PART |
Description |
Maker |
P-306-DB |
Multiple Density Solder Eyelet
|
List of Unclassifed Man...
|
180-1462 |
Solder terminal, eyelet, thru hole
|
CAMBION Electronic Components
|
CXA49XXXX |
Low Profile Dip Solder / Eyelet Edgecard Connectors
|
Sullins Electronics
|
EBT156 |
Single Readout, Dip Solder, Eyelet and Wire Wrap Termination, Modified Tuning Fork Contacts, Polarization On or Between Contact Positions, Polarizing Key is Reinforced Nylon, Protected Entry
|
Vishay
|
A-HDF15LL-TL-B A-HDF15LL-TL-B-R |
HIGH DENSITY D-SUB SOLDER
|
Assmann Electronics Inc.
|
M29W640D M29DW323 M29DW324 M29DW640D70N1 M29DW640D |
64 Mbit (8Mb x8 or 4Mb x16, Multiple Bank, Page, Boot Block) 3V Supply Flash Memory FLASH NOR HIGH DENSITY & CONSUMER
|
ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
|
DBCHDMSS15S DBCHDMSS26S DBCHDMSS44S DBCHDMSS62S DB |
D TYPE CONNECTORS LOW COST HIGH DENSITY SOLDER PIN STRAIGHT
|
Dubilier http://
|
PY14 H3YN-2-DC24 PYF08F |
Miniature Timer with Multiple Time Ranges and Multiple Operating Modes
|
Omron Electronics LLC
|
ISPLSI1032EA-170LT100 ISPLSI1032EA-200LT100 1032EA |
60 MHz in-system prommable high density PLD 170 MHz in-system prommable high density PLD 125 MHz in-system prommable high density PLD 100 MHz in-system prommable high density PLD Shielded Paired Cable; Number of Conductors:8; Conductor Size AWG:24; No. Strands x Strand Size:7 x 32; Jacket Material:Polyethylene; Shielding Material:Aluminum Foil/Polyester Tape/Tinned Copper Braid; Number of Pairs:4 RoHS Compliant: Yes In-System Programmable High Density PLD 在系统可编程高密度可编程逻辑器件
|
LATTICE[Lattice Semiconductor] Lattice Semiconductor Corporation Lattice Semiconductor, Corp.
|
461-2634 |
Eyelet mount connector pin, .040 (1,02) diameter pin
|
CAMBION Electronic Components
|
M76DW63000A70Z |
64Mbit (x8/ x16, Multiple Bank, Boot Block) Flash Memory and 8Mbit/4Mbit SRAM, 3V Supply, Multiple Memory Product
|
ST Microelectronics
|