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CDR31BP331B -    MIL-PRF-55681/Chips

CDR31BP331B_8818478.PDF Datasheet

 
Part No. CDR31BP331B CDR34BP332B CDR31BP241B CDR32BP241B CDR33BP242A CDR34BP242B CDR32BP240B CDR32BP910B CDR32BP911B CDR34BP912A CDR35BP912B CDR32BP5R1B CDR33BP102B CDR33BP112B CDR33BP132B CDR33BP152B CDR33BP162B CDR33BP182B CDR33BP122B CDR32BP100B CDR32BP470B CDR32BP2R0B
Description    MIL-PRF-55681/Chips

File Size 54.30K  /  4 Page  

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AVX Corporation



Homepage http://www.avx.com
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PART Description Maker
74ACT04MTCX-NL 74ACT04SCX-NL CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
Fairchild Semiconductor Corporation
Fairchild Semiconductor, Corp.
UT54ACS04-PCA UT54ACTS04-PCA UT54ACS04-PCX UT54ACT CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
KOA Speer Electronics,Inc.
CDR32BX109BBSM CDR32BX129ABSP CDR32BX109BBSR CDR32 CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
电容
KEMET Corporation
TT electronics Semelab, Ltd.
5962-8854001CX CERAMIC CHIP/MIL-PRF-55681 陶瓷芯片/mil-prf-55681
Weidmuller, Corp.
CDR04BX104AKUM CDR03BP331B CDR01B151B CDR01BX561B CAP 0.15UF 10% X7R SMD-1812 BULK BASE/BARR/SOLDER R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.1 uF, SURFACE MOUNT, 1812
Chips
MIL-PRF-55681/Chips Part Number Example CDR01 thru CDR06
AVX, Corp.
AVX Corporation
M39014/22-1146 M39014/22-1102 M39014/22-1169 M3901 CAP 0.27UF 50V 10% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BR, 0.27 uF, THROUGH HOLE MOUNT
CAP 2200PF 200V 10% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 200 V, BX, 0.0022 uF, THROUGH HOLE MOUNT
CAP 1000PF 200V 10% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 200 V, C0G, 0.001 uF, THROUGH HOLE MOUNT
CAP 0.18UF 50V 10% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BR, 0.18 uF, THROUGH HOLE MOUNT
CAP 0.22UF 50V 20% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.22 uF, THROUGH HOLE MOUNT
CAP 0.18UF 50V 10% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.18 uF, THROUGH HOLE MOUNT
CAP 0.01UF 200V 20% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 200 V, BX, 0.01 uF, THROUGH HOLE MOUNT
CAP 1200PF 100V 5% NP0(C0G) DIP-2 TUBE-PAK R-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 100 V, C0G, 0.0012 uF, THROUGH HOLE MOUNT
CAP 0.01UF 200V 10% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 200 V, BX, 0.01 uF, THROUGH HOLE MOUNT
CAP 0.1UF 50V 20% X7R DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.1 uF, THROUGH HOLE MOUNT
CAP 0.01UF 50V 1% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.01 uF, THROUGH HOLE MOUNT
CAP 4700PF 50V 5% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0047 uF, THROUGH HOLE MOUNT
CAP 470PF 200V 10% X7R DIP-2 TUBE-PAK R-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 200 V, BX, 0.00047 uF, THROUGH HOLE MOUNT
CAP 8200PF 50V 1% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0082 uF, THROUGH HOLE MOUNT
CAP 0.22UF 50V 20% X7R DIP-2 TUBE-PAK R-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.22 uF, THROUGH HOLE MOUNT
CAP 6800PF 50V 1% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0068 uF, THROUGH HOLE MOUNT
CAP 0.01UF 50V 5% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.01 uF, THROUGH HOLE MOUNT
CAP 8200PF 50V 5% NP0(C0G) DIP-2 TUBE-PAK S-MIL-PRF-39014/22 CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.0082 uF, THROUGH HOLE MOUNT
AVX, Corp.
T323A474J035AS-C T323A474J035AT-C T323A474K035AS-C TANTALUM MOLDED
DISSIPATION FACTOR: Maximum DF limits are shown in corresponding series part number listings on pages 44-48. See Application Notes Section, page 76 for addi-tional
PERFORMANCE CHARACTERISTICS
TANTALUM MOLDED / AXIAL ?MIL-PRF-49137/1&5
TANTALUM MOLDED / AXIAL . MIL-PRF-49137/1&5
Kemet Corporation
CKR06BX474KR CKR06BX334KS CKR06BX104KRV CAP 0.47UF 50V 10% X7R RAD.20 .30X.30 BULK M-MIL-PRF-39014 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.47 uF, THROUGH HOLE MOUNT
CAP 0.33UF 50V 10% X7R RAD.20 .30X.30 BULK M-MIL-PRF-39014 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.33 uF, THROUGH HOLE MOUNT
CAP 0.1UF 100V 10% X7R RAD.20 .30X.30 BULK M-MIL-PRF-39014 STANDOFF CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.1 uF, THROUGH HOLE MOUNT
AVX, Corp.
IDT72V3640L75PF IDT72V3650L75PF IDT72V3690L75PF ID 3.3 VOLT HIGH-DENSITY SUPERSYNC?/a> II 36-BIT FIFO
3.3 VOLT HIGH-DENSITY SUPERSYNCII 36-BIT FIFO 32K X 36 OTHER FIFO, 6.5 ns, PQFP128
RECTIFIER STANDARD SINGLE 1A 200V 200 30A-ifsm 5uA-ir 1V-vf DO-41 5K/REEL-13 8K X 36 OTHER FIFO, 10 ns, PQFP128
Five Channel 4th Order Standard Definition Video Filter Driver; Package: TSSOP; No of Pins: 14; Container: Tape & Reel 16K X 36 OTHER FIFO, 10 ns, PQFP128
DIODE-RECT, CONTROL PIV=200V, IO>.75A 8K X 36 OTHER FIFO, 6.5 ns, PQFP128
CAP 4700PF 100V 10% X7R RAD.20 .20X.20 BULK M-MIL-PRF-39014
CAP 470PF 200V 10% X7R RAD.20 .20X.20 BULK M-MIL-PRF-39014
CAP 0.033UF 50V 10% X7R RAD.20 .20X.20 TR-16 M-MIL-PRF-39014 STANDOFF
3.3 VOLT HIGH-DENSITY SUPERSYNC??II 36-BIT FIFO
Integrated Device Technology, Inc.
INTEGRATED DEVICE TECHNOLOGY INC
CDR01BPXXXX CERAMIC CHIP/MIL-PRF-55681
Kemet Corporation
CDC204DWR CERAMIC CHIP/MIL-PRF-55681

54AC04LMQB 54AC04FMQB CERAMIC CHIP/MIL-PRF-55681
十六进制逆变
电容
 
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CDR31BP331B ic中文资料网 CDR31BP331B Transistors CDR31BP331B Serial CDR31BP331B command CDR31BP331B Description
 

 

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