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| TC170 CMOS Current Mode PWM Controller Features * Low Supply Current With CMOS Technology: 3.8mA Max * Internal Reference: 5.1V * Fast Rise/Fall Times (C L = 1000pF): 50nsec * Dual Push-Pull Outputs * Direct-Power MOSFET Drive * High Totem-Pole Output Drive: 300mA * Differential Current-Sense Amplifier * Programmable Current Limit * Soft-Start Operation * Double-Pulse Suppression * Undervoltage Lockout * Wide Supply Voltage Operation: 8V to 16V * High Frequency Operation: 200kHz * Available with Low OFF State Outputs * Low Power, Pin-Compatible Replacement for UC3846 General Description The TC170 offers maximum supply current of 3.8mA. Bipolar current-mode control integrated circuits require five times more operating current. The dual totem-pole CMOS outputs drive power MOSFETs or bipolar transistors. The 50nsec typical output rise and fall times (1000pF capacitive loads) minimize MOSFET power dissipation. Output peak current is 300mA. The TC170 contains a full array of system-protection circuits (see Features Section). Current-mode control lets users parallel power supply modules. Two or more TC170 controllers can be slaved together for parallel operation. Circuits can operate from a master TC170 internal oscillator or an external system oscillator. The TC170 operates from an 8V to 16V power supply. An internal 2%, 5.1V reference minimizes external component count. The TC170 is pin compatible with the Unitrode UC1846/UC2846/UC3846 bipolar controller. Other advantages inherent in current-mode control include superior line and load regulation and automatic symmetry correction in push-pull converters. Applications * Switching Power Supplies * DC/DC Converters * Motor Control Device Selection Table Part Number TC170COE TC170CPE Package 16-Pin SOIC (Wide) 16-Pin PDIP (Narrow) Temp. Range 0C to +70C 0C to +70C Package Type 16-Pin PDIP (Narrow) SOFT START/ ILIM 1 VREFOUT 2 - I SENSE IN 3 + I SENSE IN 4 + ERROR AMP IN 5 - ERROR AMP IN 6 CMPTR 7 CO 8 9 RO 16 SHDN 15 IN 16-Pin SOIC (Wide) SOFT START/ ILIM VREFOUT - I SENSE IN 1 2 3 4 5 6 7 8 16 15 14 SHDN VIN OUTPUT B VDD GND OUTPUT A SYNC RO TC170CPE DD + I SENSE IN + ERROR AMP IN - ERROR AMP IN CMPTR CO TC170COE 13 12 11 10 9 NOTE: Outputs LOW in "OFF" state. 2002 Microchip Technology Inc. DS21395B-page 1 (c) TC170 Functional Block Diagram VREF 2 VIN RO CO Sync (-) Current Sense Input (+) Current Sense Input Comp (+) Error Amp Input (-) Error Amp Input 15 5.1-Volt Reference TC170 13 11 9 8 10 3 4 7 VDD 5 6 + - Error Amplifier 350mV Lock-up Amplifier - Q1 + Positive Feedback 3.5k Q2 - 100A - + x 3.15 Current Amplifier + - 0.75V PWM Comparator S - S Limit Buffer Amplifier + - Q4 Shutdown Comparator 16 + 350 mV 6k Q3 Shutdown PWM Latch 1 Current Limit/ Soft-Start Adjust R Q Oscillator Undervoltage Lockout DQ C Q 14 12 VDD Output A( ) + Output B( ) Ground NOTE: Outputs low in OFF state. (c) DS21395B-page 2 2002 Microchip Technology Inc. TC170 1.0 ELECTRICAL CHARACTERISTICS *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Supply Voltage ....................................................... 18V Output Voltage ........................................... VDD or 18V Analog Inputs .................................. -0.3V to VS + 0.3V Package Thermal Resistance: SOIC (Wide) JA ..................................... 105C/W SOIC (Wide) JC ....................................... 23C/W PDIP (Narrow) JA .................................... 95C/W PDIP (Narrow) JC .................................... 55C/W Operating Temperature Range ............... 0C to +70C Storage Temperature Range .............. -65C to +150C TC170 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = 16V, RO = 24k, CO = 1nF, TA = 25C, unless otherwise noted. Symbol Reference Voltage VREF Reference Voltage Line Regulation Load Regulation VRTC Oscillator F VCOSC TCOSC VOS IB VCMRR AVOL BW CMRR PSRR AIAMP VDM VCM VOS IB VTH VIN IL IL Oscillator Frequency Voltage Stability Temperature Stability Input Offset Voltage Input Bias Current Common-Mode Input Voltage Open-Loop Voltage Gain Unity Gain Bandwidth Common-Mode Rejection Ratio Power Supply Rejection Ratio Amplifier Gain Maximum Differential Input Signal Common-Mode Input Voltage Current Limit Offset Voltage Input Bias Current Threshold Voltage Input Voltage Range Minimum Latching Current at Pin 1 Maximum Nonlatching Current at Pin 1 0.3 0 125 50 0.35 0 0.5 60 60 3 3.15 3.3 1.1 VDD - 3V 1 1 0.4 VDD 0 70 1.2 35 42 1.1 5 46 1.5 10 30 1 VDD - 2V kHz %/V % mV nA V dB MHz dB dB V/V V V V nA V V A A VCMV = 0V to 14V VIN = 8V to 16V Pin 3 = 0V to 1.1V VPIN4 - VPIN3 VIN = 8V to 16V VOUT = 1V to 6V VIN = 8V to 16V Over operating temperature range. Temperature Coefficient 5 5.1 5 13 0.4 5.3 15 20 0.5 V mV mV mV/C IOUT = 1mA VIN = 8V to 16V IOUT = 1mA to 10mA Over operating temperature range. Parameter Min Typ Max Units Test Conditions Error Amplifier Current Sense Amplifier Current Limit Adjust Shutdown Terminal 2002 Microchip Technology Inc. DS21395B-page 3 (c) TC170 TC170 ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: VIN = 16V, R O = 24k, CO = 1nF, TA = 25C, unless otherwise noted. Symbol Output Stage V DD VOL VOL VOH VOL tR tF Output Voltage Output Low Level Output Low Level Output High Level Output High Level Output Rise Time Output Fall Time Start-Up Threshold Hysteresis Supply IS Standby Supply Current 2.7 3.8 mA 7.15 0.5 VDD - 1V VDD - 4V 50 50 7.7 0.75 150 150 8.25 1 VIN - 0.5 VIN VIN + 0.5 0.4 2 V V V V V nsec nsec V V Pin 13 ISINK = 20mA ISINK = 100mA ISOURCE = 20mA ISOURCE = 100mA CL = 1000pF CL = 1000pF Threshold Parameter Min Typ Max Units Test Conditions Undervoltage Lockout (c) DS21395B-page 4 2002 Microchip Technology Inc. TC170 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. (16-Pin PDIP, SOIC) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 PIN FUNCTION TABLE Symbol Description SOFT START/ILIM Soft Start Adjust/Current Limit. For setting the peak current threshold of sense inputs (pins 3 and 4). Second function of this pin is Soft-Start Adjust. VREFOUT -ISENSEIN +ISENSEIN Reference supply output of 5.1 volts. It can supply a minimum of 10mA. -Current Sense Input. Inverting input for sensing peak current of the pass transistor through series sense current monitor resistor. +Current Sense Input. Non-inverting input used in conjunction with pin 3. This senses the positive end of current monitor resistor. -Error Amp In. Inverting input of the amplifier for the reference voltage. For compensation of the feedback loop response. Timing capacitor (CO) input to set oscillator frequency in conjunction with pin 9, RO, resistor input. Second function is for setting crossover dead time of pin 11and 14 outputs. Timing resistor (RO) input to set oscillator frequency by setting constant current charge rate to charge capacitor CO. For PWM controller oscillator synchronization of two or more controllers. Or as a clock input to sync oscillator from external signal. A output drive of phase A from push pull transistors. Ground return for all input and output pins. Supplies power to operate the output drivers only. Output of phase B from push pull transistors. Voltage bias supply for all TC170 circuits except the output transistors. Input pin to disable both output drives to 0V OFF. +ERROR AMP IN +Error Amp In. Non-inverting input for output voltage regulation. -ERROR AMP IN CMPTR CO RO SYNC OUTPUT A GND V DD OUTPUT B VIN SHDN 2002 Microchip Technology Inc. DS21395B-page 5 (c) TC170 3.0 3.1 DETAILED DESCRIPTION Peak Current Limit Setup Resistors R1 and R2 at the current limit input (pin 1) set the TC170 peak current limit (Figure 3-1). The potential at pin 1 is easily calculated: V1 = VREF R2 R1 + R2 The input pulse to pin 16 should be at least 500nsec wide and have an amplitude of at least 1V in order to get the minimum propagation delay from input to output. If these parameters are met, the delay should be less than 600nsec at 25C; however, the delay time will increase as the device temperature rises. 3.3 Soft Restart From Shutdown R1 should be selected first. The shutdown circuit feature is not latched for (VREF - 0.35)/R1 < 50A and is latched for currents greater than 125A. The error amplifier output voltage is clamped from going above V1 through the limit buffer amplifier. Peak current is sensed by RS and amplified by the current amplifier which has a fixed gain of 3.15. IPCL, the peak current limit, is the current that causes the PWM comparator noninverting input to exceed V1, the potential at the inverting input. Once the comparator trip point is exceeded, both outputs are disabled. IPCL is easily calculated: IPCL = where: V1 = VREF R2 R1 + R2 V1 - 0.75V 3.15 (RS) A soft restart can be programmed if nonlatched shutdown operation is used. A capacitor at pin 1 will cause a gradual increase in potential toward V1. When the voltage at pin 1 reaches 0.75V, the PWM latch set input is removed and the circuit establishes a regulated output voltage. The softstart operation forces the PWM output drivers to initially operate with minimum duty cycle and low peak currents. Even if a soft start is not required, it is necessary to insert a capacitor between pin 1 and ground if the current IL is greater than 125A. This capacitor will prevent "noise triggering" of the latch, yet minimize the soft-start effect. 3.4 Soft-Start Power-Up VREF = Internal voltage reference = 5.1V 3.15 = Gain of current-sense amplifier 0.75V = Current limit offset Both driver outputs (pins 11 and 14) are OFF (LOW) when the peak current limit is exceeded. When the sensed current goes below IPCL, the circuit operates normally. During power-up, a capacitor at R1, R2 initiates a softstart cycle. As the input voltage (pin 15) exceeds the undervoltage lockout potential (7.7V), Q4 is turned OFF, ending undervoltage lockout. Whenever the PWM comparator inverting input is below 0.5V, both outputs are disabled. When the undervoltage lockout level is passed, the capacitor begins to charge. The PWM duty cycle increases until the operating output voltage is reached. Soft-start operation forces the PWM output drivers to initially operate with minimum duty cycle and low peak current. 3.5 Current-Sense Amplifier 3.2 Output Shutdown The TC170 outputs can be turned OFF quickly through the shutdown input (pin 16). A signal greater than 350mV at pin 16 forces the shutdown comparator output HIGH. The PWM latch is held set, disabling the outputs. Q2 is also turned ON. If VREF/R1 is greater than 125A, positive feedback through the lockup amplifier and Q1 keeps the inverting PWM comparator inverting input below 0.75V. Q3 remains ON even after the shutdown input signal is removed, because of the positive feedback. The state can be cleared only through a power-up cycle. Outputs will be disabled whenever the potential at pin 1 is below 0.75V. The shutdown terminal gives a fast, direct way to disable the TC170 output transistors. System protection and remote shutdown applications are possible. The current-sense amplifier operates at a fixed gain of 3.15. Maximum differential input voltage (VPIN4 - VPIN3) is 1.1V. Common-mode input voltage range is 0V to VIN - 3V. Resistive-sensing methods are shown in Figure 3-2 and Figure 3-3. In Figure 3-2, a simple RC filter limits transient voltage spikes at pin 4, caused by external output transistor-collector capacitance. Transformer coupling (Figure 3-4) offers isolation and better power efficiency, but cost and complexity increase. In order to minimize the propagation delay from the input to the current amplifier to the output terminals, the current ramp should be in the order of 1sec in width (min). Typical time delay values are in the 300 to 400nsec region at 25C. The delay time increases with device temperature so that at 50C, the delay times may be increased by as much as 100nsec. (c) DS21395B-page 6 2002 Microchip Technology Inc. TC170 FIGURE 3-1: Switch Current x 3.15 Current Sense Amplifier 4 3 RS 7 VDD 100A Error Amplifier 5 6 + - V1 + - Limit Buffer Amplifier Shutdown Comparator 16 + Q1 + Positive Feedback Q2 - 6k Q4 + - PWM Comparator - + + S - From Undervoltage Lockout S PWM Latch 5.1V VREF 2 R1 1 V1 Q R R1 AND R2 SET MAXIMUM PEAK OUTPUT CURRENT 10 "A" = 1 Output Off (Low) 0.75V R2 Q3 350mV - Lock-Up Amplifier TC170 350mV IL 3.5k FIGURE 3-2: x 3.15 Current Sense Amplifier + - GROUND REFERENCE RESISTIVE SENSING I 4 C 3 R* RS FIGURE 3-3: I x 3.15 Current Sense Amplifier ABOVE GROUND RESISTIVE SENSING RS VOUT TC170 + 4 *Optional RC Filter - 3 TC170 2002 Microchip Technology Inc. DS21395B-page 7 (c) TC170 FIGURE 3-4: TRANSFORMER ISOLATED CURRENT SENSE FIGURE 3-5: 9 MASTER/SLAVE PARALLEL OPERATION RO x 3.15 Current Sense Amplifier + - 4 + VS - IS * RS VS = N N 1 8 TC170 IS CO Master SYNC 10 CMPTR 7 3 TC170 1/2 TC4427 VDD 3.6 Undervoltage Lockout 2 VREF 10 SYNC 7 CMPTR The undervoltage lockout circuit forces the TC170 outputs OFF (low) if the supply voltage is below 7.7V. Threshold hysteresis is 0.75V and guarantees clean, jitter-free turn-on and turnoff points. The hysteresis also reduces capacitive filtering requirements at the PWM controller supply input (pin 15). 9R O 8 CO TC170 3.7 Circuit Synchronization FIGURE 3-6: Slave Current-mode-controlled power supplies can be operated in parallel with a common load. Paralleled converters will equally share the load current. Voltagemode controllers unequally share the load current, decreasing system reliability. Two or more TC170 controllers can be slaved together for parallel operation. Circuits can operate from a master TC170 internal oscillator with an external driver (Figure 3-5). Devices can also be slaved to an external oscillator (Figure 3-6). Disable internal slave device oscillators by grounding pin 8. Slave controllers derive an oscillator from the bidirectional synchronization output signal at pin 10. Pin 10 is bidirectional in that it is intended to be both a sync output and input. This is accomplished by making the output driver "weak." This is advantageous in that it eliminates an additional pin from the package but does not enable the device to directly drive another device. In order to make it an effective driver, a buffer is required (Figure 3-5). In order to use pin 10 as a sync input, it is necessary to overcome the internal driver. This requires a pulse with an amplitude equal to VIN. Since VIN must be above 8.25V for the undervoltage lockout to be disabled, a CMOS or open-collector TTL driver should be used. EXTERNAL CLOCK SYNCHRONIZATION VDD External* Oscillator 1/2 TC4427 15 VIN 10 SYNC TC170 VREF 2 + VS 15 VIN 10 SYNC TC170 VREF 2 RO 9 CO RO 9 CO 8 *Pulse Width of Oscillator is = TD (c) DS21395B-page 8 2002 Microchip Technology Inc. TC170 FIGURE 3-7: OSCILLATOR CIRCUIT VDD Pin 8 1 FO 2.3V 4.3V ICHARGE 2.3V RO + - 2.3V Pin 10 On-Time 10 Sync Discharge Current 1mA 8 9 RO CO Output Dead Time (TD) 3.8 Oscillator Frequency and Output Dead Time FIGURE 3-8: The oscillator frequency for R O = 24k and CO = 1000pF is: 50 OSCILLATOR FREQUENCY VS. OSCILLATOR RESISTANCE FO = where: OSCILLATOR RESISTANCE (k) [ 1.27 ROCO - 2800 RO2CO ] CO CO + 150 x 10-12 45 40 35 30 25 20 15 10 5 0 500pF 1000pF 750pF 20 40 60 80 100 120 140 160 180 200 OSCILLATOR FREQUENCY (kHz) 250pF TA = +25C R O = Oscillator Resistor () C O = Oscillator Capacitor (F) FO = Oscillator Frequency (Hz) The oscillator resistor can range from 5k to 50k. Oscillator capacitor can range from 250pF to 1000pF. Figure 3-8 shows typical operation for various resistance and capacitance values. During transitions between the two outputs, simultaneous conduction is prevented. Oscillator fall time controls the output off, or dead time (Figure 3-7). Dead time is approximately: TD = 2000 [CO] 2.3 1- RO () where: R O = Oscillator Resistor (k) C O = Oscillator Capacitor (pF) TD = Output Dead Time (sec) Maximum possible duty cycle is set by the dead time. 2002 Microchip Technology Inc. DS21395B-page 9 (c) TC170 4.0 Note: TYPICAL CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Output Rise and Fall Times TA = +25C CLOAD = 500pF VS = 16V Output Rise and Fall Times TA = +25C CLOAD = 1800pF VS = 16V Output Rise and Fall Times TA = +25C CLOAD = 1000pF VS = 16V 5V DIV 50 nsec DIV 5V DIV 5 nsec DIV 5V DIV 50 nsec DIV (c) DS21395B-page 10 2002 Microchip Technology Inc. TC170 5.0 5.1 PACKAGING INFORMATION Package Marking Information Package marking data not available at this time. 5.2 Taping Form Component Taping Orientation for 16-Pin SOIC (Wide) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 16-Pin SOIC (W) 16 mm 12 mm 1000 13 in 2002 Microchip Technology Inc. DS21395B-page 11 (c) TC170 5.3 Package Dimensions 16-Pin PDIP (Narrow) PIN 1 .270 (6.86) .240 (6.10) .045 (1.14) .030 (0.76) .770 (19.56) .740 (18.80) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .310 (7.87) .290 (7.37) .040 (1.02) .020 (0.51) .014 (0.36) .008 (0.20) .400 (10.16) .310 (7.87) 10 MAX. .110 (2.79) .090 (2.29) .070 (1.78) .045 (1.14) .022 (0.56) .015 (0.38) Dimensions: inches (mm) 16-Pin SOIC (Wide) PIN 1 .299 (7.59) .419 (10.65) .291 (7.40) .398 (10.10) .413 (10.49) .398 (10.10) .104 (2.64) .097 (2.46) .050 (1.27) TYP. .019 (0.48) .014 (0.36) .012 (0.30) .004 (0.10) 8 MAX. .050 (1.27) .016 (0.40) .013 (0.33) .009 (0.23) Dimensions: inches (mm) (c) DS21395B-page 12 2002 Microchip Technology Inc. TC170 Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21395B-page13 TC170 NOTES: DS21395B-page14 2002 Microchip Technology Inc. TC170 Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. 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Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 03/01/02 (c) DS21395B-page 16 2002 Microchip Technology Inc. *B59312SD* |
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