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TDA1170N
LOW-NOISE TV VERTICAL DEFLECTION SYSTEM
. . .
COMPLETE VERTICAL DEFLECTION SYSTEM LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS
DESCRIPTION The TDA1170N is a monolithic integrated circuit in a 12-lead quad in-line plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are : synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. PIN CONNECTIONS
FINDIP12 (Plastic Package) ORDER CODE : TDA1170N
RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND POWER AMPLIFLIER OUTPUT POWER AMPLIFLIER SUPPLY VOLTAGE REGULATED VOLTAGE
1 2 3
12 11 10
RAMP GENERATOR COMPENSATION AMP. INPUT GROUND
4 5 6
9 8 7
OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT
1170N-01.EPS
December 1992
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TDA1170N
BLOCK DIAGRAM
+ VS C4 DA
FREQ
6
2
3
5 RH C9
P1
TDA1170N
9
OSCILLATOR
VOLTAGE REGULATOR
FLYBACK GENERATOR
POWER AMPLIFLIER
4
C1 RG C8 SYNC 8 YOKE
SYNC CIRCUIT
RAMP GENERATOR
BUFFER STAGE
PREAMPLIFLIER
11 C5 C7 RE RD
7 TABS C2 P2 RA
12 1 LINEARITY
10
P3 C3
RB
RC C6 RF
1170N-02.EPS
HEIGHT
ABSOLUTE MAXIMUM RATINGS
Symbol VS V4, V5 V10 Io Io Io I3 I3 I8 Ptot Tstg, Tj Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2msec Output Peak Current at f = 50Hz t 10sec Output Peak Current at f = 50Hz t > 10sec Pin 3 DC Current at V4 < V2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly 1.5msec Pin 8 Current Power Dissipation : at Tab = 90C at Tamb = 80C (free air) Storage and Junction Temperature Parameter Value 35 60 + 10 - 0.5 2 2.5 1.5 100 1.8 20 5 1 - 40, +150 Unit V V V V A A A mA A mA W W C
1170N-01.TBL 1170N-02.TBL
THERMAL DATA
Symbol Rth j-tab R th j-amb Parameter Thermal Resistance Junction-tab Thermal Resistance Junction-ambient Max Max Value 12 70 Unit C/W C/W *
* Obtained with tabs soldered to printed circuit with minimized copper area.
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TDA1170N
ELECTRICAL CHARACTERISTICS (Refer to the test circuits, VS = 35 V, Tamb = 25oC,unless otherwise specified) DC CHARACTERISTICS
Symbol I2 I5 - I9 - I10 - I12 - I12 I12 I12 Vs V1 V3 V4 Parameter Pin 2 Quiescent Current Pin 5 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current Ramp Generator Non-linearity Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Qiuescent output Voltage I1 = 1mA I3 = 10mA VS = 10V R1 = 1k, R2 = 1k VS = 35V R1 = 3k, R2 = 1k V4L V4H V6 V7 |V6| V7 ; VS VS V10 R8 Output Saturation Voltage to Ground Output Saturation Voltage to Supply Regulated Voltage at Pin 6 Regulated Voltage at Pin 7 Regulated Voltage Drift with Supply Voltage Amplifier Input Reference Voltage Pin 8 Input Resistance V8 0.4V I7 = 20A VS = 10 to 35V 2.07 1 - I4 = 0.1A - I4 = 0.8A I4 = 0.1A I4 = 0.8A 6.1 6.2 4.1 8.3 Test Conditions I3 = 0 I4 = 0 V9 = 1V V10 = 1V V12 = 0 I7 = 20A, V12 = 0 V12 = 0 to 12V, I7 = 20A 10 1 300 4.4 8.8 0.9 1.9 1.4 2.8 6.5 6.6 1 2.2 2.3 18.5 Min. Typ. 7 8 0.1 1 0.02 20 0.2 Max. 14 17 1 10 0.3 21.5 1 35 1.4 450 4.75 9.45 1.2 2.3 2.1 3.2 6.9 7 Unit mA mA A A A A % V V mV V V V V V V V V mV/V V M 1a 1a 1a 1a 1c 1c 1d 1d 1b 1b 1b
1170N-03.TBL
Fig. 1b 1b 1a 1b 1a 1b 1b
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TDA1170N
Figure 1 : DC Test Circuits Figure 1a Figure 1b
I2
V3 I3 + Vs
+ Vs I5
2
3 2 5
5
8
TDA1170N
9 I8 7 1k 12 TABS 10
4
9
R1
TDA1170N
TABS 6 12 7
10
- I9 1V 8V
- I12 R2
V4
V6
- I12
V7
- I10
1V
100k
1170N-03.EPS
1V
1170N-04.EPS
Figure 1c
+ Vs
Figure 1d
+ Vs
2
5
I4
2
5
V4H
9
TDA1170N
TABS 10
4
9
TDA1170N
TABS 10
4
4V
V4L
1V
1170N-05.EPS
I4
1170N-06.EPS
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TDA1170N
ELECTRICAL CHARACTERISTICS (Refer to the AC test circuit, VS = 22V ; f = 50Hz ; Tamb = 25C, unless otherwise specified) AC CHARACTERISTICS
Symbol Is I8 V4 tfly VON fo f f VS | f | Tab Parameter Supply Current Sync. Input Current (positive or negative) Flyback Voltage Flyback Time Peak to Peak Output Noise Free Running Frequency Sychronization Range Frequency Drift with Supply Voltage Frequency Drift with tab Temperature Iy = 1App Iy = 1App Pin 9 Connected to GND (P1 + R1) = 300k, C2 = 0.1F (P1 + R1) = 260k, C2 = 0.1F I8 = 0.5mA Vs = 10 to 35V Ttab = 40 to 120C 14 0.005 0.01 42.2 48.5 Test Conditions Iy = 1App 500 45 0.7 40 Min. Typ. 140 Max. Unit mA A V ms mVPP Hz Hz Hz
1170N-04.TBL 1170N-07.EPS
Hz/V Hz/C
Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10/20mH/1App
V S = 2.2V 1N4001 TABS
470F
0.1F
100F 3
5
2
3.3
0.1F
4
Sync. Input
8
T D A 1 1 7 0 N
220k
11
100pF
5.6k
470pF
5.6k 10 22k
YOKE Ry = 10 Ly = 20mH
1000F
9
1
100k
P1 R1
6
7
47k 100k
1.8k
0.1F 0.1F
1
C2
0.1F
120k
910k
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TDA1170N
Figure 3 : Typical Application Circuit for Small Screen 90TVC Set (RY = 15, LY = 30mH, IY = 0.82 App)
V S = 26V D1 1N4001 TABS C1 0.1F C4 100 F
3
C5 470F
5
2
R8 3.3 4
C10
0.1F
C2 0.1F f sync = 50Hz R1 4.7k
8
T D A 1 1 7 0 N
R5 390k C6 470pF 10 R6 18k 1 P3 100k R7 47k
C9
100pF
R11 5.6k
R13 270
YOKE Ry = 15 Ly = 30mH
R10 5.6k C11 10F C12 1000F
9
P1
100k R2 150k
6
7
12
P2 100k R3 100k R4 680k
C7
R9 1.5k
0.1F
C8 0.1F
Figure 4 : P.C. Board and Components Layout of the Circuit of fig. 3 (1:1 scale)
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1170N-09.TIF
1170N-08.EPS
C3
0.15F
R12 1
TDA1170N
MOUNTING INSTRUCTION During soldering the tab temperature must not exceed 260C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. The junction to ambient thermal resistance can be Figure 5 : Example of P.C. Board Copper Area Used as Heatsink reduced by soldering the tabs to a suitable copper area of the printed circuit board (fig. 5) or to an external heatsink (fig. 6). The diagram of fig. 7 shows the maximum dissipable power Ptot and the Rth j-amb as a function of the side "e" of two equal square copper areas having a thicknessof 35 (1.4 mil). Figure 6 : Example of External heatsink
1170N-10.EPS
Figure 7 :
Maximum Power Dissipation and Junction-Ambient Thermal Resistance versus "e"
Figure 8 :
Maximum Allowable Power Dissipation versus Ambient Temperature
1170N-12.EPS
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1170N-13.EPS
1170N-11.EPS
TDA1170N
PACKAGE MECHANICAL DATA : 12 PINS - PLASTIC FINDIP
D G e4
A
a1
I
b c c1 e5 e6 e3 E2 E e E1
K D
12
7
1
6
F
L
M
b1
Dimensions A a1 b b1 c c1 D E E1 E2 e e3 e4 e5 e6 F G I K L M
Min. 3.8 1.5 0.55 0.3
Millimeters Typ.
Max. 4.05 1.75 0.6 0.35
Min. 0.150 0.059 0.022 0.012
Inches Typ.
Max. 0.159 0.069 0.024 0.014
1.32 0.94 19.2 16.8 4.86 10.11 2.29 17.43 7.27 12.35 6.3 7.8 6.1 2.5 2.5 17.2 19.9 17.6 5.56 10.81 2.79 18.13 7.97 13.05 7.1 8.6 6.5 2.9 3.1 0.756 0.661 0.191 0.398 0.090 0.686 0.286 0.486 0.248 0.307 0.240 0.098 0.098
0.052 0.037 0.677 0.783 0.693 0.219 0.426 0.110 0.714 0.314 0.514 0.280 0.339 0.256 0.114
2.54 17.78 7.62 7.62 12.7 9.8
0.100 0.700 0.300 0.300 0.500 0.386
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without noti ce. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
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FINDIP.TBL
PM-FDIP.EPS

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