PART |
Description |
Maker |
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
TQFN5X5-40 |
Package Outline
|
Global Mixed-mode Techn...
|
SOP-7 |
Package Outline
|
Global Mixed-mode Techn...
|
PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
DFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X3-16 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-12 |
Package Outline
|
Global Mixed-mode Techn...
|
SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|