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PD - 94306
HEXFET(R) Power MOSFET
l l l l l l l
IRF520VS IRF520VL
VDSS = 100V
Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating 175C Operating Temperature Fast Switching Fully Avalanche Rated Optimized for SMPS Applications
D
RDS(on) = 0.165
G S
ID = 9.6A
Advanced HEXFET(R) Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF520VL) is available for low-profile applications.
Description
D2Pak IRF520VS
TO-262 IRF520VL
Absolute Maximum Ratings
Parameter
ID @ TC = 25C ID @ TC = 100C IDM PD @TC = 25C VGS IAR EAR dv/dt TJ TSTG Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current Power Dissipation Linear Derating Factor Gate-to-Source Voltage Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds
Max.
9.6 6.8 37 44 0.29 20 9.2 4.4 7.0 -55 to + 175 300 (1.6mm from case )
Units
A W W/C V A mJ V/ns C
Thermal Resistance
Parameter
RJC RJA Junction-to-Case Junction-to-Ambient (PCB Mounted, steady state)**
Typ.
--- ---
Max.
3.4 40
Units
C/W
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1
01/18/02
IRF520VS/IRF520VL
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ
RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf LD LS Ciss Coss Crss EAS
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Single Pulse Avalanche Energy
Min. 100 --- --- 2.0 1.9 --- --- --- --- --- --- --- --- --- --- --- --- ---
Typ. --- 0.12 --- --- --- --- --- --- --- --- --- --- 6.9 23 30 24 4.5 7.5
--- 560 --- 81 --- 10 --- 150
Max. Units Conditions --- V VGS = 0V, ID = 250A --- V/C Reference to 25C, ID = 1mA 0.165 VGS = 10V, ID = 5.5A 4.0 V VDS = VGS, ID = 250A --- S VDS = 50V, ID = 5.5A 25 VDS = 100V, VGS = 0V A 250 VDS = 80V, VGS = 0V, TJ = 150C 100 VGS = 20V nA -100 VGS = -20V 22 ID = 9.2A 5.2 nC VDS = 80V 7.0 VGS = 10V, See Fig. 6 and 13 --- VDD = 50V --- ID = 9.2A ns --- RG = 18 --- VGS = 10V, See Fig. 10 Between lead, --- 6mm (0.25in.) nH G from package --- and center of die contact --- VGS = 0V --- VDS = 25V --- pF = 1.0MHz, See Fig. 5 44 mJ IAS = 9.2A, L = 1.0mH
D
S
Source-Drain Ratings and Characteristics
IS
ISM
VSD trr Qrr ton Notes:
Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Min. Typ. Max. Units
Conditions D MOSFET symbol --- --- 9.6 showing the A G integral reverse 37 --- --- S p-n junction diode. --- --- 1.2 V TJ = 25C, IS = 9.2A, VGS = 0V --- 83 120 ns TJ = 25C, I F = 9.2A --- 220 330 nC di/dt = 100A/s Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 ) Starting TJ = 25C, L = 1.0mH RG = 25, IAS = 9.2A, VGS=10V (See Figure 12) ISD 9.2A, di/dt 360A/s, VDD V(BR)DSS, TJ 175C Pulse width 400s; duty cycle 2%.
This is a typical value at device destruction and represents
operation outside rated limits.
This is a calculated value limited to TJ = 175C . Uses IRF520V data and test conditions.
**When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994
2
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IRF520VS/IRF520VL
100
I D , Drain-to-Source Current (A)
I D , Drain-to-Source Current (A)
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V TOP
100
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V TOP
10
10
4.5V
4.5V
1 0.1
20s PULSE WIDTH T = 25 C
J 1 10 100
1 1
20s PULSE WIDTH T = 175 C
J 10 100
VDS , Drain-to-Source Voltage (V)
VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
100
3.5
ID = 9.2A
I D , Drain-to-Source Current (A)
TJ = 25 C
RDS(on) , Drain-to-Source On Resistance (Normalized)
3.0 2.5
TJ = 175 C
10
2.0 1.5
1.0
1 4.0
V DS = 50V 20s PULSE WIDTH 7.0 8.0 5.0 6.0 9.0
0.5 0.0 -60 -40 -20
VGS = 10V
0 20 40 60 80 100 120 140 160 180
VGS , Gate-to-Source Voltage (V)
TJ , Junction Temperature ( C)
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance Vs. Temperature
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3
IRF520VS/IRF520VL
1000 20 VGS = 0V, f = 1 MHZ Ciss = C + C , C gs gd ds SHORTED Crss = C gd Coss = C + C ds gd
ID = 9.2A
VGS , Gate-to-Source Voltage (V)
800
16
VDS = 80V VDS = 50V VDS = 20V
C, Capacitance(pF)
600
Ciss
12
400
8
200
Coss Crss
4
0 1 10 100
0 0 4 8
FOR TEST CIRCUIT SEE FIGURE 13
16 20 12 24
VDS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage
Fig 6. Typical Gate Charge Vs. Gate-to-Source Voltage
100
100
TJ = 175 C
ISD , Reverse Drain Current (A)
OPERATION IN THIS AREA LIMITED BY R DS (on)
10
ID, Drain-to-Source Current (A)
10 100sec
1
1
1msec
TJ = 25 C
0.1 0.4
V GS = 0 V
0.6 0.8 1.0 1.2 1.4 1.6
0.1 1
Tc = 25C Tj = 175C Single Pulse 10
10msec
VSD ,Source-to-Drain Voltage (V)
100
1000
VDS , Drain-toSource Voltage (V)
Fig 7. Typical Source-Drain Diode Forward Voltage
Fig 8. Maximum Safe Operating Area
4
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IRF520VS/IRF520VL
10.0
VDS
8.0
RD
VGS RG
D.U.T.
+
I D , Drain Current (A)
-VDD
6.0
VGS
Pulse Width 1 s Duty Factor 0.1 %
4.0
Fig 10a. Switching Time Test Circuit
2.0
VDS 90%
0.0 25 50 75 100 125 150 175
TC , Case Temperature
( C)
10% VGS
td(on) tr t d(off) tf
Fig 9. Maximum Drain Current Vs. Case Temperature
Fig 10b. Switching Time Waveforms
10
Thermal Response (Z thJC )
D = 0.50 1 0.20 0.10 0.05 0.02 0.01 0.1
SINGLE PULSE (THERMAL RESPONSE)
0.01 0.00001
Notes: 1. Duty factor D = t 1 / t 2 2. Peak T J = P DM x Z thJC + TC 0.01 0.0001 0.001
P DM t1 t2 0.1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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5
IRF520VS/IRF520VL
80
EAS , Single Pulse Avalanche Energy (mJ)
1 5V
VD S
L
D R IV E R
60
TOP BOTTOM ID 3.8A 6.5A 9.2A
RG
VGS 20V
D .U .T IA S tp 0 .0 1
+ - VD D
A
40
Fig 12a. Unclamped Inductive Test Circuit
V (B R )D SS tp
20
0 25 50 75 100 125 150 175
Starting TJ , Junction Temperature ( C)
Fig 12c. Maximum Avalanche Energy Vs. Drain Current
IAS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator Same Type as D.U.T.
50K
QG
12V
.2F .3F
VGS
QGS VG QGD
VGS
3mA
D.U.T.
+ V - DS
IG
ID
Charge
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
Fig 13b. Gate Charge Test Circuit
6
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IRF520VS/IRF520VL
Peak Diode Recovery dv/dt Test Circuit
+
D.U.T* Circuit Layout Considerations * Low Stray Inductance * Ground Plane * Low Leakage Inductance Current Transformer
+
-
+
RG VGS * dv/dt controlled by RG * ISD controlled by Duty Factor "D" * D.U.T. - Device Under Test
+ VDD
*
Reverse Polarity of D.U.T for P-Channel
Driver Gate Drive P.W. Period D=
P.W. Period
[VGS=10V ] ***
D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt
[VDD]
Re-Applied Voltage Inductor Curent
Body Diode
Forward Drop
Ripple 5%
[ ISD ]
*** VGS = 5.0V for Logic Level and 3V Drive Devices Fig 14. For N-channel HEXFET(R) power MOSFETs
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IRF520VS/IRF520VL
D2Pak Package Outline
Dimensions are shown in millimeters (inches)
1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) M AX. -A2
4.69 (.1 85) 4.20 (.1 65)
-B 1.3 2 (.05 2) 1.2 2 (.04 8)
1 0.16 (.4 00 ) RE F.
6.47 (.2 55 ) 6.18 (.2 43 ) 15 .4 9 (.6 10) 14 .7 3 (.5 80) 5 .28 (.20 8) 4 .78 (.18 8) 2.7 9 (.110 ) 2.2 9 (.090 ) 2.61 (.1 03 ) 2.32 (.0 91 ) 1.3 9 (.0 5 5) 1.1 4 (.0 4 5) 8.8 9 (.3 50 ) R E F.
1.7 8 (.07 0) 1.2 7 (.05 0)
1
3
3X
1.40 (.0 55) 1.14 (.0 45) 3X 5 .08 (.20 0)
0 .93 (.03 7 ) 0 .69 (.02 7 ) 0 .25 (.01 0 ) M BAM
0.5 5 (.022 ) 0.4 6 (.018 )
M IN IM U M R E CO M M E ND E D F O O TP R IN T 1 1.43 (.4 50 )
NO TE S: 1 D IM EN S IO N S A FTER SO L D ER D IP. 2 D IM EN S IO N IN G & TO LE RA N C IN G PE R A N S I Y1 4.5M , 198 2. 3 C O N TRO L LIN G D IM EN SIO N : IN C H . 4 H E ATSINK & L EA D D IM EN S IO N S D O N O T IN C LU D E B UR R S.
LE A D A SS IG N M E N TS 1 - G A TE 2 - D R AIN 3 - S O U RC E
8.89 (.3 50 ) 17 .78 (.70 0)
3 .8 1 (.15 0) 2 .08 (.08 2) 2X 2.5 4 (.100 ) 2X
D2Pak Part Marking Information
THIS IS AN IRF530S WITH LOT CODE 8024 ASSEMBLED ON WW 02, 2000 IN THE ASSEMBLY LINE "L" INTERNATIONAL RECTIFIER LOGO ASSEMBLY LOT CODE PART NUMBER F530S DATE CODE YEAR 0 = 2000 WEEK 02 LINE L
8
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IRF520VS/IRF520VL
TO-262 Package Outline
Dimensions are shown in millimeters (inches)
TO-262 Part Marking Information
EXAMPLE: THIS IS AN IRL3103L LOT CODE 1789 ASSEMBLED ON WW 19, 1997 IN THE ASSEMBLY LINE "C"
INTERNATIONAL RECTIFIER LOGO ASSEMBLY LOT CODE
PART NUMBER
DATE CODE YEAR 7 = 1997 WEEK 19 LINE C
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9
IRF520VS/IRF520VL
D2Pak Tape & Reel Information
Dimensions are shown in millimeters (inches)
TR R
1 .6 0 (.0 6 3 ) 1 .5 0 (.0 5 9 ) 4.1 0 (.16 1 ) 3.9 0 (.15 3 )
1 .6 0 (.06 3) 1 .5 0 (.05 9) 0 .3 68 (.0 14 5) 0 .3 42 (.0 13 5)
F EE D D IRE C TIO N 1 .8 5 (.0 7 3 )
1 .6 5 (.0 6 5 )
1 1.60 (.45 7) 1 1.40 (.44 9)
1 5.42 (.6 09) 1 5.22 (.6 01)
24.30 (.95 7) 23.90 (.94 1)
TR L
10.90 (.42 9) 10.70 (.42 1) 1 .7 5 (.069 ) 1 .2 5 (.049 ) 1 6.10 (.6 34 ) 1 5.90 (.6 26 ) 4.7 2 (.13 6) 4.5 2 (.17 8)
F E ED D IRE C T IO N
13.50 (.532) 12.80 (.504)
27.40 (1.079) 23.90 (.941) 4
330.00 (14.173) M AX.
60.00 (2.362) M IN.
NO TES : 1. CO MF OR MS TO EIA-418. 2. CO NT RO LLING D IM EN SIO N: M ILLIM ETER . 3. DIM ENS ION M EASUR ED @ HU B. 4. INC LUD ES F LANG E DIST ORT IO N @ O UT ER EDG E.
30.40 (1.197) MA X. 26.40 (1.039) 24.40 (.961)
4
3
Data and specifications subject to change without notice. This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.01/02
10
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