PART |
Description |
Maker |
MK2761ASTR MK2761A MK2761AS MK2761ASLF MK2761ASLFT |
Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body)
|
ICST[Integrated Circuit Systems]
|
SOD523 |
Surface mounted, 2 pin package Package outline
|
Zetex Semiconductors
|
AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3 Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp. Advanced Power Electronics Corp.
|
DFN2X2-10 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN2X2-6 |
Package Outline
|
Global Mixed-mode Techn...
|
WDFN3X3-10 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
TQFN5X5-20 |
Package Outline
|
Global Mixed-mode Techn...
|
WLCSP8X8-64 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-28 |
Package Outline
|
Global Mixed-mode Techn...
|
TSSOP-16-EP |
Package Outline
|
Global Mixed-mode Techn...
|