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HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6761 Issued Date : 1994.10.06 Revised Date : 2002.02.26 Page No. : 1/3 HTIP50 NPN EPITAXIAL PLANAR TRANSISTOR Description The HTIP50 is designed for line operated audio output amplifier switch-mode power supply drivers and other switching applications. Absolute Maximum Ratings (Ta=25C) TO-220 * Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 40 W Total Power Dissipation (Ta=25C) ....................................................................................... 2 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage..................................................................................... 500 V BVCEO Collector to Emitter Voltage.................................................................................. 400 V BVEBO Emitter to Base Voltage............................................................................................ 5 V IC Collector Current............................................................................................................... 1 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO IEBO ICEO ICES *VCE(sat) VBE(on) *hFE1 *hFE2 fT Min. 500 400 5 30 10 10 Typ. Max. 1 1 1 1 1.5 150 Unit V V V mA mA mA V V Test Conditions IC=1mA, IE=0 IC=30mA, IB=0 IE=0.1mA, IC=0 VEB=5V, IC=0 VCE=300V, IB=0 VCE=500V, VEB=0 IC=1A, IB=0.2A IC=1A, VCE=10V IC=0.3A, VCE=10V IC=1A, VCE=10V IC=0.2A, VCB=10V, f=2MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz HTIP50 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 hFE @ VCE=10V 1000 VCE(sat) @ IC=5IB Spec. No. : HE6761 Issued Date : 1994.10.06 Revised Date : 2002.02.26 Page No. : 2/3 Saturation Voltage & Collector Current hFE 125 C 100 25 C 75 C o o o Saturation Voltage (mV) 100 125 C o 75 C 25 C o o 10 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) ON Voltage & Collector Current 1000 25 C o Cutoff Frequency & Collector Current 100 VCE=10V ON Voltage (mV) 75 C o 125 C o VBE(ON) @ VCE=10V 100 1 10 100 1000 Cutoff Frequency (MHz).. . 10 1 10 100 1000 Collector Current-IC (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 100 10 Safe Operating Area PT=1ms PT=100ms PT=1s Collector Current-IC (mA) 1 Capacitance (pF) 10 0.1 Cob 0.01 1 1 10 100 0.001 1 10 100 1000 Reverse Biased Voltage (V) Forward Voltage-VCE (V) HTIP50 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-220AB Dimension Marking: A D B E C Date Code H 50 Spec. No. : HE6761 Issued Date : 1994.10.06 Revised Date : 2002.02.26 Page No. : 3/3 TIP Control Code H I G 4 P M 3 2 1 N K Style: Pin 1.Base 2.Collector 3.Emitter O 3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical DIM A B C D E G H Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HTIP50 HSMC Product Specification |
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