| PART |
Description |
Maker |
| 19459 19459-3 |
THERMAL INTERFACE PAD (VI-200)
THERMAL INTERFACE PAD, (VI-200)
|
VICOR[Vicor Corporation]
|
| AND8044D |
Single-Channel 1206A ChipFET TM Power MOSFET Recommended Pad Pattern and Thermal Performance
|
ON Semiconductor
|
| KF2004-GM50 KF2004-GM50A |
Thermal Printheads > For BARCODE, SCALE > KF2002*-, 300*-GM Series
Thick film thermal printhead (with thermal historical control) 厚膜热敏打印头（热历史与控制
|
ROHM[Rohm]
Rohm CO.,LTD.
Rohm Co., Ltd.
|
| P2NS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| STP3NA100 STP3NA100FP |
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN
OLD PRODUCT: NOT SUITABLE FOR NEW DESIGN-IN 老产品：不适合用于新设计中
N - CHANNEL ENHANCEMENT MODE FAST POWER MOS TRANSISTOR
|
ST Microelectronics
|
| EMC1428-1-AP EMC1428-6-AP |
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
SMSC Corporation
|
| KD2002-DC70A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| SE3004-DC70A |
High speed thermal printhead (with thermal historical control)
|
Rohm
|
| KD2003-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| 1LWP2300 5TH21000 5TH23000 |
THERMAL Pads For SC, SV and SO relays Low thermal resistance Easy to use
|
celduc-relais
|
| SE2004-DC70A |
High speed thermal printhead (with thermal historical control)
|
ROHM[Rohm]
|
