (0,36) 0.125 (3,18) MIN 0.012 (0,30) 0.008 (0,20) 28 WIDE NARR WIDE NARR 32 WIDE NARR 40 WIDE
0.100 (2,54)
PINS ** DIM "A" MAX MIN "B" "C" MAX MIN MAX MIN NARR
24
0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53) 1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 4040084/C 10/97
NOTES: A. B. C. D. E.
All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin). This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification.
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
MECHANICAL DATA
MCDI005 - JANUARY 1998
JD (R-CDIP-T**)
24 PINS SHOWN A 24 13
CERAMIC SIDE-BRAZE DUAL-IN-LINE PACKAGE
0.590 (15,00) TYP
1 0.065 (1,65) 0.045 (1,14) 0.075 (1,91) MAX (4 Places)
12
0.175 (4,45) 0.140 (3,56)
0.620 (15,75) 0.590 (14,99)
Seating Plane 0.020 (0,51) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.125 (3,18) MIN 0- 15 0.012 (0,30) 0.008 (0,20)
PINS ** DIM A MAX
24 1.250 (31,75)
28 1.450 (36,83)
40 2.050 (52,07)
48 2.435 (61,85)
52 2.650 (67,31) 4040087/B 04/95
NOTES: A. B. C. D.
All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package is hermetically sealed with a metal lid. The terminals are gold-plated.
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI006B - SEPTEMBER 2001 - REVISED APRIL 2002
N (R-PDIP-T24)
1.222 (31,04) MAX 24 13
PLASTIC DUAL-IN-LINE
0.360 (9,14) MAX
1 0.070 (1,78) MAX
12
0.200 (5,08) MAX 0.020 (0,51) MIN 0.425 (10,80) MAX
Seating Plane 0.125 (3,18) MIN
0.100 (2,54) 0'-15' 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051-3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-010
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI008 - OCTOBER 1994
N (R-PDIP-T**)
24 PIN SHOWN A 24 13
PLASTIC DUAL-IN-LINE PACKAGE
0.560 (14,22) 0.520 (13,21)
1 0.060 (1,52) TYP
12 0.200 (5,08) MAX 0.020 (0,51) MIN
0.610 (15,49) 0.590 (14,99)
Seating Plane
0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) M
0.125 (3,18) MIN 0.010 (0,25) NOM
0- 15
PINS ** DIM A MAX
24 1.270 (32,26) 1.230 (31,24)
28 1.450 (36,83) 1.410 (35,81)
32 1.650 (41,91) 1.610 (40,89)
40 2.090 (53,09) 2.040 (51,82)
48 2.450 (62,23) 2.390 (60,71)
52 2.650 (67,31) 2.590 (65,79) 4040053 / B 04/95
A MIN
NOTES: A. B. C. D.
All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Falls within JEDEC MS-011 Falls within JEDEC MS-015 (32 pin only)
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C - JANUARY 1995 - REVISED FEBRUARY 1999
PW (R-PDSO-G**)
14 PINS SHOWN
PLASTIC SMALL-OUTLINE PACKAGE
0,65 14 8
0,30 0,19
0,10 M
0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 A 7 0- 8 0,75 0,50
Seating Plane 1,20 MAX 0,15 0,05 0,10
PINS ** DIM A MAX
8
14
16
20
24
28
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
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