PART |
Description |
Maker |
HVR100 |
Small Resin Package (SRP) is suitable for surface mount design
|
TY Semiconductor Co., L...
|
HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
AC08FSMA AC08DSMA |
8A resin insulating TRIAC (AC08DSMA / AC08FSMA) 8A RESIN INSULATION TYPE TRIAC 8A RESIN INSULATION TYPE TRIAC 8A条树脂绝缘型可控 ECONOLINE: RB & RA - Dual Output from a Single Input Rail- Power Sharing on Output- Industry Standard Pinout- 1kVDC & 2kVDC Isolation- Custom Solutions Available- UL94V-0 Package Material- Efficiency to 85% 8A条树脂绝缘型可控
|
NEC[NEC] NEC Corp. NEC, Corp.
|
LRT6MF |
black PLCC-2 package, colorless resin
|
OSRAM GmbH
|
LR-A67F |
white SMT package, colorless clear resin
|
OSRAM GmbH
|
LR-P47F |
white SMT package, colorless clear resin
|
OSRAM GmbH
|
LSQ976-NR-1 |
SMT package 0603, colorless diffused resin, 1.6 mm x 0.8 mm x 0.8 mm
|
OSRAM GmbH
|
LRTBG6SG |
white P-LCC-6 package, diffused silicone resin
|
OSRAM GmbH
|
LH-CPDP |
SMD ceramic package with silicon resin with lens
|
OSRAM GmbH
|
LCW-G6SP |
white P-LCC-6 package, colored diffused silicone resin
|
OSRAM GmbH
|
LCW-JDSI.EC |
white SMT package, colored diffused silicone resin
|
OSRAM GmbH
|
GW-PSLM31.CM GWPSLM31.CM |
white SMT package, colored diffused silicone resin
|
OSRAM GmbH
|