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E2D0048-39-22
Semiconductor MSC1157
Semiconductor Speaker Drive Amplifier
This version: Feb. 1999 MSC1157 Previous version: May. 1997
GENERAL DESCRIPTION
The MSC1157, designed specifically to operate at a low voltage with low current consumption, is a power amplifier developed for driving a speaker for a voice IC. The voltage gains can be adjusted over a range of up to ten. The differential output can directly drive a speaker without any output coupling capacitors. The MSC 1157, because of its ability to stand by, is ideally suitable for portable equipment applications powered by a battery.
FEATURES
* Low voltage operation * Low current dissipation Operating current * Standby function * High output current * Differential outputs : 2.0 to 6.0 V (Single power supply) : : : : 1.6mA without load (typ.) Current dissipation less than 1 mA in standby 350mA peak A speaker can be directly connected between differential outputs. : Gain can be adjusted by use of an external resistor.
* Adjustable gain * Package options: 8-pin plastic DIP (DIP8-P-300-2.54) (Product name : MSC1157RS) 8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name : MSC1157MS-K) Chip
BLOCK DIAGRAM
VCC Logic VCC
STBY SEL
VCC
52 kW
+ -
VR
SP 5 kW SP
50 kW
+
AIN GND
-
20 kW 100 kW
5 kW
1/13
Semiconductor
MSC1157
PIN CONFIGURATION (TOP VIEW)
VR
1
8
SEL
AIN
2
7
STBY
SP
3
6
SP
GND
4 8-Pin Plastic DIP or 8-Pin Plastic SOP
5
VCC
PIN DESCRIPTIONS
Pin 5 4 2 Symbol Type VCC GND AIN -- -- I Power supply pin. Ground pin. Signal input pin for analog signal inputs, etc. Digital input pins. Setting these pins configures the standby status. See the table below for how to set the pins. SEL 0 STBY 0 1 Clock 0 1 7, 8 STBY, SEL I Clock 1 Clock 0 1 Clock Status Operation Standby Operation Standby Operation Operation Operation Operation
Unstable Operation
Description
Applying a clock between 32kHz and 4MHz to either the STBY or the SEL pin leads the IC to operation status regardless of the status set at the other pin. Applying clocks to both of the pins at the same time may cause malfunction. Refer to the section, RECOMMENDED OPERATING CONDITIONS since clock frequencies are changed by setting the SEL pin. Bias output pin for internal circuits. This pin is at GND potential during standby. 1 3 6 VR SP SP O O O Connecting a capacitor between VR and the GND pin reduces the pop-up noise at power on and improves the ripple elimination ratio. Speaker output pin. This pin outputs a negative phase with respect to the input signal. Speaker output pin. This pin outputs a positive phase with respect to the input signal.
2/13
Semiconductor ABSOLUTE MAXIMUM RATINGS
Parameter Power Supply Voltage Input Voltage Maximum Output Current Power Dissipation Junction Temperature Storage Temperature
Symbol
MSC1157
Condition Ta=25C Ta=25C Ta=25C Ta=25C -- --
Rating -0.3 to +6.5 -0.3 to VCC+0.3 (*1) 400 470 400 125 -55 to +150
Unit V V
Remark VCC STBY AIN, SEL SP, SP DIP type SOP type Chip
VCC VIN IOMAX PD TjMAX TSTG
mA mW mW C C
*1 Avoid shorting the output pins (SP and SP) to VCC or GND because the IC may be damaged.
RECOMMENDED OPERATING CONDITIONS
Parameter Power Supply Voltage Load Impedance (*2) Peak Load Current "H" Input Voltage "L" Input Voltage
Symbol
Condition -- -- -- For STBY and SEL pins SEL = "L" At clock input
Min. 2.0 8.0 -- 0.7 VCC -- 32 k
Max. 6.0 -- 350 -- 0.3 VCC 4.096 M
Unit V W mA V V
VCC RL IO-P VIH VIL
STBY Operating Frequency (*3)
fSTBY
VCC 2.4 V SEL = "H" At clock input VCC 2.4 V 32 k -20 1M +70
Hz
Operating Temperature
Top
--
C
*2 A speaker of 8 W (standard) or more should be used. *3 The input of clocks may cause a little noise in output waveforms. It is recommended to input the DC voltage to inprove voice quality.
3/13
Semiconductor ELECTRICAL CHARACTERISTICS
Parameter AIN Input Resistance Voltage Gain
Symbol
MSC1157
Unless otherwise specified, Ta=25C, VCC=2 to 6 V Condition -- AINAESP SPAESP AINAE(Between SP-SP) VCC=3 V, f=1 kHz RL=8 W, THD10% VCC=6 V, f=1 kHz RL=32 W, THD10% VCC=3 V, RL=8 W f=1 kHz, POUT=45 mW VCC=6 V, RL=32 W f=1 kHz, POUT=125 mW f=1 kHz, C2=4.7 mF Min. 14 13.44 -1.94 19.46 100 300 -- -- 30 0.53 2.49 -- VCC-1.15 -- -- -- 18 1.1 -- Typ. 20 14 0 20 178 440 1.2 0.37 43 0.65 2.61 -- VCC-1.04 0.17 -- -- 25 1.6 -- Max. 26 14.49 +1.58 20.51 -- -- -- -- -- 0.77 2.73 30 -- 0.3 0.1 0.1 32 2.4 1.0 mW mW % % dB V mV V V mA mA kW mA mA dB Unit kW
RIN AV1 AV2 AV3 POUT1
Output Power POUT2 THD1 Total Harmonic Distortion THD2 Ripple Elimination Ratio Output DC Voltage (*4) Output Offset Voltage Output "H" Voltage Output "L" Voltage STBY, SEL Input Current VR Equivalent Resistance
Circuit Current During Operation
RR VO DVO VOH VOL IIH IIL RVR ICC ICCS
In no signal state
VCC=2 V VCC=6 V
Between SP-SP AIN=VCC or GND IOUT=-100 mA AIN=VCC or GND IOUT=100 mA VI=VCC VI=GND -- VCC=6 V, RL=* --
Circuit Current During Standby
*4 The typical value of the output voltage in no signal state is determined from the following equation.
VO = (VCC - 0.67)
50 kW 50 kW + 52 kW
4/13
Semiconductor APPLICATION CIRCUIT
+ C4 - C3
MSC1157
Standby Select Input Standby Input
SEL STBY C1 AIN
VCC
SP
Speaker GND SP
Audio Input
VR + C2 -
* If parasitic capacitance of 60pF or more exists between GND and the speaker output pin SP or SP, oscillation may occur. Implement the circuit mount design so as to be less than 60pF. * C1 is the AC coupling capacitor. Cutoff frequency fc on the low frequency side is determined by the following equation. Choose a value of C1 according to the bandwidth.
1 (Hz) 2 p C1 20k * Choose a value of C2 that is 80 to 100 times as large as that of C1. * When the standby function is not used, connect the pins STBY and SEL to VCC or GND. * It is recommended that the capacitor C4 (approximately 0.1mF) having better high frequency characteristics and the capacitor C3 (approximately 10mF) be placed between the pins VCC and GND. fc =
5/13
Semiconductor
MSC1157
GAIN ADJUSTMENT
1. Gain Adjustment Using Input Resistance (This approach allows gain adjustment with fewer external components)
Standby Select Input Standby Input Audio Input SEL STBY C1 R1 AIN VR + C2 - GND SP Speaker VCC SP
* Cutoff frequency fc on the low frequency side is determined from the equation:
1 (Hz) 2 p C1 (R1 + 20k) * Voltage gain AV1 is determined from the equation: . fc = .
. AV1 = . 100k R1 + 20k (V/V)
2. Gain Adjustment Using Feedback Resistance (This approach has the advantage over the above approach (less noise approach), but the number of components is increased)
Standby Select Input Standby Input Audio Input SEL STBY C1 R1 AIN VR + C2 - GND SP Speaker VCC SP
R2
* Cutoff frequency fc on the low frequency side is determined from the equation: 1 R2 20k . Zin = R1 + (Hz) (W) . R2 + 120k 2 p C1 Zin * Voltage gain AV1 is determined from the equation: . fc = .
. AV1 = . 1+
5 R1 20k + 6 R1 R2
(V/V)
6/13
Semiconductor
MSC1157
OPERATING CHARACTERISTICS
Power Dissipation vs. Ambient Temperature 800
Maximum Output Amplitude VOM [V]
Maxiumum Output Amplitude vs. Voltage Supply 12 10 RL=* RL=64W RL=32W RL=16W RL=8W
700 Power Dissipation PD [mW] 600 500 400 300 200 100 0 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 DIP SOP
8 6
4 2 0
1
2
3
4
5
6
7
Ambient Temperature Ta [C]
Supply Voltage VCC [V]
Power Dissipation vs. Output Power 1000 RL=8W 800
Power Dissipation PD [mW]
Power Dissipation vs. Output Power 1000 VCC=6.0V 800 RL=16W
Power Dissipation PD [mW]
600
VCC=4.5V
600 VCC=6.0V 400 VCC=4.5V 200 VCC=3.0V
400 VCC=3.0V 200
0
100
200
300
400
500
600
0
100
200
300
400
500
600
Output Power POUT [mW]
Output Power POUT [mW]
Power Dissipation vs. Output Power 1000 RL=32W 800 800 1000 RL=64W
Power Dissipation vs. Output Power
Power Dissipation PD [mW]
600
Power Dissipation PD [mW]
600
400 VCC=6.0V 200 VCC=3.0V 0 100 200 300 400 500 600 VCC=4.5V
400
200 VCC=3.0V 100
VCC=6.0V VCC=4.5V 200 300 400 500 600
0
Output Power POUT [mW]
Output Power POUT [mW]
7/13
Semiconductor
MSC1157
Circuit Current vs. Voltage Supply 2E-3 10000
VR Rise Time vs. Capacitor Value (C2)
1000
VR Rise Time (0 to 90%) [ms]
1.5E-3
Circuit Current ICC [A]
100
1E-3
10
5E-4
1
0
1
2
3
4
5
6
7
0.1
1E-2
0.1
1 Capacitor C2 [mF]
10
100
Supply Voltage VCC [V]
Output Voltage vs. Load Current 2 1.8 1.6
Output "L" Voltage VOL [V]
Output Voltage vs. Load Current 0 SP Output
SP Output
Output "H" Voltage VOH (VCC-VO) [V]
-0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8
1.4 1.2 1 0.8 0.6 0.4 0.2 0 50 100 150 200 250 300 350 VCC=3.0V VCC=6.0V VCC=2.0V
VCC=6.0V VCC=3.0V VCC=2.0V
-2
0
50
100
150
200
250
300
350
Load Current IOUT [mA]
Load Current IOUT [mA]
Output Voltage vs. Load Current 2 1.8 0 SP Output -0.2 SP Output
Output Voltage vs. Load Current
Output "H" Voltage VOH (VCC-VO) [V]
1.6
Output "L" Voltage VOL [V]
-0.4 -0.6 -0.8 VCC=6.0V VCC=3.0V
1.4 1.2 1 0.8 0.6 0.4 0.2 0 50 100 150 200 250 VCC=3.0V VCC=6.0V 300 350 VCC=2.0V
-1 V =2.0V CC -1.2 -1.4 -1.6 -1.8 -2 0 50 100 150 200 250 300 350
Load Current IOUT [mA]
Load Current IOUT [mA]
8/13
Semiconductor
MSC1157
Circuit Curent vs. Ambient Temperature 2.4
Circuit Current [mA]
2.2 2 1.8 1.6 1.4 1.2 1 0.8 -40 Range of Ambient Temp. -20 0 20 40 60 80 100 120 140 VCC = 2.0V VCC = 6.0V
Ambient Temperature [C]
VR Resistance vs. Ambient Temperature 64
VR Resistance [kW]
60 56 52 48 44 40 36 -40 Range of Ambient Temp. -20 0 20 40 60 80 100 120 140
Ambient Temperature [C]
Circuit Current during standby ICCS [mA]
Circuit Current during Standby vs. Ambient Temperature (VCC = 6.0V) 3 2.6 2.2 1.8 1.4 1 0.6 0.2 -0.2 -40 -20 Range of Ambient Temp.
0
20
40
60
80
100
120
140
Ambient Temperature [C]
9/13
Semiconductor
MSC1157
Total Harmonic Distortion vs. Output 10
Total Harmonic Distortion THD [%]
VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W
f=1kHz
5
VCC=6V RL=16W
0
0
100
200
300 Output Power POUT [mW]
400
500
600
Total Harmonic Distortion vs. Output 10
Total Harmonic Distortion THD [%]
VCC=3V RL=16W VCC=3V RL=8W VCC=4.5V RL=16W VCC=6V RL=32W VCC=4.5V RL=8W
f=3kHz
5
VCC=6V RL=16W
0
0
100
200
300 Output Power POUT [mW]
400
500
600
Voltage Gain vs. Frequency 26 23
C1=0
Ripple Elimination Ratio vs. Frequency 20
C2=0 mF
10
Voltage Gain AV3 [dB]
17 14 11 8 5 2 -1 -4
C1
=0
.
mF 22
Ripple Elimination Ratio RR [dB]
20
.47m
F
0 -10 -20 -30 -40 -50 -60 -70
C 2= C 2= C 2= C 2= 2.2 4.7 mF mF F F
C1
=0
.1m F
Vi SEL VCC SP STBY AIN SP VR GND C2
VO
10m 22m
C1 =0 .04 7m F
C1 Vi
SEL VCC SP STBY AIN SP VR GND
VO
20
100
1k Frequency f [Hz]
10k
20k
-80
50
100
1k Frequency f [Hz]
10k
20k
10/13
Semiconductor PAD CONFIGURATION Pad Layout Chip size Chip thickness Pad size (PV aperture) Substrate potential Pad location diagram : X=2.3mm, Y=2.4mm : 35030mm : 110110mm : GND
MSC1157
Y-Axis
2
1
8
7
X-Axis
3 5 4
6
Pad Coordinates (Chip center is located at X=0 and Y=0.)
Pad No. 1 2 3 4 5 6 7 8 Pad Name VR AIN SP GND VCC SP STBY SEL X-AXIS -133 -985 -950 -180 240 950 985 159
(Unit: m) Y-AXIS 1035 1035 -263 -1027 -914 -263 1035 1035
11/13
Semiconductor
MSC1157
PACKAGE DIMENSIONS
(Unit : mm)
DIP8-P-300-2.54
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.46 TYP.
12/13
Semiconductor
MSC1157
(Unit : mm)
SOP8-P-250-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.10 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
13/13
E2Y0002-29-11
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan

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