| PART |
Description |
Maker |
| MPC603PFE220LX MPC603PFE240LX MPC603PFE233LX MPC60 |
32-BIT, 220 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 240 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 233 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 180 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 166 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
32-BIT, 160 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 4.15 MM HEIGHT, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| C450UT190-0319-30 C460UT190-0319-30 C450UT190-0318 |
Small Chip 190 x 190 x 85 Single Wire Bond Structure
Cree UltraThin Gen III LEDs
Small Chip 190 x 190 x 85 Single Wire Bond Structure
|
Cree, Inc
Marktech Corporate
|
| ATCWBR14701FGEW |
Wire Bond Resistors
|
List of Unclassifed Manufac...
|
| TT140N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| TT320N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| TT280N16SOF |
Solder-Bond Technology
|
Infineon Technologies A...
|
| MPE603EFE100LX |
32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 32 X 32 MM, 0.50 MM PITCH, WIRE BOND, CERAMIC, QFP-240
|
Motorola Mobility Holdings, Inc.
|
| SML-LX19012UWC-WB7 |
7W, WIRELESS BOND LED MODULE
|
LUMEX INC.
|
|
