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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 1/4
HMBT4403
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT4403 is designed for general purpose applications requiring high breakdown voltages.
Absolute Maximum Ratings
SOT-23
* Maximum Temperatures Storage Temperature ........................................................................................... -55 ~ +150 C Junction Temperature.................................................................................................... +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 225 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -40 V VCEO Collector to Emitter Voltage..................................................................................... -40 V VEBO Emitter to Base Voltage............................................................................................. -5 V IC Collector Current....................................................................................................... -600 mA
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICEX *VCE(sat)1 *VCE(sat)2 *VBE(sat)1 *VBE(sat)2 *hFE1 *hFE2 *hFE3 *hFE4 *hFE5 fT Cob Min. -40 -40 -5 30 60 100 100 20 200 Typ. Max. -100 -400 -750 -950 -1.3 300 8.5 Unit V V V nA mV mV mV V Test Conditions IC=-100uA IC=-1mA IE=-100uA VCE=-35V, VBE=-0.4V IC=-150mA, IB=-15mA IC=-500mA, IB=-50mA IC=-150mA, IB=-15mA IC=-500mA, IB=-50mA VCE=-1V, IC=-0.1mA VCE=-1V, IC=-1mA VCE=-1V, IC=-10mA VCE=-2V, IC=-150mA VCE=-2V, IC=-500mA VCE=-10V, IC=-20mA, f=100MHz VCB=-10V, f=1MHz
*Pulse Test: Pulse Width 380us, Duty Cycle2%
MHz pF
HMBT4403
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000
Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 2/4
Current Gain & Collector Current
125 C
o
125 C
o
25 C
o
25 C
o
hFE
hFE
100
75 C
o
100
75 C
o
hFE @ VCE=1V
hFE @ VCE=2V
10 1 10 100 1000
10 1 10 100 1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
1000 VCE(sat) @ IC=10IB
1000
Saturation Voltage & Collector Current
25 C
o
Saturation Voltage (mV)
Saturation Voltage (mV)
75 C 125 C
o
o
100 75 C
o o
125 C
25 C
o
VBE(sat) @ IC=10IB
10 0.1 1 10 100 1000
100 0.1 1 10 100 1000
Collector Current-IC (mA)
Collector Current-IC (mA)
Capacitance & Reverse-Biased Voltage
100 1000
Cutoff Frequency & Collector Current
Cutoff Frequency (MHz).. .
VCE=10V
Capacitance (pF)
Cob 10
100
1 0.1 1 10 100
10 1 10 100 1000
Reverse Biased Voltage (V)
Collector Current (mA)
HMBT4403
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 3/4
Safe Operating Area
10
PT=1ms
Collector Current-IC (mA)
1
PT=100ms PT=1s
0.1
0.01 1 10 100
Forward Biased Voltage-VCE (V)
HMBT4403
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6818 Issued Date : 1993.06.30 Revised Date : 2002.10.25 Page No. : 4/4
A L
Marking:
3 BS 1 V G 2
2T
Rank Code Control Code
3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector *: Typical
DIM A B C D G H
Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040
Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10
DIM J K L S V
Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256
Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Te : 886-3-5983621~5 Fax: 886-3-5982931
HMBT4403
HSMC Product Specification


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