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 MC74HCT541A Octal 3-State Non-Inverting Buffer/Line Driver/ Line Receiver With LSTTL-Compatible Inputs
High-Performance Silicon-Gate CMOS
The MC74HCT541A is identical in pinout to the LS541. This device may be used as a level converter for interfacing TTL or NMOS outputs to high speed CMOS inputs. The HCT541A is an octal non-inverting buffer/line driver/line receiver designed to be used with 3-state memory address drivers, clock drivers, and other bus-oriented systems. This device features inputs and outputs on opposite sides of the package and two ANDed active-low output enables.
http://onsemi.com MARKING DIAGRAMS
20 PDIP-20 N SUFFIX CASE 738
1
MC74HCT541AN AWLYYWW 1 20
20
* * * * * * *
Output Drive Capability: 15 LSTTL Loads TTL/NMOS-Compatible Input Levels Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 4.5 to 5.5V Low Input Current: 1A In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 134 FETs or 33.5 Equivalent Gates
LOGIC DIAGRAM
A1 A2 A3 A4 A5 A6 A7 A8 2 3 4 5 6 7 8 9 1 19 PIN 20 = VCC PIN 10 = GND 18 17 16 15 14 13 12 11 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8
20 1
SOIC WIDE-20 DW SUFFIX CASE 751D 1 A WL YY WW
HCT541A AWLYYWW
= Assembly Location = Wafer Lot = Year = Work Week
ORDERING INFORMATION
Device MC74HCT541AN MC74HCT541ADW Package PDIP-20 SOIC-WIDE Shipping 1440 / Box 38 / Rail 1000 / Reel
MC74HCT541ADWR2 SOIC-WIDE
FUNCTION TABLE
Inputs Non-Inverting Outputs OE1 L L H X OE2 L L X H A L H X X L H Z Z Output Y
Data Inputs
Z = High Impedance X = Don't Care
Pinout: 20-Lead Packages (Top View)
VCC 20 OE2 19 Y1 18 Y2 17 Y3 16 Y4 15 Y5 14 Y6 13 Y7 12 Y8 11
Output Enables
OE1 OE2
1 OE1
2 A1
3 A2
4 A3
5 A4
6 A5
7 A6
8 A7
9 A8
10 GND
(c) Semiconductor Components Industries, LLC, 2000
1
March, 2000 - Rev. 2
Publication Order Number: MC74HCT541A/D
MC74HCT541A
II I IIIIIIIIIIIIIIIIIIIIIII I II I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I II II I I I IIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIII II I II I I III II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I III II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I IIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
SymbolIIIIIIIIIIIIII Parameter VCC Vin DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) Value Unit - 0.5 to + 7.0III V V V - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 35 75 750 500 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air Plastic DIP SOIC Package mW Tstg TL Storage Temperature Range - 65 to + 150 260
_C _C
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
v
v
Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP or SOIC Package
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
IIII I I I IIIIIIIIIIIIIIIIIIIIIII II I I IIII I I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII II I
Symbol VCC Parameter Min 4.5 0 Max 5.5 Unit V V DC Supply Voltage (Referenced to GND) Vin, Vout TA DC Input Voltage, Output Voltage (Referenced to GND) Operating Temperature Range, All Package Types Input Rise/Fall Time (Figure 1) VCC - 55 0 + 125 500
RECOMMENDED OPERATING CONDITIONS
_C
ns
tr, tf
DC CHARACTERISTICS (Voltages Referenced to GND)
Symbol VIH VIL VOH
Parameter Minimum High-Level Input Voltage Maximum Low-Level Input Voltage Minimum High-Level Output Voltage
Condition Vout = 0.1V or VCC - 0.1V |Iout| 20A Vout = 0.1V or VCC - 0.1V |Iout| 20A Vin = VIH or VIL |Iout| 20A Vin = VIH or VIL |Iout| 6.0mA
VCC V 4.5 5.5 4.5 5.5 4.5 5.5 4.5 4.5 5.5
Guaranteed Limit -55 to 25C 2.0 2.0 0.8 0.8 4.4 5.4 3.98 0.1 0.1 0.26 0.1 0.5 85C 2.0 2.0 0.8 0.8 4.4 5.4 3.84 0.1 0.1 0.33 1.0 5.0 125C 2.0 2.0 0.8 0.8 4.4 5.4 3.70 0.1 0.1 0.40 1.0 10.0 A A V Unit V V V
VOL
Maximum Low-Level Output Voltage
Vin = VIH or VIL |Iout| 20A Vin = VIH or VIL |Iout| 6.0mA
4.5 5.5 5.5
Iin IOZ
Maximum Input Leakage Current Maximum Three-State Leakage Current Maximum Quiescent Supply Current (per Package) Additional Quiescent Supply Current
Vin = VCC or GND Output in High Impedance State Vin = VIL or VIH Vout = VCC or GND Vin = VCC or GND Iout = 0A Vin = 2.4V, Any One Input Vin = VCC or GND, Other Inputs GND i Iout = 0A
ICC ICC
5.5
4
40
160
A
-55C 5.5 2.9
25 to 125C 2.4 mA
1. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). 2. Total Supply Current = ICC + ICC.
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MC74HCT541A
AC CHARACTERISTICS (VCC = 5.0V, CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit Symbol tPLH, tPHL tPLZ, tPHZ tPZL, tPZH tTLH, tTHL Cin Cout Parameter Maximum Propagation Delay, Input A to Output Y (Figures 1 and 3) Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4) Maximum Propagation Delay, Output Enable to Output Y (Figures 2 and 4) Maximum Output Transition Time, Any Output (Figures 1 and 3) Maximum Input Capacitance Maximum Three-State Output Capacitance (Output in High Impedance State) -55 to 25C 23 30 30 12 10 15 85C 28 34 34 15 10 15 125C 32 38 38 18 10 15 Unit ns ns ns ns pF pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V CPD Power Dissipation Capacitance (Per Buffer)* 55 pF * Used to determine the no-load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
SWITCHING WAVEFORMS
tr 90% INPUT A tPLH 90% OUTPUT Y tTLH 1.3V 10% OUTPUT Y tTHL 1.3V HIGH IMPEDANCE tPZH tPHZ 90% VOH 1.3V 10% tPHL GND OUTPUT Y 1.3V 10% VOL tf 3.0V 3.0V OE1 or OE2 1.3V tPZL tPLZ 1.3V GND HIGH IMPEDANCE
Figure 1. TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST CL* DEVICE UNDER TEST OUTPUT
Figure 2.
TEST POINT 1k CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ and tPZH.
CL*
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 3.
Figure 4.
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MC74HCT541A
PIN DESCRIPTIONS
INPUTS
A1, A2, A3, A4, A5, A6, A7, A8 (PINS 2, 3, 4, 5, 6, 7, 8, 9) -- Data input pins. Data on these pins appear in non-inverted form on the corresponding Y outputs, when the outputs are enabled.
CONTROLS
outputs are enabled and the device functions as a non-inverting buffer. When a high voltage is applied to either input, the outputs assume the high impedance state.
OUTPUTS
OE1, OE2 (PINS 1, 19) -- Output enables (active-low). When a low voltage is applied to both of these pins, the
Y1, Y2, Y3, Y4, Y5, Y6, Y7, Y8 (PINS 18, 17, 16, 15, 14, 13, 12, 11) -- Device outputs. Depending upon the state of the output enable pins, these outputs are either non-inverting outputs or high-impedance outputs.
LOGIC DETAIL
To 7 Other Buffers
One of Eight Buffers INPUT A
VCC
OUTPUT Y
OE1 OE2
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MC74HCT541A
PACKAGE DIMENSIONS
PDIP-20 N SUFFIX PLASTIC DIP PACKAGE CASE 738-03 ISSUE E
11
-A-
20
B
1 10
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. INCHES MIN MAX 1.010 1.070 0.240 0.260 0.150 0.180 0.015 0.022 0.050 BSC 0.050 0.070 0.100 BSC 0.008 0.015 0.110 0.140 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 25.66 27.17 6.10 6.60 3.81 4.57 0.39 0.55 1.27 BSC 1.27 1.77 2.54 BSC 0.21 0.38 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01
-T-
SEATING PLANE
K M E G F D
20 PL
N J 0.25 (0.010)
M 20 PL
0.25 (0.010) TA
M
M
TB
M
DIM A B C D E F G J K L M N
SO-20 DW SUFFIX CASE 751D-05 ISSUE F
D A
11 X 45 _
q
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 2.35 2.65 0.10 0.25 0.35 0.49 0.23 0.32 12.65 12.95 7.40 7.60 1.27 BSC 10.05 10.55 0.25 0.75 0.50 0.90 0_ 7_
H
M
B
M
20
10X
0.25
E
1
10
h
20X
B 0.25
M
B TA
S
B
S
A
SEATING PLANE
DIM A A1 B C D E e H h L
L
18X
e
A1
q
T
C
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MC74HCT541A
Notes
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MC74HCT541A
Notes
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MC74HCT541A
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local Sales Representative.
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MC74HCT541A/D


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