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| (R) TN2540-G SCR FEATURES HIGH SURGE CAPABILITY HIGH ON-STATE CURRENT HIGH STABILITY AND RELIABILITY DESCRIPTION The TN2540 series of Silicon Controlled Rectifiers uses a high performance glass passivated technology. This SCR is designed for power supplies up to 400Hz on resistive or inductive load. A A K G D2PAK ABSOLUTE MAXIMUM RATINGS Symbol IT(RMS) IT(AV) ITSM Parameter RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current (Tj initial = 25C) I2t dI/dt Tstg Tj Tl I2t Value for fusing Critical rate of rise of on-state current dIG /dt = 1 A/s. IG = 100 mA Storage junction temperature range Operating junction temperature range Maximum temperature for soldering during 10s Tc= 100C Tc= 100C tp = 8.3 ms tp = 10 ms tp = 10ms Value 25 16 314 300 450 100 - 40 to + 150 - 40 to + 125 260 A2s A/s C C Unit A A A Symbol VDRM VRRM Parameter Repetitive peak off-state voltage Tj = 125C TN2540600G 600 800G 800 Unit V May 1998 - Ed: 5 1/5 TN2540-G THERMAL RESISTANCES Symbol Rth(j-a) Rth(j-c) Parameter Junction to ambient (S=1cm2) Junction to case for D.C Value 45 1.0 Unit C/W C/W GATE CHARACTERISTICS PG (AV)= 1W PGM = 10 W (tp = 20 s) ELECTRICAL CHARACTERISTICS Symbol IGT Test Conditions VD = 12V (DC) RL= 33 Tj= 25C Type MIN MAX VGT VGD IH IL VTM IDRM IRRM dV/dt VD = 12V (DC) RL= 33 VD = VDRM RL = 3.3k IT= 200mA IG = 1.2 IGT ITM= 50A tp= 380s VD = VDRM VR = VRRM VD=67%VDRM Gate open Gate open Tj= 25C Tj= 125C Tj= 25C Tj= 25C Tj= 25C Tj= 25C Tj= 125C Tj= 125C MAX MIN MAX MAX MAX MAX MAX MIN Value 3 40 1.3 0.2 50 90 1.5 5 4 500 V V mA mA V A mA V/s Unit mA IGM = 4 A (tp = 20 s) VRGM = 5 V ORDERING INFORMATION Add "-TR" suffix for Tape & Reel shipment TN SCR CURRENT 25 40 - 600 SENSITIVITY G PACKAGES : G: D2PAK VOLTAGE 2/5 TN2540-G Fig. 1: Maximum average power dissipation versus average on-state current . Fig. 2 : Correlation between maximum average power dissipation and maximum allowable temperatures (Tamb and T case) for different thermal resistances heatsink+contact. P(W) =180 D.C. P(W) 25 20 15 10 5 IT(AV)(A) 0 0 5 10 15 20 25 =30 =60 =120 =90 Tcase (C) Rth=3C/W Rth=2C/W Rth=1C/W Rth=0C/W 25 20 100 105 15 10 5 0 0 110 115 =180 120 Tamb(C) 40 60 80 100 120 140 125 20 Fig. 3: Average and D.C. on-state current versus case temperature. Fig. 4: Relative variation of thermal impedance versus pulse duration. IT(AV)(A) 30 D.C. K=[Zth/Rth] 1.00 Zth(j-c) 25 20 =180 Zth(j-a) 15 10 5 0 0 25 Tcase(C) 50 75 100 125 0.10 tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig. 5: Relative variation of gate trigger current and holding current versus junction temperature. Fig. 6: Non repetitive surge peak on-state current versus number of cycles. IGT,IH[Tj]/IGT,IH[Tj=25C] 2.5 2.0 1.5 1.0 0.5 Tj(C) 0.0 -40 -20 0 20 40 60 80 100 120 140 IH IGT ITSM(A) 320 280 240 200 160 120 80 40 0 1 Number of cycles 10 100 1000 3/5 Tj initial=25C F=50Hz TN2540-G Fig. 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and corresponding value of I2t. ITSM(A),It(As) 1000 ITSM Tj initial=25C Fig. 8: On-state characteristics (maximum values). ITM(A) 300 100 500 It Tj=Tj max. Tj max.: Vto=0.77V Rt=14m 10 200 tp(ms) 100 1 2 5 10 Tj=25C VTM(V) 1 0 1 2 3 4 5 Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m). Rth(j-a) (C/W) 80 70 60 50 40 30 20 10 0 0 4 8 12 S(Cu) (cm) 16 20 24 28 32 36 40 Fig. 10: Typical reflow soldering heat profile, either for mounting on FR4 or metal-backed boards. T (C) 250 200 150 100 50 0 Metal-backed board Epoxy FR4 board 245C 215C t (s) 0 40 80 120 160 200 240 280 320 360 4/5 TN2540-G PACKAGE MECHANICAL DATA D2PAK DIMENSIONS A E L2 C2 REF. A A1 D Millimeters 4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0.40 0 8 0 1.40 4.60 0.169 2.69 0.098 0.23 0.001 0.93 0.027 Inches 0.181 0.106 0.009 0.037 0.024 0.054 0.368 0.405 0.208 0.624 0.055 0.069 0.016 8 Min. Typ. Max. Min. Typ. Max. L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R A2 B B2 C C2 D E G L L2 L3 R V2 0.048 0.055 0.60 0.017 1.36 0.047 9.35 0.352 10.28 0.393 5.28 0.192 15.85 0.590 1.40 0.050 1.75 0.055 FOOT PRINT DIMENSIONS (in millimeters) 16.90 MARKING: TN2540 x00G 10.30 1.30 5.08 3.70 8.90 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics (c) 1998 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5 |
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