View HC4P5509A1R3060_118583.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

HC5509A1R3060
June 1997
SLIC Subscriber Line Interface Circuit
Description
The HC4P5509A1R3060 telephone Subscriber Line Interface Circuit integrates most of the BORSCHT functions on a monolithic IC. The device is manufactured in a Dielectric Isolation (DI) process and is designed for use as a high voltage interface between the traditional telephone subscriber pair (Tip and Ring) and the low voltage filtering and coding/decoding functions of the line card. Together with a secondary protection diode bridge and "feed" resistors, the device will withstand 1000V lightning induced surges, in plastic packages. The SLIC also maintains specified transmission performance in the presence of externally induced longitudinal currents. The BORSCHT functions that the SLIC provides are: * Battery Feed with Subscriber Loop Current Limiting * Overvoltage Protection * Ring Relay Driver * Supervisory Signaling Functions * Hybrid Functions (with External Op Amp) * Test (or Battery Reversal) Relay Driver In addition, the SLIC provides selective denial of power to subscriber loops, a programmable subscriber loop current limit from 20mA to 60mA, a thermal shutdown with an alarm output and line fault protection. Switch hook detection, ring trip detection and ground key detection functions are also incorporated in the SLIC device. The HC4P5509A1R3060 SLIC is ideally suited for line card designs in PBX and CO systems, replacing traditional transformer solutions.
Features
* DI Monolithic High Voltage Process * Compatible with Worldwide PBX and CO Performance Requirements * Controlled Supply of Battery Feed Current with Programmable Current Limit * Operates with 5V Positive Supply (VB+) * Internal Ring Relay Driver and a Utility Relay Driver * High Impedance Mode for Subscriber Loop * High Temperature Alarm Output * Low Power Consumption During Standby Functions * Switch Hook, Ground Key, and Ring Trip Detection * Selective Power Denial to Subscriber * Voice Path Active During Power Denial * On Chip Op Amp for 2-Wire Impedance Matching
Applications
* Solid State Line Interface Circuit for PBX or Central Office Systems, Digital Loop Carrier Systems * Hotel/Motel Switching Systems * Direct Inward Dialing (DID) Trunks * Voice Messaging PBXs * High Voltage 2-Wire/4-Wire, 4-Wire/2-Wire Hybrid * Related Literature - AN9607, Impedance Matching Design Equations - AN9628, AC Voltage Gain - AN9608, Implementing Pulse Metering - AN549, The HC-5502S/4X Telephone Subscriber Line Interface Circuits (SLIC)
Ordering Information
PART NUMBER HC4P5509A1R3060 TEMP. RANGE (oC) 0 to 75 PACKAGE 28 Ld PLCC PKG. NO. N28.45
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999
File Number
3675.3
1
HC5509A1R3060
Absolute Maximum Ratings TA = 25oC
Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V Maximum Supply Voltages (VB+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V (VB+)-(VB-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +75V Junction Temperature Plastic . . . . . . . . . . . . . . . . . . . . . . . . . 150oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . 300oC
Thermal Information
Thermal Resistance (Typical, Note 1) PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . .
JA (oC/W)
67
Die Characteristics
Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 x 120 Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI
Operating Conditions
Operating Temperature Range HC4P5509A1R3060 . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 75oC Storage Temperature Range . . . . . . . . . . . . . . . . . . -65oC to 150oC Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V Positive Power Supply (VB+) . . . . . . . . . . . . . . . . . . . . . . . +5V 5% Negative Power Supply (VB-) . . . . . . . . . . . . . . . . . . . . -42V to -58V Loop Resistance (RL) . . . . . . . . . . . . . . . . . 200 to 1750 (Note 2)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. JA is measured with the component mounted on an evaluation PC board in free air. 2. May be extended to 1900 with application circuit.
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at TA = 25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at 600 2-Wire terminating impedance. TEST CONDITIONS MIN TYP MAX UNITS
PARAMETER AC TRANSMISSION PARAMETERS RX Input Impedance TX Output Impedance 4-Wire Input Overload Level
300Hz to 3.4kHz (Note 3) 300Hz to 3.4kHz (Note 3) 300Hz to 3.4kHz RL = 1200, 600 Reference Matched for 600 (Note 3)
+1.5
100 -
20 -
k VPEAK
2-Wire Return Loss SRL LO ERL SRL HI 2-Wire Longitudinal to Metallic Balance Off Hook 4-Wire Longitudinal Balance Off Hook Low Frequency Longitudinal Balance
26 30 30 Per ANSI/IEEE STD 455-1976 (Note 3) 300Hz to 3400Hz 300Hz to 3400Hz (Note 3) 58
35 40 40 63
-
dB dB dB dB
50
55
-
dB
R.E.A. Test Circuit ILINE = 40mA TA = 25oC (Note 3)
-
-
-67 23 30
dBmp dBrnC mARMS
Longitudinal Current Capability Insertion Loss 2-Wire/4-Wire 4-Wire/2-Wire 4-Wire/4-Wire
ILINE = 40mA TA = 25oC (Note 3) 0dBm at 1kHz, Referenced 600
-6.22 -6.22
-6.02 0.05 -6.02
-5.82 0.2 -5.82
dB dB dB
2
HC5509A1R3060
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at TA = 25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at 600 2-Wire terminating impedance. (Continued) TEST CONDITIONS 300Hz to 3400Hz (Note 3) Referenced to Absolute Level at 1kHz, 0dBm Referenced 600 Referenced to -10dBm (Note 3) +3 to -40dBm -40 to -50dBm -50 to -55dBm Absolute Delay 2-Wire/4-Wire 4-Wire/2-Wire 4-Wire/4-Wire Transhybrid Loss Total Harmonic Distortion 2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire Idle Channel Noise 2-Wire and 4-Wire C-Message (Note 3) Psophometric 3kHz Flat Power Supply Rejection Ratio VB+ to 2-Wire VB+ to 4-Wire VB- to 2-Wire VB- to 4-Wire VB+ to 4-Wire VB+ to 2-Wire VB- to 4-Wire VB- to 2-Wire Ring Sync Pulse Width DC PARAMETERS Loop Current Programming Limit Range (Note 4) 20 (Note 4) 10 RL = 200 60 mA (Note 3) 200Hz to 16kHz, RL = 600 (Note 3) 30Hz to 200Hz, RL = 600 5 -85 15 dBrnC dBmp dBrn (Note 3) fIN - 1kHz fIN - 1kHz fIN - 1kHz VIN = 1VP-P at 1kHz (Note 3) Reference Level 0dBm at 600 300Hz to 3400Hz (Note 3) 32 0.7 0.3 1.5 40 1.2 1.0 2.0 -52 s s s dB dB 0.05 0.1 0.3 dB dB dB MIN TYP 0.02 MAX 0.05 UNITS dB
PARAMETER Frequency Response
Level Linearity 2-Wire to 4-Wire and 4-Wire to 2-Wire
25 25 25 25 25 25 25 25 50
29 29 29 29 25 25 -
500
dB dB dB dB dB dB dB dB s
Accuracy Loop Current During Power Denial
3
5
% mA
3
HC5509A1R3060
Electrical Specifications
Unless Otherwise Specified, Typical Parameters are at TA = 25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at 600 2-Wire terminating impedance. (Continued) TEST CONDITIONS MIN TYP MAX UNITS
PARAMETER Fault Currents TIP to Ground RING to Ground TIP and RING to Ground Switch Hook Detection Threshold Ground Key Detection Threshold Thermal ALARM Output Ring Trip Comparator Threshold Dial Pulse Distortion Relay Driver Outputs On Voltage VOL Off Leakage Current TTL/CMOS Logic Inputs (RC, PD, RS, TST, PRI) Logic `0' VIL Logic `1' VIH Input Current (RC, PD, RS, TST, PRI) Logic Outputs Logic `0' VOL Logic `1' VOH Power Dissipation On Hook IB+ IBUNCOMMITTED OP AMP PARAMETERS Input Offset Voltage Input Offset Current Differential Input Resistance Output Voltage Swing Small Signal GBW NOTES: (Note 2) RL = 10k
9.5 Safe Operating Die Temperature Exceeded See Typical Applications for more information 140 9.5 -
38 54 85 12 13.5 13.5 0.1
45 60 95 15 17.5 160 17.5 0.5
mA mA mA mA mA
oC
mA ms
IOL (PR) = 60mA, IOL (RD) = 60mA VOH = 13.2V
-
0.2 10
0.5 100
V A
2.0 0V VIN 5V -
-
0.8 5.5 100
V V A
ILOAD = 800A ILOAD = 40A Relay Drivers Off VB+ = +5.25V, VB- = -58V, RLOOP = VB+ = +5.25V, VB- = -58V, RLOOP =
2.7 -
0.1 200 -
0.5 6 -
V V mW mA mA

-6
-
5 10 1 3 1
-
mV nA M VP-P MHz
3. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied. 4. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and specification compliance. 5. Application limitation based on maximum switch hook detect limit and metallic currents. Not a part limitation.
4
HC5509A1R3060 Pin Descriptions
SOIC 1 SYMBOL AG DESCRIPTION Analog Ground - To be connected to zero potential. Serves as a reference for the transmit output and receive input terminals. Positive Voltage Source - Most Positive Supply. Capacitor #C1 - An external capacitor to be connected between this terminal and analog ground. Required for proper operation of the loop current limiting function. Power Denial - A low active TTL-compatible logic input. When enabled, the output of the ring amplifier will ramp to close to the output voltage of the tip amplifier. Ring Command - A low active TTL-compatible logic input. When enabled, the relay driver (RD) output goes low on the next high level of the ring sync (RS) input, as long as the SLIC is not in the power down mode (TST = 0) or the subscriber is not already off-hook (SHD = 0). Ring Synchronization Input - A TTL - compatible clock input. The clock is arranged such that a positive pulse (50 - 500s) occurs on the zero crossing of the ring voltage source, as it appears at the RFS terminal. For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and for Ring injected systems, on the positive going zero crossing. This ensures that the ring relay activates and deactivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin should be tied to +5. Switch Hook Detection - An active low LS TTL compatible logic output. A line supervisory output. Ground Key Detection - An active low LS TTL compatible logic output. A line supervisory output. A TTL logic input. A low on this pin will keep the SLIC in a power down mode. The TST pin in conjunction with the ALM pin can provide thermal shutdown protection for the SLIC. Thermal shutdown is implemented by a system controller that monitors the ALM pin. When the ALM pin is active (low) the system controller issues a command to the Test pin (low) to power down the SLIC. The timing of the thermal recovery is controlled by the system controller. A TTL compatible active low output which responds to the thermal detector circuit when a safe operating die temperature has been exceeded. Reference the TST pin description for a method to reduce prolonged thermal overstress that may reduce component life. Loop Current Limit - Voltage on this pin sets the short loop current limiting conditions using a resistive voltage divider. The analog output of the spare operational amplifier. The inverting analog input of the spare operational amplifier. An analog input connected to the TIP (more positive) side of the subscriber loop through a feed resistor and ring relay contact. Functions with the RING terminal to receive voice signals from the telephone and for loop monitoring purpose. An analog input connected to the RING (more negative) side of the subscriber loop through a feed resistor. Functions with the TIP terminal to receive voice signals from the telephone and for loop monitoring purposes. Ring Feed Sense - Senses RING side of the loop for Ground Key Detection. During Ring injected ringing the ring signal at this node is isolated from RF via the ring relay. For Tip injected ringing, the RF and RFS pins must be shorted. Receive Input, 4-Wire Side - A high impedance analog input. AC signals appearing at this input drive the Tip Feed and Ring Feed amplifiers differentially. Longitudinal Amplifier Output - A low impedance output to be connected to C2 through a low pass filter. Output is proportional to the difference in ITIP and IRING.
2 3
VB+ C1
4
PD
5
RC
6
RS
7 8 9
SHD GKD TST
10
ALM
11
ILMT
12 13 14
OUT1 -IN1 TIP
15
RING
16
RFS
17
VRX
18
LAO
5
HC5509A1R3060 Pin Descriptions
SOIC 19 SYMBOL VTX (Continued) DESCRIPTION Transmit Output, 4-Wire Side - A low impedance analog output which represents the differential voltage across TIP and RING. Transhybrid balancing must be performed beyond this output to completely implement two to four wire conversion. This output is referenced to analog ground. Since the DC level of this output varies with loop current, capacitive coupling to the next stage is necessary. A TTL compatible input used to control PR. PRI active High = PR active low. An active low open collector output. Can be used to drive a Polarity Reversal Relay. Battery Ground - Tube connected to zero potential. All loop current and some quiescent current flows into this terminal. Ring Relay Driver - An active low open collector output. Used to drive a relay that switches ringing signals onto the 2-Wire line. Feedback input to the tip feed amplifier; may be used in conjunction with transmit output signal and the spare op amp to accommodate 2-Wire line impedance matching. Tip Feed - A low impedance analog output connected to the TIP terminal through a feed resistor. Functions with the RF terminal to provide loop current, and to feed voice signals to the telephone set and to sink longitudinal currents. Ring Feed - A low impedance analog output connected to the RING terminal through a feed resistor. Functions with the TF terminal to provide loop current, feed voice signals to the telephone set, and to sink longitudinal currents. The battery voltage source. The most negative supply. Capacitor #2 - An external capacitor to be connected between this terminal and ground. It prevents false ring trip detection from occurring when longitudinal currents are induced onto the subscriber loop from power lines and other noise sources. This capacitor should be nonpolarized.
20 21 22
PRI PR BG
23
RD
24
VFB
25
TF
26
RF
27 28
VBC2
Pinout
HC4P5509A1R3060 (PLCC) TOP VIEW
VB+ PD VB27 AG C1 RF 26 C2 28
4
3
2
1
RC RS SHD GKD TST
5 6 7 8 9
25 TF 24 VFB 23 RD 22 BG 21 PR 20 PRI 19 VTX
ALM 10 ILMT 11
12 OUT1
13 -IN1
14 TIP
15 RING
16 RFS
17 VRX
18 LAO
6
HC5509A1R3060 Functional Diagram
PLCC
R R TF 25 TF + R R/2 RF1 2R R R TIP 14 R R 4.5K 100K RING 15 100K 100K RFS 16 100K 4.5K 90K RFC 90K 26 10 LA + 25K FAULT DET 25K RTD GKD GK TA + 2R SHD THERM LTD SW IIL LOGIC INTERFACE 2R 4 PD 5 RC 6 9 TST 20 21 PR 23 RD 7 8 SHD GKD ALM PRI RS + VRX 17 OUT 1 12 -IN 1 13 OP AMP VFB 24 VTX 19 VB+ 2 BIAS NETWORK AG 1 22 BG
27
VB-
TSD
RF
RF +
90K VB/2 REF 3 C1 18 LAO 28 C2 GM +
RF2
R = 108k
11 ILMT
Overvoltage Protection and Longitudinal Current Protection
PARAMETER
TABLE 1. TEST CONDITION 10s Rise/ 1000s Fall 10s Rise/ 1000s Fall 1000 (Plastic) 1000 (Plastic) VPEAK PERFORMANCE (MAX) 1000 (Plastic) UNITS VPEAK
The SLIC device, in conjunction with an external protection bridge, will withstand high voltage lightning surges and power line crosses. High voltage surge conditions are as specified in Table 1. The SLIC will withstand longitudinal currents up to a maximum or 30mARMS, 15mARMS per leg, without any performance degradation.
.
Longitudinal Surge Metallic Surge
T/GND R/GND 50/60Hz Current T/GND R/GND
10s Rise/ 1000s Fall
VPEAK
11 Cycles Limited to 10ARMS
700 (Plastic)
VRMS
7
HC5509A1R3060 Logic Diagram
TTL TO I2L RS
RELAY DRIVER
RD
RC
I2L TO TTL GKD
SHD GK
SH
TST
TSD
ALM
BN PD IPD PD = 0, IPD = ACTIVE A B C KEY INJ A B C
NOTE:
PRI and PD are independent switch driven by TTL input levels.
8
HC5509A1R3060 Applications Diagram
SYSTEM CONTROLLER
K1 RS1 TIP CS1 K2
SHD GKD PRI RD PR
RS
TST
PD
ALM
RC RL2 ILIMIT
K1A RB1 SECONDARY PROTECTION (NOTE) C5 RB2
TIP TF
VRX+ VFB RL1
FROM PCM FILTER/CODER
VB-
SLIC HC4P5509A1R3060 VTX
CAC
PRIMARY PROTECTION K1B RS2 CS2 VRING 150VPEAK(MAX) RB4
RF -IN1
KRF
KZ0 RFS OUT1 TO HYBRID BALANCE NETWORK
RING
RB3
LAO RING VBBG C2 AG VB+ C1
Z1
PTC C3 CF2 C4 +5V RF1 RF2 CF1
NOTE: Secondary protection diode bridge recommended is 3A, 200V type.
FIGURE 1. TYPICAL LINE CIRCUIT APPLICATION WITH THE MONOLITHIC SLIC
TYPICAL COMPONENT VALUES C1 = 0.5F, 30V RF1 = RF2 = 210k, 1% CF1 = CF2 = 0.22F, 10%, 20V Nonpolarized C3 = 0.01F, 100V, 20% C4 = 0.01F, 100V, 20% C5 = 0.01F, 100V, 20% CAC = 0.5F, 20V KZ0 = 30k, (Z0 = 600) RL1, RL2; Current Limit Setting Resistors:
NOTES: 1. All grounds (AG, BG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes to run separate grounds off a line card, the AG must be applied first. 2. Application shows Ring Injected Ringing, a Balanced or Tip injected configuration may be used.
ILIMIT = (0.6) (RL1 + RL2)/(200 x RL2), RL1 typically 100k KRF = 20k RB1 = RB2 = RB3 = RB4 = 50 0.1% absolute matching RS1 = RS2 = 1k typically CS1 = CS2 = 0.1F, 200V typically, depending on VRing and line length. Z1 = 150V to 200V transient protector. PTC used as ring generator ballast.
9
HC5509A1R3060 Plastic Leaded Chip Carrier Packages (PLCC)
0.042 (1.07) 0.048 (1.22) PIN (1) IDENTIFIER C L 0.042 (1.07) 0.056 (1.42) 0.050 (1.27) TP 0.004 (0.10) C
N28.45 (JEDEC MS-018AB ISSUE A)
28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE INCHES SYMBOL A MIN 0.165 0.090 0.485 0.450 0.191 0.485 0.450 0.191 28 MAX 0.180 0.120 0.495 0.456 0.219 0.495 0.456 0.219 MILLIMETERS MIN 4.20 2.29 12.32 11.43 4.86 12.32 11.43 4.86 28 MAX 4.57 3.04 12.57 11.58 5.56 12.57 11.58 5.56 NOTES 3 4, 5 3 4, 5 6 Rev. 1 3/95
0.025 (0.64) R 0.045 (1.14)
D2/E2 C L
A1 D
E1 E
D1 D2
D2/E2 VIEW "A"
E E1
D1 D 0.020 (0.51) MAX 3 PLCS
A1 A
0.020 (0.51) MIN
E2 N
-C- SEATING PLANE 0.026 (0.66) 0.032 (0.81) 0.013 (0.33) 0.021 (0.53)
0.045 (1.14) MIN
0.025 (0.64) MIN VIEW "A" TYP.
NOTES: 1. Controlling dimension: INCH. Converted millimeter dimensions are not necessarily exact. 2. Dimensions and tolerancing per ANSI Y14.5M-1982. 3. Dimensions D1 and E1 do not include mold protrusions. Allowable mold protrusion is 0.010 inch (0.25mm) per side. 4. To be measured at seating plane -C- contact point. 5. Centerline to be determined where center leads exit plastic body. 6. "N" is the number of terminal positions.
10

▲Up To Search▲

Price & Availability of HC4P5509A1R3060

	To Download HC4P5509A1R3060 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .