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TD62783,784AP/AFW
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62783AP,TD62783AFW,TD62784AP,TD62784AFW (Manufactured by Toshiba Malaysia)
8CH HIGH-VOLTAGE SOURCE DRIVER
The TD62783AP / AFW Series are comprised of eight source current Transistor Array. These drivers are specifically designed for fluorescent display applications. Applications include relay, hammer and lamp drivers.
FEATURES
l High output voltage Type-AP, AFW : VCC = 50 V MIN. Type-F : VCC = 35 V MIN.
l Output current (single output) IOUT = -500 mA MIN. l Output clamp diodes l Single supply voltage l Input compatible with various types of logic l Package Type-AP : DIP-18 pin l Package Type-AFW : SOL-18 pin
TYPE TD62783AP / AFW TD62784AP / AFW
DESIGNATION TTL, 5 V CMOS 6~15 V PMOS, CMOS
Weight DIP18-P-300-2.54F : 1.478 g (Typ.) SOL18-P-300-1.27 : 0.48 g (Typ.)
PIN CONNECTION (TOP VIEW)
SCHEMATICS (EACH DRIVER)
Note:
The input and output parasitic diodes cannot be used as clamp diodes.
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MAXIMUM RATINGS (Ta = 25C)
CHARACTERISTIC Supply Voltage Output Current Input Voltage Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation Operating Temperature Storage Temperature AP AFW SYMBOL VCC IOUT VIN (Note 1) VIN (Note 2) VR IF PD Topr Tstg RATING 50 -500 15 30 50 500 1.47 0.92 / 1.31 (Note 3) -40~85 -55~150 UNIT V mA / ch V V mA W C C
Note 1: Only TD62783AP / AFW Note 2: Only TD62784AP / AFW Note 3: On Glass Epoxy PCB (75 x 114 x 1.6 mm Cu 20%)
RECOMMENDED OPERATING CONDITIONS (Ta = -40~85C)
CHARACTERISTIC Supply Voltage SYMBOL VCC TEST CONDITION Duty = 10% 8Circuits Output Current IOUT AFW Input Voltage Output On Output Off TD62783AP / AFW TD62784AP / AFW TD62783AP / AFW TD62784AP / AFW TD62783AP / AFW TD62784AP / AFW AP AFW VIN Ta = 85C Duty = 50% 8Circuits Tj = 120C Tpw = 25ms Duty = 10% 8Circuits Duty = 50% 8Circuits Ta = 85C Ta = 85C (Note) MIN 2.0 4.5 0 0 TYP. 5.0 12.0 MAX 50 -260 -59 -180 -38 12 24 15 30 0.8 2.0 50 35 400 0.76 0.48 V mA W V V mA / ch UNIT V
VIN (ON)
Input Voltage
VIN (OFF)
Clamp Diode Reverse Voltage Clamp Diode Forward Current Power Dissipation
VR IF
AP AFW
PD
Note:
On Glass Epoxy PCB (75 x 114 x 1.6 mm Cu 20%)
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ELECTRICAL CHARACTERISTICS (Ta = 25C)
CHARACTERISTIC Output Leakage Current SYMBOL ICEX TEST CIR- CUIT 1 TEST CONDITION VCC = VCC MAX. VIN = 0.4 V Ta = 25C VIN = VIN (ON), IOUT = -350 mA Output Saturation Voltage VCE (sat) 2 VIN = VIN (ON), IOUT = -225 mA VIN = VIN (ON), IOUT = -100 mA TD62783AP / AFW Input Current TD62784AP / AFW TD62783AP / AFW Input Voltage TD62784AP / AFW TD62783AP / AFW TD62784AP / AFW Supply Current Clamp Diode Reverse Current Clamp Diode Forward Voltage Turn-On Delay Turn-Off Delay IIN (ON) 3 VIN = 2.4 V VIN = 3.85 V VIN = 5 V VIN = 12 V VIN (ON) 4 VIN (OFF) ICC (ON) IR VF tON tOFF 3 5 6 7 VCE = 2.0 V IOUT = -350 mA IOUT = -500 A VIN = VIN (ON), VCC = 50 V VR = 50 V IF = 350 mA VCC = VCC MAX. RL = 125 CL = 15 pF, RL = 88 (F) MIN 0.8 2.0 TYP. 36 180 92 790 0.15 1.8 MAX 100 2.0 1.9 1.8 52 260 130 1130 2.0 4.5 2.5 50 2.0 mA / ch A V s V A V UNIT A
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TEST CIRCUIT
1. ICEX 2. VCE (sat)
3.
IIN (ON), ICC
4.
VIN (ON), VIN (OFF)
5.
IR
6.
VF
7.
tON, tOFF
Note 1: Pulse width 50 s, duty cycle 10% Output impedance 50 , tr 5 ns, tf 10 ns Note 2: CL includes probe and jig capacitance
PRECAUTIONS for USING
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding.
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PACKAGE DIMENSIONS
DIP18-P-300-2.54F Unit: mm
Weight: 1.478 g (Typ.)
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PACKAGE DIMENSIONS
SOL18-P-300-1.27 Unit: mm
Weight: 0.48 g (Typ.)
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RESTRICTIONS ON PRODUCT USE
000707EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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