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| BUZ 91 Not for new design SIPMOS (R) Power Transistor * N channel * Enhancement mode * Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 91 VDS 600 V ID 8.5 A RDS(on) 0.8 Package TO-220 AB Ordering Code C67078-S1342-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 8.5 Unit A ID IDpuls 34 TC = 32 C Pulsed drain current TC = 25 C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 8 13 mJ ID = 8 A, VDD = 50 V, RGS = 25 L = 16.3 mH, Tj = 25 C Gate source voltage Power dissipation 570 VGS Ptot 20 150 V W TC = 25 C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 0.83 75 E 55 / 150 / 56 C K/W 1 07/96 BUZ 91 Not for new design Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 600 3 0.1 10 10 0.7 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 A VDS = 600 V, VGS = 0 V, Tj = 25 C VDS = 600 V, VGS = 0 V, Tj = 125 C Gate-source leakage current IGSS 100 nA 0.8 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 5 A Semiconductor Group 2 07/96 BUZ 91 Not for new design Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 5 8.5 1400 180 65 - S pF 2100 270 100 ns 20 30 VDS 2 * ID * RDS(on)max, ID = 5 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Rise time tr 70 110 VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Turn-off delay time td(off) 250 330 VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Fall time tf 80 100 VDD = 30 V, VGS = 10 V, ID = 3 A RGS = 50 Semiconductor Group 3 07/96 BUZ 91 Not for new design Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TC = 25 C Inverse diode direct current,pulsed A 1.1 480 6.5 8.5 34 V 1.2 ns C Values typ. max. Unit ISM VSD trr Qrr TC = 25 C Inverse diode forward voltage VGS = 0 V, IF = 16 A Reverse recovery time VR = 100 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 100 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 07/96 BUZ 91 Not for new design Power dissipation Ptot = (TC) Drain current ID = (TC) parameter: VGS 10 V 9 A 160 W Ptot ID 120 7 6 100 5 80 4 60 3 2 1 0 20 40 60 80 100 120 C 160 0 20 40 60 80 100 120 C 160 40 20 0 0 TC TC Safe operating area ID = (VDS) parameter: D = 0.01, TC = 25C 10 2 Transient thermal impedance Zth JC = (tp) parameter: D = tp / T 10 0 A t = 2.9s p 10 s K/W ID 10 1 DS ZthJC 10 -1 100 s /I D DS (on ) =V 1 ms 10 ms R D = 0.50 0.20 10 0 10 -2 0.10 0.05 single pulse 0.02 0.01 DC 10 -1 0 10 10 -3 -7 10 10 1 10 2 V 10 3 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 s 10 0 VDS tp Semiconductor Group 5 07/96 BUZ 91 Not for new design Typ. output characteristics ID = (VDS) parameter: tp = 80 s 19 A 16 Typ. drain-source on-resistance RDS (on) = (ID) parameter: VGS 2.6 Ptot = 150W k i l j hg f e dVGS [V] a 4.0 2.2 a b c ID 14 12 c RDS (on) b 4.5 c 5.0 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 VGS [V] = a 4.0 4.5 b 5.0 c 5.5 d 6.0 e f 6.5 7.0 g 7.5 h i j k 8.0 9.0 10.0 20.0 d 5.5 e 6.0 f 6.5 10 8 6 4 2 0 0 a g 7.0 h 7.5 i j 8.0 9.0 d e f g h i j k b k 10.0 l 20.0 0.2 0.0 V 40 0 4 8 12 16 20 24 28 32 2 4 6 8 10 12 14 A 18 VDS ID Typ. transfer characteristics ID = f (VGS) Typ. forward transconductance gfs = f (ID) parameter: tp = 80 s VDS2 x ID x RDS(on)max 10 A parameter: tp = 80 s, VDS2 x ID x RDS(on)max 12 S 10 ID 8 7 gfs 9 8 6 5 4 3 7 6 5 4 3 2 2 1 0 0 1 0 1 2 3 4 5 6 7 8 V 10 0 1 2 3 4 5 6 7 A ID 9 VGS Semiconductor Group 6 07/96 BUZ 91 Not for new design Drain-source on-resistance RDS (on) = (Tj ) parameter: ID = 5 A, VGS = 10 V 3.6 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 1 mA 4.6 V 4.0 RDS (on) 2.8 2.4 98% VGS(th) 3.6 3.2 2.8 typ 2.0 1.6 1.2 0.8 2.4 2.0 2% 98% typ 1.6 1.2 0.8 0.4 0.0 -60 0.4 0.0 -60 -20 20 60 100 C 160 -20 20 60 100 C 160 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 1 Forward characteristics of reverse diode IF = (VSD) parameter: Tj , tp = 80 s 10 2 nF C 10 0 A IF Ciss 10 1 Coss 10 -1 10 0 Crss Tj = 25 C typ Tj = 150 C typ Tj = 25 C (98%) Tj = 150 C (98%) 10 -2 0 5 10 15 20 25 30 V VDS 40 10 -1 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 07/96 BUZ 91 Not for new design Avalanche energy EAS = (Tj ) parameter: ID = 8 A, VDD = 50 V RGS = 25 , L = 16.3 mH 600 mJ Typ. gate charge VGS = (QGate) parameter: ID puls = 12 A 16 V 500 EAS 450 400 VGS 12 10 350 300 250 6 200 150 100 2 50 0 20 0 40 60 80 100 120 C 160 0 20 40 60 80 100 130 4 8 0,2 VDS max 0,8 VDS max Tj Q Gate Drain-source breakdown voltage V(BR)DSS = (Tj ) 710 V 680 V(BR)DSS 660 640 620 600 580 560 540 -60 -20 20 60 100 C 160 Tj Semiconductor Group 8 07/96 BUZ 91 Not for new design Package Outlines TO-220 AB Dimension in mm Semiconductor Group 9 07/96 |
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