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TLP3020, TLP3021, TLP3022, TLP3023
TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRIAC
TLP3020,TLP3021,TLP3022,TLP3023
Unit: mm
OFFICE MACHINE HOUSEHOLD USE EQUIPMENT TRIAC DRIVER SOLID STATE RELAY
The TOSHIBA TLP3020, TLP3021, TLP3022 and TLP3023 consist of a photo-triac optically coupled to a gallium arsenide infrared emitting diode in a six lead plastic DIP package. l Peak Off-State Voltage l Trigger LED Current : 400 V (Min.) : 30mA (Max.) (TLP3020) 15 mA (Max.) (TLP3021) 10 mA (Max.) (TLP3022) 5 mA (Max.) (TLP3023) : 100 mA (Max.) : UL1577, File No. E67349 : 5000 Vrms (Min.) : DIN VDE0884 / 08.87, Certificate No. 68329 JEDEC EIAJ TOSHIBA Weight: 0.44g 11-9A2
l On-State Current l UL Recognized l Isolation Voltage l Option (D4) Type l VDE Approved
PIN CONFIGURATION (TOP VIEW)
Maximum Operating Insulation Voltage: 630 VPK Highest Permissible Over Voltage: 6000 VPK
Note: When a VDE0884 approved type is needed, please designate the " Option (D4) "
l Creepage Distance : Clearance : Insulation Thickness :
7.62mm pich standard type 7.0 mm (Min.) 7.0 mm (Min.) 0.5 mm (Min.)
10.16 mm pich (LF2) type 8.0 mm (Min.) 8.0 mm (Min.) 0.5 mm (Min.) 1: 2: 3: 4: 6: ANODE CATHODE N.C. TERMINAL 1 TERMINAL 2
1
2001-06-13
TLP3020, TLP3021, TLP3022, TLP3023
MAXIMUM RATINGS (Ta=25C)
CHARACTERISTIC Forward Current Forward Current Derating (Ta 53C) Peak Forward Current (100ms pulse, 100pps) Power Dissipation Power Dissipation Derating (Ta 25C) Reverse Voltage Junction Temperature Off-State Output Terminal Voltage On-Stage RMS Current Ta=25C Ta=70C SYMBOL IF DIF/C IFP PD DPD/C VR Tj VDRM IT(RMS) DIT/C ITP ITSM PD DPD/C Tj Tstg Topr Tsol PT DPT/C BVS RATING 50 -0.7 1 100 -1.0 5 125 400 100 50 -1.1 2 1.2 300 -4.0 115 -55 ~ 150 -40 ~ 100 260 330 -4.4 5000 UNIT mA mA/C A mW mW/C V C V mA mA/C A A mW mW/C C C C C mW mW/C Vrms
LED DETECTOR
On-State Current Derating (Ta 25C) Peak On-Stage Current (100ms pulse, 120pps)
Peak Nonrepetitive Surge
Current (PW =10ms, DC=10%) Power Dissipation Power Dissipation Derating (Ta 25C) Junction Temperature
Storage Temperature Range Operating Temperature Range Lead Soldering Temperature (10s) Total Package Power Dissipation Total Package Power Dissipation Derating (Ta 25C) Isolation Voltage (AC, 1 min., R.H. 60%) (Note 1)
Note 1: Device considered a two terminal device together.
:Pins 1, 2 and 3 shorted together and pins 4 and 6 shorted
RECOMMENDED OPERATING CONDISTIONS
CHARACTERISTICS Supply Voltage Forward Current Peak On-Stage Current Operating Temperature SYMBOL VAC IF* ITP Topr MIN 3/4 15 3/4 -25 TYP. 3/4 20 3/4 3/4 MAX 120 25 1 85 UNIT Vac mA A C
*: In the case of TLP3022
2
2001-06-13
TLP3020, TLP3021, TLP3022, TLP3023
INDIVIDUAL ELECTRICAL CHARACTERISTICS (Ta=25C)
CHARACTERISTIC Forward Voltage LED Reverse Current Capacitance Peak Off-State Current DETECTOR Peak On-Stage Voltage Holding Current Critical Rate of Rise of OffState Voltage Critical Rate of Rise of Commutating Voltage SYMBOL VF IR CT IDRM VTM IH dv / dt dv / dt(c) TEST CONDITION IF=10mA VR=5V V=0, f=1MHz VDRM=400V ITM=100mA 3/4 Vin=120Vrms, Ta=85C (Fig.1) Vin=30Vrms, IF=15mA (Fig.1) MIN 1.0 3/4 3/4 3/4 3/4 3/4 200 3/4 TYP. 1.15 3/4 10 10 1.7 0.6 500 0.2 MAX 1.3 10 3/4 100 3.0 3/4 3/4 3/4 UNIT V mA pF nA V mA V/ms V/ms
COUPLED ELECTRICAL CHARACTERISTICS (Ta=25C)
CHARACTERISTIC TLP3020 Trigger LED Current TLP3021 TLP3022 TLP3023 Capacitance Input to Output Isolation Resistance CS RS VS=0, f=1MHz VS=500V (R.H. 60%) AC, 1 minute Isolation Voltage BVS AC, 1 second (in oil) DC, 1 minute (in oil) 3/4 3/4 IFT VT=3V SYMBOL TEST CONDITION MIN 3/4 3/4 3/4 3/4 3/4 510
10
TYP. 3/4 3/4 5 3/4 0.8 10
14
MAX 30 15 10 5 3/4 3/4 3/4 3/4 3/4
UNIT
mA
pF W Vrms Vdc
3/4 10000 10000
Fig. 1 dv/dt TEST CIRCUIT
3
2001-06-13
TLP3020, TLP3021, TLP3022, TLP3023
IF - Ta
IT
(RMS)
- Ta
IFP -DR
I F - VF
DV F /DTa - I F
IFP - VFP
4
2001-06-13
TLP3020, TLP3021, TLP3022, TLP3023
NORMALIZED IFT - Ta
NORMALIZED IH - Ta
NORMALIZED IDRM - Ta
NORMALIZED VDRM - Ta
NORMALIZED LED CURRENT - LED CURRENT PULSE WIDTH
5
2001-06-13
TLP3020, TLP3021, TLP3022, TLP3023
RESTRICTIONS ON PRODUCT USE
000707EBC
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
6
2001-06-13

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