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MC14015B Dual 4-Bit Static Shift Register The MC14015B dual 4-bit static shift register is constructed with MOS P-channel and N-channel enhancement mode devices in a single monolithic structure. It consists of two identical, independent 4-state serial-input/parallel-output registers. Each register has independent Clock and Reset inputs with a single serial Data input. The register states are type D master-slave flip-flops. Data is shifted from one stage to the next during the positive-going clock transition. Each register can be cleared when a high level is applied on the Reset line. These complementary MOS shift registers find primary use in buffer storage and serial-to-parallel conversion where low power dissipation and/or noise immunity is desired. http://onsemi.com MARKING DIAGRAMS 16 PDIP-16 P SUFFIX CASE 648 MC14015BCP AWLYYWW 1 16 SOIC-16 D SUFFIX CASE 751B 1 16 TSSOP-16 DT SUFFIX CASE 948F 1 14 015B ALYW 14015B AWLYWW * Diode Protection on All Inputs * Supply Voltage Range = 3.0 Vdc to 18 Vdc * Logic Edge-Clocked Flip-Flop Design -- Logic state is retained indefinitely with clock level either high or low; information is transferred to the output only on the positive going edge of the clock pulse. Capable of Driving Two Low-power TTL Loads or One Low-power Schottky TTL Load Over the Rated Temperature Range. * MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.) Symbol VDD Vin, Vout Iin, Iout PD TA Tstg TL Parameter DC Supply Voltage Range Input or Output Voltage Range (DC or Transient) Input or Output Current (DC or Transient) per Pin Power Dissipation, per Package (Note 3.) Ambient Temperature Range Storage Temperature Range Lead Temperature (8-Second Soldering) Value - 0.5 to +18.0 - 0.5 to VDD + 0.5 10 500 - 55 to +125 - 65 to +150 260 Unit V V mA mW C C C SOEIAJ-16 F SUFFIX CASE 966 16 MC14015B AWLYWW 1 A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week ORDERING INFORMATION Device MC14015BCP MC14015BD MC14015BDR2 MC14015BDT MC14015BF MC14015BFEL Package PDIP-16 SOIC-16 SOIC-16 Shipping 2000/Box 48/Rail 2500/Tape & Reel 2. Maximum Ratings are those values beyond which damage to the device may occur. 3. Temperature Derating: Plastic "P and D/DW" Packages: - 7.0 mW/_C From 65_C To 125_C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS (Vin or Vout) VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. TSSOP-16 2000/Tape & Reel SOEIAJ-16 SOEIAJ-16 See Note 1. See Note 1. v v 1. For ordering information on the EIAJ version of the SOIC packages, please contact your local ON Semiconductor representative. (c) Semiconductor Components Industries, LLC, 2000 1 March, 2000 - Rev. 3 Publication Order Number: MC14015B/D MC14015B TRUTH TABLE C D 0 1 X X X R 0 0 0 1 Q0 0 1 No Change 0 Qn Qn-1 Qn-1 No Change 0 X = Don't Care Qn = Q0, Q1, Q2, or Q3, as applicable. Qn-1 = Output of prior stage. PIN ASSIGNMENT CB Q3B Q2A Q1A Q0A RA DA VSS 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VDD DB RB Q0B Q1B Q2B Q3A CA BLOCK DIAGRAM Q0 7 D Q1 Q2 9 6 Q0 15 D Q1 Q2 1 14 VDD = PIN 16 VSS = PIN 8 C R Q3 2 12 11 13 C R Q3 10 4 3 5 http://onsemi.com 2 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II I I I II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIII II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I I I III II IIII I III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I I I I III II IIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II II IIII I I II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I I I I III I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIII I I I I I I I III IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I II IIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III II IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII 4. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. 5. The formulas given are for the typical characteristics only at 25_C. 6. To calculate total supply current at loads other than 50 pF: where: IT is in A (per package), CL in pF, V = (VDD - VSS) in volts, f in kHz is input frequency, and k = 0.002. ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS) Total Supply Current (5.) (6.) (Dynamic plus Quiescent, Per Package) (CL = 50 pF on all outputs, all buffers switching) Quiescent Current (Per Package) Input Capacitance (Vin = 0) Input Current Output Drive Current (VOH = 2.5 Vdc) (VOH = 4.6 Vdc) (VOH = 9.5 Vdc) (VOH = 13.5 Vdc) Input Voltage "0" Level (VO = 4.5 or .05 Vdc) (VO = 9.0 or 1.0 Vdc) (VO = 13.5 or 1.5 Vdc) Output Voltage Vin = VDD or 0 (VOL = 0.4 Vdc) (VOL = 0.5 Vdc) (VOL = 1.5 Vdc) (VO = 0.5 or 4.5 Vdc) "1" Level (VO = 1.0 or 9.0 Vdc) (VO = 1.5 or 13.5 Vdc) Vin = 0 or VDD Characteristic IT(CL) = IT(50 pF) + (CL - 50) Vfk "1" Level "0" Level Source Sink Symbol VOH VOL IOH VIH IDD Cin IOL VIL Iin IT VDD Vdc 5.0 10 15 5.0 10 15 5.0 10 15 5.0 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 15 -- http://onsemi.com - 3.0 - 0.64 - 1.6 - 4.2 4.95 9.95 14.95 0.64 1.6 4.2 Min 3.5 7.0 11 -- -- -- -- -- -- -- -- -- -- -- MC14015B - 55_C 3 0.1 0.05 0.05 0.05 Max 5.0 10 20 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- - 2.4 - 0.51 - 1.3 - 3.4 4.95 9.95 14.95 0.51 1.3 3.4 Min 3.5 7.0 11 -- -- -- -- -- -- -- -- -- -- -- IT = (1.2 A/kHz)f + IDD IT = (2.4 A/kHz)f + IDD IT = (3.6 A/kHz)f + IDD 0.00001 Typ (4.) - 4.2 - 0.88 - 2.25 - 8.8 0.005 0.010 0.015 25_C 0.88 2.25 8.8 2.75 5.50 8.25 2.25 4.50 6.75 5.0 5.0 10 15 0 0 0 0.1 0.05 0.05 0.05 Max 5.0 10 20 7.5 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- -- -- - 1.7 - 0.36 - 0.9 - 2.4 4.95 9.95 14.95 0.36 0.9 2.4 Min 3.5 7.0 11 -- -- -- -- -- -- -- -- -- -- -- 125_C 1.0 0.05 0.05 0.05 Unit MaxIII 150 300 600 1.5 3.0 4.0 -- -- -- -- -- -- -- -- -- -- -- -- -- -- mAdc mAdc Adc Adc Adc Vdc Vdc Vdc Vdc pF III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I III I I I I I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I III I I I I I IIIII I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I III I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I IIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII 7. The formulas given are for typical characteristics only at 25_C. 8. Data labelled "Typ" is not to be used for design purposes but is intended as an indication of the IC's potential performance. SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C) Setup Time Reset Pulse Width Clock Pulse Rise and Fall Times Clock Pulse Frequency Clock Pulse Width Propagation Delay Time Clock, Data to Q tPLH, tPHL = (1.7 ns/pF) CL + 225 ns tPLH, tPHL = (0.66 ns/pF) CL + 92 ns tPLH, tPHL = (0.5 ns/pF) CL + 65 ns Reset to Q tPLH, tPHL = (1.7 ns/pF) CL + 375 ns tPLH, tPHL = (0.66 ns/pF) CL + 147 ns tPLH, tPHL = (0.5 ns/pF) CL + 95 ns Output Rise and Fall Time tTLH, tTHL = (1.5 ns/pF) CL + 25 ns tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns Characteristic CLOCK DATA Figure 1. Power Dissipation Test Circuit and Waveform PULSE GENERATOR 1 PULSE GENERATOR 2 50% 500 F http://onsemi.com 1 f tTLH, tTHL Symbol MC14015B tPLH, tPHL tTLH, tTHL tWH tWH tsu fcl C R D 4 ID VDD Q0 Q1 Q2 Q3 VDD VDD 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 5.0 10 15 VSS CL 0.01 F CERAMIC CL Min 350 100 75 400 160 120 400 175 135 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- CL CL Typ (8.) 100 50 40 200 80 60 185 85 55 460 180 120 310 125 90 100 50 40 2.0 6.0 7.5 -- -- -- 1.5 3.0 3.75 Max 750 250 170 750 250 170 200 100 80 15 5 4 -- -- -- -- -- -- -- -- -- MHz Unit s ns ns ns ns ns MC14015B tTLH DATA INPUT tsu PULSE GENERATOR 2 SYNC PULSE GENERATOR 1 C R VDD D Q0 Q1 Q2 Q3 CL VSS tWL = tWH = 50% Duty Cycle tTLH = tTHL 20 ns Q0 tTLH CL CL CL tTLH CLOCK INPUT tWH tPLH t- tTHL 90% 50% 10% tTHL 90% 50% 10% tWL tPHL 90% 50% 10% tTHL VDD 0V VDD 0V Figure 2. Switching Test Circuit and Waveforms PULSE GENERATOR 2 SYNC PULSE GENERATOR 1 VDD D Q0 Q1 Q2 C R Q3 CL VSS CL DATA INPUT 50% CL CL CLOCK INPUT 50% tsu th VDD 0V VDD 0V Figure 3. Setup and Hold Time Test Circuit and Waveforms http://onsemi.com 5 SINGLE BIT VDD Q RESET CLOCK DATA IN TO D OF NEXT BIT VSS MC14015B CIRCUIT SCHEMATICS http://onsemi.com RESET INPUT BUFFER VDD VDD DATA TO FIRST BIT RESET IN VSS VSS 6 DATA INPUT BUFFER CLOCK INPUT BUFFER VDD DATA IN RESET TO 4 BITS CLOCK IN CLOCK TO 4 BITS VSS MC14015B LOGIC DIAGRAMS SINGLE BIT C DATA C C C C C Q TO D OF NEXT BIT C RESET C C C C COMPLETE DEVICE 5 Q0 DATA INPUT BUFFER D 7 CLOCK INPUT BUFFER D C R Q Q D C R Q Q D C R Q Q D C R Q Q 4 Q1 3 Q2 10 Q3 C 9 R 6 RESET INPUT BUFFER DATA INPUT BUFFER D 15 CLOCK INPUT BUFFER C 1 R 14 RESET INPUT BUFFER D C R Q Q 13 Q0 12 Q1 11 Q2 2 Q3 D C R Q Q D C R Q Q D C R Q Q VDD = PIN 16 VSS = PIN 8 http://onsemi.com 7 MC14015B PACKAGE DIMENSIONS -A- 16 9 PDIP-16 P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R B 1 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 F S C L -T- H G D 16 PL SEATING PLANE K J TA M M 0.25 (0.010) M http://onsemi.com 8 MC14015B PACKAGE DIMENSIONS SOIC-16 D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 -A- 16 9 -B- 1 8 P 8 PL 0.25 (0.010) M B S G F K C -T- SEATING PLANE R X 45 _ M D 16 PL M J 0.25 (0.010) TB S A S DIM A B C D F G J K M P R http://onsemi.com 9 MC14015B PACKAGE DIMENSIONS TSSOP-16 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F-01 ISSUE O 16X K REF 0.10 (0.004) 0.15 (0.006) T U S M TU S V S K K1 16 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ 2X L/2 J1 B -U- L PIN 1 IDENT. 1 8 SECTION N-N J N 0.25 (0.010) 0.15 (0.006) T U S A -V- N F DETAIL E C 0.10 (0.004) -T- SEATING PLANE H D G DETAIL E http://onsemi.com 10 EEE CCC EEE CCC M 9 -W- MC14015B PACKAGE DIMENSIONS SOEIAJ-16 F SUFFIX PLASTIC EIAJ SOIC PACKAGE CASE 966-01 ISSUE O 16 9 LE Q1 E HE M_ L DETAIL P 1 8 Z D e A VIEW P NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --- 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --- 0.78 INCHES MIN MAX --- 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --- 0.031 c b 0.13 (0.005) M A1 0.10 (0.004) http://onsemi.com 11 MC14015B ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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