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(R)
Thermal Data
MULTIWATT Family 8,11,15 leads (JEDEC MO-048 )
8 leads
11 leads PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 3.9 W/cmC 3.9 W/cmC
15 leads
leadframe slug
copper high thermal conductivity Cu soft solder ( tin / lead ) epoxy resin
0.5 mm 1.5 mm
die attach
15-50 m
0.2 W/cmC
molding compound
3 mm
0.0063W/cmC
Typical assembly configuration before molding :
Charts enclosed : 1) Rth(j-c) vs. die size and dissipating area 2) Rth(j-a) vs on board heat sink area 3) Zth(j-a) vs time width and die size
February 1998 1/2
Thermal Data
Rth(j-c) (C/W)
MULTIWATT Family
Tcase = 150 C
5
4
diss. area silicon
3
1)
2
die thickness = 375 m solder thickness = 25 m
1
0 1
Rth(j-a) (C/W) 50
2
3
4
5
6
Dissipating area on die ( mm )
die size = 20.000 sq.mils dissipating area = 2000 sq.mils
40
floating in air mounted on PC board
30
2)
20
mounted on TH17023 heat sink
10
0 0 1 2 3 Dissipated Power ( Watt ) 4 5
Transient Thermal Resistance (C/W) 100
SINGLE PULSE
30
10
Pd = 2 Watt, mounted on board die size = 35.000 sq.mils dissipating area = 2.000 sq.mils
3
3)
1
0.3
Pd = 2 Watt, mounted on board die size = 175x195 sq.mils dissipating area =16.000 sq.mils
0.1
0.03 0.001
0.01
0.1
1 Time or pulse width ( s )
10
100
1,000
2/2

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