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LMU18 DEVICES INCORPORATED 16 x 16-bit Parallel Multiplier LMU18 DEVICES INCORPORATED 16 x 16-bit Parallel Multiplier DESCRIPTION The LMU18 is a high-speed, low power 16-bit parallel multiplier. The LMU18 is an 84-pin device which provides simultaneous access to all outputs. The LMU18 produces the 32-bit product of two 16-bit numbers. Data present at the A inputs, along with the TCA control bit, is loaded into the A register on the rising edge of CLK. B data and the TCB control bit are similarly loaded. Loading of the A and B registers is controlled by the ENA and ENB controls. When HIGH, these controls prevent application of the clock to the respective register. The TCA and TCB controls specify the operands as two's complement when HIGH, or unsigned magnitude when LOW. RND is loaded on the rising edge of CLK, providing either ENA or ENB are LOW. RND, when HIGH, adds `1' to the most significant bit position of the least significant half of the product. Subsequent truncation of the 16 least significant bits produces a result correctly rounded to 16-bit precision. At the output, the Right Shift control (RS) selects either of two output formats. RS LOW produces a 31-bit product with a copy of the sign bit inserted in the MSB postion of the least significant half. RS HIGH gives a full 32-bit product. Two 16-bit output registers are provided to hold the most and least significant halves of the result (MSP and LSP) as defined by RS. These registers are loaded on the rising edge of CLK, subject to the ENR control. When ENR is HIGH, clocking of the result registers is prevented. For asynchronous output these registers may be made transparent by setting the feed through control (FT) HIGH and ENR LOW. The two halves of the product may be routed to a single 16-bit three-state output port (MSP) via a multiplexer. MSPSEL LOW causes the MSP outputs to be driven by the most significant half of the result. MSPSEL HIGH routes the least significant half of the result to the MSP pins. The MSB of the result is available in both true and complemented form to aid implementation of higher precision multipliers. FEATURES u 35 ns Worst-Case Multiply Time u Low Power CMOS Technology u Full 32-bit Output Port -- No Multiplexing Required u Two's Complement, Unsigned, or Mixed Operands u Three-State Outputs u 84-pin PLCC, J-Lead LMU18 BLOCK DIAGRAM TCA CLK ENA ENB A15-0 16 A REGISTER TCB B15-0 16 B REGISTER RND REGISTER 32 RS FORMAT ADJUST 16 FT ENR RESULT 16 REGISTER MSPSEL OEM 16 R31 R31-16 16 R15-0 OEL Multipliers 1 08/16/2000-LDS.18-O LMU18 DEVICES INCORPORATED 16 x 16-bit Parallel Multiplier FIGURE 1A. INPUT FORMATS AIN BIN Fractional Two's Complement (TCA, TCB = 1) 15 14 13 -20 2-1 2-2 (Sign) 210 2-13 2-14 2-15 15 14 13 -20 2-1 2-2 (Sign) 210 2-13 2-14 2-15 Integer Two's Complement (TCA, TCB = 1) 15 14 13 -215 214 213 (Sign) 210 22 21 20 15 14 13 -215 214 213 (Sign) 210 22 21 20 Unsigned Fractional (TCA, TCB = 0) 15 14 13 2-1 2-2 2-3 210 2-14 2-15 2-16 15 14 13 2-1 2-2 2-3 210 2-14 2-15 2-16 Unsigned Integer (TCA, TCB = 0) 15 14 13 215 214 213 210 22 21 20 15 14 13 215 214 213 210 22 21 20 FIGURE 1B. OUTPUT FORMATS MSP Fractional Two's Complement (RS = 0) 31 30 29 -20 2-1 2-2 (Sign) LSP 18 17 16 2-13 2-14 2-15 15 14 13 -20 2-16 2-17 (Sign) 210 2-28 2-29 2-30 Fractional Two's Complement (RS = 1) 31 30 29 -21 20 2-1 (Sign) 18 17 16 2-12 2-13 2-14 15 14 13 2-15 2-16 2-17 210 2-28 2-29 2-30 Integer Two's Complement (RS = 1) 31 30 29 -231 230 229 (Sign) 18 17 16 218 217 216 15 14 13 215 214 213 210 22 21 20 Unsigned Fractional (RS = 1) 31 30 29 2-1 2-2 2-3 18 17 16 2-14 2-15 2-16 15 14 13 2-17 2-18 2-19 210 2-30 2-31 2-32 Unsigned Integer (RS = 1) 31 30 29 231 230 229 18 17 16 218 217 216 15 14 13 215 214 213 210 22 21 20 Multipliers 2 08/16/2000-LDS.18-O LMU18 DEVICES INCORPORATED 16 x 16-bit Parallel Multiplier MAXIMUM RATINGS Above which useful life may be impaired (Notes 1, 2, 3, 8) Storage temperature ........................................................................................................... -65C to +150C Operating ambient temperature ........................................................................................... -55C to +125C VCC supply voltage with respect to ground ............................................................................ -0.5 V to +7.0 V Input signal with respect to ground ........................................................................................ -3.0 V to +7.0 V Signal applied to high impedance output ............................................................................... -3.0 V to +7.0 V Output current into low outputs ............................................................................................................. 25 mA Latchup current ............................................................................................................................... > 400 mA OPERATING CONDITIONS To meet specified electrical and switching characteristics Mode Active Operation, Commercial Active Operation, Military Temperature Range (Ambient) 0C to +70C -55C to +125C Supply Voltage 4.75 V VCC 5.25 V 4.50 V VCC 5.50 V ELECTRICAL CHARACTERISTICS Over Operating Conditions (Note 4) Symbol VOH VOL VIH VIL IIX IOZ ICC1 ICC2 Parameter Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Current Output Leakage Current VCC Current, Dynamic VCC Current, Quiescent (Note 3) Test Condition VCC = Min., IOH = -2.0 mA VCC = Min., IOL = 8.0 mA Min 2.4 Typ Max Unit V 0.5 2.0 0.0 VCC 0.8 20 20 25 45 1.5 V V V A A mA mA Ground VIN VCC (Note 12) Ground VOUT VCC (Note 12) (Notes 5, 6) (Note 7) Multipliers 3 08/16/2000-LDS.18-O 432109876543210987654321 432109876543210987654321 432109876543210987654321 *DISCONTINUED SPEED GRADE tDIS tENA tSEL tD tH tS tPW tMUC tMC Symbol tDIS tENA tSEL tD tH tS tPW tMUC tMC Symbol R31-0 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 321098765432121098765432109876543210987654321 Min 15 20 5 DEVICES INCORPORATED COMMERCIAL OPERATING RANGE (0C to +70C) Notes 9, 10 (ns) SWITCHING CHARACTERISTICS 16 x 16-bit Parallel Multiplier LMU18- 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 10987654321 210987654321 210987654321 2 Min 11 9 1 21098765432 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 210987654321 1 210987654321 Min 15 15 5 SWITCHING WAVEFORMS MILITARY OPERATING RANGE (-55C to +125C) Notes 9, 10 (ns) Parameter Parameter Three-State Output Disable Delay (Note 11) Three-State Output Enable Delay (Note 11) Output Select Delay Output Delay Input Hold Time Input Setup Time Clock Pulse Width Unclocked Multiply Time Clocked Multiply Time Three-State Output Disable Delay (Note 11) Three-State Output Enable Delay (Note 11) Output Select Delay Output Delay Input Hold Time Input Setup Time Clock Pulse Width Unclocked Multiply Time Clocked Multiply Time ENA, ENB MSPSEL CLOCK INPUT OEM OEL ENR tS tH tDIS tPW HIGH IMPEDANCE tMC 4 tPW tMUC tENA tS 75* 65* Max Max 25 24 30 35 75 95 24 25 25 30 65 85 tH tPW Min Min 15 15 15 15 5 5 tSEL tD 55* 45 Max Max LMU18- 20 20 20 20 30 35 25 30 55 45 85 65 Min Min 12 15 12 15 5 5 45* 35 Max Max 20 20 20 20 30 33 25 28 45 35 65 55 Multipliers 12 10 2 08/16/2000-LDS.18-O LMU18 25* 20* Max 20 20 18 18 20 20 18 18 25 20 38 30 LMU18 DEVICES INCORPORATED 16 x 16-bit Parallel Multiplier NOTES 9. AC specifications are tested with input transition times less than 3 ns, output reference levels of 1.5 V (except tDIS test), and input levels of nominally 0 to 3.0 V. Output loading may be a resistive divider which provides for specified IOH and IOL at an output voltage of VOH min and VOL max 2. The products described by this spec- respectively. Alternatively, a diode ification include internal circuitry de- bridge with upper and lower current signed to protect the chip from damagsources of IOH and IOL respectively, ing substrate injection currents and ac- and a balancing voltage of 1.5 V may be cumulations of static charge. Neverthe- used. Parasitic capacitance is 30 pF less, conventional precautions should minimum, and may be distributed. be observed during storage, handling, and use of these circuits in order to This device has high-speed outputs caavoid exposure to excessive electrical pable of large instantaneous current stress values. pulses and fast turn-on/turn-off times. As a result, care must be exercised in the 3. This device provides hard clamping of testing of this device. The following transient undershoot and overshoot. In- measures are recommended: put levels below ground or above VCC will be clamped beginning at -0.6 V and a. A 0.1 F ceramic capacitor should be VCC + 0.6 V. The device can withstand installed between VCC and Ground indefinite operation with inputs in the leads as close to the Device Under Test range of -0.5 V to +7.0 V. Device opera- (DUT) as possible. Similar capacitors tion will not be adversely affected, how- should be installed between device VCC ever, input current levels will be well in and the tester common, and device ground and tester common. excess of 100 mA. 4. Actual test conditions may vary from b. Ground and VCC supply planes those designated but operation is guar- must be brought directly to the DUT anteed as specified. socket or contactor fingers. 5. Supply current for a given applica- c. Input voltages should be adjusted to tion can be accurately approximated by: compensate for inductive ground and VCC noise to maintain required DUT input NCV2 F levels relative to the DUT ground pin. 4 where 10. Each parameter is shown as a minimum or maximum value. Input requirements are specified from the point of view of the external system driving the chip. Setup time, for example, is specified as a minimum since the exter6. Tested with all outputs changing ev- nal system must supply at least that ery cycle and no load, at a 5 MHz clock much time to meet the worst-case requirements of all parts. Responses from rate. the internal circuitry are specified from 7. Tested with all inputs within 0.1 V of the point of view of the device. Output VCC or Ground, no load. delay, for example, is specified as a 8. These parameters are guaranteed maximum since worst-case operation of any device always provides data within but not 100% tested. that time. N = total number of device outputs C = capacitive load per output V = supply voltage F = clock frequency 1. Maximum Ratings indicate stress specifications only. Functional operation of these products at values beyond those indicated in the Operating Conditions table is not implied. Exposure to maximum rating conditions for extended periods may affect reliability. 11. For the tENA test, the transition is measured to the 1.5 V crossing point with datasheet loads. For the tDIS test, the transition is measured to the 200mV level from the measured steady-state output voltage with 10mA loads. The balancing voltage, VTH, is set at 3.5 V for Z-to-0 and 0-to-Z tests, and set at 0 V for Zto-1 and 1-to-Z tests. 12. These parameters are only tested at the high temperature extreme, which is the worst case for leakage current. FIGURE A. OUTPUT LOADING CIRCUIT DUT S1 IOL CL IOH VTH FIGURE B. THRESHOLD LEVELS tENA OE Z 0 1.5 V 1.5 V 1.5 V tDIS 3.5V Vth VOL* 0.2 V 0 1 Z Z 1.5 V VOH* 0.2 V Z 1 0V Vth VOL* Measured VOL with IOH = -10mA and IOL = 10mA VOH* Measured VOH with IOH = -10mA and IOL = 10mA Multipliers 5 08/16/2000-LDS.18-O LMU18 DEVICES INCORPORATED 16 x 16-bit Parallel Multiplier ORDERING INFORMATION 84-pin B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 B10 B11 B12 B13 B14 B15 ENB CLK OEL GND VCC R0 R1 R2 R3 R4 R5 R6 R7 R8 R9 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 12 74 13 73 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 72 71 70 69 68 67 66 Top View 65 64 63 62 61 60 59 58 57 56 55 32 54 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 A11 A12 A13 A14 A15 ENA RND TCA TCB VCC GND GND MSPSEL FT RS OEM ENR R31 R31 R30 R29 Speed 0C to +70C -- COMMERCIAL SCREENING 45 ns 35 ns LMU18JC45 LMU18JC35 R10 R11 R12 R13 R14 R15 VCC GND R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R26 R27 R28 Plastic J-Lead Chip Carrier (J3) Multipliers 6 08/16/2000-LDS.18-O 121098765432109876543210987654321210987654321098765432109876543212109876543210987654321098765432 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 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1210987654321098765432109876543212109876543210987654321098765432121098765432109876543210987654321 DEVICES INCORPORATED Speed -55C to +125C -- MIL-STD-883 COMPLIANT -55C to +125C -- COMMERCIAL SCREENING 0C to +70C -- COMMERCIAL SCREENING ORDERING INFORMATION 84-pin G H D C K E B A F L J OEL CLK GND B15 B13 B12 R0 R9 R7 R6 R4 R1 B9 1 ENB VCC R12 R10 B14 B11 B10 R2 R8 R5 B7 2 R13 R11 R3 B8 B6 3 Ceramic Pin Grid Array (G3) Discontinued Package R15 R14 GND VCC B5 B4 4 (i.e., Component Side Pinout) R16 R17 B0 B2 B1 7 5 Through Package Top View R19 R18 A0 A1 B3 6 R20 R21 R22 A4 A3 A2 7 R23 R24 A6 A5 8 16 x 16-bit Parallel Multiplier GND GND RND VCC TCA TCB R27 R25 RS A9 A7 9 ENR OEM R30 R26 R29 A15 A12 A10 FT MSPSEL 10 A8 ENA R31 R28 R31 A14 A13 A11 11 Multipliers LMU18 08/16/2000-LDS.18-O |
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