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INTEGRATED CIRCUITS
DATA SHEET
TDA8779H 10-bit converter interface (ADC/DAC) for quadrature transceiver
Product specification Supersedes data of 1999 Jan 18 File under Integrated Circuits, IC02 1999 Sep 16
Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
FEATURES * Two 10-bit ADCs with multiplexed outputs * Two 10-bit DACs with multiplexed inputs * Sampling rate for the ADCs and DACs up to 20 MHz * Digital outputs (for the ADC) and inputs (for the DAC) are TTL/CMOS compatible * Internal reference voltage regulator * Power dissipation 520 mW * Standby mode. APPLICATIONS * Wireless communication. QUICK REFERENCE DATA SYMBOL VCCA1 VCCD1 VCCA2 VCCD2 VCCO ICCA ICCD ICCO fCLK(ADC)max INLA DNLA fCLK(DAC)max INLD DNLD Ptot PARAMETER analog supply voltage for the ADC part digital supply voltage for the ADC part analog supply voltage for the DAC part digital supply voltage for the DAC part output stage supply voltage analog supply current digital supply current output stage supply current maximum clock frequency for the ADC part integral non linearity for the ADC part differential non linearity for the ADC part maximum clock frequency for the DAC part integral non linearity for the DAC part differential non linearity for the DAC part total power dissipation full-scale; ramp input; fCLK = 20 MHz full-scale; ramp input; fCLK = 20 MHz full-scale; ramp input; fCLK = 20 MHz full-scale; ramp input; fCLK = 20 MHz ramp input; fCLK = 20 MHz CONDITIONS MIN. 4.75 4.75 4.75 4.75 2.7 59 15 - 20 - - 20 - - - 5.0 5.0 5.0 5.0 3.0 74 23 7 - 2.25 TYP. 5.5 5.5 5.5 5.5 3.3 85 35 - - 4 GENERAL DESCRIPTION
TDA8779H
The TDA8779 contains two 10-bit high speed ADCs and two 10-bit DACs for wireless communication (for use in transceiver modules). This device converts two analog input signals (channels I and Q) and digital inputs (D0 to D9) at a maximum sampling rate of 20 MHz. The input bias voltages for the analog input voltages are provided internally at the middle code. The analog input and output voltages are AC coupled. The data sampling is performed on the rising edge of the clock for ADCs and DACs. All reference voltages are generated internally.
MAX.
UNIT V V V V V mA mA mA MHz LSB LSB MHz LSB LSB mW
+1.55 to -0.9 +2.8 to -1.1 - 0.4 0.35 520 - 1.25 1.5 745
1999 Sep 16
2
Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
ORDERING INFORMATION TYPE NUMBER TDA8779H PACKAGE NAME QFP44 DESCRIPTION plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
TDA8779H
VERSION SOT307-2
BLOCK DIAGRAM
handbook, full pagewidth
VCCA1 7 INPUT BIAS
DEC1 2
DEC2 3
DEC3 5
VCCD1 31
DGND1 28
STDBYA 29
REFERENCE REGULATOR
TDA8779
32 10 10 10 34-43 44 OE
INI
4
10-BIT ADC
MUX INQ 6 10-BIT ADC 10 LATCHES
BUFFER
D0A to D9A
VCCO
30 AGND1 1 26 BUFFER OUTI 9 10-BIT DAC BUFFER OUTQ 11 10-BIT DAC 10 10 LATCHES 10 10
CLKA CLKD
33 OGND
15-24
BUFFER
D0D to D9D
AGND2
13
REFERENCE REGULATOR 8 VCCA2 10 12 14 VCCD2 25 27
MGG075
DEC4
DEC5
DGND2
STDBYD
Fig.1 Block diagram.
1999 Sep 16
3
Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
PINNING SYMBOL AGND1 DEC1 DEC2 INI DEC3 INQ VCCA1 VCCA2 OUTI DEC4 OUTQ DEC5 AGND2 VCCD2 D0D D1D D2D D3D D4D D5D D6D D7D D8D D9D DGND2 CLKD STDBYD DGND1 STDBYA CLKA VCCD1 OE OGND D0A D1A D2A D3A D4A D5A D6A 1999 Sep 16 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 analog ground 1 decoupling input 1 decoupling input 2 I channel ADC input decoupling input 3 Q channel ADC input analog supply voltage 1 for ADC part (5 V) analog supply voltage 2 for DAC part (5 V) I channel DAC analog output decoupling input 4 Q channel DAC analog output decoupling input 5 analog ground 2 digital supply voltage 2 for DAC part (5 V) multiplexed input for the DACs; bit 0 multiplexed input for the DACs; bit 1 multiplexed input for the DACs; bit 2 multiplexed input for the DACs; bit 3 multiplexed input for the DACs; bit 4 multiplexed input for the DACs; bit 5 multiplexed input for the DACs; bit 6 multiplexed input for the DACs; bit 7 multiplexed input for the DACs; bit 8 multiplexed input for the DACs; bit 9 digital ground 2 transmission block clock power standby for the DAC part (active HIGH) digital ground 1 power standby for the ADC part (active HIGH) reception block clock digital supply voltage 1 for ADC part (5 V) ADCs digital output enable (3-state output); (active LOW) input/output ground I and Q digital outputs; bit 0 I and Q digital outputs; bit 1 I and Q digital outputs; bit 2 I and Q digital outputs; bit 3 I and Q digital outputs; bit 4 I and Q digital outputs; bit 5 I and Q digital outputs; bit 6 4 DESCRIPTION
TDA8779H
Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
SYMBOL D7A D8A D9A VCCO PIN 41 42 43 44 I and Q digital outputs; bit 7 I and Q digital outputs; bit 8 I and Q digital outputs; bit 9 output supply voltage (2.7 to 3.3 V) DESCRIPTION
TDA8779H
42 D8A
34 D0A
37 D3A
41 D7A
36 D2A
35 D1A
38 D4A
40 D6A
39 D5A
43 D9A
handbook, full pagewidth
44 VCCO
AGND1 DEC1 DEC2 INI DEC3 INQ VCCA1 VCCA2 OUTI
1 2 3 4 5 6 7 8 9
33 OGND 32 OE 31 VCCD1 30 CLKA 29 STDBYA
TDA8779H
28 DGND1 27 STDBYD 26 CLKD 25 DGND2 24 D9D 23 D8D
DEC4 10 OUTQ 11
D6D 21
DEC5 12
VCCD2 14
D0D 15
D1D 16
D2D 17
D3D 18
D4D 19
AGND2
D5D 20
D7D 22
13
MGG074
Fig.2 Pin configuration.
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCCA1 VCCA2 VCCD1 VCCD2 VCCO VCC PARAMETER analog supply voltage for the ADC part analog supply voltage for the DAC part digital supply voltage for the ADC part digital supply voltage for the DAC part output stage supply voltage voltage difference between VCCA - VCCD VCCA - VCCO VCCD - VCCO Io Vi Vclk(p-p) Tstg Tamb Tj output current input voltage AC input switching voltage (peak-to-peak value) storage temperature ambient temperature junction temperature with respect to AGND with respect to DGND -1.0 -1.0 -1.0 - -0.3 - -55 -20 - CONDITIONS -0.3 -0.3 -0.3 -0.3 -0.3 MIN.
TDA8779H
MAX. +6.0 +6.0 +6.0 +6.0 +6.0 +1.0 +4.0 +4.0 10 +6.0 VCCD +150 +75 150
UNIT V V V V V V V V mA V V C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER CONDITIONS VALUE 75 UNIT K/W
thermal resistance from junction to ambient in free air
CHARACTERISTICS VCCA = V7 and V8 to V1 and V13 = 4.75 to 5.5 V; VCCD = V31 and V14 to V28 and V25 = 4.75 to 5.5 V; VCCO = V44 to V33 = 2.7 to 3.3 V; AGND1, AGND2, OGND, DGND1 and DGND2 are shorted together; Tamb = -20 to +75 C; measured typically at VCCA = VCCD = 5 V and VCCO = 3.0 V; CL = 15 pF; Tamb = 25 C; unless otherwise specified. SYMBOL Supplies VCCA1 VCCD1 VCCA2 VCCD2 VCCO analog supply voltage for the ADC part digital supply voltage for the ADC part analog supply voltage for the DAC part digital supply voltage for the DAC part output stage supply voltage 4.75 4.75 4.75 4.75 2.7 5.0 5.0 5.0 5.0 3.0 5.5 5.5 5.5 5.5 3.3 V V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
SYMBOL VCC PARAMETER voltage difference between VCCA - VCCD VCCA - VCCO VCCD - VCCO ICCA ICCD ICCO ICCA1(stb) ICCA2(stb) ADC part CLOCK INPUT VIL VIH IIL IIH VIL VIH IIL IIH IIL IIH Vi(p-p) Vi(p-p)over LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current Tamb = 25 C Tamb = 25 C Tamb = 25 C Tamb = 25 C 0 2.0 -10 -10 0 2.0 -10 -10 for code 0 for code 1023 full-scale overvoltage for fi = 4.43 MHz; Tamb = 25 C - - 1.52 - - - - - - - - - -91 80 1.57 - analog supply current digital supply current output stage supply current analog standby current for the ADC part analog standby current for the DAC part ramp input; fCLK = 20 MHz CONDITIONS Tamb = 25 C -0.2 0 0 59 15 - - - - - - 74 23 7 0.7 2.5 MIN. TYP.
TDA8779H
MAX. +0.2 2.8 2.8 85 35 15 3 5
UNIT V V V mA mA mA mA mA
0.8 VCCD1 +10 +10
V V A A V V A A A A V V
DIGITAL INPUTS: PINS OE AND STDBYA LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current 0.8 VCCD1 +10 +10 - - 1.62 3.0
ANALOG INPUTS LOW-level input current HIGH-level input current analog input voltage (peak-to-peak value) maximum analog input overvoltage (peak-to-peak value) input impedance input capacitance
ZI CI VOL VOH IoZ
- - Io = 1 mA Io = -1 mA 0
10 3 - -
- - 0.5 VCCO +20
k pF
DIGITAL OUTPUTS: D0A TO D9A LOW-level output voltage HIGH-level output voltage output current in 3-state mode V V A VCCO - 0.5 -
0.5 V < Vo < VCCO - 0.5 V -20
SWITCHING CHARACTERISTICS; Tamb = 25 C (see Fig.3) fCLK(max) tCH maximum clock frequency clock pulse width HIGH 7 20 20 - - - - MHz ns
1999 Sep 16
Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
SYMBOL tCL tr tf PARAMETER clock pulse width LOW clock rise time clock fall time CONDITIONS 20 - - MIN. - 4 4 TYP.
TDA8779H
MAX. - - -
UNIT ns ns ns
ANALOG SIGNAL PROCESSING
Linearity
INLA DNLA integral non linearity differential non linearity maximum missing codes guaranteed: 20 ramp input; fCLK = 20 MHz full-scale; ramp input; fCLK = 20 MHz - - 2.25 4 LSB
+1.55 to -0.9 +2.8 to -1.1 LSB
Noise floor; note 1
NF noise floor fi = 4.43 MHz; 20 Msps fi = 4.43 MHz; 20 Msps fi = 4.43 MHz; 20 Msps -55 -50 50 -71 -58 58 - - - dB
Harmonics; note 2
THD total harmonic distortion dB
Spurious free dynamic range
SFDR spurious free dynamic range dB
Matching between the I and Q channels
V amplitude matching fi = 4.43 MHz; fCLK = 20 MHz; Tamb = 25 C fi = 4.43 MHz; fCLK = 20 MHz; Tamb = 25 C full-scale sine wave; Tamb = 25 C 50% full-scale sine wave; Tamb = 25 C tds th td sampling delay time output hold time output delay time VCCO = 3.3 V VCCO = 2.7 V 3-STATE OUTPUT DELAY TIMES; Tamb = 25 C (see Fig.4) tdZH tdZL tdHZ tdLZ output delay enable HIGH output delay enable LOW output delay disable HIGH output delay disable LOW - - - - 10 7.7 15.5 14.9 - - - - ns ns ns ns - 0.1 6 %
phase matching
-
0.05
2
deg
Bandwidth
B bandwidth (maximum attenuation of -0.3 dB) 30 30 - - - - MHz MHz
TIMING (THE OUTPUT DATA IS AVAILABLE AFTER THE MAXIMUM DELAY TIME td); CL = 15 pF; Tamb = 25 C (see Fig.3) - 5 - - - - 12 13 11 - - - ns ns ns ns
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
SYMBOL PARAMETER CONDITIONS - - MIN. - - TYP.
TDA8779H
MAX.
UNIT s s
STANDBY MODE OUTPUT DELAY TIMES; STDBYA; Tamb = 25 C td(stb)LH td(stb)HL standby delay (LOW-to-HIGH transition) start-up delay (HIGH-to-LOW transition) 100 100
CROSSTALK ON THE ADC ct crosstalk on the ADC fCLK(DAC) = 16.384 MHz; fCLK(ADC) = 8.192 MHz; Tamb = 25 C; both DACs switching between input codes 0 and 1023; one ADC 1 V (p-p) sine wave at 4 MHz and the other ADC set at the middle code -50 -55 - dB
DAC part DIGITAL INPUTS: D0D TO D9D AND CLKD VIL VIH IIL IIH VIL VIH IIL IIH fCLK(max) tCH tCL tr tf ts th Vo(p-p) ZoL LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current Tamb = 25 C Tamb = 25 C Tamb = 25 C Tamb = 25 C 0 2.0 -200 -10 0 2.0 -10 -10 20 20 20 - - 11 0 - - - - - - - - - - - 4 4 - - 1 15 0.3 0.8 VCCD2 0 +10 V V A A V V A A MHz ns ns ns ns ns ns
DIGITAL INPUT; STDBYD LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current 0.8 VCCD2 +10 +10 - - - - - - - 1.1 - -
TIMING; Tamb = 25 C (see Fig.5) maximum clock frequency clock pulse width HIGH clock pulse width LOW clock rise time clock fall time input data set-up time input data hold time
ANALOG OUTPUTS; note 3 output voltage (peak-to-peak value) output load impedance full-scale see Fig.6 0.9 - - V pF k
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
SYMBOL PARAMETER CONDITIONS - - - - MIN. 0.4 0.35 8.0 7 TYP.
TDA8779H
MAX. 1.25 1.5 - -
UNIT
TRANSFER FUNCTION INLD DNLD tst integral non linearity differential non linearity settling time ramp input; fCLK = 20 MHz ramp input; fCLK = 20 MHz 10% to 90% full-scale; Tamb = 25 C 10% to 90% for 10% full-scale; Tamb = 25 C MATCHING BETWEEN CHANNEL I AND Q V amplitude matching fo = 4.43 MHz; fCLK = 20 MHz; Tamb = 25 C fo = 4.43 MHz; fCLK = 20 MHz; Tamb = 25 C fo = 4.43 MHz; fCLK = 20 MHz fo = 4.43 MHz; fCLK = 20 MHz - 0.2 6 % LSB LSB ns ns
phase matching
-
-
2
deg
DYNAMIC RANGE; note 1 NF noise floor -56 -61 - dB
SPURIOUS FREE DYNAMIC RANGE SFDR spurious free dynamic range - 55 - dB
STANDBY MODE OUTPUT DELAY; STDBYD; Tamb = 25 C td(stb)LH td(stb)HL standby delay (LOW-to-HIGH transition) start-up delay (HIGH-to-LOW transition) - - - - 100 100 s s
CROSSTALK ON THE DAC ct crosstalk on the DAC fCLK(DAC) = 16.384 MHz; fCLK(ADC) = 8.192 MHz; Tamb = 25 C; one DAC switching between input codes 0 and 1023 the other DAC set at the middle code; both ADCs 1 V (p-p) sine wave at 4 MHz; incoherent -60 -75 - dB
Notes 1. The noise floor is the maximum value of the output spectrum without taking into account fundamental and harmonics of the input signal up to the 6th harmonic. 2. Harmonics are obtained via a Fast Fourier Transformer (FFT) treatment taking 8k acquisition points per period. 3. It is recommended that the DAC output voltage is AC coupled in order to achieve optimum performance.
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
Table 1 Output coding and input voltage (typical value, with respect to AGND) Vi - V512 (V) <-0.75 -0.75 ... 0 ... 0.75 >0.75 BINARY OUTPUT BITS D9A 0 0 ... 1 ... 1 1 D8A 0 0 ... 0 ... 1 1 D7A 0 0 ... 0 ... 1 1 D6A 0 0 ... 0 ... 1 1 D5A 0 0 ... 0 ... 1 1 D4A 0 0 ... 0 ... 1 1 D3A 0 0 ... 0 ... 1 1
TDA8779H
STEP underflow 0 ... 512 ... 1023 overflow Table 2
D2A 0 0 ... 0 ... 1 1
D1A 0 0 ... 0 ... 1 1
D0A 0 0 ... 0 ... 0 1
Input coding and output voltage (typical value, with respect to DGND) BINARY INPUT BITS Vo - V512 (V) -0.5 ... 0 ... 0.5
STEP D9D 0 ... 512 ... 1023 Table 3 0 ... 1 ... 1 D8D 0 ... 0 ... 1 D7D 0 ... 0 ... 1 D6D 0 ... 0 ... 1 D5D 0 ... 0 ... 1 D4D 0 ... 0 ... 1 D3D 0 ... 0 ... 1 D2D 0 ... 0 ... 1 D1D 0 ... 0 ... 1 D0D 0 ... 0 ... 0
Mode selection D0A TO D9A high impedance active; binary Standby selection (ADC part) D0 TO D9 - ADC active Standby selection (DAC part) OUTI AND OUTQ - DAC active ICCA + ICCD (typ.) 5 mA 38 mA ICCA + ICCD (typ.) 5 mA 64 mA
OE 1 0 Table 4
STDBYA 1 0 Table 5
STDBYD 1 0
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
TDA8779H
handbook, full pagewidth
tCH n
tCL 1.4 V
CLKA
I CHANNEL ADC OUTPUT
In - 2
In - 1
In
In + 1
Q CHANNEL ADC OUTPUT
Qn - 2
Qn - 1
Qn
Qn + 1
Q CHANNEL LATCHED DATA
Qn - 2
Qn - 1
Qn
Qn + 1
HIGH MULTIPLEXED OUTPUTS In - 2 Qn - 2 In - 1 Qn - 1 td tds ViI or ViQ sample N
MGG078
In
Qn
In + 1 LOW
th
Fig.3 Timing diagram for the ADC.
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
TDA8779H
V handbook, full pagewidthCCO OE 1.4 V
HIGH
LOW tdHZ HIGH 90% output data tdLZ high-Z output data LOW 10% VCCO 50% 3.3 k TDA8779 15 pF OE
MGG077
tdZH
50% tdZL high-Z
S1
fOE = 100 kHz.
Fig.4 Timing diagram and test conditions of the 3-state output delay time.
Table 6
Test conditions for Fig.4 TEST tdLZ tdZL tdHZ tdZH SWITCH S1 VCCO VCCO OGND OGND
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
TDA8779H
handbook, full pagewidth
th
tCH
tCL HIGH 1.4 V
CLKD n ts
LOW
HIGH MULTIPLEXED INPUTS In Qn In + 1 Qn + 1 In + 2 Qn + 2 In + 3 LOW
I CHANNEL LATCHED DATA
In
In + 1
In + 2
In + 3
I CHANNEL DAC OUTPUT
In - 1
In
In + 1
In + 2
Q CHANNEL DAC OUTPUT
Qn - 1
Qn
Qn + 1
Qn + 2
MGG079
Fig.5 DACs multiplexed inputs timing diagram.
handbook, halfpage
TDA8779 9,11 I, Q
1 F
300
15 pF
MGG076
Fig.6 Equivalent DACs output load.
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
APPLICATION INFORMATION
TDA8779H
handbook, full pagewidth
VCCA1 7 INPUT BIAS 100 nF
100 nF
10 nF DEC1 DEC2 2 3
47 VCCD1 nF DEC3 5 31
DGND1 28
STDBYA 29
REFERENCE REGULATOR
TDA8779
32 10 10 10 34-43 44 OE
INI
4
10-BIT ADC
MUX 100 nF INQ 6 10-BIT ADC 10 LATCHES
BUFFER
D0A to D9A
VCCO
30 AGND1 1 26 BUFFER OUTI 9 10-BIT DAC BUFFER 11 10-BIT DAC 10 10 LATCHES 10 10
CLKA CLKD
1 F 15 pF
33 OGND
300 1 F
15-24
BUFFER
D0D to D9D
15 pF
OUTQ 300 AGND2 13
REFERENCE REGULATOR 8 VCCA2 10 nF 12 10 DEC4 DEC5 22 nF 14 VCCD2 25 27
MBH581
DGND2
STDBYD
Fig.7 Application diagram.
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
TDA8779H
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
TDA8779H
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE HLQFP, HSQFP, HSOP, SMS PLCC(3), SQFP SSOP, TSSOP, VSO Notes SO LQFP, QFP, TQFP not suitable(2) suitable not recommended(3)(4) not suitable not recommended(5) suitable suitable suitable suitable suitable
TDA8779H
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1999 Sep 16
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Philips Semiconductors
Product specification
10-bit converter interface (ADC/DAC) for quadrature transceiver
NOTES
TDA8779H
1999 Sep 16
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545004/25/04/pp20
Date of release: 1999
Sep 16
Document order number:
9397 750 06124

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