| PART |
Description |
Maker |
| BC18-12 |
Absorbent Glass mat technology for efficient gas recombinatino
|
B. B. Battery Co., Ltd.
|
| PR010002 PR010003 PP040001 PP050002 PP040002 PRO50 |
MAT PRFRNCE 1.5X0.9 CHA/GRY
MAT PRFRNCE 1.8X1.2 CHR/GRY
MAT POLYPLUSH 0.9X0.6 GRN 垫POLYPLUSH 0.9X0.6 GRN
MAT POLYPLUSH 1.5X0.9 BRWN 垫POLYPLUSH 1.5X0.9 BRWN
MAT POLYPLUSH 1.5X0.9 GRN 垫POLYPLUSH 1.5X0.9 GRN
MAT PRFRNCE 1.5X0.9 BRWN 垫PRFRNCE 1.5X0.9 BRWN
MAT PRFRNCE 1.5X0.9 BLUE 垫PRFRNCE 1.5X0.9
|
YEONHO Electronics Co., Ltd.
Central Semiconductor, Corp.
Vishay Intertechnology, Inc.
|
| HDG12864F-1 |
Chip On Glass Technology
|
Hantronix,Inc
|
| LE-RTDUWS-2W |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
| LEUWS2W-PXQX-4P7R |
compact lightsource in multi chip SMT technology with glass window on top
|
OSRAM GmbH
|
| 33481-0301 33481-0305 33481-0304 |
MX150 1X3 BLADE SEALED ASSEMBLY MAT SEAL
|
Molex Electronics Ltd.
|
| 9920 |
Static Control Anti-Fatigue Mat 9900 Series
|
3M Electronics
|
| PIC18F248009 PIC18F4480-E_ML PIC18LF4480-E_ML PIC1 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| PIC18LF4685T-I_SP PIC18F2682 PIC18F2682-I_ML PIC18 |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
MICROCHIP[Microchip Technology]
|
| MSM9000B-XXAV-Z-XX MSM9000B-01AV-Z-XX |
16 X 60 DOTS DOT MAT LCD DSPL CTLR, UUC 35 MM, TCP
|
Oki Electric Industry Co., Ltd.
|
| MSM6222B-01GS-BL |
16 X 40 DOTS DOT MAT LCD DRVR AND DSPL CTLR, PQFP80
|
OKI ELECTRIC INDUSTRY CO LTD
|
